S ITIIIIZO d ayi

Electronics Beyond Content.

‘A \\\\ \\‘\\ \[ V_ xv“

I

DELIVERING f\": ‘ use

AUTOMATION I ‘UN

WITH JASON SPE RA

Vii E ~ '\\

/fr ' ‘gt 1;

INSIDE SMT TODAY

- Meet the CEO - Mr. Jason Spera, Aegis Software Corporation

- Jim Angeloni COO, Neotech, introduces first commercial

hands-free mic assembly line

- lnovar partners with Mirtec for continuous quality improvement,

Jed Jones, VP Sales & Marketing, lnovar Inc.

0 N ‘ Acompany of the Comet Group

<7

L

i “ i_'. ,.e ' Y \\ M. ' -

5

1\"‘,;| \" J

.=.%.- as

5

M

£5‘ Visit us at h_

EPCON C ‘\"3

N Apm24—26.2018

. i Booth #1A25

Wh ' 7

y compromise.

Choose a custom-built EVO solution for premium inspection

Join the Evolution: www.yx|on.com/evolution

, P\"'-—

E5 E E, W‘. E 3-,

, M; - 7 L) I‘? ,‘_l ‘H ‘Hm

. F _ M _ L

Cheetah nus Cougar sw Cheetah saw Cougar PLUS Cheetah SMT Cougar sfiw

\" C C . ‘t .

\\' \\ . '\\\\ x I x. - '

o ay

Industry Smart Content.

'~ V ‘VI?’ -.

., 1, \" *7 “*9

Ge @f§snn“ected with L

' gustry 4.0

7“ 5

if \}

|40today.com

Part of the SMT Today Group

T .. W E LC 0 M E

-,-our I .

V l

‘l

\" .4”

ED|TOR’S NOTES

e A

Hello and welcome to the latest issue of SMT Today!

I hope everyone had a Happy Easter! ED'T0R'A'- WRECTOR ; ‘._ .

Wendy Tindle 4'

The SMT Today team have not long returned from yet another successful [email protected] 5 .

IPC APEX EXPO in San Diego, where our new platform i4.0 Today was fully §

launched. The magazine was welcomed in the industry as the solely dedicated GLOBAL SALES -

publication for Industry 4.0, and has gained great momentum. A round up _. Andreyv Carpenter /

summary along with photographs from the show can be found inside. a“d\"eW@Sm“0da‘/-Com ‘

This issue ofthe magazine focuses on a preview of NEPCON China, “the must— MAR KET|NG -

attend event in China this year” being held in Shanghai World Expo Exhibition SPECIAUST

& Convention Centre, Shanghai from Tuesday 24th April thru Thursday 26th Cameron Shaw

April, 2018. You will find a selection of exhibitor press releases demonstrating Cam9V°'‘@SmTT0da‘/-00”‘ ‘ ‘

what they will exhibiting at the show, and where they can be found. If you ,

would like us to promote any exciting announcements/news from the show, PUBLISHED BY ‘

please email us at [email protected].

Ourfront coverthis issue is Mrdason Spera, CEO ofAegis Software Corporation. i

We had the pleasure of catching up with Jason recently, to hear Aegis views

on Industry 4.0 and the importance of having standards in place. Jason also

discusses what he thinks are essentials for companies as they embark on the DES'GNED BY

Industry 4.0 journey. A topic on everyone‘s mind at the moment! SMT Creative

We have a study on a formulated no clean flux for fine—pitch flip chip package - .

of copper pillar/microbump interconnect from Shenmao Technology Inc's CONTACTS

technical team. We also have a piece from NEOTech‘s Aerospace and

Defense Division introducing the first commercially available hands—free mic P7 ‘_tSlv1TTotdeViii'_§ldiyi‘Eow_R§ad-P’ \}

assembly line. All these and more, along with our regular features — Industry ,

News, New Products and Red Carpet Sections — make for a great read! T ‘ MOWOO 4019

e:+' ' ya 83' L

The next issue of both SMT Today and i4.o Today will be published prior E”‘a“‘\"‘*\"°@5”“‘“““V'°“”‘

to SMT Hybrid Packaging, being held on June 5th thru 7th. Our editorial ALL RIGHT RESERVED

deadline for both publications will be 30th APRIL 2018. If you would like to

advertise with us, contribute articles, news or high profile press releases, or ‘D:‘/5\"\"’i’-F:W3:tE::l'lTmfiT§HJ(‘l4!:;t:eEtrefil

simply make an appointment with us at the show, please do not hesitate to ;i'i2§iCt3i‘iaSieii—o\}I%iiiepI.nii§iei.i.i/iiiie

Contact us at he||[email protected]. ‘Si21i.’?i?l”‘

I would like to wish everyone as always, a safe and successful NEPCON China!

OfI'llSSlOflS wnicli maii ncrrur

Wendy

Wendy Tindle, Editor

Email: we/Tdy@smttoday com

Skype: we/Tc/y—snTttoc/ay

Call: +44 7292 834009

P399 4 Electronics Beyond conlent l “7'j‘L 3“ \" ‘SSUE

Editorial & Advertising Enquiries \] NEXT EDITION

To enquire about available advertising C June edififin Wi\" f0GUS 0\"

opportunities, please contact: 3 5MT Hi/bfid PaGk39in9r

_ _ 5 Nuremberg

C0 N T [email protected] -

- - - I Deadline for content:

Website smttoday.com ', 30m Apr\" 2018

‘ HIS ISSUE...

I r

, W : . Shows/Events

._ _ A ‘ .__

i |= 3» - ~ - . . .. .

l‘ KL.“ -H»: ,5. fie‘ ‘ ' . ‘ I‘ _ 7. Exhibiting Companies

0 . __' ( _ ”11i‘l\"-iii: _ V'=__:>., _ 28. A Review oflPC APEX EXPO 2018

,.. ’ V ‘ , 34. SMT Hybrid Packaging 2018

\" Director Spotlight

NEPCON China 2018

Mr. Jason Spera, CEO of Aegis Software Corporation

'~ . : -. ~. -._ r _: ,.,—.'—,.;,‘ '3

.: ii\" ' ‘ T 1... .

. t—_fl_ Industry News

— .‘~' , 3:‘ E.’ _. .

- ’:. 4-:7» ‘rs. :._T

g — ;.'- Li ‘‘-J .

. . - » -.,. Q Technology Today

_ . g — \\ '\\

. ~ \\ -as

l A Review of IPC APEX 20. Study on A Formulated No Clean Flux for

EXPO 2018 Fine»Pilch Flip Chip Package of Copper Pillarl Microbump

' Interconnect

‘ . . \"*‘\"I\"\"\"'.” 24. NEOT hl t cl F\" to ‘II A ‘I bl

i=fllJ__;i-n5”\".\" ‘ 5'; ...-..n...:§...e\"rl.‘.’c\"A°§;..'.'..‘..r?’J2’\"e'°\"“ ’ °

l5”‘|-’5\"!“ ' __;_ , :11 30. ic:io\\lI_.:\\R| Partners with MIRTEC for Continuous

l 5 ‘rr 7 \" I ? \"— ua I y mprovemen

T? III‘ 7 w _ ,1 36. Optimal Electronics Creates Smartsoftware

. . a . ‘i.*,”.1* :\\-—:17 \" .

7' ' F l Solutions for Electronics Manufacturing

A r, \"I. ll ‘ 42. EDM Partners with Nordson YESTECHID Provide

~ : ‘ Customers with Cutting»Edge 3D AOI Technology

——: T Red Car et

_ _ Technology Today - p

Director Spotlight NEG Tech

l l

T g «—:~:~. i

*L—E I ~ Jo - i —

' .>»>

:5-Q:-,r -‘

' l

E . . ,.,_

V‘ . 7

.9-. we La. *4 3 ._.

.3 K» _. -' - er 5

. 17.; \\ ~. », Z

~' l

i ‘ r

l 4 ._ ..

‘mi ‘ll!

.. _. ..H“' \"‘ in

1 E I: E :1 5i : .

Red Carpet - SMT Today sponsors local bashetljetll club

,-Umsajmrnuslarunou‘ _ _ _ I

WHY VISIT NEPCON?

' ‘. l‘.llCR0ELECTH0NlCS _\{C;l-l_I.,lll4\"2i,0~iB'

»‘*I?’“\"\"'i‘l' ._i?,e%#FI%§.!i%*i'?:Ii?—&‘

TH E MUST-ATTEND EVENT IN CHI NA THIS YEAR!

CONVENTION CENTRE, SHANGHAI, CH I NA

NEPCON China is a prestigious trade platfonn and exhibition devoted to 355 NEW \"R°°\"°T '-A\"\"°” 55

. . FIRST HAND

SMT (surface mount technology) and EMA (electronics manufacturing

automation). The NEPCON China show floor consistently attracts over Industry frontrunners will launch new machines

35,000 corporate managers and purchasing decision makers from 3”“ updaied i°°i‘”°'°9'°5\"‘e'°-

the electronics fields of OBM / OEM / ODM. Over the past 33 years, AN EXCEPNONAL CHANNEL FOR

the show has developed a powerful and far-reaching reputation for COMMUNICATION AMONG INDUSTRY

constantly innovating value and facilitating efficient face-to-face trade PEERS

talks bewveen exhibitors and buyers 27,951 key members of the industry gathered in

2017 to Siiaie be5i Practice and disc‘-I55 iopicai

issues related to electronics manufacturing.

Alongside the exhibition platform, dozens FIVE REASONSTOVISIT

of high-quality seminars, prominent media NEPCON CHINA 2018 pm\]; ouTA3ouTT|-\[E |_ATEs1'|NDus1'RY

interviews and all-inclusive e-channel promotions I I I I DEvE|_opMENTs

will bring exhibitors more opportunities to BrIngingTogether Leading International Brands

b0°5i iiieii market Pi°iiia5- F0? dECad95 HOW. A diverse range of seminars, diploma courses

NEPCON China has proven itself to be the - 35.000 sqm of exhibition area covered and Diheiinstiuctionai activities are scheduied

Wi”\"i\"9 Ciiaice i0\" C°iT'Pa\"i95 I0 maintain ‘ i to take place on-site to further enhance the

Ci-'5i°iT'ei ieIaii0”5iiiPS. acquire flash Saies ' 500 eXh‘I5\"t°\"5 brands numerous benefits of attending the show.

leads, showcase new products and fortify their _ _

brand image. ' 22 countries and regions represented NEW PAVILIONS LEADING mousmv

O 1000ty f 1 t _ f t _ DEVELOPMENT, DEMONSTRATING HOT

- ver , peso eec ronics manu ac uring APPLICATIONS

SHOW HOURS devices

Tue Apr 24 2018 o9_3o_16_3o . N _t d_ I d |_ d Electronics Manufacturing Automation Area.

’ ' ' umeious “'5' 3 ‘SP ays an We em“ Electronics Material Special Area.

Wed Apr 25, 2018 09:00-16:30

www.nepconchina.com/en

Thu Apr 26, 2018 09:00-16:00

I’

' Ii

42.\}, I _, ii ‘ __:: ; '

ll '.=_ .~ ,-_~ ——_p »:; , __

3 ; ,‘*;\"‘ ;,'7'i 1 _.'-' ML‘. =3 « .. 7 J ;:‘ ‘: ‘T-_

,~_ I — I. ;, ‘~'' lire: -» -- — 15.3 3 -~

‘ 1 .- 5% ' ::::J:. __ : » nun 1 I 1:3,‘: K.-I

*3‘; I » l‘~‘%l:‘.‘i..~ Yr. 1,; I\" iiiiiiiiii = i 235:5: '

‘ \"E , « riff\}: 4 ‘ .-.-‘r —--- _ \" . ‘--'» ~ I -* E§§__ I: i

» .,?E I ma ._. - - - ' ‘; 1 ' nnuun __ \" -‘I

I ‘ ,,;, M . ..-.. \" _ .. ——< ~z~ iii ii I i‘iIii“i“““\"'~ \" . , I -

, , -A---- M .u-...... ... —. __. . ,, A _ ..___ ,.__r_.,_ , . _ -.- a

’ :--»—;#~----~~ ‘ ~ ' i i 1 .‘ I

. i £2 ;:-:5 gig? -‘I , .: ‘

Vi * * I 1 ;—f' __ —— —~'—'—»» ,i * »_;:; ‘;_:'x~“:;\" ;, ’ ~37 5' ’ 7, ““ A ,x,2-_’; ' ' —'

,— :3 I —;'g‘—': :_:$:£\"~\}i i’ ff\" »i§‘:\"— - ' :»l%L_'.' \"~. '

-*1- :2 ' ,_~_»_ \" ,:\"...—\":”\" ‘ K .2. ~ =::_ 7 ,~.—. A ’- 23- »-?‘:-i~:'-—,— 34:‘: 52' . — ,

-» '—,:.\"\":- .—;r.— 4 i 7 ' 'i\" \"fi' —:’-E‘?! _' -'t’ '‘'—‘;f', 371:2 \"‘--._;’_‘:I, ‘ '

'—.,..a->'* ’ —’E—7 — ”\" ’ ' 3» ‘*3:-_‘r‘;\"T.:_ 7 “ - 5“-:~~ 2,; 7» .:.._ \"—* —

The following is a snapshot of exhibiting companies...

level of accuracy for both dispense pumps. The M

%@w patented design corrects for part to part rotation M E Tc A L \"‘

in “real—time\" allowing synchronous dispensing of Metcal brin S innovative benchto

Data \[/0 to showcase Award both_pumps. Camalot is also launching Nu.JetiM, _ 9 P

Winning UFS Programming :.l:;ll\".?.;:i::i:2:,:::;::;::l%.:::?:::;:§ s°'.“°\"\"9 Systems ‘° \"E*’°°\"

Technology at NEPCON china state—of—the—art pneumatic actuatorthatgenerates chma

B°°d‘ Ne: 1A32 an operating frequency of up to SOOHZ. Booth NO; ‘F38

Da1a 1/O Coreeraaen (NASDAQ. D/A101 W111 MPM will be debuting the Momemum H”: Thecompanywillshowits_ConnectionValidation

showcase awardwinning UFS device programming - - - i S°|de””_9 System \"‘\{'th new handfleeesl

- Wm a new paste momtomg System feammg Di ital Hot Air Pencil Hi h Thermal Demand

leemelegy 0” the I-dmenwx '\" Booth “A32 at tem erature monitorin as well as u er and g - V g

» P , , , 9 , , pp solution and Solder Tip Cleaner.

NEPCON Ch'”a- lower limit ro||—helght monitoring. These new

..NeW reqairemema 101 1aS1e1 performance’ features Wlll improve yield and reduce wastelby CV Soldering System

impi°Ved ’eSl’°\"3iVe”eS3 a”d 9i°\"\"i”9 file Sizes ensumrg-proper pastes Vlscqsm/tto ravold bndgmg Connection Validation is Metca|’s latest patented

for '°T deViee3i the eemeeled ea’ a”d Wireless and Voldmg and ehmv-me mumclem or excess technological innovation that is reinventing hand

applications are driving adoption of Universal paSle,\"°'“me3- There '3 alee a new “Se”l\"e”d'y soldering! Bum on me eemeanyis Sma1-1Hea1TM

Flash Sleiage lUFSli the ”e’d’9e\"eia“°” flash graphic user lmerfaca technology used in all Metcal soldering systems,

memeiw Said D0010’ Ma Qmghdai Ge\"e'ia' “Miniaturization continues to demand CV evaluates the quality of the solder joint by

Ma\"a9ei°l Data I/O Chi”a- “These aPp\"ea“°\"3 enhancements in speed and precision, and calculating the intermetallic compound formation

a’e”a\"3i“°\"i”9f’°m eMMC flash to UFS Chi\"a we are excited to showcase our capabilities and providing closed—loop feedback to the

eleelieiiiee mamfaeldiere are faced with an in these areas,\" said Hutch Coburn, lT\\N EAE operator, mitigating risk in the process. Metcal

exliaeidinaw Challenge id ma\"a9e eXl’°”e\"fia' General Manager. “We also welcome the will introduce the latest CV system accessories

gidwm in edmem a”d_ tianemedte new Flash opportunity to continue our discussions with at the show, a full set of hand—pieces including

Mem°’Yteeh\"°'°9V \"\"h\"e ma'ma'”'”9 pieddeae” leading manufacturers on Industry 4.0 and the tweezers, desolder and high thermal demand that

miedghpdt Tiadifi°”a' methods el piegiammme collective advantages these capabilities can bring. will transform the CV—5200 soldering system into

\"° '°\"9ei appll’ lo ledayye eleetiemee markets a complete rework solution. Additionally, Metcal

fD='=ti1='jtFi/Sodis ihtiiizd |i_0 ‘3_><iB”d S_UPP0iT Or’? l—Um9”X www.i'tweae.com has released the CV Monitoring Software that

°’ _ H eV'ee3 e '‘’e“”9 maX'm“m Pe °”“a\"eei will improve your solder process traceability and

flexibility and throughput for the lowest total cost e1ea1e a eencennanee base11ne1O quickly analyze

to our customers.\" a -. i i i -

Q your soldering performance, identify changes in

The Lumenx programming p|atfO1-m is architecred \{;,'.:..’ your solder conditions, and allow you to make

to support the latest device technologies for Changes to ye” process‘

maximum performance today and in the

future. Data I/Ois UFS support delivers optimal K|c to showcase rea|_time

i\"°9'ai”£”1l”9 i’e’l°”1:‘a1':°ei1 eapadéy and dashboard, traceability and data

managea iity to meet ig —vo ume pro uction - -

demands while delivering the lowest total cost analytles at NEPCON chma

01 Ownership. Booth No. 1858

UFS aappan is aVa11ab1e an 1ne Lumenx Daamop The KIC team will debut the new ecosystem led

or integrated into the Psvsooo and PSV7000 “Y W’ Va\"ia9'3 \"awoik S‘?iiWa’e Sysiei” and

automated programming systems. Existing PSV d'S°“SS the SP8 amen profile“

customers can protect their investments and easily The new KIC Van1aee senware is designed 10

Upgiadaiheii P$V 3‘/Si9m3i0 3UPP0i'l Ulesasmeii help engineers gain insight into their reflow and __

P;0|:1UCii0nXi9qUiiBmemS_ Ch5;\"9|E:-We C0mbi”a§§\\”/ wave solder processes to enable better and

0 Um9i'i Piogiammiiig 190 \"0 09V in a faster decision making. It provides a real—time _ » » » »

SYS_i€?m d9iiV9i3 me maximum P9i’i0tma|7Cer dashboard for thermal processes, accessible HCT2 200 Dgnal Hot A\" Pam\"

flexibility and ihiohighpul ioiiiie '°W93i total 0051- anywhere, from any authorized PC or mobile Metca|’s new Digital Hot Air Pencil was developed

, device. The process data is automatically stored for very small surface mount component and

WWW‘data’°-e°’\"/l“”7e\"\" in a central location where the engineer can package sizes (1 206s and smaller) and low board

quickly retrieve and share all relevant data for full densities. As component miniaturization continues

:W E . process traceability. (e.g. 01005 components), the ergonomics of a

H , pencil become more important to allow a user

The Vantage delivers value to users, not through fieedam 10 access and rework Com

. ponents on

ITW EAE to Reveal Latest S°l1(:a(‘)’:11da::1iB1e:;1‘i;:°;'/5:‘: the board without affecting adjacent parts.

Advances in Electronics actionable data For example, with afew mouse High Thermal Demand

Assembly Equipment at clicks the user can access traceability data for

NEPCON China every assembled PCB within acertain time frame, The \"aw High Ti‘B\"“='=i' De_”ia”d lHTDl S°'%'ii°“i

B 11, N : 1640 1 11111 1- 1 1 11 11h b I comprised ofanew hand—piece andaselection of

00 O oven 8 I Clem name Ora 0 ea We thermalefficientcartridges,isdesignedforusewith

The |T\\N EAE stand (1C-E40) will be displaying The new l<|C SP8 smart profiler collects the Metca|’s CV and MX line of power supplies. HTD

and demonstrating the latest advances in the profile data and compares it to the process transforms a Metcal CV or M><—series soldering

MPM, Camalot, Electrovert and Vitronics Soltec specifications. Within seconds, the new smart station into a powerhouse for applications with

product lines. profiler also suggests an improved reflow oven high thermal loads, suchasdense boards, without

NEPCON China is a great Oppoaunay 10 See the sletuliaeltatat!ifs;:i:ti;lh:eT:1yptre)e:l;r;:|<:(g:e1seE’<: damaging sensitive components.

broad equipment offering from “W EAE‘ Engineers insldght and actionable data leading to increased AOSTC Selder Tip C'ea”e’

and Applications Experts will be on hand, as well . . .. . 1 1 _ 1

as Sa|es and Management 10 answer quesfiens :|re°C‘i:(e:il1'e’:lS'\"ede “l\"'Zat'°\"i reduced rework a\"d Metcal s innovative Solder Tip Cleaner features a

and offer solutions. The combined knowledge and V ‘ replaceable bmahysystem that pulls excess solder

experience of the ITW EAE group has generated Move toward the future of line connectivity, a\"\"aY lrem “deep ‘me a _’em°Vab'e eelleehe” “Cay

some breakthrough innovation which is speeding flexible production, process transparency, for d'SpeSa' \"\"h\"e 'em°V'”,9 °_’$'dat'°” lief“ the \"9'

the development of next generation technology. machine learning and real—time insight. For more Seleeg “PS ’el|’;eSfem a 3|g”'l\"1’a‘1‘_\"l p°”::1\"111‘)1H'“|e

1 _ _ >1 1» bO1K1C) 1 b B 1n1B58a - cos c owners ip oraso ersaion,an ecas

Camalot Will be launching Dynamic Dual HeadTi’i Egerggfingnina S op y 00 Umg new Solder Tip Cleaner removes oxidation and

iDDH) which offers the unique ability to double ‘ extends the life of the soldertip. By placing the tip

dispense speed while maintaining the highest www.ki'ctherma/.com into the opening, the AC—STC SolderTip Cleaner

senses the tip and automatically activates, saving Optel provides smart and mobile software Vision><P+ Vac:The 2—in—1 solution for convection

the operator time. solutions for scheduling, dispatching, tracking, reflow soldering

monitoring and controlling electronics assembly

www.metcaI.com on a paperless factory floor. This integrated The Vision><P+ convection soldering system

offering is supported by the company’s extensive combines various advances in technology,

application experience to help electronics particularly with regard to energy efficiency

assembly manufacturers achieve their productivity, optimisation and emissions reduction. It allows

. . cost and quality goals. customers to reduce energy use in electronics

0

Nihon Superior to Exhibit the New www opte/co com gnnagxeeeggereobi/ontreeeoleig (:)eCroyreeateni:e>Sr

sN10ocV solder AHOY at NEPCON the first time ever, the vacuum option makes it

China possible for convection soldering to take place

with or without a vacuum — in one systemi The

B°°m N03 2'31 , g Vision><P+ Vac reliably removes gas cavities and

D4 °°E::Ef!.l

free, lead—free, no—clean solder paste. Unlike silver— Veeeem pressure er up re 2 mber Void rates or

c°”tai“i“9 a\"°V3 that °te”\"e the\" Stiength t'°”‘ Optical Control to display its world- less than 2% can be achieved. V

a dispersion of fine particles of eutectic Ag3Sn,

SN1OOCV gains its strength from solute atoms class SMD Xfray parts counter at Cehdeheexc. Cemeeei eireeiure _ huge

in the tin matrix of the joint. The paste provides NEPCON chlna '

_ _ _ performance

excellent wetting and reduces voiding. Booth No: 1327 e ‘C75

, , The Condenso><C, designed for reliable

The Company else plane to exhtbtt Neeeeet ethe Com an representitives will hold demonstrations C0nd9nS8ti0n 30id9|fin9i has 3 Compact Structure

t”‘t\"°\"ed \"e'3t°” °i the NS’F85O '°3t”’baSed in borethyl B27 located in the German Pavillion thanks to its innovative processing chamber-And

flux fer Ieeeeeee Wave Soldering‘ The new’ nee as well as booth 1C75 with cooperation from it Performs in abig W3Y- With its Patented injection

clean flux ensures excellent wetting of all PCB Suzhou Link We Smeeh Ce Lid principle the exeeremeehi er Geideh® required

and componem Substrates t° deliver maximum y It i is addedtto the process for optimal profiling. The

mtoughehetefittendfactmetesme Setderdmtnage Exact inventory knowledge and permanent c|osed—loop filter system allows almost 100%

that ensures minimum bridges and icicles. It is the invenrery ie mendeiery re inereeee predueriviiy of the medium ie be reeeihed end fiiiered_ The

ideal flux for lead—free wave soldering. Additionally, for en_rirne delivery end an immediere reeerien System is eemeieieiy eeiiebie fer Veeuume ehd

the rosin—based flux ensures that the full reliability in ease or behieneeke The enrire SMT iine ie has eh ihieereieei ereeeee reeerderfer meximem

potential of SN1 OOC lead—free solder is realized. menireredi ee menirerin end eenrreiiin e invenrery ireeeebiihy

. . to run the lines ise uall critical forthe roduction

At-USA.C'35 '3 5 'ead't'ee \"”l\"°V de3'9“ed t°' process. The oc—(ecAyN®ccx.s SM8 counting ViCON: Smarter Software for more efficiency

eeleermg e|ummum' Deeptte me Cost end machine simplifies electronic manufacturing work

me performance advantages of etuminum’ its and gives exact and precise control of inventory Rehm h='=tS deVet0Ped With ViCON an inn0VatiV9

commercial adoption has been slow because and eeereeuir’heipe keeneiinee runninei ’ Solution for easy epeiabimy and Optimal

Otthe C0nC9Tn ='=1h°Utth9 9aiVaniC C°ii03i°n that Y ' traceability in the Vision>< series. The software

results from differences in the electrical potential of Th e flier or he kind the OOSCAN COX 3 Uses can for example monitor all values that have

the C0n3titUent Phases Joints t0 aluminum made X,iay to mum grit/ID Components in just 10 changed, or collect and statistically evaluate

With this new 3\"0Y ietain reasonable Strength 9V9n Seconds for ANY size ieei ii is an exiiemeiy alarms in order to avoid errors and to optimize

after 30 days °f Saltwater immersion‘ intelligent, simple and fast. machine that can machine Settings

Aieeneno Nene_Sih/er ieeeie is based on a provide fast Roliby eliminating endless hours

patented technology that makes it possible to Sitiimin;mkgggfien9eUfi°§ij$§:e;“i:t:i::Zi fin\]: Wwwrehm emeeeem/en

eeeeevety jet\" meet metele ‘as We\" ‘as St end machineycan be setup and in production in less

SiC at low sintering temperatures, if necessary

in nitrogen, without the nitrous or sulphurous than one hour‘ fin

residues that are the by—products of the sintering Seme er rhe hiehiiehre er the COX 3 ineiude_

of some other nano—silver pastes. The highly ' '

active surface of the nano—silver particles and o Automatic component recognition SEHO and Toratec to Demo

the consequent strong capillary forces make it Selective Solder System at

possible to achieve strong bonds even on copper ' 99-9 percent accurate NEPCQN china

with high electrical and thermal conductivity at , Ceehi ehy Size reei ih approximately

low temperatures without the need for external 10 eeeehde i300thI 1325

pressure. I

. count four 7\" reeis in 20 seconds SEHO Systems GmbH will demonstrate the

WWW mleoneupee-or Ce‘/p/eee”-Sh 0 Communicate with storage and ERP systems 1e§k2e§tt\"\"e’e Selective eeieenne System In Stand

in the German Pavilion.

' Truly e meimeneneeeeee meemne The SelectLine—C features an outstanding modular

D t 1 . _ design and innovative, award—winning technical

Pong“ Wwwepeeel eeneeleem details. It allows the integration of additional

processes such as selective brushing for automatic

= cleaning and automated optical inspection for

WKK to \[nu-oduce opte| softwareis ' - imlmefiiate Iigspection of sotlhier joints direi:tly

- a er e so ering process, us ensuring cear

smart Factory .s°|ut'°ns at THERMAL svsvzns cost benefits. Highlights for the soldering area

NEPCON Shanghat Reh m presents inn ovative are the Synchro software feature to double the

. - - production volume without major investments,

Booth Not \"430 prgceuctichn equipment at NEPCON and the automatic

Flanko Vujosevic, Founder and CEO at Optel m 3'19 3' Ultrasonic Cleaning -. i. ‘T’ L _ '

Software, commented, “We are very excited Booth No: 1F20 ct Sctdet nczztes _‘ . eff A—

about partnering with WKK as part of our efforts \" “K *— ,:__\\_e,

to expand ourcustomer base in China. We have Rehm Thermal Systems will once again be — —— ~—

started working with WKK in December of last represented at NEPCON Shanghai. The latest _ .

year and the 2018 NEPCON Shanghai show is systems engineering, innovative software ' 7*

a continuation of our collboration.\" solutions and competent process consulting i

will be presented to you.

/” it Not having complete control of

/

your inventory wastes valuable

resources and money!

con trol

Intelligent! irnpiiei Fast! automated component counting

From the makers of the world's FIRST automated counter to use X-ray for counting SMD

reels — The \"OC—SCAN CCX.3\" from optical control is an extremely intelligent, simple, and

fast component counter with built—in intelligence that was, truly the first of its kind!

FFATURFS: x_,__\\_*_‘

- Automatic component recognition ..;._,, « f

. \{C l

- 7-10 seconds for single reel Lg - ‘5

<7\", 13\", or 17\") Etcggfé c

- 15-20 seconds up to (4) 7\" reels .~=.;«7=r;3,5.~«._i\".-5.5%\}, (*5 cg ( Q1

- - - - ‘-\"-\"L\"'i.‘:* ('(%%( D tical ’

. Automatic plausibility check <§.t(fEfE§ (( réf P

to verify results Q-¢c_<(<.<«,<(gc;((,(;;,§ 7

- Count JEDEC trays and \"”r,f:;' “

storage tubes/sticks 6;

- Count cut tape components ~____,-jgvv “*4” ’ ’

- Count without removing ”$*fi¢ * 1

from ESD bags >)g>.»7,7~‘m _

. Ignores interference from ;:1_§j_:JJ_.9 ‘ fig, 3,3335

dry—pack desiccant bags -...:'._ir.$ J.J_‘§9§ %;\})7\};’;;.

- Group and inventory counting \"J _ J ‘ 33%)

i :::‘:i:2i3$:5:::::.i:;W” )

- 1D/2D barcode reading and ““'** ‘~\"\" \"

label printing , _ _ Meets all FDA requirements

- Communicate directly with component storage units

- Communicate with ERP and MES systems

BOTTOM LINE:

Drastically reduce counting labor ~ Eliminate counting mistakes

More up—time in production lines - Make better use of manpower

For more information please visit -- l l l l l ll l optical—control.com

that guarantees maximum machine availability The TS7000 Series Interchangeable Material I P

and a nozzle service life up to several months. (IMP) Rotary Valves are the latest additions to

the Rotary Microvalve family. The valve uses a

With hundreds of machine installations throughout feed screw (auger) to dispense fluid with a rotary 'l'“|°V¢“°|1

the entire range of products, China represents an displacement action, allowing ultra—precise control TRI Features One Stop Solution

important marketfor SEHO. “At SEHO, customers of the dispensing process. The valve’s modular for SMT fines at NEPCON china

profit from complete solutions with the aim of design allows quick and easy replacement of the 2018

making production processes more efficient,\" says feed screw/chamber cartridge assembly without _

Markus Walter, CEO of SEHO Systems GmbH. removing the valve from the machine. B°°”‘ '‘‘°- 154°

This also includes S60° onsite support from . . .

solution—driven purchase advice, through process www.techcon.com Test Rhesgamshl t(TR.|) w'“t.eXh'|b:.t a

optimization up to complete after sales service. Compile. ens“/e m ac Orymspec '0“ So.” m’

it i - combining SD SPI, SD AOI, SD AXI and multi—core

With Toratec Shanghai we have the perfect . . .. . .

-d h i ICT at NEPCON China 2018 exhibition. Visit us

pameno prom esuc Semceto ourcustomers V THERMALTRONICS and discover the leadin one sto solution for

in China,\" explains Walteir. Toratec Shanghai has PCBA inspection 9 p

both excellent technical expertise and process . . . '

knowledge, and can draw on many years of T!1?rmaltr°m_cs to Exmblt New Full . . . .

. . Vlslon somenng Robot at NEPCQN The 2018TRl lineupforNEPCON Chinawill include

experience to effectively support customers. To _ award Winnin TRWOOQ SD AOI ins action

keep up with new developments, Toratec’s staff China with Ieadingegdge Solder fillet inspecfign and

5~‘?l23‘i~3?§‘aiis‘”“”“°“““‘” 15.23223:r.l.::i°i::air:.%:;0ii::iz:::.z

,7 d The °°T“l’a”V p|a\".St° Sh°WCaSetheTMT’R98O.OS this year Ere TR7C%7gpstop—and—go SD SPI,

WWW” 0' E S°'.de\"”9 R°.b°‘ '“ Ha\" 1’ Sm“ ‘F55 U\"\"ke revolutionary SPI solution TR7007 Sll Plus and

‘Vl\"°a' Ca”e3'a” '°b°‘Si ‘he T'“e\"“\"’“’°”'°S WT’ all new TRSOO1 Q Sll INLINE Mu|ti—core ICT. TRl’s

R980“ S°\"‘e\"”9 R°b°‘ ‘S eq”‘l’l’ed with f“\" lineup will also include first—c|ass high resolution

vision to verifythe procedure being undertaken and SD CT AXI TR76OO Sm and TWGOOFSDI

does not simplyfollow a pre—determined program.

Th Th H . R b t. S t . t Discover how TRl’s PCBA test and inspection

Techcon to Show New Smart . 9 film (;°”',°3 ° ° '° \{3 e”‘('j'‘°°’l’°.'“. 95 solutions work together with Industry 4.0 data

Dispensing Robot & Va|ve mnova N? temgn Concep 31%\" pr:.C'St'.°\" based YMS 4.0 management infrastructure to

controllers at NEPcoN china §?LT§h°335$Snefiifiiivififlnrelliriiflérlivéfil §:g9nfin'i§:*(;'3:,\[t“yf§:fS'“V\};f§;°;j“,§§;,gQj

Booth: 1F38 f”.3‘f’eS p\"?°'3|;°\"t3°\"“?\"'“|9da’_‘d '°‘” °pe'a‘°' China booth 1E4O for a personal tour of TRl’s

ra'n'\"g COS 3‘ ea was me ” e‘ acclaimed solution lineup.

Company representatives will display the TSRZOOO . D I . . Id , b t

Smart Dispensing Robot, new Smart Valve ua arm’ SD‘ M3 so emg r0 O www.tri.com.tw

Controllers, TS81OO Series Positive Displacement . .

Pump and 1.85000 /Tsmoo Series Rotary Valves‘ 0 lntelligently compensates for PCBA variance

The TSRZOOO Smart Dispensing Robot is ' 'ma9e'e°°9”\"‘°“&m\"lpl\"“9 Syslel“

designed specifically for precise fluid dispensing .

applications and is compatible with all valve . Laserhagm measurement

types and controllers. The user—friendly, smart

PC—based software makes the robot easy to _ he VJ E|ectr¢_-mix to Demo |ts

Eficggigiitihand Slgmplte l<>a0\{J;9rl::'-Cléllllle l/ClSl0\"e:¥SFl)<“fl \" ' XQuik with Material Handling

W 9 TO 0 O U I y Off ‘ - -

misalignment and shorten programming time via ., -: 7'1? l Automaflon at NEPCON chma

pattern recognition feature. 9 1 .75 Boom 1F32

Techcon’s new series of smart valve controllers 53;‘ \" VJ El9Cll0lll><l lllc-r 3 l9_adlll9 global Pl0Vldel_ Of

includes the TS55OR, TS56OR, TS57OR and _r :1 \\ : \\ advanced ><—rayinspectionr C0mp0Ifient<§0Untl_H9

TS580i:g‘ Equipped with a universal power supply, __ ,9 systems and PCB rework technologies, will exhibit

the new smart valve controllers are fully ‘plug and lll_ST='=llld “:32 31 NFPCON’ Chlll3_- The C0lTlP3l'lY

pieyi and can be used immediately, anywhere will demonstrate its ><Quik ||’W|1h AccuCount

in the World‘ The soldering robot has an observation mode a Technology and Summit 1800' rework System

Th b t_. _ I H 1 H . d verification modeand decision making capabilities. The revolutionary’ ><Quik ll_with AccuCount

Wit: E?:e;:::e(t:::: in(::r?a::)e::::\{:||e::'5:;rS This capability to collect and utilize_data for Technologywill be displayed with material handling

to Configure the exact parameters’ and monitor production processing is one ofthe most important automation, enabling the system to automatically

°*

world. This feature complies with Smart Factory ry ' ' 1: ac ‘We ma :8 and Calculate Com énem

requirements of Industry 4.0. Th . . 9 9 . P

ermaltronics Curie Heat Technology (CHT) count in parallel with bar code scan, loading and

The TS81OO Series Positive Displacement Pump J.':;‘:°:;’:‘(jJ?:|:§;';e?:‘:'Sjwjffissfgfignheifjgfif 'abe\"”9 °l iee'S- I o o I

'3 deggned. 10 d'.SpenSe .a W'de “V99 of flmqs’ thereby meeting the exact requirements of the The Summn 1800' '3 3” 'mP’°Ved V9’S'°” Of the

from low V'3.C°3'ty (.:Oa.tmg3. to mgh V'3C93.”y substrate component and solder material. The \"\"°\"dY3 \"1051 p°P”'a’ ’e\"\"°’k S3/Stem WE has

greases Typical applicaliens include under filling ddmpddyrs hand Sdlddn-dd prdddds include both maintained all of the benefits of high efficiency

PCBA C0mP0ll9HlSr eiiC='ilFJsUl='=lTl0l'l and POUIWQ 13 55 MHZ and 470 KHZ power Supplies and are convection heating and the renowned 1—2—S—Go

='=lPP“CfiTl0l'lsr applylllg lubllcallols 0” 3Ut0iTl0TlV9 fdlfy Compatible with Competitive product Offerings interface, coupled with updated technology for

Pfiilsr and dispensing pastes slid flU><- ' greater reliability and an improved price point.

-- - - F the ef' me ts nhance the s stem’s

Techcon systems‘ patented Ts5oooDMP—DcX 'T”.d§f‘r‘,f'a‘.'§;(”,,,‘.‘C’§';§(')‘§?§VrZ‘§§§fl”§XrZL‘§‘§r°\};L”§g pgrrformancenvevith iI:|trae— small components like

Series Disposable l\\/laleilal Palh (DMP) valve of ddddssddes to Sdppdd both pmddcrrdd and O1005s, while maintaining its capabilities with

°°'f”al”3 3 disposable feed S_°l9W T0’ 933V rework appiieafione large boards, oversized CPU sockets, connectors

maintenance and reliable dispensing. With afeed and large BGA3

screw made of Delrin®, the valve is designed for WWW thermamonics Com

use with two—compound and abrasive materials. ' ' WWW_V/e/eC;,en,'X_po,T,

T

T

When it comes to building your brand and

marketing your business, you need an agency

that lives and breathes the Electronics Industry.

QUITE SIMPLY. N0 AGENCY KNOWS IT BEITER.

rig smtcreatlve

':'’/'i‘ ’ Branding Websites Digital Marketing PrintDesign Social Media

_ ’,’//2/4.\\_'.._ smt—creative.com

i/I///I>' \"

AE I

S D F l l'i R E

DELIVERING AUTOMATION WITH JASON

SPERA CEO OF AEGIS SOFTWARE CORP ~

! - \\_

\\

\\ \\ .~ . .

, \\ t . _ \\ \\. ‘_

\"‘ i : A‘

x V l’ .i

/‘ “\" T as ;-’ T

Q .

We recently had the opportunity to catch up lndustry4.0 capabilities can shift theiroperations \\

with Mr Jason Spera, CEO of Aegis Software on a dime, flexibly adapting to meet changing

Corporation, to discuss the company’s view on customer demands, enhance productivity, reduce ‘

Industry 4.0 and the importance and need for waste, and accelerate production.

standardization.

There is much debate and confusion ~

surrounding the roles that ERP & MES play ,

in a manufacturers‘ organization can you

provide some clarity on this topic?

While ERP and MES may have some overlap, I

ERP primarily drives the business offices such as ~

purchasing, sales, and many other business—side l ,\\

functions. ERP also includes shop—floor tracking i

and ‘inferred traceability’ of materials, but these it '

capabilities are far more general than what one

finds in MES. The basic truth is that ERP, as ‘

good as it is on the business side, often lacks the i ,,

data model and architecture required to handle can you provide some more detans on the it t, ‘ l

V35i atTi0U'ti5 Di iitmtiiiitg M05955 and deViCe Industry 4.0 vision and how manufacturers , _,

daiai Qtaiiuiat DVOCGSS 519?) itackiflgl DFOCGSS can achieve that autonomous and intelligent i i,

interlocking, etc. Nor do ERP solutions operate adaptabflity? ii. :

on the same time scale as MES solutions do, and ', i

as a result, they do not offer the key capabilities To answer this, i feel it is best to break out into ,

and real—time granularity that is critical for tightly segments. The first vision is the ability to control \"

controlling and coordinating production, materials, the flow of materials to ensure lines are never down :'=__ l_

quality control, and processes. due to inventory shortages and to maintain the , ii-.

overall lowest levels of inventory possible — lean it

N3iUt'aiiY. ii i5 hard i0 aV°id the question logistics and materials flow. At this state, the , i‘ 1,.»

5“\"'°““di“9 i\"dU5it'Y 4-°- HOW (1055 Aegis systems involved in the factory are so connected / ‘i 1% ;

View indU5i|'Y 4-07 to everything regarding materials logistics within /lg J \"‘

the factory that the ‘‘pull’' model is seamless and ::‘i.~i' ii , \\ -lr

HOW 3“ Aegis lDet5lDeCiiVe» OW View Of automated,thereby removing the need for human ii \"' i \\

iiidU5itY 4-0 i5 that POW at Which iaCi0tie5» 31 intervention. Automation is driving the material ' ”

the m05i genetic ieVei» beC0me 50 auimiiaied flow from the loading dock to the material store «

and adaptable, without a need for significant th the Warehouse all the Way through to the ._ \\

nurnan intervention, tnat they can produce infinitely kahhahs and local stores. What’s more, with all »f\\ ‘

variable products with the efficiencies of steady— the automated matehat hahdtihg Systems, ftgm ‘ ‘*-

Siaie hiQii’V0iUme Dt0dtJCii0”- ii i5 DFBTW tTiUCii autonomous guided vehicles to material towers — \"9 ‘ i

3 i0te90”e C0'tCiU5i0” ihai i'idtJ5itY 4-0 i5 ab0Ui human involvement is minimal even when machine i -

aUi0m5ii0”» btii ii i5 the BUTDWDWOUS am iflieiiigeiii faults and other variables cause the need for line ‘.

adaptability that is more care to the vision and switching and other reactions that would usually

enables the transformative benefits of industry take a tatge humah efiett ta ateheettate AS the

4.0. in this era of the connected customer, we are pteduetteh processes ate gehetatihg demahdy

“OW expetieming 3 Wh0ie View WOtid With W355 the materials are automatically replenishing from

customization/personalization in a high—volume the peiht Qt use an the Way up thtg the Wateheuee

environment becoming the norm. Factories with autematteatty

todav

The second vision is an environment in which a may be able to see that a process is drifting two 0. When it comes to Industry 4.0, lloT plays

factory can manufacture an entirely configurable machines down and will proactivelytake corrective a fundamental role and an area in which

and customizable product at a low unit cost action autonomously. standards become mission-critical. IPC

traditionally only possible via a steady—state and recently achieved a powerful demonstration

static high—volume production environment. The Finally, the fourth vision is big data and smart of the upcoming cFX (Connected Factory

concept of what many people call single—piece analytics. The amount of sensor and machine Exchange) standard at a trade event in San

flow, ltypicallylike the term mass customization. data being produced today alone is immense, Diego, a demonstration never before seen

Let’s take for example a mega—factory that is only and this is only expected to increase as the cost in IloT. Can you provide some insights into

manufacturing an Apple iPhone. This mega—factory of sensors decrease, and control points increase. this new standard and its differentiators?

can achieve a low unit cost because it is running As the number of interconnected factory assets,

fu|| bore with the single design for months at 51 devices and sensors increases, the amount of A. The goal of the IPC CFX committee was to

time.There is no variability at all inaplant like that, data available to manufacturers provides an gather a group of machine vendors, software

and it has an incredible level of cost efficiency. The unprecedented opportunity to generate “smart” providers and end—user customers to collaborate

problem though is that they can only build that insights not possible before. What’s needed is and work together to agree upon afree industry

iPhone. The vision of industry 4.0is that factories contextual insights — and the ability to access, standard that would define the data content

will be able to achieve the same economic and analyze and act on the data quickly. Applying the devices and machines would emit, which is

throughput benefit of a mega—factory, similar to traditional way of extracting and analyzing the critical, and the data transport.The content would

the one building the iPhone. The difference is that ever—increasing terabytes and exabytes of data have to scalable in a way such that as machines

this Industry 4.0 factory will be able to have every is no longer an option. Analytics should also be evolve, their capabilities can be modeled elegantly

other unit that comes down the production lines for the masses, not just for IT or data specialists. without endless delays in committee. On the

unique. That level of “uniqueness\" could be driven Everyone should be able to easily manage and transport side, it was agreed the standard would

from the customer, or it could be one in which the display data that is important and enables real— use one of the generally accepted global lloT

factory builds everything from refiigeratorsto circuit time and proactive decision making to their job transports that is open source and proven. The

cards and every other unit moving down the line functions. The more broadly that data is available IPC CFX standard will eliminate the need for the

might be different. Both are basically “configure— for all members ofthe organization, the more value added costs and complexity of middleware. On

to—order\" but at a mass scale and low cost, and the enterprise can extract from it. the transport side, it was agreed the standard

is impossible to achieve without digitalization. would use one of the generally accepted global

Q. What do you think is essential for lloTtransports that are open source and proven.

companies as they embark on that Industry The IPC CFX standard will eliminate the need for

“THE FiRs1- visiou is THE A5ii_i-ry 4.0 journey? the added costs and complexity of middleware.

1-O CONTROL 1-HE FLOW OF A M O b I’ h h The demonstration and the rapid course to the

NEVER DOWN DUE To INVENTORY transform their factory That perception (Exist: 0“ e Stan ar '8 emg ac lave '

SHORTAG Es AN D To MA'NTA' N today because many of the Industry 4.0 showcase

THE OVERALL LOWEST LEVELS factories, in the mediatoday, have only been able *-1-HE uL1-MATE GOAL is To HAVE

OF |NVENTORY P0$$|5LE ' LEAN \" to achieve that state by leveraging great numbers A PRODUCTION ENVIRONMENT IN

LOGISTICS AND MATERIALS FLOW. :;th:::ro:w‘;lTnan;1ds:(f;t|vs/tare eggitileeesrs to burl: ailwl WHICH MACHINES ARE LOOKING OUT

choose a: M(|)ES|:ystemltl1|a)tnis rnore ofeagtoiiigt BEYOND TH EMSE WES FOR PROCESS

The third vision is one in which processes are then customize that endlessly. Unfortunately, the VARIABLES AND AUTONOMOUSLY

automatically adapting and improving based on result of both approaches is a static system that ADAPTWG To “GHTEN THE

outcomes and conditions — closed—loop feedback. cannot adapt to future changes to the production VAR|A5| UTY OF TH E PROCESS‘ \"

There are a lot of process variables that emerge environment and assets and that requires an

from any kind of production process discrete army of people to keep it running. Our vision is

or otherwise. The ultimate goal is to have a manufacturers, ofallsizes, being able to leverage thgthe Past» the Stahdatd Pfotooote that We Worked

production environment in which machines are a Commercial Off—the—Shelf (COTS) solution to With had CommonfailingsInthelrapproaches-The

looking out beyond themselves for process deliver the same benefits that these large mega— Ptotooote etthetetahdatdtzed the data oohheottoh

variables and autonomously adapting to tighten factories have achieved — democratizing these methodology and transport 0’ Stahdatdtzed

the variability of the process. By being contextually— benefits. For the world to benefit from Industry :‘:jt3e_ot th”e data: oohteht but hot the ttahezott

aware, the machines can act upon those variables 4.0, it should be achievable and affordable for tttoha Y» W eh Ptotooo S attempte to

and adapt accordingly — closed—|oop feedback any size manufacturer. Standardize the data oohtehti they thVaTtabtY did

in a massive Way_ For exampiey one machine it in awaythat was specificto the type of machine.

.........

........... ..................

.......u ..................u

.....3.. .3:3333:33:33:33:'.3::333:3333:3:3:33:3

u........ u............... ..........u...

.. ..333:33:333.....:3. ooclo :33:33:33:33:3:33:. ':33333333:33:'

.::EEEE:.. . ......:EE5EEEEE5EE5E5E55E5E§EEEEEEEEEEE:::.::.:... -‘ESEE5::::::::::EEE§E§E§EEEEEEEEZ\"EE... §E§E5EE5““'

'2'“ .:::E5E§S5§5§E5E§SE§SEE5§E§EESEE5EE5EE§EEE§E\"\"\"'::E '25“ \"E5E5EE55§SEESEEE::.. E55555;

333:'.:3:3::333:333333:3:33:3:33:3333::33:3:3::333:333::3: 3‘ '33:3:3:3::33333:3.:3:3::333.

...................................................... .......................

°:33:3:333333‘3333:3 .33:33:3:3:3:3:33:3:33:333:3333:°.. :33:3:33333333:33:33333.

.......... .... ... ............................... ... ..................... ..

“=3'....\"'E’-:EE252E5.25SESEEEEEEEEEE§EE§EEEEEEI§‘E'..:§ ’EEEEEEESEEEEEEE§EEE'

.:::33:3:........333333:33:33:33:::::::33:3333::::. ’33\"' '::3:33:::33::3:

.:E§ESEE555ESESEESEZ‘SE5:.2‘*3“EEEEEE§E§EE§EE5EEEE‘2 “E55355” °‘

:::33:33333:3::333333.':3:33:' '::::33\"3::3:3\" .. ::::.3:

...u................. u... an an... .. uoulooo

3:33:::33:3:3::333:333:.... ‘:3 33:3: 3:: \":3 ..33..

oiooooooooonooooooooooono . .. .. ..........

.... ................. . .. .. u. . ..........

33333333333333\" ‘:3’ 33:3... .. .3:3333:3:33

............. ......... ..... .................

=sssssasszas \"=====ze--. '=s==: =2ssassa52sassszs=

.33:3333333: 33. \"3333. 33 \"33:3:3:33:3::3

.......... ... ........... .............

3:333:33: 33' 3:3:33:::3:::33 3333:3:33:3\"

'::333:3' ‘ '3333333::3:3:33 333333333\"

'33:: 33::°\":33:333' . :33:33::°

33:33 3:. 3:33:3:'

.33‘ '33:

3:’ 3:33.

3333'

. ~.

»« rm 1

A 1

/V ,

M

, ,5’

,,

I

The problem with that approach, and why all Why is having a standard like this and product shipments. Information vital to safety

attempts in that direction will continue to fail, is important? and control functions and heavily dependent on

because machines are no longer singie—purpose the availability and reliability of network bandwidth,

machines. Today machines are hybrid entities of At Aegis, we believe that it isn't possible to should not be in the cloud. Additionally, one must

capabilities. The IPX CFX committee designed the get to industry 4.0 if you're spending so much also consider security, especially when it comes

data model to be capabi|ity—based and inherently time and money on customized adaptation to to sensitive and confidential information. Even

extensible to accommodate an infinite number devices, machines, and all the cyber—physicai though there are greater security controls today,

of machine capabilities. These capabilities can systems in a factory. Or spending money on you never know when a cyber—attack may leak

then be aggregated together to accommodate middleware providers doing that for you, who will confidential information. When one is considering

custom machines without having to go back to keep billing you as your machines update their a shop floor solution provider positioning their

a committee to get a new data structure for that software and the connections break. We've been solution as completely cloud, one should really

unique machine. Now, with CFX, if a machine developing machine adapter layers since 2000. think on the fact that if the internet connection to

vendor needs to add a custom capability, they We have hundreds and hundreds of machine data that factory lags even minutes, there is nothing

can grab the data content, as defined in the adapters in our stock library. We have engineers any cloud software can do to keep your lines

standard, and insert that into the data content for that do nothing all day but upgradethese adapters moving———uniess the solution is so basic it does

the custom machine. APEX 2018, was the forum because the machine platforms are changing not actually operate rea|—time or handle process

that the group felt was an excellent opportunity to and their software platforms are changing. The controi—and that limitation is also something a

demonstrate the power, ease of use, and validity endless effort to build machine adapters has customer should consider before making achoice.

of this new standard. been a necessary evil in our industry and not

cost—effective orefficientfor any one—customer, What advice would you give to

machine vendor, or software provider. Now with someone getting ready to embark on a

the IPC CFX standard, machine and software digital transformation journey for their

vendors can benefit by reducing customers’ total manufacturing operations?

cost of ownership, while simultaneously leveraging

the ever—increasing machine data that is available. No matter where manufacturers begin their

This fuels the ability for manufacturers to create Industry 4.0 journeys, a modular MES will fast—

their digital factories, and support initiatives such track their success in not only meeting today's

as Industry 4.0. infrastructure requirements but also enabling

critical connectivity they will need down the

For years, the ‘'cloud’’ model has been the line. When deployed, MES shares critical data

talk of everyone, yet the analyst firms show between operational factory floor processes

on the APEX 207 8 Show tteetv eVet 43 dtttetent the adoption rate of cloud solutions for the and higher—|eve| business systems such as

nieenthee Wete Cenneetthg ahd Sending data shop-floor has lagged expectations that ERP, effectively converging IT/OT (Information

to tne Mteteeett Aztite etetid Using tne heW “DC were rather lofty only two years ago. Why Technology/Operational Technology) and

CFX 5tanCtatCt- Anyene On the 3h0W fleet Could do you thinkthat is? What is Aegis‘ position? becoming synonymous with the ||oT platform

aCCeS5 the Websttel ttem any deVtCe» and See powering industry 4.0 capabilities. The greatest

teattlnie maehlne data and analVtlC5 tteni all We do believethere is value inthe cloud model, opportunities for both business and operational

tne Vehdete participating in the deni0n5ttati0h- and in fact, our solution can be fully deployed in gains are derived from a unified MES platform. As

Aegte CteVel0Ded ahd Ctehated the SDK i50t'tWate the cloud if a customer was interested. But our manufacturers move towards industry 4.0, MES

Cte‘/el0DfTient Kit) t0 the tPC- The SDK ie Open position lies more in favor of a hybrid cloud model isthe single tool that can share data between key

Setlteel ttee and aVaitable Oh Gttl‘tUb t0daY- The approach. We believe the value in the cloud lies areas, as well as integrating with existing systems

SDKenabteCttne ntaehtne Vehdete» ttent alt atednd more in the use—case area of data collection to ensure maximum value in the shortest period.

the Wotridl t0 qUlCt<tV and eaSttV take tne Cede th and analysis, but not feasible for the reai—time Without MES, factories are left with a gap that

tne SDK ahd DUt it Onte tnett ntaChineS- Seine status and control of production applications. inhibits industry 4.0 innovation.

Paitletpating Vendete Wete 0UtPUttinQ ahd Sehdthg it is not a technological limitation but rather the

data into the ClDUd ih leSSthaV1fDUt hOUtS§ meet mission—criticai nature and revenue impact that

t00t< at30Ut tntee daV5 t0 integtate it tUltY- 3UCn 51 even a few seconds of latency could have on a

Veleelty Ot tmptementatien 0t a Standatd has net factory that relies on real—time control. Any delays,

been eeeh bet0te- Tnat enCt't0'enCi Pt0Ce55 i5 beyond a sub—second, cannot be tolerated.

proof of a real ||oT standard that is scalable and otherwise’ mere is a Compromise in productivity

robust, yet easy to use and deploy.

todav

Manufacturing Agility,

Adaptive, modu|ar FactoryLogix, a uniquely adaptive manufacturing execution

MES’ and operations solution, drives enterprise—wide compliance,

quality, and efficiency. Designed for today's manufacturing reality,

it connects business—critica| systems, processes, and people-

unleashing the transformative benefits of Industry 4.0.

‘V ‘ V o

. \\ -

V‘ E‘ o /Y _‘‘_..u....-‘ --..,..,_:N‘___........_._. I .

b ’ ,V.__:.; r . ,. .. 5 _©‘ . . Q

.1 £2, v’:-': I H VEWHMH n . .... n -z I i o 3 1. .27\", y‘! nl

; . 1, 1,’... °.\"‘\"\"\\\"'”\"\"'\":\"”\",..:_E%.i.,§ g

7:. ‘l ‘L____, r_:'—~__;.—...-T ;

\\ . . . .

\\ r‘ ''

Delivering Industry 4.0 Benefits

Reduce Costs I Increase Revenues I Optimize Quality

Achieve Compliance Requirements I Improve Customer Satisfaction

fig c- H 0 K C .3;

FactoryLogIx

2 Holistic. Modular. Adaptive. Proven.

.i. ~E~ v

F F 0- - Digital Process Engineering - Quality Management System (QMS)

° L‘ - Manufacturing Execution System (MES) - Tactical Production Planning 8 Scheduling

- Warehouse Management System (WMS) - Industrial Internet of Things (||oT) Engine

- Manufacturing Intelligence - Workflow 8 Rules Engine

8. Big Data Analytics

Learn more at www.aiscorp.com

S D F T W A R E

KEEP UP TO DATE WITH WHAT’S NEW

chemistry solutions is growing considerably. Zenith 2 makes programming faster and simpler

T Electrolube is fast becoming the go—to resource for with advanced features like Auto—Programming,

THE SOLUTIONS PEOPLE specialist technical solutionsthat solve customers’ the KY—P3 inspection system guarantees adrastic

_ manufacturing problems and helpthem bring high— reduction in false calls and eliminates escapes

Electrolube Launches First clear quality products to market faster. The UR5641 with reliable, accurate measurement across many

UL94 V.0 F|ame Retardant PU is a world—firsvtJpervodviJ/cvt), vgenuinely oevffering iafully pin configurations.

- transparent, 4 — ame retar ant so ution

Resln for the LED Market to the LED market. We have now launched the Major Milestones

. roduct loball and are ver excited about

The global eleclloechemlcals mallulacllllell Tine feedbgack we are receivingyfrom customers K0i'i Y0UnQ aCi'iieVed iW0 inaioi iniiaaianes in

Electrolube, has frequently been approached , _ ,, . . . .

re ardin the ros ect of an o ticall clear Curlelllly lesllng The reel” 2.Ol7'.l:llSl’ ll °.e'eb’a‘ed lls l 5Tyeala.nlllyel.Saly'

9 9 P .p P y ’ Since its founding Koh Young has dedicated itself

flame lelaldanl rem‘ AS The demand fol LED I t I b to rovidin innoyative solutions to im rove the

ellcapslllallen ever lncleases’ parllculally Tel Wwwleec mu elcom inspectiongrocess Theindust reco Tnizes this

hazardous areas, Electrolube has developed the roezs in Zgt 7 Ken’ Young insileliied iiegtt ooorn

long—awaited new UR5641 encapsulation resin. inepeerien Sveliem at Dynamic Manufacturing

Technically, UR5641 almost defies convention and a lylalllc Glioup Company .ba.3ed ln Tleepoll’

is very different from other resins that claim to be 5§.TNe Peillrl;lrS.ylV?<nl:’\\l‘vlSA' The Zellllh lnslillallon ‘We’

flame retardant and transparent. Traditionally, in T:‘,r‘f,:j..'::‘?L”‘3‘ 30 l rkl leer Z iollellg Zpeslggnsgilze \"?rSrii’g°i'F’“

orderto obtain the desired flame retardancy resin ' flee beeefiaeeergmliln eien elQS2pi 7 Wnignlldeiivifleg

manufacturers have used solid fillers to achieve ire beer e rrenneaee in ine 1 eer eem en

flame retardancy but such fillers simply do not Koh Young Celebrates 15 years rristei (lieu red with eweriuiysoirwereprne

pelmll allanspalelll resin when Cured‘ Tladlllonal With its Best Peffofmance EVE? Zenithyseries gollects enormous amount of data

liquid flame retardants tend to be halogenated, Wnien nei e eneineere eein eieieiieei ineieni re

whereas Electrolube’s UR5641 does not contain Koh Young -rechnoioev announced its hiohest_ meke reeiier eeiier eieeieiene

any fillers and has the additional benefit of being ever querteriv resuit _ up 20 percent veer_ever_ ’ '

i‘a'°9en iiea year. Buoyed by strong SD AOI (Automated Optical smarter soiutions

. . . Inspection) business coupled with tremendous

o°”Ve“\"°”a' '95“ ihai °'a'”‘ ‘° be “ame SD SPI (Solder Paste Inspection) growth Koh Looking forward Koh Young is expanding its

lelaldalll and opllcally Clear are actually a pale Young finished 2017 as its most successful year market influence across industries with the

amber Whell Cured‘ Many °l These leelns are mosl with double—digit annual sales growth. power of Al (Artificial Intelligence) The company

likely lo be based on epoxy Technology Whlch has been progressively implementing the latest

are prone To Ve\"o\"l’l”9' Eleoliolubels UR5o4T is In particular, the consistent sales growth reflects At tgcnnoiogy to many aspects of its business

based upon aliphatic urethane chemistry, which the industrvrs continence in the Koh Young SD From ine Ame Preeremmine eerivvere vvnien

ls llalulally leslslanl lo The yellowlng effects of Spi and 3D Aoi Pi°dUCi quaiiiy and TU” daieci helps users generate inspection condition settings

nalulal “9'7li ”.‘akl“9 ll ”S.ei“' lo’ b°l'“ e\"le\"l°' detection. Koh Young can even provide rea|—iime quickly to the KSMART Process Optimizer (KPO)

as Well as '”le\"°l ai\"’l'°al'°”3' process optimization vviih po_worfu| SP0 analytics that improves printing quality, Koh Young promises

UR5641 cures to provide a flexible, protective :::t?lilil,il::lrle:s°eT lfielifireoltiflllcyeeslltrsllroeTig$:(:esrt:l:sae Ailreyrieiliileiiijfiylgreda Hgilipendous leap Tollyllald ln

and aesthetically pleasing covering over the product reiiapiiitv p y q y‘

luminaire elements. The resin also offers high “Leer veers Success has reeiiv Set the nigh

resistance to weather, acids and alkalis, water This proedpeseci orovvth centirrns Koh Young is Standards for the kind er reennoieev We can

and mould 9’°\"\"lh' UR5o4T is aTWo’pa'Ti Semi’ the undisputed leader in SD measurement and provide to our customers and the industry \" says

rigid, optically clear, flame retardant polyurethane inspection svsterns Over the course of 2017i JD Shin Director or Giobai Saree and Suplporr at

resin that meals The UL94 V70 Slandald Due Koh Young continued pushing into newfrontiers Koh Youlng Technology “We are hearing from our

To a Carefully Selected blend OT Componellls’ and CiiiVin9 inn0Vaii0n aCi0SS inany indusiiies customers and partners all over the world that

URSGAT ls an exllemely durable’ low Vlscoslly Wiin ii3 Unique llcnaiiangai DNA\" The C0FnPanY our solutions really make their lives easier These

Syslem lhal can be Used Tol a Wlde Valllely OT aiS0 expanded iiS Siiaiagia Paiineisnips Wiih gratifying comments serve to motivate us to try

applications. The new resin is eminently suitable ieedine equipment providers to tuiiv harness the even harder We are Oniv fifteen veers in yet We

for the protection of LED luminaires exposed to pevver of cennectivitv This eitort eiueiitied the are enivi.uSr'Siei_iine re shew new muenlvve can

iiazaidous aimospiieiasv 3'40“ as eineigency Zenith as the first APC—ready SDAOI certified for many help the industry it

lighting, or lighting intended for installation in 0201M components Bevond its technoioeicei '

ATEX ialed/Zoned e”\"i'io”me”l3' advancements, Koh Young celebrated its 15—year www.kohyoung.com

The UR5641 resin demonstrates high dielectric anllhlielsalyi byachlevlllg llsi blgges-T mlleslolles

strength at 11 W/mmi excellent inevmei yet installing its 11,000th inspection system.

conductivity of 0.35 W/m.K and provides a

wide operating temperature range between 40 Product Launches R\} N h

T0 +120 °C- The Fi°HS'2 °°inP'iani iasin also Koh Young did not sit idle with its best—selling ' ‘ll

provides a cure time within 24 hours at 23°C or equipment during the veer in 2017i it introduced

4 hours 31 oo°C- several new innovationsincludingtheZenith 2AOl NEO Tech wins service

_ r and KY—P3 pin inspection solution. Each based

Ron Jakeman, Electrolube’s Managing Director, on the uniciuetrue 3D imaging and dvnernic vverp Excellence Award for

Commemsi “We have bee” iiequemly asked compensation technologies found at the core of Exceptional Customer Service

over quite some time about a fully clear, flame Koh Youne Both nevv inspection svsterns ere

ieiaidam resin Sysiemi arid Saw an oppommlly To designed to overcome long—standing industry NEO Tech announces that it has earned the 2018

provide 3 Soluiio” To’ The LED market Where o”’ challenges like long programming time and high Circuits Assembly Service l3<cellence Award (SEA)

ienuiaiion *0’ Pi°Vidin9 high Paii°”nan°a» iaiiabie false call rates. white the next generation SD AOI in the category of EMS Provider > $500 million

, \\— « 1:4 ‘ ~..\\ 2 . -1- ..-L I . , (M .:a I -' .« g.../ \{,4

' . '51 §\\ *3’: R. '47:”. I w.‘5i:-- er’ 5: g : = - V

\\ U , Ii; \\ -, '4: it

‘ ; ._-, ’ 4_ (I — ;~ ’ :, ‘ \"\"' -3‘

< ~ v 3:»/«..£./, -—

e —‘_«,»~‘-‘~.‘_ ‘ * s

-7-«...',_ I e ;~ eysa L P

. I-‘ ' —

— - -

. j I‘ > ‘:5 ' __L_,

l ' ‘ _ 4?

. ._ g_ '—D|SCDVER 7 _

* - \\ SMART

2 - xg, \\ LTECHNOLOGIESJ

‘V '- Ersa HOT_FLOW3serie5)$~'; . §\\,: ‘ V :3-_,

. ,Proc_ess \{ones 175.0’ m \{r \\ ‘fix '&\\ w.;\\_ _ . ;_:_ 4“. : '

‘_

' ~ \\. 7 x. V.‘

Excellent heat transfer with the most varied board assemblies =53’-‘ , » v .1

. . . . I-»

Rest—oxygen monitoring and control with low N2 consumption ’ - 7/ .'_‘

Low energy consumption through intelligent energy management :

Mu|ti—level controlled cooling Process tunnel, testedfor tightness,

Mu|ti—level process gas cleaning system 9\"°'°\"t\"sl°\"9'te'\"' stability

\"0n—the—F|y\" maintenance for increased machine availability / uptime . , ____...'zs ’__

Mu|ti—track conveyor system (1-4 tracks) ; \} I

Ersa Process Control (EPC) for continuous process monitoring \"I ~ - _ _,

Ersa Auto Profiler software for quickly generating temperature profiles ‘ ;

Ouick and easy servicing through

excellent accessibility

Ersa North America. Inc. Kurtz Ersa, SA de C.V. I Mexico

1779 Pilgrim Road Kurtz Ersa Asia I China

Plymouth WI 53073 I USA Ersa Hong Kong I China » k t

Tel: +1920 8931779 Ersa Shanghai I China u r Z e

[email protected] Ersa GmbH I Headquarters I Germany

for its outstanding customer ratings in both the the expansion of Nihon Superior to its current =

Quality and Delivery categories, as judged by its position as a major supplier of lead—free solder - \"

own customers. Circuits Assembly Editor—in—Chief to the global electronics industry.

Mike Buetow presented the award to NEO Tech TNERMAL SYSTEMS

during a ceremony on Tuesday February 27, 2018 www.ni'honsuperi'on co./‘p/eng/ish. ii . ,,

at the San Diego Convention Center during the Voter _Expert _ Expert Datebase

IPC APEX EXPO. Covering all Aspects of Voids

_ _ _ Rehm Offers Straightforward Tool for

Sponsored by Circuits Assembly, the Service _ _ _ _ _

Excellence Awards for Electronics Manufacturing Mlnlmlzlng Volds

Services (EMS) providers and electronics assembly , , , ,

suppliers honor companies excelling in the crucial DAGE letedldlrernente tor troldfrree eolder lolnte are

area or Customer Service The program’ now in continuously increasing in the field of electronics

its 25th year, functions as a way for participants Nordson DAGE announce the rnfan“tatct”r,'n9tih\"e' tne rettdctlton her ellrnlnatlog

to see how they compare to peers in customer iaunch of Para on-i-M Materiais o cal\" lee 'n e connec ton ec no ogy “Se

satisfaction. NEO Tech received this award based 9 eetween_cor,nponent connectors and connector

0- some 2232,3224:ri?.r*;::.::;a::m:i;:

iirnis acnievement recognizes NEO Tecnis Nordson DAGE, adivision of Nordson Corporation influencing tactors and interaction amongst the

excellent customer service throughout every level (NASDAQ NDSNl- and the leading supplier rnecnanlerne wnlcn result ln Verde-

of ourorganization,\" stated David Brakenwagen, of Bond Test and Materials Test equipment . .

NEOTech Chief Sales and Marketing Officer “Our announces ine launch of Paragon” Materials the ‘?°°”rre.r‘ce or \"°'dS '3 Surely °\"e .°t the

goal is to partner with each of our customers and a neW suite or soi'tWare designed for performing meet '.”tere3t'”9 phenomena a33°°'ateF‘ Wtth Sort

surpass their expectations of service, support, mechanical tailure analYsis on a range or S°teter'.rtg'ASer”te’ te.rg.er °r3”‘.a\"erV°'°l3 Cert be

quality and technical knowledge while successfully micro’materials- teund tn meet S°\"‘l9li°'n.t3i Whteh are termed es

introducing new products to market in accelerated trte result or gas wrtlch '3 trapped tn the molten

timetramesgi It is an exciting time to be in the micro—electronics solder- When the molten solder hardens- these

industry as devices continue to become more gas bubbles are troZen into place-

NEO Tech’s goal is to successfully convert complex and demands on their performance _ ,, , , , _

customers’ product technology into engineered increase- Furthermore» expectations on product .-the retteetttty °r'.“.\"3r S°'°leri‘?'nl3 re net.neeeeS.e\".ty

products’ providing the meei Capable Supply irtetime are as criticai as every meaning new influenced decisively by voids contained within

base, manufacturing products with care and device evaluation needs to assess both long— them; _aith0ugh there are exceptions F0_re><ample-

delivering ihem on “me The Company is rerge term tatigue and cvciicai per-rermance Adding to sensitivity to voids is taking on new dimensions

enougn to offer refined Tier 1 tooisr processes this complexity is the fact that failure can come With regard to eVolVing pacl<age trends such as

and capapiiitiesr vet smaii enough to provide from many different sources including individual LG_/as and QFNs-_ The greater the poi/Ver loss

individuaiized care and service. NEO Tecn provides interconnects, surface components, the substrate Which_ has to be _dissipat_ed _Via a solder Joint» the

taiicred proiect_py_proiect services tnat tocus material, or a combination of several of these i°Wer_its tolerabilitY to Voids is- in particular solder

on each Customer-S individual’ unique neede sources joints in power semiconductor devices should be

The result is a true collaboration in which the nearly Vo'd’tree'

customer's needs are met — or exceeded — in a learagonm Materials is speciticalll’ designed t0 _ .

timeivr efficient and cost,etfectrve manner tackle these complexfailure modes and take the This expert database makes a considerable

operator straight to the root cause of the failure contribution to understanding the mechanisms

WWW Ngorecnrcom mode. Traditionally, micro—materials testing has inV°lYed in the occurrence tori/bids and outgassingr

been ciitficuit tc setup and even more taxing to and identifying the essential influencing variables.

extract the correct failure information from the lntluencing Variables and the WaYs in Which they

raw data paragonm ivrateriais presents a ciear interact are explained in a very clear—cut manner

interface to the user featuring built—in analysis tools With reterenoe to the respectiVe response Variables-

. and statistical algorithms — allowing the user to Various graphics and Pareto charts h_elp to clarity

find every taiiure vvitn ease_ the ||'ltel'l'e|at|O|'lS|'.lr|\[|:S, Vtlllhlch alre quite corgplex

in some cases. is a ows e user o raw

Tetsuro Nishimura Earns IPC Alan King, Business Director, Bond Test and conclusions regarding hbWVcids canbeminimized

Distinguished committee Service Materials Test commented, “Paragon” Materials tor certain applications-

is a software platform focused on the mechanical

Award testing and data analysis of materials used in The expert database deVeloped by Dr l'leinZ

_ _ i _ _ ccniunction vvitn tne packaging or ccmpiex Wohlrabe from the Dresden Technical University

N'ncn,S”per'or_Co' Ltd\" an advanced lclnlng electrical devices. Bondtesting typically evaluates presents results Which are based on Work

rnaterlal edpplleri today announced tnat rte the integrity of interconnect associated with die conducted bYtheVcids Workgroup and knowledge

Preeldent -retedro Nlerllrndra nae recellred a and integrated circuits, essentially their connection gained through preVious projects (in some cases

Dletlngdlened oornrnlttee Service Award to the outside world however micro materials subsidiZed projects)» as Well as the international

ln recognltlon end acknowledgement or nle testing concentrates on evaluating the strength literature- Experiments conducted to this end

e><traordinarY contributions t0 lPC and the of tne die and packaging itseitgi were evaluated by means of statistical methods.

electronics industry lPC—Association Connecting

Electronics lndd3trleS® Presented tne award at This second level of functionality is especially The database is continuousli’ Updated With neW

the recent IPC APEX EXPO that took place at the appiicabie to researchers when quaiifying new findings and can be obtained from Rehm Thermal

San Dlegc Conlrentlon Center materials and quality assurance when new Systems-

Nishimura received the award for his contributions products 90 Into production Advantages at a glance:

to the 524c Solder Alto)’ Task Group that “Paragon” Materialssoftware isapowerful addition

developed Amendment 1 to .J—STD—OO6C. He to our arready Successtur and esiabrished micro 0 Database with freely selectable access to

was recognized for making significant contributions resting capabiriiygv experimental results and comparison thereof

to IPC and the industry by lending his time and as desired

expertise through IPC committee service. WWW_nO,ds0n‘Com G h_ rt

- rap ics expo

Nishimura is recognized throughout the electronics

industryastheinventorofSN1OOC and the pioneer 0 Comprehensive documentation section

of micro—alloyed solders. In addition, since his

promotion to President in 2004, he has overseen www.tu-dresdende | www.rehm-group.com

'. ‘ »\". . -_ ‘D Q./'.');'

- . _, . . ‘.'-.. —,‘-;§ _

‘ 1-

. 4’

us. A ‘ ~25.-» .

uf: 1‘. ‘ ‘ f, u

M an

*1

‘ Lil i‘ L

i Li -— ~*<‘l ‘ M

__ , . g _ __g_

. - _-ms: ..g\\x‘_\\x\\\\\\ A ‘ i ‘V i 4 _

\\\" . . ,_ _ E . . . ‘ V A _ _ A __ _ _ . ‘ > ‘

‘*\\““‘\\\\'i‘\\;\\l“‘\\ L ‘ .

ls : “L L i ,_ , L W '9 id‘

.>‘ '.§_- ‘V 7 gm . V‘. ”- f\"/ / .i

‘ 5-v§ *

as ‘ as

. A

‘ DWKZEN ANALYST D l ”3érVi//* W

, __ . \\. . (l (P » CBS ,

f o _ o 7 \"V ' o

. \]USl made your I lie 0 whole Tot easier.

Now you can access and monitor wash bath concentrations and trend processes from multiple sites and cleaning

machines no matter where they, or you, are located in the world. Real-time access, traceability, advanced data

analytics, user-friendly customizable dashboards and alerts all come together in the most comprehensive data

reporting platform available today, including for any PCS installed anywhere. SQ, RELAX.

Complete process monitoring that's faster, more precise and secure makes any job feel like a day at the beach.

For More Information on ANALYST Data Services

Visit Anu|ystDutuServices.com

WORLDWIDE ENVIRONMENTALLY RESPONSIBLE CLEANING TECHNOLOGIES

\\ yT\\ F\\

\\ 5. Li L i

Wflbaita ©@f@3n@@ Gmcafl @@L?@ @@

KY 2 E N . C O M

C.gpyrij|t®KYZENCorpomtion2018.

A||R£ghts Reserved.

TECHNOLOGY TODAY FEATURE IM 5\"E“\"\"A°

Technology Inc.

BY HSIANG-CHUAN CHEN, YA-CHING CHUANG, CHIA-HAO CHANG, WATSON TSENG

ABSTRACT Wetting test

For several years, an approach to use fine-pitch flip chip package %'%F;er:r:\"eae3\}Exs3£t\";r\";

(<150um) with copper pillarl microbump is for the realization of 2.5D/3D on it. The alloy composition of BGA sphere is

packages of higher density and performance enhancement. Generally, 95-r\}’>3\"/3-cg)/tffi-50\" T(St3AC30~’t’- R9f'f°;V4;Vaé

flux is widely used to clean the surfaces to be soldered for good wetting gfid gggie for 3(‘):.F’t‘,9t;\"‘etta:)ri:\}tF:,e‘,'vaa;'ftec;tsureC§’in

and form reliable /omts. The upcoming concerns about fluxes are spreading ratio by digital microscope (Keyence

clean-ability for fine-pitch package, voiding and compatibility with VHX-2000)-

“\"de\"\"” \"73 t9’'’a’5- Evaluation ofteliability and underfill compatibility

For chip reliable evaluation, the standard process

There is a tradeoff between flux characteristics EXPERIMENTS of flip chip package was performed. The FCCSP

and soldering performance. Therefore, this paper , test vehicle was simply carried out using a die

will discuss in details about the applicability Preparam\" of flux Samples (8x8mm in size with bump size of 80pm and

of a new no clean flux in fine-pitch flip chip Two flux samples, named F1 and F2, are bump pitch of 150pm), soldered onasubstrate

interconnect from the point of view of flux developed with different compositions in this (12x12mm), The procedure of heating treating

formulations, including flux activity for wetting research. In general, flux mainly comprises is baking the package at 125oC for 24hrs,

performance, rheological characterization for rosins, thixotropic agents, activators, solvents followed soaking at 3OoC and humidity of

the study of behaviors during reflow process and other additives. Table 1 present the brief 60°/ORH for 192hrs, and reflowed 3 times of

and the evaluation of compatibility with underfill. summary of the flux compositions in wt% for the peak temperature of 260oC_ voiding check

As a result, the flux with higher activity showed both samples. The basic properties are also was observed by X.ray machine (Dage 7600N‘|')_

better wetting performance as well as good listed in Table 2, including viscosity, thixotropic Micrographs of the |MC layer in solder joints

compatibility with underfill materials. Rheological index and acid value.

properties of flux can be controlled by modifying

the formulations to be applicable in dipping :1 pg

process, and keep stable during reflow process.

In addition, long term reliability of thermal shock 48% 60%

testing was determined. Hence, evaluation and

selection of a suitable flux is very critical for a

robust advanced package process. 10% 9%

Flip chip package technology has been extended 33% 26%

increasingly with the adoption of copper pil|ar/

microbump for the finer pitch to meet the 1% 1%

demand of higher input/ output (I/O) density.

Hence, fine-pitch WP Chip i\"leTC°nF1eCt i5 Table 1.The description of two flux samples

becoming a main trend in advanced packages

of semiconductor assembly industry due to the

miniaturiztion of modern electromics, such as F1 F2

application processors in smartphone and image

processors in digital cameras. 4143 375

Flux is widely used to clean the surfaces to be 0.746 0.419

soldered for good wetting and form reliable

joints. In addition, the cohesive property of flux 15230 12103

can keep the die in position and hold it during

reflow. Water-soluble flux, which can be applied Table 2_ Basic properties of two flux samptes

in a dispensing or dipping way, is generally

choosed to employ for flip chip package, and . . ‘

therefore the upcoming concern about flux is Rheologmal behawor Wére P9\"i°|'m9d 0\" C\"°55'59Ci'°”9d Samples

clean-ability for fine-pitch package. However, The correlations between formulations in flux “SW19 SEM-

flux residue is unavoidable and removal of flux and applicability for dipping process were

residue on the surface of fine-pitch package is investigated into the rheological properties RESULTS AND D'scUss'°N

extremely difficult due to the gap between die of flux materials by a parallel plate rheometer _ ,

and substrate is too small, \[1\] hence a move (Physica MCR 101). Measurement of viscosity Study on rhe°I°9’°aI b9haV’°r

towards the necessary use of no clean flux is against shear rate was obtained with the shear The rheeteeteat prepetttes of the two fluxes

inevitable in fine-pitch flipchip interconnect. The rate from 0.01 to 100 1/s. The visco-elastic were determined via measurements Obtained

flux |'ESld'lJe‘C‘)n the surfacethas atpossibility to behavior of flux was characterized through the during rheological testing \[4\] Designing a

affect reliability due to the impediment to flow oscillatory stress sweep test which applied at flux for dipping Viscosity and thixetrepy are

ability and property of underfill materials, \[2, 3\] a constant frequency of1 Hz and shear stress the two tmpettment factors that should be

asa result, the compatibility with underfill should in the range of 0.5-500 Pa. taken into eeneideratien because they have

be also taken into consideration.

' SHEN MAO

5 Technology Inc.

an influence on dipping performance. The viscosity for

20000 —I— F 1 dipping is recommended in the range of 40:20 Pa-s and

_g_ F 2 the thixtropic index is suggested being greater than 0.60

technically. A stringy phenomonen that causes inconsistent

A dipping amount of flux easily occurs when thixotropic

‘9 15000 index is smaller than 0.60. The viscosities of F1 and F2

(5 were measured to be 41.3 Pa-s and 37.6 Pa-s while the

E-_ thixtropic indexes of F1 and F2 were measured to be 0.746

> and 0.419, indicating F1 was less stringy and more suitable

: 10000 than F2 in dipping application. A plot of viscosity against

U, shear rate for the two fluxes was illustrated in Figure 1.

o The viscosity was not a constant value but varied with the

U 5000 shear rate that exposed to, and furthermore the viscosity

,2 decreased with increasing applied shear rate. That meant

> both F1 and F2 were shear-thinning behavior which was

_ a common form of non-Newtonian fluid. Thixotropy is

0 T a time-dependent property of shear-thinning, providing

drip resistance when at rest but easy to utilize when a

stress is applied. The different thixotropy as mentioned

15 '3 0-01 0-1 1 1° 100 above can result from the chemical composition of flux

system even if there was only a tiny difference in the ratio

5 I1 E3 T R ate ) of thixotropic agents.

Figure 1. Viscosity against shear rate of fluxes. “WATER'5°LU3'-E FLUX» WHICH CAN BE

APPLIED IN A DISPENSING OR DIPPING WAY.

IS GENERALLY CHOOSED TO EMPLOY FOR

FLIP CHIP PACKAGE, AND THEREFORE THE

14000 (3) —I— G’ storage modu|us UPCOMING CONCERN ABOUT FLUX IS

_._ (3.. loss modulus CLEAN-ABILITY FOR FINE-PITCH PACKAGE.\"

12000

73‘ To understand the changes in flux microstructure under

E 10000 stress during process, the visco-elastic behavior of flux

~.v was characterized through the oscillatory stress sweep

: test which applied at a constant frequency of 1 Hz and

0 8000 shear stress in the range of 0.5-500 Pa. The measurements

6 of storage modulus G’ and loss modulus G”, which were

= 6000 shown in Figure 2, can represent the elastic (sloid-like

a feature) and viscous (liquid-like feature) properties of

. flux respectively. The linear visco-elastic region, where

0 4000 the G’ value is not affected with varying shear stress, is

defined as the maximum deformation that can be applied

2000 to the flux prior to the disruption of its microstructure. The

broader linear region of F1 over F2 indicated that F1 had

0 _ a better’; lstrur<1:tL:1rehresiétanf:e tcgvléards applieed‘ strefss;t\[)'|.S\]

meanw ie,t e ig er ’va ueo represent pre er e

0'1 1 1° 10° 1000 tack which can prevent flux from wicking after dipping.

Moreover, the dipping performance is also correlated to

S hear stress the ratio of G’/G” and the stress value at G’=G” because

the G” value is a fluid-like characteristic which is the

5000 opposite of G’. From the Figure 2, F1 showed optimum

G, t d I G’/G” ratio and the higher G’=G” value than F2, indicating

(b) S orage mo u us F1 was more difficult to flow during dipping process.

—O— G\" loss modulus Therefore, based on the designation of flux formulations

4900 and the rheological properties, F1 was proved to be more

as applicable for dipping process.

9:’ Investigation of wetting performance

; 3°00 The activity of flux plays an important role because it could

0 be served as the capability of removal of metal oxide on

.6 solder and pads. It has been commonly known that the

= 2000 higher activity of flux, the better ability to remove metal

N oxide. The wettability of flux was measured as the ratio of

_ solder diameter between post to and prior to reflow. Figure

0 3 shows spreading area measurement on copper sheet

1000 of both fluxes, in which (a) and (b) are reflowed at 245oC

and 260oC, respectively. It was obviously observed that

. spreading area on copper sheet of F1 was larger than F2,

0 indicating wettability of F1 is better than F2 because of the

' difference in acid value. From Figure 4, it is observed as

0'1 1 1° 1 0° 1 000 temperature increased, both fluxes showed the same trend

of increasing spreading area. In addition, the increased

S hear Stress spreading area of F1 of 7.43% was much more than F2

of 4.20%. That means these two fluxes have different

rheological behavior at high temperature because of the

Figure 2. Storage and loss modulus as a function of d'fie\"e”t flux f°\"\"\"”'at'°\"5-

shear stress for (a) f1 and (b) f2.

‘M S H E N MAC

4 Technology Inc.

—s .... '1.

I \\‘ e V N‘ V . . .

Fl _ A ’ '72 e . ,. ._ '._ V

Figure 3(a). Wetting test of fluxes on copper sheet at 2450C. “ “ — ' . . ‘

V _A /» Figure 5. X-ray inspection of (a) f1 and (b) f2.

~ Q l

. ‘ -' (a) After flip chip (b) After underfill (c) After heating

i , - , Cu pillar _ i . i .i

. 1-\"1 ~;F2:¢ . K _, _

Figure 3(b). Wetting test of fluxes on copper sheet at 260oc. hr —.w:n ll\\

195 e :e: eeee 7e.e»e.ee l , K . 7

i .

190 : - - ' _ -

\",5 $ i ' L l|,Il‘»,l,l!l l.\\||,' ,l~1\\«:r

.. l '

.\\° 130 ' ' '

E175 \"“\"\"“““ “mun” D\" e‘\"'‘

§ 170 $ ,,~— . , . —

= ; we we

*9 155

3

150

155 Figure 6. Sem images of interface inspection.

F1 (245) F2 (245) F1 (260) H1260)

Temperamrelocl Therefore, investigation of instead of flux residue were discussed. The

the interfacial reactions is relationship between compatibility of underfill

_ ,, important and crucial to and flux residue of different flux formulations will

F'9ure 4' Wettabmty ef fluxes at 245°C and 260°C‘ the understanding of solder be discussed in the further. Therefore, the best

joint during soldering. no-clean dipping flux was achieved by a well

Evaluation ofreliabilityand underfill compatibility Figure 6 showed typical rheological, synthetic, high activity formulation

SEM ' h fth 'trf bt F1.Th It fth\" h '||h| t

Voids are defined as Cavities formed in the coppe?lglllglrffiliirgbunednaidaggjipee 2:3: Zefine opt(?n::|S:o:1:atid:it:e:?fall1‘:< afllcll unilgrffil

Solder joint‘ Voids are Created by the ameunt in the consequent steps of flip chip process, for flip chip process.

of outgassing flux that gets entrapped due to which (ai is the Step after flip Chip bending. (bi

Surface tension in the Solder joint during reflew‘ is the step after underfill encapsulation, and (c) CONCLUSIONS

In ether words’ the eutgaeeing ef entrapped is the step after heating treatment From the

flux is directly responsible for the major void images aeeritiniieiie and uniform WK‘: iayerwae In this research, we bring theory to practice

formation. These gases have been believed to found er the interface and the thickness of MC that a formulated fiux in. a dipping way is

be caused by fluxing reactions between solder ieyer become ierger c'iue to the aging and heat developed for fine-pitch flip chip package of

materials and flux formulations, especially the treatment after Steps (bi and (Ci reepeciiveiy copper pi||ar/ microbumps interconnect. The

activators. X-ray inspection of both F1 and F2 ' ' following conclusions can be formulated:

was showed in Figure 5, that F1 with higher . . . .

activity was realized to be lower volume of voids. .,Ti_i E AC.iiViTY OF FLUX PLAYS AN 1'Ai:r(i:DrCije'ng ti? theizhiologkimil Chari:ft.er'Zat'Ce)3

Since flux with higher activity was supposed iMPOR_i_ANT ROLE BECAUSE ii, COULD ? bux age on i. etfijmrm ad'.°nS.’ eprov

to generate more fluxing reactions and more D e more app ma e or mpmg process‘

°Ul9a55l\"9 dl-‘ling T9fl0W. leading 10 higher BE SERVED As THE CAPABILITY 2. The relationship between flux activity and

voiding rate with more risks of mechanical and CF REMQVAL OF METAL Oxlm‘: ON wetting performance was im,e5tigated_ |t is

eledllcal d9f9‘3t5- \[5\] HOWEVER f|'0F|’| the POW Of SOLDE R AN D PADS clear that F1 could be contributed to mitigate

view of the designation of flux formulations, flux the issues of Voids with good wettabi|ity_

with higher acid value is considered to eliminate Fiux rermuieiiene er F1 Wee ideniiriee ihei ere _ _ _ _ _

oxides more rapidly and completely, thus the eem eiibie with uneeiriii meieiieie The flux 3- R<_9l'3b'l'lY lest Of C°PP<?T_P'”5T/ \"\"'CT°PUmP

outgassing is more efficient at reflow. Hence, the reimflieiiene were nei ieedin en efieeie en Wllh F1 5h0W9d _9°C_’d J°'\"t V951-‘H5 W'tl_‘°Ul

flux activity is critical to voiding performance. the iiew eeirermenee er undgriiii lee e reeuii Clagksjngfielamlnailcg beeween flux \"95'dU9

- i an un e i materia a er eatin treatment.

According to the rheological characterization no delamination or cracks were found at the g

and wettability oftwo fluxes, F1 was the better interface of the bump and underfill, as shown

choice for the application of flip chip bonding in Figure 3(b) and (c). Generally speaking, low

process. Hence, F1 was chosen to do evaluation residue flux formulations provided the best

of reliability. One of the major influences on compatibility with the underfill materials. \[3\] lnthis

reliability was the solder joints microstructure. research, F1 is a conventional flux with residue

around 40-50wt%, and only flux formulations

Experience Your

CW \\ to V g’ s

'_ ' / — it I. , -= *3

7 In \{xi \" __ ._ -l :. ,

Au / 3 2 . _ 6 T .

'«-3‘ \"

.. 4.» W‘ ' ,

\\ ‘ J5 ; P I ' -1

V ‘ A ‘L’ ‘ ‘ I , .’33%’:/i7#33:;?33:...... \" \\‘ \" Z‘

a g , ‘V r I rmmlfl,-' ;;;.‘;..-;., _ , V l, _

‘ ‘qt /4 I ,l..H_F‘F5“,--wry‘ fl Q I

_ R V u//llllllllllllllf ,

HENNY PENNY

Engineered to Last

i t :2

r- we I

.=-I \" , _ _ _ ’ :4

‘ll|||lll‘ll:|llIl;lll_j I

'. I I9. . . ~ . .

1 1 ‘ ii‘

The SM471 PLUS Fast Chip Shooter is a high performance chip shooter which applies

two gantries equipped with 10 spindles per head as well as a new flying vision system.

The SM485 Wide Ranged Component Placer allows high speed placement of

small components, as well as precise placement of odd-shaped components.

R\] NEOTech

For GaN and similar advanced die or |Cs, truly

“hands-free\" automation requires an accurate,

high-resolution method for dispensing the

precise amount of epoxy every time. The die-

bonding platform must be constantly stable,

regardless of fluctuations in temperature

and humidity. NEO Tech’s unique machine

configuration consistently achieves high-

precision epoxy dispensing.

NEO Tech partnered with leading precision

E€,.W_é._._'w I assembly equipment manufacturer Palomar

‘- .;j‘‘'.'.E ‘ I , - _ » , to develop and produce specialized die-attach

f- ‘. I: I ’ » ' ~ _ , ‘ I ' ’ - , . r‘ — ' systems using optically balanced breadboards,

' ”3I-\"'. . ' f ‘ I ‘ 5 _ , ' ' ‘ ' - with internal dampening built into the honeycomb

: , -' . I , . ‘ '- ‘ '7 , structure. The equipment's resulting superior

' ' ‘ _ _ -‘ vibration dampening supports precision die

*,IgJI\".f_. — __ ‘ -. ..., ' _

A wlkkh\" \"£'4‘R5.!..‘.LA.A.‘.‘_..'..'_::.‘ .- I A -M I ~.~..5.- - attach at much higher Speeds

‘-=--:=«* '- T-‘:~ - -II.-_.,_.._..« .7.-I ;-«I-.1-, l!FfI!'| ~

\" -T I ' I ' I \"E\" 7‘ \"-.‘.\"\"“'j ' '_ “NEO TECH wAs ONE or THE FIRST Us

.. . . N .—L . . _I E II

,' ... T 1; I -gr‘; £1! _=: . ' COMPANIES To BRING COMMERCIALLY

$7 l «I_u,m. “I E #1‘ I .5‘ , I 5\" ‘ . AVAILABLE, INTEGRATED

. I g E E- EN 1 n I...-I.I:‘ — r:IFn.,1'»_II . , AUTOMATION To VERY THIN AND

3 Q5 IEEI I -5 ,; '; I1: FRAGILE sEMIcoNoucToR DlE,AND

,- 5% -I _.’,|_,r\"T=‘. 1 I51 L=_J_ n .; I THE LATEsTINNovATIoNs AREA

‘ -. I-— \" . . ' - . \" * . » l

I LI-'I‘ .EEEd §:'rI_._.‘\[;_:..’_lI‘I_'I‘| ht. I I, nu ,‘ I I :|CGHN||EF\\|l(EZI:hE'L:XTEN$|0N or THIs

I “'5: *5. E; :_ I — ‘ '.:,,.,:T,,; - 4 ‘

*2“; III I“ —; F‘? I I-E - I-E -

v‘,:&' I \" Ir‘I an :‘ \"II_.

9 ., :\\ . , . . ..

_ ,,.u._. ‘ _ E to reliably handle large, thIn, MMIC devIces.

—-\"_\"-'_ '-'\"\"\"\"\"\"\"\"\"\"“ - \"\"\"\"\"“ ' Developments include extremelylaccuratle

~2»lI,‘,3_-‘.-,_.;_- I I I I I dIspense for epoxy and a proprietary dIe

:' I . I I eutectic attach process, using solder preforms.

\" I I ‘ These innovations enable manufacturing of

‘ -ijI,‘.'<1;f,’_:',“‘__-,. ' I MM|Cs with minimum voiding under dies as

\"r\"§§‘:.\";.‘ § thin as 0.002 inches. Originally, NEO Tech

\" ‘ developed this system to meet the needs

o Ig -re Ia IIty app IcatIons In e ense,

fh'h |'b'l' l' ' 'df

While designers can reduce the size of a automationtoverythin andfragilesemiconductor advanced teIecdn-In-Iunjcatidns, and ImpIantabIe

device using GaN technology, it creates new die, and the latest innovations are a significant medICa| deVICe5_ system designers u5Ing Ia.-dd,

complications. The more sophisticated the extension of this achievement. For example, thin, MMIC devices In Ineir high.fIequeI-Icy

device, the thinner and more fragile the air- in existing manual or semi-automated appncatidns now can work cdnfidenuy Witntnis

bridged die, the higher the number of I/Os, and lines, operators must subjectively judge the dptidn for bdtn PI-dtdtypqng and manufacturing

the smaller the pitch between interconnects. coverage under the die and visually estimate at 5Ca|e_

These micro-miniature structures make it the permissible amount of material extruding

more difficult to assemble rapidly, accurately, from the edges, incurring the variability

consistently, and economically. Conventional inherent in such methods. NEQ Tech’s new “Auto «IFOR GAN AND SIMILAR ADVANCED

methods of handlIng complex |C’s typically LIne” Is dedicated to performlng and measurIng DIE OR Ics TRULY ..HANDs_

231353.322lZ%?£i?§§\"SlZ§;n\"§\"§n2\"lilffbilffififif Llfdfiiinkg\"§IZLiIIZ2§?$£'3'I§$’§§§£§ElI§3 FREE\" A°T°MAT'°N RE°U'RE$ A\"

leading to lower yields and reduced reliability. quality and reliability.

To overcome these labor-intensive, process- PRECISE AMOUNT OF EPOXY EVERY

dependent elements, NEO Tech has introduced “THE MORE sopH|s'rIcA1'ED THE TIME.\"

its new generationhoftassteI‘3tI|y automation, as DEVICE -I-HE -I-HINNER AND MORE

We as \"We SOP '5 '°a ‘9 EV” ° F\"°°°55 FRAGILE THE AIR-BRIDGED DIE, THE . . . .

characterization, enabling lower costs and HIGHER THE NUMBER OF I/Os AND The Industry average for thIn dIe damage In

enhanced reliability. THE SMALLER THE PITCH BETWEEN handling before placement into a higher level

H assembly exceeded 20 percent. For odd-shaped

NEO Tech was one of the first US companies 'NTERC°NNEcTs~ and extremely thin die and |Cs, NEO Tech’s fully

to bring commercially available, integrated automatic eutectic die-attach process performs

”“rF@ rmiancllui lll?fil’r‘ll‘l§y”“

I

5!

F”

E733! _

“ZERO STRESS” __$ 3 V

30 W Short Wavelength Laser source. “ U ‘

25 Micron positional Accuracy I I

100 Micron spot Size ‘ , SI ix '

Minimal HAZ exposure to substrate ‘ V |

In-Line or Stand Alone I I , ' -~ ' ‘|

Full MES integration capability _ ; |

for traceability. ' i \[:3 ‘

u 7 3' l;

I .;| I

' I

m NEOTech

.= —

I‘

av a

~—n ' \\ \\._\\>‘

, C: '3 .1

’» - ‘ I5.

I M : ' ‘ : IN» 5’,

‘*- \" H» \"W I a

' 1 ’ 1 - I\"-I! -.

J . té‘ _ 7 _ 1'7 7 ‘N 3, 3‘ ., .,

=*v _ »i '____,:-i \\ . ff |_ “ I \" I

. I , .56

I A 5 , .

, . I II ‘I ‘ 7 ' .

‘ /_,

I 7-; ‘ ' Ill ‘

‘V ‘ 3’ . I V .

- I ,‘J_;.,; -

I ~ I I

I ‘ “ ‘ I

I _ , ; ‘: ’

‘ ‘ ls,» ...v' .- ' _

_ _~_. . ,5 ‘ > 7 - .

with consistently near-zero rework. In addition To further guarantee reliability and quality,

to practically eliminating damage and rework, thorough cleaning is mandatory to prevent latent

NEO Tech's continuous, contiguous auto line defects in interfacejunctions during wire-bond

guarantees planar placement of these delicate interconnect. NEO Tech’s automated process

die with minimal interface voids. includes in-line argon plasma cleaning just prior

to wire or ribbon bonding, ensuring complete

For the notoriously sensitive eutectic die-attach residual organic removal without exposing the

method, the tuned handling and improved IC to ion or U\\/_

process accuracy represent significant

breakthroughs in product quality, reliability, NEOTech’s hands-free, continuous, contiguous,

and cost. automatic MIC assembly lines operate in a

lean manufacturing environment, with high

Increasing overall process consistency by repeatability and near-zero rework. High-

eliminating touch in areas such as epoxy frequency system designers seeking domestic

dispense and eutectic attach was the critical suppliers offering the highest quality and

first step. Gaining the full economic benefit, the most cost-effective MIC solutions are

however, required integrating these and other encouraged to take advantage of these next-

advancements into an automated line capable of generation capabilities.

producing high-complexity devices at rates and

yields supportive of today’s most demanding

programs. NEO Tech has accomplished this with

a level of quality and cost-efficiency exceeding

existing MIC assembly touch methods.

an I‘ ‘W —— ..: -'.\{-3‘ .v-.1-* a »

I - .1 \" .‘ I . . -'

i .: -3; ‘.3. ff?» ..:ii:§ _ J

\\ _ ‘.‘ _.' . at-_‘-'0 ‘n \" ','_ . ' .‘

~ ' ‘ /.v\"o:3-..'*'-'5' ‘A \"J

°\"£ ‘:3?’ \" . 2* . ’

. ,_\\\\/\} .vz:...'_4-.5. ..

., _, ‘ .::— \"4; .- ».-v

- -. _+,:.~«~, V ~ so ‘-

E . _'_7.‘_.”’ j V» V . . ; ,.,’._,

. , fir . ‘ _ /. . ,‘;::~ .2;

xx. , ,-:5: F-— I ._ ,1 s

\" ' ' -W .<'¥~-' ' “ I‘ '

s Ar ._ —. -4: .. K’ .

_ 3 ~ ~ . - r / .. -

. .\\__.,, V , _‘ .,. —.

- ~ 7'' “ ‘N 0 -.-

_ __ 69 E\] \"El

'=/'i\"E\"=e:=‘.' . -

I _l. J. 1. 1141 ® E‘ H

...innovating vision 7

www.vitrox.com

. I I o o u

n Introducing V9: Robotic Vision @

Nepcon Shanghai 2018

24 - 26 Apr | Zone B, #1C6O

Advanced Age of 2

I . , 16 - 18 Jan

- - » #7“ T i b \" \"\"BoboDEX

. , __g,. _,

ix ,, .'v‘‘-:‘_. . ’.“~\\ ‘T,

' ' -;., H:-;~. 0 4:‘ -. _ ~ -

1, I ‘ V , ;«;,N.\\ 5., --...~'._ ' ‘ \\\\

‘n . ”<=~ ~‘ . -\\*IT__

. Nfic. ‘ \" 2-,7-~ ‘-..-i\"-' - ii’. -E‘

. . '41, V r . v-4 \\ I\\. _‘ ._.‘__';L V \"' \{'1 V,‘ \\A :‘ -

. - 1 ,' T. ‘ £9‘ ‘ firs .” . ._ r .7? \\'_‘x x‘ .“ .

.- :4 \\ -L‘ -> 1 . ‘ -z’ .' ~—‘«‘-- ‘i... ».‘.. x

. - i. ,_ . , . \}; ’\\ . i /1, ._‘E‘\\ K

. ' .\" V. -.L.‘.. '. -~‘\\\\,:'\\‘. 3

' I _ - . .-x,( \\\\i .

' ;4.,\"4.;‘ ‘ , 5; Q‘. \\~ ,‘ '

<_v‘ \"‘,.,-“As\" 1- « 3 5 4: L o . I . \\ 4,_

T -. , *»=\"-iii... -

, ‘Z ,'_‘ Jr»-“'.f _ \"v - . . - u y

i it ‘ w A I ' ' - *

I *\"r/ Q V’ Ii I‘ ' \\‘‘l 5 W;

‘J ' ' ‘A 4 ( S

' _‘ V 7+. ;. ‘ ‘r -

‘ \" \\ ~ ’/5 i . ~ 3 “;' H :- ..\" ' /

1.’ “E ‘ ‘I ' ' v, J,‘ ‘- ‘V’ by

. _‘ . - - V . _ ;_ ' .., .

‘s. « 9-“A.” , . ‘ . ' x. w \" ‘

- ; Ru. .- \"v .- -- A-<7. '

. V X‘ 3‘ _. \\ - .41. 5’ . /I . - 23\" ,:‘/

-fl. \} - _ ,4; . ' If‘ _, V\";

‘ \"1 .‘ ‘ .‘\\’\\ i.’ i . f’

,. ‘ J.» -. _ ‘ ,4 ' I-:'

_. *7 ~ I VA)‘ \"

. 33‘: 4 ‘ I. ‘f. ‘ ‘

0 . , -

‘T7 ' _' \" é-v

E) ‘ ‘ '

- j. J -

fig K

gfigfl We are the World Leading Vision Solution Provider.

V9i V910i V920i V810iS2EX V810iS2 V81OS2XXL V81OMini V510iOptimus3D V51OXXL V510iG2

E . V3‘l0i TH2000i TH1000Si TH1100i TR2000i TR1000Si Wi8i VR20Li VR20i V»ONE

/u:X\" P0

\[P0

Jared Cohen, founder and director of Google

Ideas at Google, and currently CEO of Jigsaw

(its successor arm with Alphabet lnc.), provided

answers to the question on every attendee’s

mind: “What’s next for the world of technology?”

As the second keynote speaker, l covered an

issue i am passionate about — educating the 21 st

Century Workforce‘ “is Crittcal businesses

, t t H worldwide understand the issues facing the

The 479 exhibitors welcomed a busy three featured nearly 100 technical papers detailing Workforce as todayls busthess and technology

days of business development and qualified original research and innovations from industry redutrements oohttnue to onange at a raotd

sales leads on nearly 150,000 net square feet experts around the world. Our programs are pace and eaon Company needs to know wnat

of show floor space. lPC APEX EXPO attracted grounded in and driven by rea|—wor|d application tt needs to do to attract the rtght tateht and trath

9,169 total visitors including attendees and that’s happening right now. Attendees had access tnem for Success‘

exhibitor personnel. to new research on materials and processes,

Oppoimnmes ta ieam more abaut Uemiing Whenlspokewith exhibitorsand attendeesatthis

With a focus on developing important standards, materials, applications and processes such as yeervs snewr teedbaeh was reseundtngty pestttvet

IPC committee members joined to discuss, Industry 4.0 (including a live demonstration on Attendees said tnat networking and edueettenet

revise, and improve documents that will be used the show floor by over two dozen exhibitors events and aettvtttes hetpedtnem find new ways

to create quality products. Their hard work is using IPC CFX) and e—texti|es. to setve enattenges. tne exntbttten prevtdedtnern

important to furthering our industry. As they are the oooortuntty to meet Suootters tnet Coutd

volunteers, I appreciate the executive leaders of IPC APEX EXPO’s full— and half—day netptnem savettme and money andtoster new

their organizations for allowing them to engage professional development courses blended busthess opportuhtttest Every year APEX EXPO

in standards development, and for allowing them traditional electronics industry topics with hot— orovtdes me with untdue ways of tearhtng thtngs

to participate in this year’s event. new developments, delivered by corporate that heto me stay oh top otourrent tndustrytssues

technologists, consultants, training center staff and Concerns‘ Overatt t am proud of everything

Education is also an important factor in furthering and university faculty. Attendees choose from an we aooomottshed in Sen Diego t am eduatty as

the success of the electronics industry. lPC APEX array of leading topics such as: PCB fabrication tnvtgorated wttn everytntng we wttt do in the rest

EXPO provided the industry’s largest breadth troubleshooting; dispensing/jetting; printing; ot the year We are atready working on putting

of learning opportunities from the Technical manufacturing yield, defect analysis, failure togetner néxtyearls Show and tooktorward to

Conference to Professional Development and analysis; reliability and design for excellence (DR). our thdustryls Cohtthued shppon th makthg tpc

hot topics covered in the Buzz Sessions. APEX EXPO 2019 a Success

Part of the fun of attending APEX EXPO is '

In keeping with the event’s theme, “Succeed at learning from individualswho are influential in the

the Velocity of Technology,” APEX EXPO 2018 industry. This year’s opening keynote speaker,

l _ V , . :

‘ T ». iffi. ' r’ -A l. - ~—— I I

- _:_r__ :__7—r!—r-__+< _ , . . I ._ -. I .- . a r t

, ‘ —- _', '_»'~'-\". r-' -' : .- ’ ' r. , .1

l ‘ j ‘ ,5-n Lia .\\ h l llfli lfl(,\}ti;,,ti.‘i u

LI,”,_ ,‘. 55:15:, it ..t_ _;i— Y.\" V 1\"‘ V '

‘ ‘ -._ ‘ “.‘j*Th\" \" 2;é?, J v- ‘1z;a’f-hr’... ~ “\"'\"°.' ' — . ;- _ ’

pl.-if t V at . . r 4‘

H7 _ - . -:0 rfl ' ,/ 3‘ _t, C _; 71¢;-:._\",*-.‘ r _ :_ t_..V:,l-V t _ t.

- __ am —_—~ g», -Q“; _, 1 - .-

’:==.-£-fig’ ‘- 7 “u ;w_.\"’ _”..r\"‘ ‘ ‘z~ 1, “=\"- -\"V — *' \"

, , l~.‘.. J ‘ -\" —~ I .2 :1 ' t ‘ j L’ ‘ iw

‘ , 1.» . . ~ ' -

‘V, ‘ ‘l ‘fish: ,. E H ,' 3 w .

we rtw. » lr/,5 .. ,, 3 I

’.’2‘ -2?‘. ‘E1 ’:,-» \\ ‘ _, _ - .- I ‘ ,\},r»l,\"\"*’-‘ E

\\ CL.-. 5 EL';‘.''- - ' _T/‘hm \\ . '~ ‘ E \\t

‘V /' H ' ,~’ .‘ -‘H r '1, A,u*\"fA / ' K

4_ . ‘ o _ .’

i 7 59' , _ »;‘,;t,rr—,:«Zk t - '*

'* ‘~-. ./-:\"w1l..i% r »“' . / .

.4 t » \"

, ,, ’ v V 5 V ' .

. ‘ H

‘ l

I .2 ‘

»\" \\v

| . >\\ . » ‘ V

' ‘\\ - —~ ‘ APEX .

» Tf I\\J W: ._ _ ,,,: - !

-1:. ‘ , , f“\" ' \"5 ‘ ‘ ’

_- ._.I_ . :~;,,,‘”\\,, VP evs aur”earr__ 9 -

' \"4 \" ‘ ~_ . *4,

3'4’ '__,‘_f¢ V g« ‘:12 : '2 ';'‘§‘ 4' ' , ,, h ' \\| \]=

'.: ~ , 4. '_, \"-‘N N’ ,~ *2“ 1\"», .

‘ ‘€13; .1 T .\"’.' W \" 3 ,_L_ 7 ' 3? _ » -'\\‘*\"-’

'. . . M H r \" ;, . _ laid g E §%_.;__ .«m»:.s§;:g;;, X -

»— r I , . ‘:‘~‘,.r /\"2; I :~'~-- \"5 ‘ * ' ’“ \"~

W ,iIl..:._~“__' '. I‘ . =' > ,n.,_ ,1 \"gm 1 . ‘N

. .3; - V; at ,l, _,\\‘\\J r‘ ,\\,- _ ‘ ‘.1 _at_ \" ‘ V;1' . « V‘

\\ , , “ m _ - '.“. ‘ .’_— is H ,7 § \\

> - _¢ ’ - g . ‘ »,,_ _V.:. ' '~

. \\ fl ‘ -,_,,%____kN \\ _’\\\\‘~‘; ‘ ‘ _ ‘

I‘ \"' :1 , S.’ “ ‘\"~_’4*‘s‘*';, | ’

aw ¢ ,.

:51: _ _ _. _y\{-I///«V//,,M 1 V a - 5

. -‘ ... -.~- -1,“; _‘A~ (: > . ;v-:-‘.~,~._> .- —.. -S. _ I

, .55 . V3. ~ . ’ ~53.» *‘ any \\'c-x,

V ' 5 g. -A. . . * as c»

—~ W t9d?V :

-~ - -- \\ - »‘ v _ A _ _ K - «~ ‘F T - 3*

L . 9‘ 5”» . ;~ ~- ‘ law? #32,; A \"SEQ: ’ = ,=

(5, \\ ' \\ ‘:2 ‘ |‘i~;‘*\" . _ Q, ' 5

. . ./, ‘ _ - ‘ . ‘aw. y it’ E; 13%’ , y. !3 . ‘ ‘I ‘

7 1: .- ~ =\\ A -~»<r= ‘*1 1

\\ J.‘ I r. ‘ V. ‘ s I‘ r ‘J ., .4 \\ AK’: V’,

. = ‘ ~ -‘ .~ _~r'E~“.-j.‘»:;j.:»'x'~_«. . ‘=~\\..,, _ n 3

.‘;l.J4 . . Sd\" \" ‘ ' ' L3?

SEQ’: ’ - . — ° -55“! §\"‘~‘*~\"5‘V“\"’f ‘<‘“\"\"

1 . t - .- . “. g ,

\" \" ‘ ‘ 75 Rik: ',,’- . “es I, ¢ ‘ .7. , “ “ ~ ,J “iv

' ‘. .I...;: \\ “ .- V‘: V J - 1'-_' % , '. A‘ ‘T 1

\\« .. , £1 .2.‘ \[1 ? ‘g_.:_ 1 ‘p

\\ . ,- »‘ ‘ V r:.-»:‘ ’_b_‘ “L Yu’.4- .‘ Q,’ , ‘ ' A ‘no I

' /\" I \}: \" 2 ‘. ‘ ‘k .X!_ ' I ‘ \\>'.‘ ‘g

. - 6 . _ v 1; ‘\"~ ~ 5 ~’ 1

I - »._ ‘. I ‘, V‘ /J v V W. In‘ Q V’. é

L D = :3 L; ' I \{“\"\\‘“1.».» t “Q X»*iV.«'=\\ '

. .-,. _ . ~ \" , ,, . . ' V » ,»« »‘\\ ” ,

A ~ \"1 7% ~% \" %

. ' _ * ‘ _ ’ ‘ ~ \" ~ ’ I.'.'5.~..’.Oi “. ' - >

it ‘ k 1’, ‘ , -, ‘V500 .&,O;.‘..~._I;_.Q._..'.‘s. / / 7.

an ~‘ ~ 5' V ”' -I'.‘.‘.\" \"

’=-,... .' ' u ¢ :3-'..--. '.I~;é',....

% = '> .. 1 * =:-=.-~.'--.'- \}

~ * g V \[.3 H . 3\"’

E > ‘_ I, \\ \\ j \\ T ¥“\{

IEEEA R‘

INOVAR is dedicated to providing the highest

quality products and dependable service to

our valued customers. In addition to having

quality teams in place across all its facilities, a

key factor in the company's quality initiatives

is the equipment selection process. When

it comes to purchasing new manufacturing

equipment, it is critical to select the appropriate

technology necessary to meet and exceed

our CuStDmer.S expectations INOVAR has

made a strong commitment to continuous

The company owns a 65,000 sq. ft. facility in and tmly valuetheir relationship with ourtalented quaiity improvement, which pmmpted its iecent

Utah, as well as a 58,000 sq. ft. factory in Tecate, manufacturing team. acquisition Qf it/iiR'rE(;'5 3D Aoi and spi systems

MeXiC0. and i5 building 5100000 Sq- ft f3Ci“tY for both our Logan and Tecate manufacturing

0” Utah State U”iV9l5itY'5 '\"”°V5“°n C3mPU5- facilities. “After evaluating several leading

This new, State-Of-THE-aft, facilitl’ Wi\" fuel “THE COMPANY HIRES FROM THE manufacturers of 3D Inspection Systems,

INOVAFVS future growth allowing the cctmpany LOCAL COMMUNITY AND HAS INOVAR selected MIRTEC as the best solution

to expand its workforce and capabilities in order EXPERIENCED Ex-I-REM E LY Low ta meet Dui Dngcing quaiity initiatives,\" stated

10 meet 9l0W'\"9 CU5t0|'n9|' d9|‘nand5- 1-URNOVER DUE To “-5 CULTURE‘ Jef Nielsen, Process Engineering Manager.

One of |NOVAR’s goals is to be the employer of DESIRABLE WORKING ENWRONM E NT

choice in every geography in which it operates. AND THE OUAUTY OFJTS «WE TAKE GREAT pR|DE IN THE FACT

The company hires from the local community MANAGEMENT TEAM -I-HAT MANY OF OUR CUSTOMERS

f‘;‘?3s“§3.t°J.Ze3Z2i’§§.§§§'§fLiZ'3 L‘L”ii3LT§’Z§i§SZ \"AVE “E” W”“ \"5 F°R °\"E'* A

the quality of its management team Over the past 20 years, INOYAR has earned DECADE AND TRULY VALUE THEIR

a solid reputation as a leading provider of RELATIONSHIP WITH OUR TALENTED

mot/Aiztrs growth has been driven by its advanced technology products and system MANUFACTURING TEAM.\"

dedicated employees, top-notch technical 5°'Ut'P\"5fP”h9m|||t5|'Yi§e|'05P5C55nd defenéé.

capabilities, and outstanding customers. We \"\"9d'°a' '\"5t\"U\"\"_e\"tat'°\" and °°”\"”\"el°'a'

take great pride in the fact that many of our markets. We believe that |NOVAR’s growth “We understand that Electronic Manufacturers

customers have been with Us for Over a decade and success is a direct result of our unwavering are becoming ever more selective in purchasing

commitment to total customer satisfaction. equipment that will add value to their business

\\ ‘~ T1’--‘ i

. . t --.. i

-33 .-“-‘~'~ .. 2 23* i

~ 9 '1' i

..-:.-—~_t ‘ , t ,,

.u . ’ _

3 X, ' .*» \" _ ...< ' —,

.'.' V4.35‘. ‘J 9/ ___,\"V ' '

('..\\é€.~‘.h. .—\" ‘

' ‘ nr ’ T V 4 T

\{ .,:fl—*;’w ' ‘ it‘ ~

. . - i ‘ i ' ’

3- . ’ Hi ‘i \\\" ‘\\

it i i, i E

Q 7 l t

’ “ it ill! a

i ' 7‘ ‘ - .. .; ' -

v ._ liHmMi‘ii“‘ it /~\\ I ., _ _

S III its“ .- Mvr‘e- I.’

, a I I‘ ___i_I___ Q1 T‘. -'2‘. T’ T‘-\" \" \" _.

(Z — ' ' _,

‘ ’ i _ .

\" ..

Pt . K t »?‘r*..,. V ' _ H: €:_”>_~fi‘h M

\\ _ \\ A‘&_T':>T.:':; 1- “.'4t:_:.~- «ea.

,(< it .. V t_ -‘ pt ~~——.._._, ,

1.1 £1; ‘ « .

' . - A . r

7..__ / i gt’, t .

. t I t . _ ‘ .

~ .. ,

. *1 T V M

D .F&TJ'I_.5_.\"

'J':'J;' M031’ 'J'EL‘:'JJ\\JUl.U£iJL‘;Xl.l.Y AD ‘./;UJL‘E'..')

.')E.3t§'J'U? 3.’) ADJ i‘JJ;\\L‘:'JJJ‘JL' UP\] 'J':'JE.' P'_;\\J‘JEJ'J

K MV-3 OMNI

‘ V) EEWEH. ‘

I —;. \\. » i 9; '1-

\\ \\‘/ iiiitiiiiil ’ M

“ ‘ My 7 ‘V 1-—& MV-SDMNV I

/4\} J '1 -

_ 7i>__Vw>‘7A—

\" - ti

jg ‘§\\:\"’:‘3 W J J J iJE. I 3

D OMNI-V|S|ON® 3D Inspection Technology ‘L

D 15 Mega Pixel CoaXPress Camera Technology ‘fiH\"?!%.F P

D 10um Telecentric Compound Lens Design i“ ‘”’''‘‘‘‘\"\"V

5 10 Mega Pixel SIDE-VlEWER® Camera System _\\ ‘ TECHNOLOGY

5 Eight Phase coI_oR Lighting system xx“

5 Full 3D Co-Planarity and Solder Fillet Inspection Capability ‘Q ‘A

I HE\]‘A R‘

and provide them with a, much needed, edge combines M|RTEC's proprietary15 Mega Pixel MlRTEC’s Award Winning MS—11 3D SPI

in this highly competitive industry,\" said Brian CoaXPress Camera Technology with their Systems are configured with a proprietary 15

D’Amico, President ofM|RTEC’s North American revolutionary 3D Digital Multi-Frequency Moire Mega Pixel Top-Down CoaXPress Camera

Salesand Service Division. “Withthis in mind,an System to provide precision inspection of System providing enhanced image quality,

increasing number of manufacturers are relying SMT devices on finished PCB assemblies. superior accuracy and incredibly fast inspection

upon 3D Automated Inspection equipment This proprietary system yields precise height rates.

to help increase profitability by improving measurement data used to detect lifted

production yields and reducing costly rework. component and lifted lead defects as well as The MSA11 uses Dual Projection Moire Phase

We are extremely pleased to partner with full SD solder fillet inspection post~reflow. Fully Shift Imaging Technology for “Shadow Free\"

INOVAR and are equally committed to their goal configured, the MV-7 OMNI machines feature SD inspection of PCBs after the screen printing

of continuous quality improvement. We look four 10 Mega Pixel Side~View Cameras in process. This proprietary system yields precise

forward to along and prosperous relationship addition to the 15 Mega Pixel CoaXPress Top— height measurement data used to detect

between our two organizations.” Down Camera and an Eight-Phase Color Lighting insufficient solder, excessive solder, shape

System for superior inspection performance. deformity, shift of deposition and bridging.

MlRTEC’s award—winning MV~7 OMNI 3D AOI

machines are configured with their exclusive “M|RTEC’s OMNI-V|S|ON® SD Inspection

OMNI-V|S|ON® SD Inspection System which Technology produces amazingly clear images of

I _ our SMT components

.',*r 9; . _ 7 \"T _ 7 and solder joints,

5:9-\\%’/‘\\~7\" ' V virtually eliminating

,'Z_;;°‘ fl U: ‘ ‘ the need for human

' H\"? W\" ' optical inspection

. _ - *2“ 5; ’-''—‘;-,5''n, - and significantly

$3.. ‘ ~:\"’F;:\" K‘. improving quality . .

.2 E1 1‘ -r: levels in both our The leadership team at INOVAR recognizes

V-E jyfi *\\/ i 5'. internal metrics and that. customers have a broad array of EMS

iii ~ - . . choices. Only INOVAR, however, offers the

- E5 ':§:g~§:,—— \" p - m the eye? of our best combination of execution, capabilities,

z.. _, 4 °3:t°c;n€:’V5' N'e|5tjn and access to executive management of any

- ‘ 5:; . a e. eareae . .

- «\"7 F ‘ *0 seamiessiv move Ellioiiflfiill '2.I2§ri’iTi'E‘ii‘. S.i?2§?§gl2'“2¥1ZF§

__/, t N‘ ‘ programs across . P P P

- /— , - multiple production :-i|l.<ehM|fltTE(§ to slerve ct>)i..i|rt'customers with the

‘ I lines with extreme ig es ec nica capa ii ies.

.15\" 1 ' ' ' repeatability, allowing

a._— us to maximize

' « _ d t‘

4@‘v““fl ' \"- ' ;’#i£iel’£;7- ”°

M|RTEC’s OMNI-V|S|ON® SD Inspection Technology produces

amazingly clear images of SMT components and solder joints

virtually eliminating the need for human inspection.

ii ‘i i i‘ x I l ‘r -

., A

1 ’ \{ ‘ i 5 - .- ’ ‘ i‘ ' “

. T l g V — I I . 2, I1!

“ 1: ‘l I ' , ’ T

‘I \" — '5 ‘ T /J /

‘-;- ~ \",1 I .— * I ‘ ’ /

. » -

V ' ”' a if

i N‘ T A I

. .2 _ , 3‘; >,, : , a -

\" . 3 ‘zr

' Q _ _’ i , 4.

, W V ' ‘ '

/, ‘ _ _ ..

_ \\‘ h u — -~ . I —

i \" xi: l T ‘~<

' l , . Tia», .

'.‘ 1 ‘ 3.‘ .

\" l .

:1‘ , r .

2 ‘ ;

ll

’ L l i l I

M|RTEC’s MS-11 3D SPI Machines use Dual Projection Shadow Free Moiré Technology for inspection of solder paste depositions

on PCBs post screen print.

todav

I

0\} fl My

0

4 A p r I ,

Crowne Plaza Amsterdam - Schiphol

Hoofddorp, Netherlands

24 April: Professional Development Courses

AM: Understanding Shock 81 Vibration Workshop

Alec Feinberg, Ph.D., DfR Software

PM: Increasing the Performance of Organic PCBs at Higher Temperatures Workshop

Martin Wickham, National Physical Laboratory

25-26 April: Technical Conference

Session topics include: Predicting Component Life, Joining Technologies, Electrochemical Reliability,

Adhesive and Coating, Advanced Test Methods and High Temperature PCB Materials and Fabrication.

The final day of conference sessions focuses on reliability in the automotive sector.

Organized by

W EUROPE

www.smta.org/ ha rsh T

ll V ‘:33: . ..iifn V ‘

2;‘; >“.‘.‘.“.‘- illlllll ll”“lI..“i“Ill H

For questions email: [email protected]

‘.

-.-\\ V T’?

.\\ . K , » ,.

& —, \\, __

c 1 ‘t V \\\\ . _

\\ \\ \\

. \\\\*gs ~\\=sss:ss::st

. ‘: \\s\\\\

= «at -* P ‘ ~t;\\ $\\\\\\\\$‘ . :\\Z\\‘ T

' . \\\\ t ‘ xxst \\

is, H .. ‘\\

2;’: 45* _ V~._‘_& — ' -,-&-in l :~ \\\\

. _ kg‘ - as-——v T‘ \\ \\ \\ _ \\S:\\\\\\\\S§§\\§&

, i. ’ ,( ~‘ \"=-—- - l- . _, i . ,_ . .. \\ t.

3*‘ ‘ ‘ 1‘ 1 ‘~15 . _ T“: 1 H“ .- r N 2‘ — C~. ‘ V ‘\\‘=:~5\\‘=.::.

’ . ‘ ;‘i‘- » 4 -1,‘: ' it -I ., ‘. \\ ‘\\\\‘\\\\ ~::::.\\\\\\

v ' —“ . -~. . t‘ i : ‘ 7 \\ TS‘,

,—g._ :5 ‘I . _ . , , _._ ‘ \\ _

=_\\..,' '3 ‘h\\\\ ‘ /i at \\ §%

L5” _iy 1, .- 7 ‘ ... ‘M K \\

roll’ Jet... . .. ' ll! 7 V , v 2 ‘I r 19\"\" I\} V‘ \\ \\

ii.’-‘~*l-=*' II‘!!! um“ i 1» ll * E ‘ \\

/35?-4%-.:\}\" ' 'T u\] fr '7\" :1 7' ‘ ’ \\ 4

. = , I!!! ’ ”-~ '~’ “ , in ‘x \\

act, . . ~ ~ ii\"i\"\"Ii iii ' “\"~‘§‘\\

; ‘i 7 I H __ ii_.,llllIfl ll |l I I l‘ l: iL J: , X :1”! A V . V \\

. - ‘»..- . 2. ~» .‘—ii ii‘;--.!,l!.' Illul l‘ I i it. Q * «. v . x

*a.?.‘~‘I'-.~ ggg - l -' » llhl ll Ii lll r 71 , ' t’ V ‘ \\ \\‘

-. i~ -' ,~;. --.. -7 ~ i» ., - _; H/._. -1,

. ‘ ~.- ‘-v i\" ‘—‘.iliil“'|i l‘ H miiiii i of’ ‘ ~ \\ ‘

._,...M. . ._ 1 I lllll ' \"l l‘ 4 .4 , _

_ i.ii.iii'i - .‘* Le ‘ \\

: ~ 414:3 ~ ~* - i i ,r .. ‘ it P 1

,i's?’»j~ .”,._,.,._,,,.,-.> 7 .» ~ « . _ ll 1 l’/‘? as /‘ . »

T ’ 5%.» iii. ' - \"' l l llffl \\

‘ ‘ 7 I r v5 \\ >1‘=., ~. , K , ~ ,;\\ FM , .

s. . 4,v~;.«‘-. - . : \" ‘—' =‘ ‘ 5‘* ‘ ‘ i \" ‘

. -»\"'%~ - ' 1‘ \\ ‘‘~ -, ‘ \\.,, i ‘ l \" ‘ ‘

_‘.j . \\ t 2:,’ la. kkliii \\.‘l ._ . . * V » ’

. 3* iu:i~; as .'-or :~-‘.§.;\\- , - -w - I.-V-' l i ‘al , ‘. l

,. ,_; ‘~..~ _r ;;;~.,v.~-t- -2:7 z.\\- ._ 2 \\, A, , pl -., , i '11; i ,

SMT HYBRID PACKAGING 2018- TOTAL VIEW OF Slllthvblld

. k _

International Exhibition

an on 8l'8l'lC8

d C t

Packaging 2018. Exhibitors can benefit from

favorable conditions and a special application

for the broad professional audience.

The joint stand “Mixed Double — PCB meets

Components\" displays circuit boards, modules

and materials on an action zone. The “EMS—

Intersection\" joint stand is a platform for contract

. . . . , . manufacturers. Products and solutions regarding

Market overview of the entire industry zogepjetgtroés vrig|l:if;:e\] eac:r:)t:fetrha3n;lV:|rl:cntii(O:E Optoelectronics will be Shown by the joint stand

l\\lumerous new exhibitors and key players in the Cfiteria requpired for mepmamal Soldering of “Optics meets Electronics\".

mduslry Ofiel 5‘ Wlde Overvlew of the emlle Value complex circuit boards Conference and tutorials offer a high quality

chain, presenting their new product innovations ' training program

and showing new trends and developments of A premier this time around takes the form

the industry. As yet, the number of registered of a Hand Soldering Competition for Young The conference will continue to provide the latest

exhibitors for this year are higher compared to Professionals at the SMT Hybrid Packaging. know—how, provide the latest information on trends

the same time last year. This competition follows the same rules as the and practical uses along the entire value chain of

H_ hr h _ 20 8 competition for the experts, but will include a the production of electronic assemblies in 2018.

'9 '9 tsm 1 circuit board assembly, which is adapted to the 0 GJ 2018a fE rsht 1 ,al ,”

Once again in 2018, the SMT Hybrid Packaging will SKINS Of the beginners. mile DEE: Theseljafilfnzlugg 'SeSs”i'O°n\"S

P9 ‘ifiellng ”“mel°,“S Cllghljghlsj The ploducllon Joint stands provide specific topics for broad as “Comparative Assessment of Temperature

lme l:UtUle,,PaCkag'”g O,” l,mell'9e”laUlOmal\",)” professional audience Mission Profiles or Component Qualification\"

for e—mobi|ity and robotics presents the entire and upreveming SMT Assembly Defects and

production process in hall 5, stand 5434. Visitors Companies wishing to present their products and Product Fa\"Ure.i_

can experience all steps of production and discuss solutions as exhibitors will have the chance to do

issues and challenges together with experts. so in a“Newcomer Pavilion“. The Pavilion offers In 2018 the central topics of all German and

t—fft' \" df||— ' k .B ' ' ' ' '

A1

sh°WCa,Se(l by the, W‘_)lldW'de trade, and exhibition presence with little organizational effort. technology, system integration and automation.

standardization organization IPC — Association

Connecting Electronics industries from the USA, Besides the Newcomer Pavilion there are more

experts in soldering will have the opportunity joint stands being planned for the SMT Hybrid

to demonstrate their skills. Over three days,

smthybridpackaging

Nuremberg, 5 -7 June 2018

Become an exhibitor now:

smthybridpackaging.com

1

5§%“”°..:<

K0

—- .

A/Lxi’ mesago

* °——‘\\,:/—‘ MesseFrankfurtGroup

9* 9i:J.iiiiiii

OPTIMAL ELECTRONICS CREATES SMART SOFTWARE

SOLUTIONS FOR ELECTRONICS MANUFACTURING

requires comprehensive, integrated, advanced

MES capabilities that ERP/MRP systems,

machine vendor software, and most MES vendor

solutions do not provide. Optimal Electronics’

Optel MES solution delivers unique functionality

and resulting benefits.

The company’s powerful Optel solution provides

complete capabilities for accurate work order

level, panel level and component circuit level

traceability by interfacing directly with SMT

“MANAGING THE MYRIAD OF

Optimal Electronics’ mission is to increase the approach for meeting customer expectations, COMPLEX”-IE5 INVOLVED IN

profitability of ‘its customers by maximizing while minimizing costs, human intervention ACHIEVING ACCURATE COMPONENT

552?;$553§f?§32§!.?ii‘§é‘§%;Yl'il?lfiE,2§£3 “”“ “°“\"°°“\"\" \"*A°EAB'L'\" RE°°'RE$ AN

said, “We accomplish this by controlling and AUTOMATED‘ c°sT_EFFECTIVE

tracking the essential manufacturing data and “USERS CONTROL THE ENTIRE APPROACH FOR MEETING CUSTOMER

processes through the use of a plant-level or MANUFAC1-uR|NG sHop FLOOR EXPECTATIONS WHILE MINIMIZING

company-accessible database.\" Users control FROM THEIR DESKTOPS OR CHECK COSTS, HUMAN INTERVENTION AND

the entire manufacturing shop floor from their STATUS VIA DASHBOARDS ON PLANT HEADCOUNT.\"

desktops or check status via dashboards PCS OR FROM TABLETS“ OPTIMAL

on plant PCs or from tablets. He added that ELECTRONICS PROVIDES CUSTOMERS

Optimal Electronics provides customers with a placement machines on the production line.

comprehensive software system that is simple WITH A COM PREH ENSIVE SOFTWARE Optel enables online setup verification to be fully

to use and integrates manufacturing data with SYSTEM THAT IS SIMPLE TO USE AND automated, ensuring that the correct parts are

ERP/MRP systems. INTEGRATES MANUFACTURING DATA loaded into the correct SMT machine slots. With

WITH E RP/ MRP SYSTEMS\" the Optel system, manufacturing operations also

One of the major changes impacting the can leverageautomated capabilitiesforreal-time

electronics assembly process is the increasing component cycle counting and advanced parts

market demand for detailed component-level Today’s electronics manufacturers need modern outage warnings to significantly reduce machine

traceability throughout each stage of the technologies and processes for managing downtime and increase production output.

assembly process. Managing the myriad of and improving all aspects of the assembly

complexities involved in achieving accurate environment - to overcome complexities, One of Opte|’s most significant advantages is

component traceability, at the most detailed respond to changing market demand, and its innovative Optimized Dynamic Scheduling

level, requires an automated, cost-effective increase profit margins. Achieving these goals technology, Which I5 KEY to COITIPEIIIIVGHESS

and profitability in a high-mix, low-volume

environment. Unique to Optel, this technology

drives major increases in production and

utilization without the addition of new SMT

equipment. No other software on the market

today enables the optimization of production

capacity that can deliver up to 50 percent

increases in production, 80 percent reduction

in changeovers and 50 percent reduction in

\\ changeover duration.

N “TODAY'S ELECTRONICS

. MANUFACTURERS NEED MODERN

TECHNOLOGIES AND PROCESSES

, FOR MANAGING AND IMPROVING

I‘ ALL ASPECTS OF THE ASSEMBLY

ENVIRONMENT - TO OVERCOME

COMPLEXITIES, RESPOND TO

- CHANGING MARKET DEMAND, AND

INCREASE PROFIT MARGINS.\"

£ Opte|’s Optimized Dynamic Scheduling approach

— '°- uses selected business rules and advanced

Optimal Electronics’ Optel MES solution provides a fully integrated, mobile, modular aI9°“Ih”\"5' _atth'eeIe\"eI5'_t° '”°\"‘?a5_e F\"'°d“°I'°\"

shop floor control system for productivity improvement, materials management, by a”I°'“at'°a\"Y 9e\"e\"aI'”9_ °F’I”“'Zed °I”5I?'5

traceability and quality management of work orders and creating SMT machyne

programs. Unlike static software grouping

todav

M E TC A L IM

‘ METCAL. ‘

35

742“;

Innovation has a

The new

Connect1on Val1dat1on\"\"

Soldering System.

- Improve Quality & Mitigate Risk: N \\

Reduce solder joint defects by validating r ‘ /

intermctallic compound (IMC) formation ‘ \\

- Enhance Process Control: ‘ , a

Chip-in-Cartridge technology precisely ‘\\ (' - ;

calculates and displays tip temperature I

- Future-Proof Investment: , _ \\

Communication port for process

traceability and firmware upgrades ’ '_,,

I’ A‘.

- Save Time and Money: X

Calibration is never required E /\"

fii

Qt 9.'§cT.l.'t,'li‘c's

approaches, this technology re-optimizes within a work order; serialization option working on several Industry 4.0 projects now,

production schedules dynamically, as new enables the identification of components involving intelligent machines, intelligent process

work orders enter the production stream. installed, per reference designator, on control, automated material replenishment,

individual circuit assemblies. self-scheduling assembly lines, etc. All of these

BE NE FITS projects include artificial intelligence and robotic

- Quality management: quality data and defect applications. Everything new we develop is for

Optel is a complete manufacturing execution data collection from inspection stations and mobile applications. Our customers now can

system, built around a single centralized automated equipment; support for rework monitor the entire plant operation and board

database, that provides the full range of repair and returns processing. by board production on each line on their cell

integrated functionality needed to effectively phones and other mobile devices_”

control, monitor and manage all phases of the - Graphical documentation: provides paperless,

electronics assembly process, including: database-drive, graphical work instructions INTERNATIONAL EXPANSION

for box-build, circuit assembly, rework and for

- Materials management: inventory and QAinspection.ltallowsassemblyinstructions Optimal Electronics is in the midst of an

warehouse management, materials and multimedia content to be assigned to international expansion. The company signed

tracking throughout the plant, and materials assemblies either at the component level or a reseller agreement with ETEK-Europe for

Se|'ia|iZatiDr1: MSD CDr1tI'D|. bar Code data at the assembly level. sales in Europe. Optimal will open a support

collection. and development office in the Republic of

- Machine Performance Monitoring: monitors Montenegro in early 2018. Optimal also signed

- Dynamic scheduling: dynamic scheduling of machine downtime by shift, day or week; distribution agreements for South East Asia and

work orders into common setups as work track number offeeders setup for next setup; China, and it will open its first Asia office in the

orders are released, optimization of setups, monitor ideal/actual cycle time, machine Shanghai Free Trade Zone by the end of 201 7.

priority criteria selection, with lean kitting to efficiency, OEE and utilization. “We are very excited about our expansion in

support grouping. Europe and Asia. We have customers in Europe,

In addition to these capabilities, Optimal Malaysia, Singapore and China and want to

- Pre-production control: kitting, offline and Electronics can customize Optel to fit customers’ use those references to expand our customer

online setup verification, feeder management, unique manufacturing environments, processes base,” Vujosevic added_ “we also are increasing

and work-in-process tracking. and requirements. our marketing reach to enhance our brand

recognition. Additionally, there is much interest in

- Materials traceability: from the work order SMART FACTORY SOFTWARE 3.-nartindustty 4_o Software soiutions in Europe

level to the circuit level and to the final SOLUTIONS and Asia that We currentiy do not find in the

3559mb'Y '9V9'- United States.” Optimal will continue aggressive

In recent Years: Optimal has 9XPa”ded its directsales in the USAand Mexico, and plansto

- Process traceability and control: process product suite to offer software solutions for Open an Office in Monterrey, Mexico, in Spring

definition and enforcement, multi-level sensor assembly in clean rooms and Smart 2013 to Support new customers and increase

routing, full process traceability, verification Factory (Industry 4.0) solutions. Although its sates efforts throughout MeXiCc,_

and data collection across the production core will remain dynamic production scheduling

facility. and MES solutions for some time, Optimal is

moving high speed into Industry 4.0. Optimal

- Component traceability: instant access to date recently hired a robotic expert to work on new

and lot code information for every component industry 4_0 projects_ Vujosevic said, “We are

' , ’ \" -,-\";_~—‘:*_ ’ v ~”~ ‘ ‘ ’ --.=:‘:v: '

‘ _ ‘ ..,(-5:; A 1 a

i — u , , ~ **=\"\" :’f'—\",-£2-‘i--_. - — E

2 *1 ‘ ~ I .

‘-._ _ u ’. , ;— _

l ~ ‘I . - .

? ‘l,_|‘;_ ' .E,. ' —_. , I _ —- .

__ V 5 -_%:l— aszim-.

~... . -T A - _ - . _

\\- “‘ _ ‘ '“~ 1 _ I .89 _‘. ’ ’ \"__._~_ 1

‘- . _ g ' V I ,4- _ _ gr ‘ , gt

.-_ Ti 9 7 I» V . ‘ * . ' ,3 _r_n .

- ‘ fiifih ' , “=1---... . rm

- t L -‘ \" ——,, ‘ms _: ,

-fin _ -‘ _’ J_. _ i '- *~\\— —. . :-__ ‘

‘I ,_ .‘ . ’~ ’

12 , *~~...\\ . _ - _ _~ » A -~ §

‘‘ :. 1 J ‘ i ' _¢ », E .

13-: W,_ 73 ~§ _ 55:’? / in ‘..____-

v _n§ 3*; =\\. .

- ' A ‘ \"T E:

. _ , A . _ .

_; ' H . <

_“— Q‘ '_ ,.‘ — ‘ I’ : » ‘I’

'3 ».__——_\{ . \[-1 E ‘ ‘, 7/

r ._ .\"'~. ; I V _ ,_ \\ ‘I -' l

-_.~&':fl , I * ‘ I \\ . _ or

Latest addition to the Optel software suit is control of sensor assembly in clean rooms, including setup verification, die attach assembly,

wafer packaging, component traceability and process control

today

A

Pynimixi“

O

Pyramaxf” the industry’s best performing

reflow oven. is now available with

award-winning Energy Pilot software.

BTU's Energy Pilot software enables =

tremendous energy savings by dynami-

cally adjusting oven settings during

gaps in production. Pyramax's superior

thermal control allows for quick .

recovery of the thermal profile from f O h

standby and sleep modes. Energy 0 e N P

Pilot, a feature of BTU’s Wincon I

windows—based operating system, V

also includes powerful process , __

monitoring and customized ‘

graphical reporting 3 wnu *

capabilities. Reporting , ‘ ‘ 0 ;‘~

functions include cost '0'“ , F“ - - ’ ' '/I ~-

per unit analysis, oven M f '

utilization along with _ -

other parameters that

empower users to V ‘ J‘

identify further efficiencies 5

and savings. Designed exclusively

for BTU reflow ovens, the software is

easily field upgradeable. Pyramax +

Energy Pilot, a winning combination. i

www.btu.com

..-., \" . -. I Y' 1

In this feature we follow our industry movers and shakers

throughout the world. Time to take a bow...

l

' ' ’ ” \"? ---*—sg-.g,:5;. '* A-' - ——

_ 4 ‘fW~,. §

;.-l*,';,

I

% _ ___ l

, .

-:v ‘UT 54 -~ 3 5 _

.5*v x, ) \" H V ‘ ”' %’ Ant

4 ’ . __ 'rIx4Jd:I‘;‘ \"\"\"°d:\"’ V W“ M,‘ * ,

..q..,i. ~ xdl

. ‘_v iviluxlm, v-'|<>'~“‘ > L

Eewr ‘

l . lit '-‘

‘ = H; _ D 9 fl\}‘€llUl ~- “E 77'

. ‘l 1-43: .. ' 1- .... .. .—.. . _. .u...3.\"' ..“.- M

urn? i-.uIl-I .‘A:.'.?éi\}\"':'\\7,

,.— . : l 1; A

-A , _ I V ’ . _ _‘ \"‘r.-\"K-.=;.‘

_‘.L 3;, ‘M w..\\ ‘ - .z- ‘ ~l» ;_ ‘_ fig, -~v_v»~ \\;_~,,, 7 1 _;.'K_J _ —

SMT Today sponsors local ' ‘g G

basketball club PT: u . \"‘ N ..

n i “av -ma» ..—a..

SMT Today recently sponsored a local ‘MM _ ‘

basketball club, (Ayr Storm) providing ‘ _ 7 $1‘ «§

warm up shirts for the various Division A . '7 11... .t.... ‘I ,9’ M \"' \"

1 teams. The coaches and committee iv ‘ Wm . -' A ’

members are all volunteers, who currently _ \"M . ‘ ‘ i? . _

encompass over 170 members. 7 . ‘)7 g F \\

.. ’ : ‘ V ‘ ‘ we 3 ‘ »m ,V V

Ayr Basketball Club's vision is to ' ‘ 5 @ , y _,2 » ~' ‘._ __ 1;’:

positively impact the lives of the people of '* ‘-/I ~ v ‘——4‘ —~ ——— — — >3 E

Ayrshire, providing an outlet in the form of

basketball. The club's aim is to create the T. - .

f I;' ’ lv

best basketball players they can through W3‘ 4:» ,., '

positive training, encouragement and 9‘ v-I» t V A‘

hard work. Ayr Storm believe through ‘ ‘*\"\"“ ' \"\"“‘ \"\"\"\"' M’

basketball they can offer their youth 6%‘ 7

and senior section the ability to grow w’l“‘~ V 6' \\§/ '~§’

as individuals and give each member a \" V T, .\\v Q «Q ‘ “

.‘ mm, 4'.‘

supportive place to push themselves and W‘ m _ mvlloday 5 2% ,. .t.;»:. i\\ ‘M’

. i‘

help prepare for the challenges life may

present to them. ,— _'\\ _ i I

, k . 1 E T. .

..‘a« “’

. ‘ , _ , A) ,

8 - ‘V x . -

\

_.,‘ . vi» V_§;«\\._:\{\{_'; .; .,!..;\\-:.;‘«:;‘_

..‘,u ‘ cg - '\\ \\.. ~ ', Eu. ‘ . v:«“«' -4:/‘»g-_,..,.»\\

e~>>‘-:,,- ' ,.,e7*- n ‘x«.—.'\{~I' . W‘-W: » \",3\"

‘.g‘.,'--‘,»,‘\\\\“ ' y,\\»\\§\\\\\\\\$I\{\\\\\\ . * ‘ :,‘_'--‘V. \\.\\_\}§)V~f._,-“‘,¢_p(,‘x_ v ‘V »‘ ‘ ‘ _‘,‘ “

,.“3\{\\\\\\‘\\\\\\_X\\~‘\\‘.‘-‘ ' “7.'§,~\\‘\\; “‘¢?‘5?f.,“' ; ' ';4?§‘.5.- :1

2.\{y§’\\'\\\\§3<::.,v,e W‘ A .3-.;;\\‘ gs)‘ ~

\\'~~\\¥‘».~ - x‘§ \"‘ -- ' 5\" « '-'- ' 3.‘ 3-’ 5 * \"‘:\"=“r-*\"'\\fX‘-

.. \\‘.\\;.2x'-,;_‘,,: v‘. . _ H 3 =_, .=:.,.,;‘s

,.‘h.‘:.: 3-: ‘:, - V ‘ xv-_‘.w-‘MW ‘-

- :Y1\\?=‘3\}3>\"' ‘ \" ‘ * ' .'.X:.\"\"*‘1 ‘‘‘7.:'-.‘‘.'‘‘ 5‘'(f:\\-‘ \"

. e e A

W V H ELLO@SMTTO DAY.COM -

1»u’»‘R ,. .-§§’?m',,, , \"\"'1¥ :23‘ V .¢ *\".\\ * _

'.‘.‘.\\... , ‘ . /;t?:¢«r’»a'-:;,J$); w . »-\\§... (9; -

v‘~’\{ \"\"x.=,'. if. Q, . \"»L~

.*.<-'j?I' aq-’*\"\"%, ‘x\\“:t \"

9;; 3-.;ri .'_:‘;_% jg‘ 51:. . _,aa .‘ v\"-«‘:':'«.v+\\;..

$4.5. 13%.: -‘,\\\{\}:J'A14Yf»\}_':<\\1y4‘;g:,‘”1£«::' ,,_~;gg,;;,. #sM'rRE|3

'3“ '.j;‘r,l .'-',';V‘,M \"‘=\"?\"*1’:.‘.2/i:!4,-54:!“A .,.-..-.. 1 _ ‘ '.x\\3

\"Ly. .r.')r~ 'G3'1“9\"-\"“‘,.a';‘W..-st?‘ “I ' \" “N

\"‘i\":I*.‘~.‘ t:\"\" fa‘ ‘L .

\"\" \"P-35:: -u\".‘f~“'-‘v’ '

' ' l 7

U -‘ ‘_

s4: ’ , - ;

QQ . l ! ‘ 7, § ‘ ‘

, . *3 3- - ‘ l ‘ , .—x \\

I . r y M L

I \"- ' A ' ‘

. . ' “ /

~'/ I ~. oda

-. ,3’ > » 4;, g,

- ' 3; z ‘ “ ‘ d Content

‘ . _ t 4. _ _~ :1 ‘, OI’? .

\"45 W 0 wt‘ ~ 3 SS“ .;

J‘ 3 A» ~ «.

Y .

V _ .. W 1

. 7 I

' I: -W I S V,

— ' C Ii .

‘E O0, ' 3‘ x

Q ' . 9*‘ . - V ' 5 #

\\~- 'xI_~ P‘ ‘

5 . iv‘ /9‘ n; ‘ f

“ ‘ 1 . > ( ' *,‘« . .

‘ '1 /r‘wjUSh_ f Q Q’ _ in 0»!

. 7 _. ......, 5- W

—a 2. ._, V 1 G

.x . \"' 1 § 3

‘V 1 \\. .

Onnect v_ ‘ « _VJ -°.u_ui_W H x ‘_ EIBCWODICE

e ’'h“

ia- \\ ‘

SMT Today/i40 Today Whisky and Gin Winners

from IPC APEX 2018.

Thanks to our sponsors, International Beverage

(Old Pulteney and Caorunn Gin)

TECHNOLOGY TODAY FEATURE finish.

YESTECH

EDM PARTNERS WITH NORDSON YESTECH TO PROVIDE

CUSTOMERS WITH CUTTING-EDGE 3D AOI TECHNOLOGY

SUBMITTED BY REBEKAH TAYLOR, BUSINESS DEVELOPMENT MANAGER,

ELECTRONIC DESIGN Er MANUFACTURING

Since 1990, Electronic Design & Manufacturing (EDM) has provided YESTECH’s expertuse of remote software

superior PCB design and production services backed with a high level sh:31LIEIQIE:kp:::?(I:::’:h;’LErI?:,‘::::§

of technical support and outstanding customer service. When Robert with ongoing extra value ‘after the sale.’

Roberts founded EDM, he had a vision of a different kind of company- M Ad dd d th t EDM h I, d

one that truly cares about its customers and employees while operating N§,ds:',‘, YaES?ECH 20, for ma::,Syer;':_ tots:

under ethical principles that drive the way business should be done. existing YESTECH equipment still works fine

EDM is proud to continue operating under these guiding principles today. f°' 2,9 '\"SPe°\"°\"5t b”_‘ the L,”-TRA “\"a9I‘_'\"e

provides many added inspection capabilities.

We ultimately chose YESTECH again because

of proven reliability, ease of programming, and

EDM is a 100 percent employee-owned “Adding SD inspection to our AOI arsenal 5X°5IIe\"t °“5I°m9\"5UPP°l‘I-\"

company (ESOP). Data shows that ESOP allows us to quickly inspect for co-planarity _ _

companies are more accountable to their of chips, lead banks, and BGAs, which is Th°SeSameq“aI'I'e5arEWhatheIP”‘akE EDM

customers, work faster and leaner, and not possible with any 2D AO|,\" said Dave 5° 5”°°e55f”I- A5 3 U,S'ba5ed eIe°tr°\"!°5

develop happier employees who serve McAden, EDM’s CTO and VP of Sales. °°\"tr_a°I manufacturer’ ‘T5 PCB assembhes,

customers more effectively. EDM’s track “Additionally, we can now verify volume °°\"5'Stef‘IIy meet 'a\"_d EXCEECI ' °“SI°'_“er5

record of customer retention confirms that and slope of every solder joint, which can eXPe°Tat'°”S Tc\" q“aI'IVl P\"'°e and deI'VerV-

and can be seen in its growth rate over the provide more accurate data to help maximize _ _

last 28 years. yield. As part sizes continue to shrink, we ‘ i _e\\ _i _v ' '= _

are committed to consistentl rovidin our - V, ‘ l:- ‘o —’

EDM prides itself on maintaining a strong customers with cutting-edgeytgchnology to _ ' _ >

financial position that allows it to provide meet their changing needs.” -Li\",-R3...-:—..i-~i\"E“\"‘ ‘ ‘ T ‘ . /—

the best terms to customers, maintain large V‘. ‘ '\" ‘¥ ’

material inventory to support changing Nordson YESTECH’s advanced 3D imaging '

customer needs, and invest in the most technology provides EDM with high-speed 7

qualified people and equipment. Customers PCB inspection and strong defect coverage. I,

can trust that the company has the resources With one top-down viewing camera, four side- i, ‘ I,

to stand behind its commitments to them and viewing cameras and 2D + 3D inspection, the I , It

minimize their risk. To continually meet this FX-940 ULTRA inspects solder joints and ./-‘e'‘ //4

position, EDM partners with manufacturers verifies correct part assembly, enabling users 7 ///' -I.

that provide advanced technologies. Years to improve quality and increase throughput. ,/ ‘

ago, it engaged with Nordson YESTECH for Programming the FX-940 ULTRA is relatively -'5 _. I.

a 2D AOI system. Since then, the partnership fast and intuitive. Typically, it takes operators ; i -

has flourished and, when EDM needed SD less than 30 minutes to create a complete ‘I I

AOI capability, the company turned to inspection program including solder and ' \"

YESTECH for the purchase of the FX-940 lead inspections, and the system uses a V,-; *

ULTRA 3D AOI technology. standard package library to simplify training

and ensure program portability across

. manufacturing lines. Advanced LED lighting

. and image processing technology integrates _

V several techniques, including SD inspection, 1

color inspection, normalized correlation and

rule-based algorithms to provide complete EDM has W°\"ked With N°\"d5°n YESTECH

inspection coverage with an unmatched low I0\" V935: and WW has Purchased ITS 3D

fa|5e faflure rate AOI system to help advance customers

to the next technology level. YESTECH’s

7 technology and strong customer support

5 ’ — “AS PART sizEs CONTINUE T0 are why E|_3tl;/||_\}o partner

\" \" SHRINK. wE ARE COMMITTED TO W‘ -

\".3\" ‘ , CONSISTENTLY PROVIDING OUR

For the CUSTOMERS WITH CUTTING'EDGE This is part of what differentiates the company

. past 28 years’ EDM has focused?” TECHNOLOGY To MEET THEIR and makes it more than just a PCB vendor.

be'”9a°°'“Pa“V‘“a“'”'V “'95 ab°”\"‘5 CHANGING NEEDS.\" EDM provides a highly skilled, flexible and

cusmmers ahndhen’|I1pI°tyees’ ar|'d operates experienced design team that is committed to

Ont e I9 es prmcip 95' customers’ rowth and success.

Not only was the installation smooth, but 9

The system was set up on EDM’s production M°Aden addéd that N°rdS°” YESTECH‘: I3)’ P3\"I”9TI”9 ‘VI/III‘ N°\"d5°” YESTECH-_ EDM

floor earlier this year, and both the installation °”S,t°mer Semce has aIway,s been ?x°eIIe,”I' '5 3I3_’Ie T0 Pr°V'd5 CU5t°\"_7_e\]'5 With the I\"9_I195I

and training were successful. Training is vital Whmh W,a5 ancther factor In EPMS °h°'°e QUZTIIY ?’D C3P3I3'_I't'9_5 and C_°”I'”U9

for any AOI platform, and even more so with 0f fetufnlrlg I0 YESTECH f°T thls next I9V§I fulfilling its mission of delivering superior RCB

the multitude of added so capabilities, which °f '”SF’°°\"°\"- A°°°’d'\"9 *° ,\"\"°Ad_9\"t DEV“ assemblies to every company they work with.

is why EDM purchased the ULTRA. °°bb' N°'d5°”. .YESTECH.5 \"“.'”°\" \"V35 , , ,

superb at describing all available inspection www.nordson.com/en/div/s/ons/yestech

options. Additionally, he said that Nordson

SALINE 1

L ELECTRONIC CONTRACT MANUFACTURER

:('/Z:/\\ |iIu|uunun,,”, / K

L” K: \\\\\\\\\\muuuIm .n

J \\ c, « T

8 L 2» YEW»

'2=-_:\\ 2 $5‘: '.' T\"*’*—’——’—>~: —— =~ ~ ,

\\5 x 3 gm» Srwn J = ‘ _ 3 5

“ ’ . ‘ is x /A /'

.. 4,4; ffrv '\\ \\\\$\" ‘

\" .V?.-'.'>.;4 “*1 ..\\*~“ 5

A V‘, balmy A ~ /\\

5‘-»‘-“I ~* \"'1I’i3 ‘Z / L

V ’ \"'7 $4 «~;»':»: .»~‘‘///

V ¢ / A‘; ‘.4’! V '«' ‘,3 V”

g \"\\‘«\\!lf;f // 7 V251 ‘r\\;, S;

flfipe‘

A W4’

V V

K

. I 7 .

—_x

5 2

.. 1/E» /’ :5 V *3‘ '

/\" ’ I I

~». V g _.f

'5 \"‘ \{-4 /

~ i - .

‘~ . ’ \" — Z »

/' ' » I / L ”/7

' ‘ 1

..' ’ 1 V

~—~ _, ' -\\ _f' ~ _-‘ 4 ‘ \\

t. . _, , A __ «

C i \{ ‘ ‘ -v\" ‘ -3'2 \\ ‘ \\\\\\~\\\\

. '\\\\‘$. . i ' .»>‘ 4\"“ N‘ 8“

. . ‘ “ ‘ 60

_‘v‘‘__ . .1 p I W, ‘ M

ii % “ ‘ ::1\\A°

;- 1 i i i V i i - ti ”

_,i , ” ' L: 0

I . - .- 3 1 ./-

, I T 9 H.’ V “V ,.r “/

... —— I i , ;

/Z’? ’ ' ‘ 7‘ ‘Y. M‘:\"- ‘ L H fl ._ i

s.-. .. a - \" ‘ ' ”“ I K ‘z

. -.,_ ‘

ff. ?* .

I _ , \\ 1 _ 5 .

, __ g _,. ..4-.

, / t I __V; .

‘-5‘ ‘ - ir , ‘

J ‘ I .

‘ I

i

A leading light in engineering

' d LED performance

'1 -. .'-

We don’t just strive to exceed expectations, we innovate to make the best of industry, perform better. ' __ E

r _ -'.- ._

The LED market is the perfect example of our capabilities in action. LEDs are considerably more

efficient than traditional lighting forms, but they do still produce some heat, which without thermal E | r\"\" _ __

management will have an adverse effect on both the efficiency and operational lifetime of the LED.

Scan the code to discover our

From bonding and non—bonding thermal interface materials, to thermally conductive resins and full spectrum of electro-

protective conformal coatings, our solutions offer the ultimate level of protection and heat dissipation °“°’\"'°a' S°'“\"°“5'

for your LED application.

With an expansive product range and a strong emphasis on research and collaboration, we provide a

complete electro-chemical solution to the world’s leading LED manufacturers.

Isn’t it time you discovered how Electrolube can serve you?

Tel: +44 (0)1530 419600 ELECTROLUBE

T T

wwvv.e|ectrolube.com THE SOLUTIONS PEOPLE

Electronic 8. General Confoimai Encapsulation Ii .-ii Maintenance

Purpose Cleaning Coatings Resins : ii. .:.i &Service Aids