Micron-level accuracy, high repeatability, and reliable solutions
Precision processing encompasses a wide range of applications, but most share the common goal of accurately removing material while carefully controlling the shape, kerf, taper, and heat impact of laser processed elements. Feature placement is also under increasingly tighter tolerances—down to micron-level accuracy—while still maintaining high throughput. Often mechanical or traditional processes cannot replicate this complex, delicate work required in new and expanding application areas. Laser processing offers the level of control, quality, and versatility needed to meet manufacturing goals.
Lasers offer a non-contact method of processing sensitive materials. No tool wear or replacement means results are consistent and repeatable over time. It is also versatile: a digitally controlled process that can be altered instantly as market and technology demands change.
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A wide range of textural or visual finishes applied to a material that alter its surface properties
Efficient, cost-effective solution for permanently marking and coding a wide range of materials and products
Non-contact method of cutting, drilling, scoring, and perforating these highly sensitive films
Cut, score, or mark high performance glass used in electronics and scientific applications to architectural glass, and glassware for food and beverages
Remove precise amounts of material to cause a change in texture, expose underlying surfaces or materials, remove contaminants and/or excess material
Create durable, precise, cost-effective parts for rapid prototyping, low volume production, or end use parts
Used across a range of photopolymer resins for the highest resolution, best detail, and smoothest surface finish of the many 3D printing technologies
Smaller holes than mechanical processes with fast, highly accurate via placement
Create precise, consistent holes with a non-contact process offering control of hole diameter, taper, depth, and placement with exceptional repeatability
Perforate the rear passivation layer and increase conversion efficiency for Passivated Emitter Rear Contact (PERC) solar cells
Create custom probe cards, allowing accurate testing of wafer devices
Create micro features with precise shape, minimal heat effect and high positional accuracy
Precise removal of material with accurate control over hole size and shape
Advancements in laser sources, beam delivery, controllers and software deliver greater cost efficiency with added flexibility to pursue new battery designs.
