Real 3D
Optical
Inspection
for PCBA
Jaroslav Neuhauser explores 3D AOI technology
Reliability Rules
Mike Konrad takes a look at the meaning of ‘rules’ within the Electronics Assembly Industry
red carpet
Who’s doing what, where?
inside
SMT Hybrid Packaging Nuremberg, Germany
6th - 8th may 2014
meet the CEos Page 6
Tetsuro Nishimura, Nihon Superior Co. Ltd. (cover) David Raby of STI Electronics Inc.
Bob Black of Juki Automation Systems Inc.
Don Miller of Nordson YESTECH
Chris Larocca of OK International Inc. Volker Pape of Viscom AG
| MAY 2014 ISSUE smttoday.com
maximum quality printed multi platform digital magazine corporate media exposure magazine compatibility and video email list
welcome
to smt today
Welcome to May’s edition of SMT Today – the leading global magazine solely focusing on the electronics industry providing the best content and largest distribution through the latest technology channels.
In March we were at the very successful IPC APEX EXPO in Las Vegas and, as a team, were delighted to meet up with many of our readers and contributors where we shared what SMT Today offers in the form of media exposure, inclusion in a quality printed magazine, multi-platform compatibility and complimentary videoing capabilities. A number of videos with industry leaders and technology experts were also taken during the show and these are now available for viewing on our website at www.smttoday.com
We’ve brought the publication of this issue forward to coincide with the SMT Hybrid Packaging Exhibition in Nuremberg, a platform on which the industry’s leading companies will show the latest trends and developments as well as up-to-date solutions.
Lin Ramsay
Editor
In this issue we’re focusing on 2D and 3D Inspection and are very pleased to include an article by Keith Bryant and Jaroslav Neuhauser from Saki Europe on “Real” 3D Automatic Optical Inspection.
In addition, we’re delighted to welcome Gene Weiner, one of the most respected industry heavyweights who will be contributing a regular column entitled ‘Industry Insights’.
The next issue of SMT Today will be published in July and will focus on Printing vs Dispensing so, if you’ve any articles that you’d like included, please don’t hesitate to send them to me at [email protected]
magazine contacts...
Editor
Design Website
Lin Ramsay [email protected] +44(0)1292 834009 skype: lin-smttoday
Big Blue Dog bigbluedogdesign.com +44(0)1292 280022
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4
SMT Hybrid Packaging 2014, Nuremberg
22
DEK Launches
Gemini Platform
DIRECT Marketing
46
Competition Raises Standards
6
Meet the CEOs
32
New Products
inside
this issue...
SMT Hybrid Packaging 2014
Take a look into some of the featured products
Technology Today
Industry experts share their knowledge
6 Meet the CEOs
10 Reliability Rules
15 Real 3D Automatic Optical Inspection for PCBA
20 Cracking the Code of the IPC Assembly Speci cations
22 DEK Launches Gemini Platform
24 National Electronics Week ADEC EXPO, South Africa
26 A First Look at Black Chrome Solder Tips
28 It’s A Panel Game!
36 The Advantages and Disadvantages of Vapour Phase Soldering
44 NEW UK 2014
46 Competition Raises Standards
48 Selective Soldering with a PLUS of Flexibility
4
Industry Insight
14 New Products 32
Industry News 38 What’s happening in the world of electronics
Gene Weiner, takes a look at bypassing 2.5D Exciting new industry innovations
Red Carpet
Photo gallery of industry personalities and events
52
Page 3
SMT Hybrid
Packaging 2014 Nuremberg, Germany 6th - 8th may
Balver Zinn/Cobar
PRODUCT SN100C® and SN100CS+ booth #9-312
Metcal will be highlighting the new MX-500. This Soldering and Rework System has been re-imagined, adding features and a new look to a bench top icon. Built upon SmartHeatTM Technology, the new MX-500 assures extremely responsive and highly controlled heating delivering the exact energy needed to ensure a precise and reliable solder connection. Additionally, the MX-500 retains switchable dual port, 40W operation while introducing numerous new features in a new housing.
Metcal
PRODUCT MX-500 booth #9-327
Balver Zinn SN100CS+® is a new variant (250ppm instead of the standard 50ppm Ge) of the unique and highly regarded lead-free solder Balver Zinn SN100C®. Germanium is an anti-oxidant that will react with metal oxides on the surface of the solder in such a way that it will reduce dross formation. Due to the higher amount of germanium in the Balver Zinn SN100CS+® this alloy is recommended for applications without nitrogen.
SN100CS+® has all the advantages that have made SN100C® so popular, including substantially reduced copper dissolution rates. The lower surface tension of solder, deoxidized with germanium, will provide better wetting and ow properties.
Microtronic
PRODUCT LBT-210 booth #9-430A
Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature pro le. A component is placed on printed solder paste and heated through the same temperature pro le that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder pro le of an in-line production solder furnace in conjunction with different solder pastes and components.
Page 4
| MAY 2014 ISSUE
SMT Hybrid Packaging is Europe’s leading event on system integration in micro electronics.
Scheduled to take place between the 6th and 8th May 2014 in Nuremberg, Germany, the show oor promises to be full of technologically advanced products and innovations.
To get the most from the show and to stay updated on the newest trends and developments, we have gathered a sampling of the products and systems that will be available at the exhibition. From SMT equipment to components and services, read on to nd out how these technologies can help your company advance to the top of its competition.
SEHO
PRODUCT SelectLine booth #9-209
The patented Synchro concept, an innovative highlight of the new selective soldering system SEHO SelectLine, guarantees maximum throughput. Typically, to increase production volume, additional soldering modules need to be added, or the machine has to be equipped with a dual conveyor to allow parallel processing of boards. These measures, of course, are associated with a large investment in equipment. The Synchro concept is an intelligent software feature that co-ordinates the soldering process for two PCBs in such a way that the total throughput is nearly doubled without the need for signi cant investment. The assemblies can enter the soldering area independently and are not linked to the same cycle. With the new Synchro concept, cycle times can be reduced by nearly 50%.
Techcon Systems
PRODUCT TS9200 Jet Tech booth #9-327
The TS9000 Series Jet Tech Valve is a piezoelectric driven, non-contact dispense valve capable of handling uid viscosities to 2 million Cps and offers a fast jetting action in producing hundreds of accurate deposits less than one second. The Jet Tech features a compact size and modular design that can be integrated into robotic systems, and adjustable parameter settings allowing the operator to change the jetting properties for different uid types and optimize the process for repeatable dispensing. A variety of nozzles shape and sizes, along with different tappet con gurations, provides a wide spectrum of output jet deposits.
Viscom
PRODUCT S3088 Ultra booth #7-203
The Viscom S3088 Ultra combines the exibility of the AOI systems of the Viscom S3088 family with the strengths of the high-performance camera module XM- 3D. The S3088 AOI systems are designed to exibly cover various requirements, from small series production to high- volume/low-mix manufacturing. The XM- 3D camera module allows especially fast inspections, with both high-resolution angled views and 3D analyses.
Through high-resolution angled views, the S3088 Ultra reliably recognizes critical defects. With the OnDemandHR function, the optical resolution of 16 μm (standard resolution) can be converted to 8 μm (high resolution).
meet the CEOs
the people who make it happen
Our industry is driven by a global network of CEOs with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.
STI Electronics Inc.
David Raby is the President & CEO of STI Electronics Inc., a full-service organization providing training services, electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly. Since 1982, the company has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. Raby and his team also produce a complete line of solder training kits and training support products. Additionally, STI distributes products for the electronics and industrial markets.
Juki Automation Systems
Bob Black is the President & CEO of Juki Automation Systems Inc., a world-leading provider of automated assembly products and systems and part of Juki Corporation. Black and his experienced team have built Juki Automation Systems into a global leader in high-speed SMT Assembly equipment and have shipped more than 27,000 machines worldwide since 1987. Juki has built its global image with a combination of top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. The pioneer of the modular assembly system in 1993, Juki offers exible solutions designed for both high-volume and high mix environments. Additionally, Juki Americas offers selective solder and stamp soldering machines backed by the largest eld service group in the industry. The company recently introduced a complete line solution to include screen printers, re ow ovens and wave solder systems.
Nordson YESTECH
Don Miller is the President of Nordson YESTECH, which is a subsidiary of Nordson Corporation. Headquartered in Carlsbad, California, USA, Nordson YESTECH is a leading provider of automated optical and high-resolution X-ray inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor packaging industries. Nordson YESTECH is operated and managed by Miller and a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales of ces and customer support centers in North America, Asia and Europe.
OK International Inc.
Chris Larocca is the President of OK International Inc., a leading global manufacturer of bench tools, equipment and related products that are used in the electronics and industrial assembly marketplace. Larocca is committed to understanding the product needs of the company’s customers. He and his team ensure that OK International supplies professional grade products that are innovative, reliable, price competitive and easy to use. Through a global sales channel, the company provides expert product support and responsive customer service, with localization to meet regional market needs.
Viscom AG
Volker Pape is the co-founder and CEO of Viscom AG, a leading manufacturer of optical and X-ray inspection systems. Viscom has successfully marketed its inspection solutions since 1984 and has grown from a pioneer in the eld of industrial image processing to a leader using a staff of several hundred employees today. The focus is high-quality inspection systems for the electronics industry, especially automatic optical inspection systems (AOI), for solder paste inspection (3-D SPI), placement and solder joint inspection, as well as X-ray inspection (AXI). In this sector, the company has become one of the leading suppliers worldwide and market leader in Europe. Headquartered in Germany, Viscom’s inspection systems are used in virtually every branch of industry - from automotive electronics to aerospace technology, to industrial electronics and the semiconductor industry.
Page 6
| MAY 2014 ISSUE
director
spotlight
an interview with
Tetsuro Nishimura
Nihon Superior Co. Ltd. was founded in 1966 when it began marketing unique ux products imported from the United States. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world and supplying them to companies in the metal- joining industry.
A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy, Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centres in Japan, China and other Asian countries as well as the United States and formed business partnerships with companies in other markets. Our editor recently spoke with Tetsuro Nishimura, President, to gauge the company’s thoughts on current and future issues.
Q. How is the current market in Japan? Where do you see it in ve years from now?
A. Very quiet. We have had some changes in the economy. For example, tax has increased from 5% to 8% and that has caused some big movement. It was busy before, but now it is weak and during the next ve years we expect that there will be more big changes in the Japanese economy.
Q. How important is a global customer base to Nihon Superior? What advantages does this bring customers?
director
spotlight
A. They are absolutely important for us. They have different ways of thinking and different rules and the new ideas and agendas are great for new products. In order to get additional information and to deliver the latest information to our customers, we opened a new Research and Development Centre in Malaysia last September. In May of this year, to support customers worldwide, we will also open a new sales company in Malaysia, Nihon Superior Asia Sdn. Bhd. (NSA). This will cover sales from the Philippines to India, including Singapore, Malaysia and Indonesia. We also expect NSA to be the hub base for all sales and technical support throughout the South East Asian countries through the connection with our subsidiaries in Thailand and of ce in Vietnam.
Q. How has 2014 started for Nihon Superior? Do you anticipate much growth this year?
A. The market is weak, but it has been busy for us so far. We may face dif culty for the next half year, but this is a good chance for us to settle down and develop something new. We estimate to be plus 10% by the end of this year.
Q. What new markets will the company focus on entering? Why these?
A. We are trying to develop semiconductors and vehicle markets. We have especially developed the home appliance markets so far, and we have been expanding the results to other markets little by little. Now is the time to expand the results widely to products with high-reliability requests. We have developed a Sn-Zn+a solder alloy for soldering Ag electrode on vehicle glass. This solder LF-Z3 drastically holds down Ag erosion that occurs even with high Ag solders. With this solder, and an exclusive use ux, we nd it may enable one of the tasks of lead-free soldering on vehicle products to be cleared. ____________________________________
Ltd. for power modules for robots. We believe that these results will be a foothold for the new market.
Q. In order to enter these new markets, will you expand your network of global licensees? How do you decide which companies to bestow with this honor?
A. We will consider it very carefully but in a positive way, whether it will expand the new market or just cause unnecessary competition. ____________________________________
‘‘SN100C (031)
is designed to improve the efficiency of electronics assembly. It offers fast sequential soldering by reducing flux spattering
and excellent spreading
____________________________________
Q. Congratulations Mr. Nishimura – we understand that Nihon Superior won an industry award at the IPC APEX EXPO for SN100C 031. Can you brie y describe this product and tell us how it meets industry challenges?
A. SN100C (031) is designed to improve the ef ciency of electronics assembly. It offers fast sequential soldering by reducing ux spattering and excellent spreading. This allows shorter solder time consumed per joint and improves working ef ciency, especially for those at mass production. Also, at the same time, it has a high reliability. It is SVHC-free, which means it contains no ingredients in the EU REACH Regulation list of Substances of Very High Concerns. It also has less cracking of ux residue after soldering which helps to prevent solder corrosion in high humidity circumstances.
Q. Speaking of new products, are you experiencing success with the Alconano range of nano-silver products? What prompted the company to create and introduce this platform?
A. Yes. As mentioned above, we received approval from Shindengen Electric Manufacturing Co. Ltd. for power modules. There are other cases coming up constantly, and we are trying to follow up and nd the best answer to customers. Since, in most cases, our customers are trying to build up new technologies, it is more like a challenge for us too. There are many tasks to be cleared but at the same time, we gain a lot from them. The curiosity and the inquiring mind to new products and new markets led us here. ____________________________________
‘‘Since, in most cases, our customers are trying to build up new technologies, it is more like
a challenge for us too
____________________________________
Q. By the end of 2014, what goals do you hope to accomplish for the company?
A. First of all, we would like to get Nihon Superior Asia on the road. We believe this will be helpful for both our customers and ourselves. Eventually, we would like to strengthen the linkage with our R&D center in Malaysia and Japan to respond to expectations from our customers.
Our aim, to expand SN100C and other NS products worldwide, has never changed and will remain unchanged. We are always watching carefully for customers’ requests and thinking hard about what solutions we can provide.
‘‘
and an exclusive
With this solder,
use flux, we find it
may enable one of
the tasks of lead-
free soldering on
vehicle products
to be cleared
____________________________________
We have also developed new products such as “Alconano” nano silver paste. This has already been accepted at Shindengen Electric Manufacturing Co.,
Page 8
| MAY 2014 ISSUE
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Reliability Rules
by michael konrad, President of Aqueous Technologies Corp
Like many other languages, the English language contains single words with multiple meanings. Take the word “rule” for example. It has many meanings. Rule can be de ned as “a statement that tells you what is allowed or what is not allowed in a particular game, situation, etc.” It is also de ned as “a piece of advice about the best way to do something,” “an accepted procedure, custom or habit” or “to be pre- eminent; be in charge”, to name a few.
In the world of the electronics assembly industry, there are many rules, each with its own de nition. Let’s start with the “Rule of Thumb.”
Rule of Thumb
Noun: “A rough and practical approach based on experience rather than a scienti c or precise one based on theory.”
The rule of thumb has long dictated if an assembly looks clean, it is clean. In the late 1980s, assemblers en masse defected from rosin and water-soluble uxes and transitioned to “no-clean” uxes. The promise, mostly delivered, was that there would be no visible residues after soldering. The formally popular ux types all left visible residues until cleaned. No-clean uxes almost miraculously left behind little to no visible residues.
Assemblers, now happy citizens of the “No-Clean Nation,” enjoyed many years of blissful tranquility until one day, when the rules changed.
Rule
Noun: “A statement that tells you what is allowed or what will happen within a particular system (such as a language or science).”
There are many residue species commonly found on an electronics assembly. These residues are accumulated over a circuit board’s long journey into usefulness. Residues from board fabrication are very common. Just because the board is bare does not mean it is clean. On the contrary, bare boards may be surprisingly dirty, covered with invisible forms of contamination, some benign and others harmful. ____________________________________
not mean it is clean.
On the contrary,
bare boards may be
surprisingly dirty
____________________________________
Additionally, there are residue stowaways from component fabrication. I recall a paper presented by Research in Motion (Blackberry) whereby they described an issue involving silicon mold-release that transferred from the component reel to the component, to the circuit board, reeking havoc on the soldering process.
Finally, there are assembly residues, perhaps the most proli c of all of the residue types. The assembly process is rife with potential residue sources. Human-derived residues including hand oils, equipment transfer residues, food products (potato chip residues are exceptionally nasty), hand lotion residues and, of course, ux residues. Here is one rule most assemblers forget. If one does not remove ux residues, one does not remove any residues. So, even with the most utopian belief that no-clean ux leaves no residues, there remains a virtual farmer’s market of other residues on the board.
Q. “We have successfully not cleaned our assemblies for the past 20 years. Why are we experiencing problems now?
A. The Rules have changed.
Remember the days when a circuit board’s geography resembled “ y-over” country? Available board real estate was in ample supply. Additionally, components 20 years ago were Land-of-the-Giant sized compared to many modern components. Circuit boards were large and component spacing was vast. Those were the days. Back then, there was a considerably higher level of tolerable residues. Today, with the drive toward miniaturization, both component-to-component and component-to-board spacings have never been lower. Miniaturization, combined with increased product lifespans and reliability expectations, has resulted in the reduction of tolerable residue limits. In other words, a speci c volume of residues on an assembly a few years ago would go unnoticed while the identical volume today would be catastrophic. The closer things are together, the more likely residues will have a detrimental affect.
just because the ‘‘
b
oard is bare does
IPC Approved Resistivity of Solvent Extract (Cleanliness) Tester
Dendritic growth caused by a combination of residues, moisture and electrical current. Photo courtesy of Foresite
Q. How do I justify cleaning a no- clean ux? Doesn’t “No-Clean” mean “Don’t Clean”?
A. Forget the term “No-Clean”. Re-label the solder paste jars “Low-Residue”.
Page 10
| MAY 2014 ISSUE
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feature continued...
The most commonly removed (cleaned) ux is no-clean. That is a fact. More assemblers clean assemblies re owed with no-clean solder paste than any other type of solder paste. Some of the assemblies re owed with no-clean solder paste arguably do not need to be cleaned while others absolutely must be cleaned.
There are many factors to determine if an assembly should be cleaned. Factors include:
• The cost of failure
• The climatic environment where the
assemblies shall live
• Geographic component layout
Cost of Failure
If your product fails due to the presence of harmful residues (or any other fatal defect), what happens? While some assembly failures can lead to very dramatic results (death, destruction, etc.), others can lead tolossofpro tsandreputation.While some failures may be considered helpful, most do not fall into that category. Some assemblies can handle residues without failing and others cannot. How can a label on a solder paste jar know whether or not your assembly can handle the residues created by a no-clean process? The fact is the label is misleading. A more appropriate de nition would be “low residue.” It is then up to the technology owner to determine how much residue is acceptable on a speci c assembly.
Climatic Environment Where the Assemblies Shall Live
Residue-related assembly failures typically are the result of three combined factors: residues, moisture and electrical current. The right combination of these three ingredients will result in electrical migration (dendritic growth) or electrical leakage, neither of which is desirable.
To eliminate any chance of electrical migration or leakage failures, all one has to do is eliminate one of the three factors.
1. Eliminate electrical current - Obviously, while effective, eliminating electrical current is not an option.
2. Eliminate moisture - Moisture acts as a catalyst for electrical migration or leakage when it comes into contact withelectricalcurrentandcorrosiveor conductiveresidues.Whileagoodboard baking process can eliminate moisture,
unless an assembly is encapsulated, moisture can return to the assembly, causing the previously described failures. A common belief is that to prevent the re-introduction of moisture, the assembly can be conformally coated or potted. While this is true when assemblies are deeply potted, it is not true when assemblies are conformally coated. Conformal coat, while providing an effective barrier to uids, most often is permeable. A small amount of moisture can penetrate a conformal coating, which can result in undercoat corrosion and electrical migration and leakage.
3. Eliminate residues - With a residue- free assembly, electrical current and moisture alone do not have anything with which to form a current path. No current path means no electrical migration or electrical leakage.
Geographic Component Layout
Consider the amount of spacing between component-to-component and component-to-board. Remember, as the spacing decreases so does the volume of tolerable residue.
Q. How exactly do I determine how much residue is on my assembly?
A. This answer involves both good news and bad news.
The good news is there are fast, easy and affordable testing systems that are capable of determining how much residue is on an assembly. There are also well-de ned cleanliness standards, originally published as military standards, then subsequently morphed into IPC standards.
The bad news is the cleanliness standard most used today was actually developed in the 1970s. The 1970s is the time before surface mount. Back when Fantasy Island was topping the TV charts, a cleanliness standard was borne. It has never changed.
The volume
of acceptable, tolerable residues back in the 1970s was many times more than would be acceptable today. Some have suggested that a new
test is required. Perhaps a better concept is to internally reject the current (yet obsolete) cleanliness pass/fail standards and replace them with lower, more conservative standards.
The current IPC pass/fail standard for post-re ow cleanliness is 10 ug NaCl (eq) /inch2 (1.56 ug NaCl cm2). A more realistic approach to cleanliness standards considers the component spacing on the assembly, the amount of electrical current, the cost of failure and the climatic environment (moisture) where the assembly will be functioning. By taking into consideration these four factors, one may determine the “safe” and tolerable amount of residues.
For some assemblers, the current IPC standard works well. These assemblies have measurable space between conductors, adequate stand-off heights that are less likely to trap residues, will beoperatinginaclimate-controlled/low humidity environment, and the cost of failure is not prohibitively high. For other assemblers, fewer residues would be more prudent.
Perhaps, in this context, the most practical de nition of the word “rule” is:
Rule:
Noun: “A piece of advice about the best way to do something.”
Page 12
| MAY 2014 ISSUE
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industry insight
by gene weiner, IPC Hall of Famer
Gene Weiner takes a look at bypassing 2.5D and reviews this year’s IPC APEX EXPO, held in Las Vegas.
Bypassing 2.5D
Did Nvidia’s announcement that it would use 3D packaging with silicon-through- vias on some forthcoming Pascal graphics processors, to make more memory available with minimal delays, signal the start of a general acceptance of stacked memory chips? ____________________________________
‘‘Samsung, Intel,
a
$62.2 billion in 2014
____________________________________
Samsung, Intel and TSMC will spend more than 50% of the entire IC industry’s billion Capital Expenditure of $62.2 billion in 2014. The questions are, “How much will they spend to help their supply chains develop the new packaging and materials needed for their now products?* How will these be selected? What other support will they provide? Will they leave this challenge up to their competition to provide the solutions if they can afford to nd them?” It seems like the obstacles to overcome are indeed steep for those wishing to enter tomorrow’s electronic packaging industry. ____________________________________
‘‘It seems like
the obstacles to overcome are
indeed steep for those wishing to enter tomorrow’s electronic
packaging industry ____________________________________
*Note that China spends about $300 billion on R&D versus $450 billion in the U.S. and is increasing its spend by 20% per year. At this rate it will surpass the U.S. in research and development spending by 2022.
IPC APEX EXPO
2014 was the best in many years. Attendance was good. Record conference attendance was coupled with steady traf c on the show oor. Even Thursday morning saw potential buyers visiting exhibitors in their booths. Capital equipment buyers were twice as optimisticasinthepreviousyear-about 65% stated that they planned to buy equipment this year versus about 30% last year. Exhibitors stated that they were making sales and getting commitments for future trials in their booths during the show - even though there was little in the way of new systems to be seen in the hall. One independent equipment sales rep stated that he had more customer meetings at this show than at the ve previous events combined. ____________________________________
beefed up its management staff, moved into larger quarters in Utah this past year, and established a branch in Zuhai, China to service its customers there. He stated that millions of boards have now been processed through their system, which is said to meet all current IPC requirements and have a longer protective life than those materials currently applied by plasma deposition. The process is marketed in a variety of ways including leased equipment, license, OEM licenses, and coating services for a fee. ____________________________________
nd TSMC will spend more than 50% of the entire IC industry’s billion CapEx of
‘‘The company grown
‘‘
uyers were twice
b Capital equipment
as optimistic as
in the prior year
- about 65% stated that they planned
to buy equipment
this year versus about 30% last year ____________________________________
New product introductions and improvements abounded. EarthOne Circuit Technologies Corporation and eSurface® Technologies created quite a stir with its sponsorship of the Tuesday luncheon to announce a new additive printed circuit board process.
It was interesting to learn of the rapid growth of HzO and its vacuum applied conformal (and other protective) coatings. Michael Mummert told us of the progress his company has made this past year. The company, grown from a handful of employees to about 50,
f
employees to about 50, beefed up its management staff, moved into larger quarters in Utah
this past year, and established a branch in Zuhai, China ____________________________________
rom a handful of
Gene Weiner
IPC Hall of Famer Gene Weiner started in our industry in 1956 as President of Weiner International Associates, and has over 50 years successful business and corporate of cer experience. Weiner International activities are geared to identifying and seizing new opportunities, expanding market boundaries, globalizing and localizing business, lowering manufacturing costs, expanding spheres of in uence, improving individual and corporate performance. Gene has a wealth of knowledge and experience, and has his nger on the pulse of the industry today.
Page 14
| MAY 2014 ISSUE
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Real 3D Automatic Optical Inspection for PCBA
by Jaroslav Neuhauser, Technical Manager, Saki Europe and Keith Bryant, SMT Today’s technology editor
The newest state-of-the-art full 3D Automatic Optical Inspection (AOI) delivers many bene ts compared to the conventional 2D AOI system i.e. improved real defects detection together with lowest false call rate, easier programming and shorter programming time, more accurate data in the Statistical Process Control (SPC) database and easy interpretation of the defects for operators. Let’s explore 3D AOI technology in more detail.
Development of AOI Technology
There are many ways to optically inspect PCBAs (Printed Circuit Board Assemblies). Previously, all of the methods were based on 2D imaging which is suf cient for the detection of many PCBA defects. However, there are some types of faults where 2D imaging has its limitations, especially lifted lead detection, non- wetting, lifted chips, tombstoning, or BGA, QFN or CSP co-planarity issues, plus bare board atness. ____________________________________
implementangledviews(orsidecameras) to enhance the detection of lifted lead inspection. This approach seemed to be more successful. However, the density of mounted components and taller packages started to restrict the areas where only the angled view was possible to be used. Angled cameras provide only local information of the component and one of the most dif cult issues is to nd a balance between the cycle time and the number of components inspected in angled view.
A typical Programmer’s question is:
“Which component will be inspected in angled view?”
The answer from Quality Assurance would be:
“Every component, for sure!”
Production Department responds:
“No way! We have no time to slow down the production line as the production plan is full!”
So the typical conclusion of the dialogue is to use the angled view for the most critical and potentially problematic components. But, which are those components? How do you anticipate a single defect occurrence? Can the angle view be used?
Figure 1: Example of Blind Area in Angled View
There are many locations on almost every PCBA where the side camera has a ‘Blind Spot’likeonthe gureabove.Inthiscase, the side camera is not an option and just orthogonal inspection has to be used.
Now, the answer is clear! Cover the full PCBA surface in 3D without compromising the cycle time... Real 3D AOI.
Figure 2:
Real 3D Non-Filtered Reconstructed Image
Real 3D AOI Advantages
Real 3D AOI delivers height information over the entire PCBA including all soldering points. Just by considering the height of the components, the presence/absence or position offset become independent on PCB and components surface colour and brightness. It also suppresses any difference between the PCB and component vendors and differences among the production batches of components. Generally, as all SMD components have a rectangular or circular shape, the height information enables automatic generation oftheinspectionlibrary. ____________________________________
‘‘Programming
methods and
parameters are also
simpler and more
understandable
____________________________________
Therefore the programming time is reduced dramatically and the ne tuning phase of programming is almost eliminated. Programming methods and parameters are also simpler and more understandable, as we are talking about dimensions and height –simplyeverybodycaneasilyimaginethe geometrical dimensions. Real 3D AOI is capable of classifying more accurately what really happens on a PCBA including the correct and clear classi cation of lifted leads, non-wetted joints, board warp, etc. In addition, the visual appearance on the
another solution ‘‘
angled views (or side
cameras) to enhance
the detection of
lifted lead inspection
____________________________________
2D imaging started with orthogonal black and white and later colour CCD or CMOS camera systems with diffusive non- directional lighting. Then the orthogonal, or structured angled lighting for soldering inspection, was added to improve the performance. However, there were still defects, which remained undetected.
Some vendors started to use point laser triangulation but this method proved unsuitable for high re ective object inspection, e.g. soldering, as it provides only very local information of the selected component and cycle time is raised dramatically typically one second per measurement. Another solution was to
w
as to implement
Page 16
| MAY 2014 ISSUE
veri cation station graphical user interface for operators, 3D view, can be rotated and zoomed in real time, enabling an operator to classify the defect reliably, consistently and quickly.
Technology
Real 3D AOI uses Phase Measurement Pro lometry (PMP) technology to acquire height information in the entire Field of View (FOV). This technology is well proven in Solder Paste Inspection (SPI) machines after the printing process. However, there are several important differences compared to SPI technology.
The projector unit projects the stripe pattern image onto the PCBA at an exact angle. With the knowledge of the projection angle, the height can be accurately calculated at each point and the PCBA surface reconstructed to the 3D view.
Shadow behind Tall Components
As the projector is not projecting the stripe pattern orthogonally, the shadowing effect comes up behind the tall components. In those areas where the stripe pattern can’t be seen by the camera and therefore the height can’t be measured. In this instance more projections have to be used. In practice, four projections (North, East, South and West) are usually used. The reconstruction algorithm identi es the shadowed areas and automatically uses the other projection(s) without shadowing instead.
Multiple Reflections
Due to shiny objects and high density of components on PCBA, the multiple re ection effect can happen. ____________________________________
‘‘any multiple
reflection causes
inability to
measure the height
or creates an
inaccurate height
calculation
____________________________________
Any multiple re ection causes inability to measure the height or creates an inaccurate height calculation. The reconstruction algorithm automatically selects the projection(s) with the smallest error in order to maximize the nal reconstructed image quality.
Height Measurement Range
In the case of SPI inspection, the typical height measurement range is up to 450μm. However, such a range is insuf cient for
PCBA inspection, as much taller components are mounted. Simple range extension is not a solution, because the height resolution and accuracy would become low. To rectify this issue, two different stripe pattern pitches/ frequencies are used.
‘‘Compensation
of PCBA surface
warpage is essential
for accurate
detection of
slight chip lifting
or BGA/QFN co-
planarity check
____________________________________
As an example of chip body inspection the component height and angle (inclination X and inclination Y) is investigated after the reference plane compensation.
Figure 6: Wide and Fine Stripe Pattern Pitch
The wide one (low frequency) is used for inspection of tall components, the ne one (high frequency) for inspection of tiny components and solder joints. Such a machine provides high resolution in the range of 0mm to 2.5mm - solder joint area and also covers a wide range of tall connectors and capacitors.
Figure 7: Old vs. New Projector Comparison
In the old concept of stripe projection, the pitch and lighting intensity was fixed and the pattern was mechanically moved by piezo motor (refer to overhead projector). This approach needs more projections compared to the latest technology, so takes much more time. The new, state-of-the- art projector is using LCoS (Liquid Crystal on Silicon) components for stripe pattern generation. Based on the above process, the stripe pattern is actually generated by software. The pitch and even the brightness (amount of the reflected light) can be changed easily providing much more flexibility.
Figure 10: Chip Body Inspection
The inspection window is set to body size. In this case, the average height result is 499μm and it is within tolerance for the 0402 chip resistor. Tombstoning (or Inclination in X direction) equals to 15μm and Billboarding (or Inclination in Y direction) equals to 8μm. Both are within tolerances. Please refer to gure 10.
Figure 8: LCoS Components
Zero Reference Plane Compensation
One of the most important matters in 3D inspection is to accurately calculate the Zero Reference Plane. If this was not calculated accurately, all the results would become inaccurate too.
3D AOI systems have to calculate not only the reference height, but also consider the reference plane angle. Compensation of PCBA surface warpage is essential for accurate detection of slight chip lifting or BGA/QFN co-planarity check. The compensation has to be done for each FOV independently, because the PCBA can be warped and bent irregularly. ____________________________________
feature continued...
3D AOI Programming
We have already mentioned that programming and debugging time is much shorter and programmer skills needed for making the program are ‘by design’ minimized.
3D vs 2D Programming
3D programming is a very friendly way to build a programme, because of its simplicity. However, for several defect types, there is no way to discover them in 3D i.e. printed polarity mark, reading the text printed on the component body etc. Then, 2D programming comes into the equation. The state-of-the-art Real 3D AOI systems combine 2D and 3D programming in a very smart way and offers the best and most suitable inspection algorithm for each situation. ____________________________________
‘‘The state-of-
t
systems combine 2D
and 3D programming
in a very smart way
and offers the best
and most suitable
inspection algorithm
for each situation
____________________________________
Automatic Component Shape Recognition
The height information is very accurate; therefore it can be easily used for automated component geometry recognition.
When using conventional 2D AOI, the programmer has to de ne the inspection windows or areas of interest. However, this step is not necessary for Real 3D AOI systems.
Programme Debugging
A programmer has full statistical control for each parameter in 3D AOI system. Histograms of the sample values for the components of the same part number all around the PCBA are available for studying with the component variance available on either a machine or of ine programming station. The data is logged into the SPC database, so the programmer has a full picture about past production.
Figure 13: Operator Interface (Lifted Component Body)
he-art Real 3D AOI
Figure 11: Automated Component Geometry Recognition
udge whether they see a real defect without having the actual PCB physically in
Figure 12: Sample Value Histogram Example
Operator Interface
Another huge advantage of Real 3D AOI technology is the visualization of defects for operators on the production line. An operator has a chance to investigate the defect by using the 2D or 3D image, depending on the type of defect. He/ she can easily judge whether they see a real defect without having the actual PCB physically in front of them. 3D images simply make their work much easier and more reliable. ____________________________________
‘‘they can easily
j
front of them
____________________________________
Conclusion
In the last decade, visual inspection performed by operators has been replaced by 2D AOI systems. Nowadays, Real 3D AOI technology is well on its way to replacing the 2D AOI systems, plus 2.5D and Pseudo 3D. Although it is clear that Real 3D AOI technology is still quite new, the potential of 3D imaging and 3D programming is huge. Today, there is signi cant market demand for Real 3D AOI in High-Tech segments i.e. military and aerospace, automotive and telecommunications. Sooner or later 3D AOI demand will spread to the other segments of the market setting the standard in the global SMTA industry. Yield improvement to increase pro ts is becoming a common mantra in our industry and this technology is a huge step forward in achieving this. As more packages change to BTC (Bottom Terminated Components) and QFNs become a common sight on boards, co planarity becomes a big issue for the assemblers as does board atness.
Page 18
| MAY 2014 ISSUE
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Cracking the Code
of the IPC Assembly
Specifications
The IPC assembly speci cations have become the worldwide standard for virtually every company involved in printed circuit board (PCB) fabrication, assembly, repair and prototyping. That is without question. What is in question amongst most in the industry is what exactly each speci cations primary focus/ purpose is. This is compounded by the many acronyms and combination of letters and numbers that are used for the speci cations and revision levels. As an IPC Master Training Center, we get calls every day from customers wanting to get IPC certi ed but do not know which speci cation is best for their situation. So this should clear it up for everyone. ____________________________________
classroom study and includes no hands- on work.
IPC-A-610E Acceptability of Electronic Assemblies
This is typically for nal QC at an assembly house and incoming inspection of assembled PCAs from an assembly facility or EMS partner. This also is very pictorial and empirical in its documentation of good and bad solder connections for all types of SMT and TH components. All aspects of workmanship standards and inspection criterion are covered. This certi cation is all classroom study and includes no hands-on work.
IPC/WHMA-A-620B Requirements & Acceptance for Cable & Wire Harness Assemblies
This is for people terminating wires and building wire/cable harnesses. It includes all types of crimp, solder and solderless connections and what constitutes a robust reliable assembly. It is mostly classroom work but there is an optional hands-on module for applying the practices learned. The optional Space Addendum is available for NASA contracts.
IPC-7711/7721B Rework, Modification and Repair of Electronic Assemblies
This is an intensive hands-on ve day curriculum that will make the student extremely pro cient in repair of most SMT and TH devices as well as laminate repair. The 7711 portion is component removal and replacement. The 7721 portion is repair of damaged TH barrels/ annular rings, SMT lands and PCB traces, including inner layers of multilayer boards.
IPC-J-001E Requirements for Soldered Electrical and Electronic Assemblies
This is the most comprehensive speci cation and focuses on process control for building reliable electronics.
The certi cation course involves mostly classroom work but hands-on skills comprise approximately 20 percent of the ve-day curriculum. This generally is considered the highest level speci cation and also has the optional Space Addendum. To further the confusion, the J-001 also includes J standards-002 through J-006 speci cations. ____________________________________
All specifications ‘‘
and use criteria from
all the specifications
in each one
____________________________________
There are ve primary assembly speci cations: IPC-600H, IPC-A-610E, IPC/WHMA-A-620B, IPC-7711/7721B and IPC-J standard 001E. The last letter in all these refers to the revision level. For example, the J standard is at revision E, which supercedes revision D. Any time there are substantive changes or additions, a new revision comes out. All speci cations are inter-related and use criteria from all the speci cations in each one. However, the main focus of each is:
IPC-600H Acceptability of Printed Circuit Boards
This is for bare board fabrication and inspection. The speci cation includes general technical information and pictures of internal and external defects as well as minimal acceptable and preferred conditions. This certi cation class is all
a
re inter-related
by Bob Doetzer, Circuit Technology
If we want to bring ‘‘
cost regions of the
world we need to
be more efficient
____________________________________
All of these speci cations are available in Certi ed IPC Specialist (CIS) level or “worker pro ciency” and Certi ed IPC Trainer (CIT) or “instructor certi ed.” The CIT is a more rigorous curriculum, higher level certi cation quali es the student to then train others to the CIS level. All certi cations are valid for two years then require re-certi cation. Perhaps the most important question is why invest in these training classes? Some do because they are contractually required but most companies now see the value in proper training. If we want to bring work back from low cost regions of the world we need to be more ef cient, build it right the rst time with better quality, quicker delivery to market and less eld returns. This will make us more competitive in real “true” cost and more pro table in the long run. The most successful companies realize that training is an investment, not an expense.
So hopefully this clears up the alphabet soup of IPC speci cations. As always, contact our knowledgeable staff with any questions and they will be happy to help. www.circuit-technology.co.uk
w
ork back from low
Page 20
| MAY 2014 ISSUE
Your AOI image of BGA Your Batch X-Ray image of and PoP components 99%+ of your BGAs / PoPs
AOI cannot see the leads underneath a BGA or PoP body. Batch X-Ray typically inspects less than 1% of the PCBs.
KIC World Headquarters 858.673.6050 [email protected] www.kicthermal.com
KIC International Sales - Europe +39.342.147.9460 [email protected] www.kicthermal.com
KIC International Sales - Singapore +65.6744.4998 [email protected] www.kicthermal.com
KIC International Sales - China +86.512.6763.5171 [email protected] www.kic.cn
See us at SMT Nuremberg: Hall 7, Booth #419
DEK Launches Gemini
Platform
by Karen Moore-Watts, Global Marketing Director, dek
Back-to-Back Print Con guration Designed to Double Productivity
At NEPCON China, DEK unveilled its latest print platform innovation: Gemini. The back-to-back (B2B) printing system delivers modular processing on-demand, enabling high-volume electronics manufacturers to dramatically increase output levels while ensuring exceptional accuracy, quality and yield.
Based on the proven Horizon iX series, Gemini provides a familiar graphical user interface (GUI) that requires no re- learning for current DEK customers. The short learning curve allows for immediate leverage of Gemini’s powerful capability, producing as many as 300 boards per hour. Gemini delivers this throughput rate without sacri cing anything, as the system is capable of managing a 508 mm x 508 mm print area in an industry standard frame, yet the footprint is far more compact than that of other B2B printers on the market.
“The demand for a highly-capable printing solution to support dual-lane pick and place processes is increasing – particularly for manufacture of mobile products,” says Karen Moore-Watts, DEK Global Marketing Director. “Until now, space requirements,
serviceability challenges and re-deployment issues have been problematic for side-by- side and back-to-back printing systems. Gemini has resolved all of these challenges with a high-volume, small footprint, independently controlled B2B solution.”
Flexibility and convenience are at the heart of the Gemini platform, as each printer in the system has all key maintenance elements located at the front of the machine for quick and easy access. What’s more, the printers in the Gemini system offer independent functionality, allowing one printer to continue running while managing product changeover on the other. These features – in addition to its exceptional processing performance - make Gemini the best market solution for B2B printing and all show delegates were invited to see a live Gemini demonstration.
The development of next-generation printing products like Gemini is possible only because of DEK’s immense printing experience and broad knowledge base. The expertise of the DEK team was also highlighted at NEPCON China through the DEK Print Lab which is a tangible compilation of DEK resources, expertise and knowhow, all available to help customers solve today’s printing challenges and prepare for tomorrow’s
opportunities. Customers were invited to sit down with DEK technologists in one-on-one sessions to discuss individual manufacturing requirements and preparation for future electronics developments.
Show delegates also learned more about DEK’s yield and control-enhancing support products. VectorGuard High Tension stencils, brand new understencil cleaning fabrics that provide exceptional ne-pitch cleaning capability and high performance understencil cleaning chemistries. All of these capabilities were demonstrated during the event. Combined with superbly capable and exible platforms, such as the Horizon 03iX, which was also on display, the company demonstrated unparalleled value of ownership, process control and productivity gains through the use of DEK products.
“DEK’s display at NEPCON China shared our comprehensive printing offer – from the award-winning, proven Horizon iX platform to robust process support products to the latest in high- throughput B2B printing,” says Moore- Watts in summary. “We understand the challenges facing our customers today and the manufacturing complexity they will confront in the future; DEK is already well-placed to deliver the solutions to meet those requirements.”
Page 22
| MAY 2014 ISSUE
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National Electronics
week adec expo, south africa
by Keith Bryant, SMT Today’s Technology Editor
South Africa’s only platform for the global electronics industry.
Returning to the Johannesburg area, this two-day show is really the only platform for SMT-related businesses in South Africa. There was a new location for 2014 as well, so there were many differing views on how the show would turn out. ____________________________________
There was a strong showing of European sales guys there to support their local distributors. We even had 6 guys from Panasonic Asia taking care of their systems on one of the larger stands. This was one of the few global branded stands, another being XJTAG with their normal showing of nice young ladies, the majority of stands were the local guys, with equipment from their principals.
The visitor numbers were not huge, but the quality was high and even by the end of day 1 there were machines with sold signs on them, which is not seen too often these days. There was also a good free seminar programme including CyberOptics presenting their unique technologies.
The rst day drew to a close with free drinks and nibbles for 2 hours after the event closed. This worked well and was a great networking opportunity for all who attended. It was held in the atrium area so it kept everyone in close proximity to the food and the bar. This worked better than the US shows where they bring beer carts and food onto the show oor a couple of hours before the show closes. This effectively signals the end of the working day and
people have a beer on their stands, with very little opportunity for networking or business interaction. ____________________________________
The visitor numbers ‘‘
the quality was high
and even by the end
of day 1 there were
machines with sold
signs on them
____________________________________
I arrived 2 hours after the 9.00 am start and the halls were both quite busy. Yes 2 halls, one for the capital equipment and one mostly focused on components.
Visitors that I talked to had no hassles getting to the venue either by car or the Gautrain, a fast monorail that is a legacy from the Soccer World Cup.
that it was a worthwhile event
____________________________________
Day 2 was not quite as busy, but again a good level of visitor, quite a few traveling in from the Cape Town area and from Durban. So the show was bringing in a good audience from the key areas for SMT in South Africa.
At the end of the day both exhibitors and visitors felt that it was a worthwhile event and was de nitely needed to keep South Africa on the map and up to speed with new technology. Some sales were closed, some new networking was done and old friends were reunited. So a good time was had by all who came, but there was room for more visitors.
w
ere not huge, but
‘‘
and visitors felt
both exhibitors
Page 24
| MAY 2014 ISSUE
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A First Look at Black Chrome Solder Tips
by Gary Goldberg, President and CEO, Promation Inc
Over the past year we have been hearing more and more about black chrome soldering tips and some of the bene ts this technology can provide to the high-volume soldering processes. This article provides insight about these tips as well as some of our observations when using them with table top production soldering robots. ____________________________________
This nish is non-smudging, very adherent and uniform. These deposits will withstand heating in high vacuum to temperatures of more than 930°F (500°C) and can be applied to most metals without the use of special equipment. ____________________________________
molten solder to the joint and aid in heat transfer. And while copper is actually better for soldering, it is also highly susceptible to being dissolved rapidly by solder alloys. Therefore, iron is most widely used.
For the purpose of this study, PROMATION developed some black chrome tips and used these tips in a side by side test comparison with our standard tip technology. Our soldering test was performed using a SAC305 solder (no- clean) with a 3.2 percent ux core, sample PCBs with a 1.7 mm pad with multi-pin connectors with 0.8 mm pins and a hot iron soldering robot from PROMATION.
The tips selected were a 2.4 mm half V con guration, one with standard plating and one with black chrome plating. For the purpose of this study, the soldering temperature was set to 375°C. ____________________________________
‘‘The standard
tip showed more
signs of oxidation
and was prone to
burnt flux residue
buildup on the
tip and shaft
____________________________________
Each of the test boards consisted of 420 through-hole soldering joints (pin connectors). Tip cleaning was done after 105 joints were soldered, simulating a high-volume production environment using an air/wet sponge combo cleaner.
At rst glance, both tips seem to perform equally well, but through extensive testing, which consisted of recreating a production-like high-volume environment, we observed a slight advantage in quality when using the black chrome tip. The standard tip showed more signs of oxidation and was prone to burnt ux residue build-up on the tip and shaft. Over time, it resulted in a minor decline of soldering operations even when tip maintenance was properly addressed.
The electrolyte ‘‘
and nickel chloride
plus a carboxylic acid
____________________________________
Black chrome (chromium) plating consists of chrome that turns black after the addition of a contaminant, according to National Metal Finishing. Back in 1953 a hard, bright chromium-base electro- deposit was developed that can be applied at a high rate of deposition. The electrolyte contains chromic acid and nickel chloride plus a carboxylic acid. When this bright deposit is treated with hydrochloric acid (for a few seconds) a black nish results.
ip consists of a solid
c
copper core, a plated
layer of iron, a plate
of nickel behind the
working surface and
a plated chrome layer
____________________________________
A typical soldering tip consists of a solid copper core, a plated layer of iron, a plate of nickel behind the working surface and a plated chrome layer. Black chrome attaches best to nickel, which adheres best to copper; however, the key working layer and the one that affects tip life the most is the layer of iron. The working surface of the tip must be wet in order to transfer
ontains chromic acid
A typical soldering ‘‘
t
Page 26
| MAY 2014 ISSUE
In contrast, the black chrome tip demonstrated pro ciency in maintaining higher quality soldering throughout the entire test, achieving a superior Class 3 type soldering connection. The complete assembly and inspection processes involved in this study were performed in accordance with IPC J-STD001-E.
Additionally, we observed the black chrome tip demonstrates an improved ability to localize the dispensed solder, forming target solder llets throughout the soldering process. Using an automatic solder feeder, we were able to ensure and consistently deliver a set amount of solder to each joint. The plating construction on the black chrome tip’s shaft was seen to have provided an added bene t. The reduction of wet-able area on the tip surface naturally directs the solder more towards the joint area, thus reducing the overall migration of solder up the tip. ____________________________________
‘‘Using an
automatic solder
feeder, we were
able to ensure
and consistently
deliver a set
amount of solder
to each joint
____________________________________
Due to the majority of the black chrome tip’s shaft being plated, we witnessed the solder only traveling to the source side of the board upon contact, increasing the accuracy of the amount of solder being dispensed into every solder joint.
Additionally, we noticed that the activated ux did not accumulate as much on the black chrome tip since the solder was only allowed to localize at the end of the tip. As
a result, smaller amounts of activated ux were left behind.
____________________________________
Totaling all variables and defects (for both the standard tip and black chrome tips), the black chrome tip resulted in a lesser defect rate (2.67 percent improvement) in accordance with IPC J-STD001-E. ____________________________________
FOURCAD, Inc., both tips
soldered well with
the black chrome tip
____________________________________
Based upon the accumulated test results, summarized by FOURCAD, Inc., both tips soldered well with the black chrome tip showing a slight advantage in reduction of overall defects throughout our multiple test runs.
‘‘
of solder on the
Localization
surface of the
tip for robotic
soldering is key
to achieving
repeatability and
quality work
____________________________________
Localization of solder on the surface of the tip for robotic soldering is key to achieving repeatability and quality work.
test results, ‘‘
s
ummarized by
It’s A Panel Game!
by Keith Bryant, SMT Today’s Technology Editor
Welcome to the rst article in the series ... yes this was where I got stuck, not much of a start! My problem is that there are so many Design For ..... titles out there - Manufacture, Assembly, Test, even DFX, so what to choose? Well none of them, design is an important thing, of course, but speci cation also plays a big part. There is also the bigger picture which encompasses process and equipment choices, all affect the nal product.
So the feature has become bigger than ‘Design For’, it is now all about IP, that is Improving Pro ts!
De-construction is a buzzword at the moment, everything from food to mobile phone design. So I have de-constructed this series and when you strip away the different layers the basic aim of everything, improved design, easier testing, etc. is all about adding to the bottom line! So welcome to the rst article in the series of Improving Pro ts!
I would like to thank Graphic PLC for their help with this article and future ones too. I started my journey in this industry at Graphic many moons ago and, returning recently, I was amazed to see so many
familiar faces. I was also amazed to see the complexity of product that is now considered standard production. ____________________________________
printed circuit board
manufacturers do
not actually make
printed circuit boards
____________________________________
First,let’sgetridofabigmisconception, printed circuit board manufacturers do not actually make printed circuit boards! They process and manufacture panels that contain circuit boards, which are cut from the panels as one of the nal manufacturing steps. This is key to understanding this article, because it is all about yield from these panels. Put simply-it’sabouthowmuchyouthrow inthebinattheendoftheday.Of course, there will always be waste but the customer actually pays for the panel area, not the circuit area, so improving panel yield has a huge effect on circuit
cost. The difference between a poor panel yield of 40% and a good yield of 80% is massive. There are certain manufacturing constraints determining the panel sizes that any circuit board manufacturer will use, some of these are:
• The size of the plating tanks and their clamping systems
• The distance between the heads of the drilling machines
• The size of the multilayer press and its tooling and location system
There are others but this gives you an idea, a good board shop will optimise theseconstraintstoensureef cientuseof material around their factory, but there are several factors which affect panel yields that are beyond their control:
• Circuit size and shape, obviously
• Supplied panelisation, if multi-circuit
layout is required
• Unbalanced copper on outer layers •Test coupons (i.e. IPC, controlled
impedance)
Circuit Size and Shape
I know that sometimes circuit size cannot be changed but, if you look at this at the base design stage, an ef cient size can be chosen up front and xing holes, boxes, etc. can be designed around it. However, in many cases, small dimensional changes are possible and even these can produce big savings. Squares and rectangles are obviously preferable as the panels are invariably this shape. I have seen many circular printed circuit boards that were not densely populated, so could actually have been made square with locating holes in each corner. If the maths is done correctly, they will still t perfectly inside the tube and the cost should be much less.
Supplied Panelisation
This can save assembly costs so should be encouraged where possible, but it needs some thought too. Most production systems can cope with some circuits on the panel turned through 90
let’s get rid of a ‘‘
b
ig misconception,
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| MAY 2014 ISSUE
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feature continued...
and 180 degrees (if L shaped etc.), but inverting them is often a step too far. Also, try to minimise the space between circuits, but leave enough to keep the panel rigid during assembly. You should specify on the drawings if you are happy for the manufacturer to use the outer frame of the panel for their tooling, plating robbers etc. ____________________________________
‘‘if there are 50
s
panel and 1 scrap
circuit makes the
panel scrap then this
adds to the costs
____________________________________
Another thing to consider is if you are prepared to accept scrap circuits on the panels and if so how many circuits per panel and how many panels per batch. Again, if there are 50 small circuits on a panel and 1 scrap circuit makes the panel scrap then this adds to the costs. If you cannot stop components being placed on the bad circuit it may be cheaper to assemble it than throw it away, rather than scrap the panel. These are commercial decisions but need to be considered and, of course, all failed circuits must be clearly marked and not included in yield calculations.
Unbalanced copper on outer layers
This is an interesting one and not understood by many people. In PCB manufacture, copper is added to the tracking by electrolytic plating. If the PCB contains ne tracks and ground planes, the plating thickness will vary in each area, too much on the tracks and too little on the larger areas, cross hatching the ground plane areas can help. But often the PCB manufacturer has to add “robber bars” to ensure even and correct thickness plating, this also affects panel size and utilisation.
Test coupons
These can be a good idea on high reliability products, controlled impedance and mixed material multi-layers, but they take up space and the testing of them can be expensive. So please think carefully before you ask for them, all good suppliers will process test coupons for their own quality standards and approvals anyway.
mall circuits on a
Some Scary Numbers
IPC is a great Standards organisation and has raised the quality of product in our industry for many years. However, companies need to understand the differences between Class 1 and Class 3 and not choose the release to the highest level just as a safety net. Also it is possible to get products produced in accordance to the standard but not released. This gives you a high quality product without the additional costs of testing. Again it depends on what the board will be used for and so it needs to be an informed decision. IPC requires the coupon shown, to increase in length for each layer, each drill size needs to be included in the coupon. In addition, if it contains buried vias, each via stack needsitsowntestcoupon.
These coupons are on each panel produced and for IPC Class 2, 8 panels have to be fully tested including micro-sections. For Class 3 release, it is 125 Panels!
The most common additional test Graphic does is for impedance-matched designs. They use a TDR (Time Domain Re ectometry) coupon to determine the impedance of speci c features. Other test coupons added sometimes are IST (Interconnection Stress Testing) for multi- layer structural integrity testing.
There are also a number of Graphic speci c in-process test coupons used to monitor key process areas such as etch rate, plating and registration.
Conclusions
Simply put, start talking to the company chosen to make the volume bare board production right at the start, sort out circuit size and copper distribution, then work with the assembler to look at ef cient nished panel sizes. Please remember that a few prototypes can be made from an inef cient design for not a lot extra, but a 20% saving on bare PCB cost, on even a small volume, is a signi cant saving for your company. ____________________________________
‘‘a few prototypes can be made from an inefficient design for not a lot extra, but
a 20% saving on bare
PCB cost, on even a
small volume, is a
significant saving
for your company
____________________________________
Unless you really need it do not ask for release to IPC or Mil or any other standard, I recommend the phrase “make in accordance to ........” to be included on the order. This gives the quality without the onerous additional waste of material and cost of testing loads of coupons. There will still be test coupons, micro-sections and other tests performed, but at the level required by the bare PCB manufacturer to satisfy their Quality System.
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| MAY 2014 ISSUE
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MW/JA/31/Juki_April2014-SMT-Today.indd 1 4/15/14 11:07 AM
new products
exciting new industry innovation
Keeping you informed of the latest developments in technology and innovation within our global electronics industry.
Juki Releases New RP-1 Automatic Screen Printer
Juki Corporation introduces the RP-1 Automatic Screen Printer. The printer achieves high-accuracy positioning of ±10 μm and high-speed printing within six seconds plus printing time.
The RP-1 high-speed and high-precision printer is equipped with the Motion Screen feature that automatically corrects the printing position by moving the screen. High- Speed Cleaning and an Automatic Solder Dispenser are also available as options.
The Automatic Solder Dispenser keeps the volume of solder paste on the screen at a constant and minimum necessary amount. This prevents smears and smudges, reducing mounting defects drastically. Additionally, the High- Speed Cleaning feature utilizes a blade to quickly wipe away solder from the bottom of the screen.
Metcal Debuts New Features on Scorpion Rework System
Metcal recently unveiled brand new features for the Scorpion Rework System, including an Automatic Placement Package capable of 50mm of motorized travel in the Z-axis and a full 360° in (Theta). The Automatic Placement Package offers ne motor control in the Z-axis and during alignment of the component to the pad. The company will also introduce a new force feedback control during the placement process, enabling the unit to accurately pick and place components without disturbing the component or solder.
The Scorpion Rework System is also now available in a Mobile version with a 1080p, high de nition, camera system that enables the operator to align and position components accurately before placement. This version is ideal for use with smaller packages commonly used in mobile devices up to 25mm x 25mm. New digital controls have also been implemented to control the light levels of both the top and bottom LED lighting modules.
Now standard on all Scorpion Rework Systems, Metcal has added a new polarized lter feature. New upgrade kits, including a Side-View Camera, Contactless IR Sensor, and Thermal and Air ow Calibration Kits
are also available.
UA1780 Fit-Line Inspection Data Creation System from Seika Supports the New HIOKI FA1240 Flying Probe Tester
With the Hioki UA1780 Fit-Line Software application, users can generate high- quality test data even without PCBs. The software supports the newly debuting Hioki FA1240 platform with simple, intuitive Windows 7 based operation. Additionally, the new UA1780 Fit- Line software application uses Gerber data les rather than CAD, which can sometimes be dif cult for customers to obtain, if not non-existent. Key features include component libraries as well as reverse net generation, providing valuable component connectivity information and empowering the customer to create highly ef cient test programs. The Hioki UA1780 Fit-Line application is backwards compatiblewiththepreviousgeneration Hioki 1240 Flying Probe Testers.
____________________________________
BTU Lowers Operating Costs with ENERGY PILOT
ENERGY PILOT is a feature in the latest release of BTU’s windows-based WINCONTM operating system. The ENERGY PILOT saves manufacturers money whenever the oven is idle. Standby mode can save more than 25%. Sleep mode can be used for longer interruptions saving over 40%. Long idle periods fully shut down the oven using
Page 32
| MAY 2014 ISSUE
V810 SEries
Advanced 3D X-ray inspection (AXI)
Superior AXI Solution for SMT Line.
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ViTrox designs and manufactures innovative, leading-edge European Distributor and cost-effective automated vision inspection equipment
and system-on-chip embedded electronics devices for the
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V510 G2 Series
Advanced Optical Inspection (AOI)
A One Stop Solution for SMT Line.
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new products continued...
hibernate mode. Recovery times are minimized using remote product sensors and SMEMA. Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption. The feature is easily upgradeable on older BTU re ow ovens.
The INTELLIMAX furnace controller and WINCON operating system have been powering BTU ovens and furnaces for the past decade. Together they provide precise control, powerful analytical tools, and intuitive interface, all designed for the harshest industrial environments. The latest INTELLIMAX2 and WINCON 6.1 are available for upgrade on most BTU systems in the eld.
____________________________________
Count On Introduces PB Swiss Tools’ VDE-design Torque Tools
Excessive torque can cause damage while insuf cient torque can pose a safety risk. In electrical work, it is extremely important to be able to control the tightening torque for screws. As a result, the Torque tools with MecaTorque VDE design have been added to the ElectroTool series, guaranteeing safe and controlled tightening of the screws for all electrical work up to 1000 V AC/1500 V DC. The blades are secured in the handle and are not removable like other Torque tool models. This allows them to be coated for safe work on electrical devices.
The PB Swiss Tools MecaTorque VDE series is available in Phillips (#1 and #2), Pozidriv (#1 and #2), Phillips/Slotted (#2) and Pozidriv/Slotted (#2) sizes. The xed connection of matching blade and handle guarantees a high degree of safety at work. The MecaTorque VDE torque range can be adjusted as required with easy recalibration using a standard testing device.
All of the torque handles are supplied with test certi cate ±6 percent according to EN ISO 6789. PB Swiss Tools offers a warranty of three years against manufacturing.
With more than 130 years of experience, PB Swiss Tools is a global leader of hand tools manufactured for use in the industrial marketplace, even for the most hazardous jobs. All PB Swiss Tools are 100 percent Swiss-made and come with an unlimited lifetime guarantee. Work with the best.
Sono-Tek Corporation Releases Next-Generation Ultrasonic Generator
Sono-Tek Corporation (OTC BB: SOTK) is pleased to introduce its next- generation ultrasonic generator. The ECHO ultrasonic generator is designed for the highest degree of accuracy and control of ultrasonic spray processes using Sono-Tek ultrasonic nozzle technology. ECHO provides the high- frequency electrical energy required to operate all frequencies of Sono-Tek ultrasonic nozzles. As with the Sono- Tek standard broadband ultrasonic generator, the ECHO automatically locks onto the ultrasonic nozzles’ operating frequency with phase-locked- loop technology.
The ECHO offers a multitude of connectivity inputs and outputs, triggering capabilities and ne-tuning spray controls, including the users’ choice of load leveling or power leveling mode for the greatest repeatability of spray possible. Some other advanced features of the ECHO generator include:
• New load leveling feature automatically compensates for changes in ow rate and liquid characteristics such as viscosity, resulting in the most stable spray characteristics and consistent drop sizes
• Power resolution of .01 Watts – valuable for applications such as medical coatings that require a high degree of control
• Operates over a frequency range of 25 - 250 kHz (frequency is user selectable through the display interface for any Sono-Tek ultrasonic nozzle)
• Graphic user interface with intuitive wheel encoder enables full on-screen control of all functions
• Uses advanced phase-locked-loop control technology to automatically lock onto a nozzle’s optimal operating frequency
• ±4 percent accuracy allows for increased repeatability and faster response time
The ECHO’s modern digital LCD display of parameters and extreme accuracy over full power range make it a phenomenal upgrade to current users of the broadband ultrasonic generator, and the ECHO’s exible connectivity and user- friendly interface make it a breeze to set up for users who are new to Sono-Tek’s ultrasonictechnology.
“The new ECHO generator is a game- changing technology for long time users of Sono-Tek ultrasonic spray systems and first time users alike,” says Steve Harshbarger, Sono-Tek’s President. “This product will allow users to enhance their spray processes and improve efficiency and repeatability more than ever before.”
Sono-Tek ultrasonic spray systems are proven in a wide range of precision spray applications worldwide, including implantable medical device coatings such as stents, printed circuit board spray uxing, solar and fuel cell manufacturing, and glass, food and other industrial coatings across any width production lines. Sono-Tek’s environmentally friendly ultrasonic spray systems feature up to 80 percent reduction in spray material, and dramatic reductions in waste and energy consumption.
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| MAY 2014 ISSUE
Engineered Material Systems Introduces 535-10M-49 UV Cure Adhesive
535-10M-49 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-49 is a low outgassing, extremely exible, high strength epoxy adhesive that does not contain antimony.
535-10M-49 was developed to pass the rigorous reliability requirements in micro-electronic assembly applications. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semi-conductor, photovoltaic, circuit assembly, printer head, camera module, disk drive and photonic applications.
____________________________________
ASC International Releases New Dual Mode Inspection Platform
“ASC is very excited about the recent release of the LineMaster DM,” said Steve Arneson, ASC’s National Business Manager. “All indications from our current customer base have pointed towards an immediate acceptance for this “Dual Mode” capability. The long time internal battle of manufacturers trying to decide which technology provides the most value add to the production process has now been eliminated. By incorporating both technologies into one affordable solution, manufacturers can realize signi cant cost savings through the implementation of the
LineMaster DM.”
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI/SPI
platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection capabilities within one platform, the LineMaster DM detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and the most accurate and repeatable true 3D volumetric measurements for SPI. Features include real-time SPC, customized data reports, of ine CAD/Gerber programming and a defect repair station, all wrapped together with an affordable price tag similar to purchasing both inspection capabilities for the same price as one solution alone.
____________________________________
cleaned. Many users have found that their conventional cleaning systems are 80- 90% effective, leaving the smallest, most sensitive apertures partially occluded. Using the Gensonic these apertures can be cleared and renewed. This system is effective as a localised cleaner, applied during the print cycle while the stencil is in the printer, preventing expensive and time-consuming shutdowns required to clean problem apertures.”
With more than 5,000 users worldwide, the Gensonic is a system that should be on everyone’s production line.
Also available in Gen3’s manufactured product line is the Ionic Contamination Systems, also known as the CM Series, Dip and Spray Coating Systems, Wizard Thermal Pro ling, SIR and CAF Testing Systems, Solderability Testing, Solder Dross Recovery and Solder Paste Inspection.
____________________________________
Nordson YESTECH Debuts FX-940 Inline PCB Inspection System with 3D Inspection Capability
Nordson YESTECH’s advanced nine megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side-viewing cameras and 3D inspection, the FX-940 inspects solder joints and veri es correct part assembly, enabling users to improve quality and increase throughput.
Con gurable for all line positions, the FX- 940 is equally effective for paste, pre / post-re ow and nal assembly inspection. Fast and intuitive off-line programming maximizes machine utilization and real- time SPC monitoring provides a valuable yield enhancement solution.
The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Advanced Fusion Lighting and newly available image processing technology
integrates several techniques
including 3D inspection,
colour inspection, normalized
correlation and rule-based
algorithms to
provide complete inspection coverage with an unmatched low false failure rate.
Gen3 Systems’ Revolutionary Cleaning Technology
The Gensonic Stencil Cleaning System, which received the European Product of the Year award at Productronica 2013, is a manually operated ultrasonic transducer unit for cleaning stencil apertures.
The Gensonic can be used either in conjunction with our Stencil Cleaning Centres or it is portable enough to be taken directly to the printer, thereby greatly reducing production downtime and printer resetting.
The key features of the Gensonic System are:
• Safe and simple to use
• No risk of stencil damage
• Typical 3-minute cleaning cycle
• Suitable for both stainless steel and
plastic stencils
• Cleans solder paste or SMD adhesives • Accepts both foils and framed stencils
Dr. Beverley Christian of Blackberry quoted in a technical paper titled ‘Cleanliness of Stencils and Cleaned Misprint Circuit Boards – Précis,’ “Solder pastes, especially lead-free pastes tend to become compacted and trap particles, blocking ne apertures and deforming aperture corners. Using proven industry cleaning solution and the Gensonic ultra-sonic transducer directly on the stencil, even the smallest tightest pitch apertures can be cleared and perfectly
The Advantages and
Disadvantages of
Vapour Phase Soldering
by Patrick McWiggin, Technical Director, SolderStar Ltd
In the beginning of SMT, Vapour Phase Soldering was the preferred re- ow soldering technology for a number of reasons including its excellent heat transfer capabilities and its ability to heat large masses evenly and quickly whilst the peak temperature is controlled. However there were some disadvantages like fast temperature rise and nearly no in uence on the temperature pro les.
To combat these process challenges, SolderStar developed a new pro ling system designed speci cally for Vapour Phase machines. The latest evolution of Vapour Phase machines now offer much more user controlled soldering, the main advantages of a vapour phase system such as xed peak temperature remain, but freely adjustable temperature gradients and pro les are now possible, automatically controlled time above liquidus and a perfect automatic inert gas atmosphere.
The original ‘dream’, sold by the manufactures of vapour phase soldering machines, was that pro ling was not needed. The reality of course in production is ‘You Can’t Manage What You Don’t Measure’. Because of this, SolderStar developed a solution that gave users the ability to understand and control the production process and quality.
Machine Types and Profiling Methods
There are several machines that bene t from SolderStar thermal pro ling, one being medium size production machines. These are batch based and the PCBs are loaded into the basket. The basket then moves through the machine and enters the Vapour Phase chamber for preheating and soldering and exits again once complete. This style of machine is harder to pro le as some have internal thermocouple ports internally wired to the outside world. An external pro ler can be used to capture the pro le, although this is more dif cult and not ideal for daily production testing.
These machines can also come with a vacuum stage. If this is employed, the solderingstageusesasealedchamberand it is not possible to get wires inside. A true pass through pro ler is needed, this is where SolderStar’s system comes into its own. ____________________________________
passes through the machine. The pass through pro ling unit is SolderStar’s main unitandistheonlywaytopro lemachines with vacuum stages, and really is a far superior method for any Vapour Phase machine, other than laboratory machines.
The Profiler’s Enemy - High Thermal Transfer!
Because of the use of Galden vapour in the machines, the thermal transfer is very high compared to a conventional re- ow oven, and subsequently the thermal protection of the data logger is paramount to survive overheating. The vapour must also not be allowed inside the pro ling unit as it will ultimately damage the electronics and insulation used. As vacuums are employed the problems increase. The system must also be able to withstand any pressure difference seen in the process.
There are two approaches to this problem:
This style of ‘‘
m
achine is harder
to profile as some
have internal
thermocouple ports
internally wired to
the outside world
____________________________________
Another machine process is in-line, these are much more dif cult to pro le with long wires in the same way a long conventional re- ow oven is not pro led with long wires, they snag and the results are not always accurate. Again, if vacuum is employed you cannot use long wires.
The SolderStar PRO - VP system allows users of batch and, in-line vapour phase soldering systems to fully pro le their products in the same way as a conventional re- ow machine. The system includes the SolderStar PRO data-logger combined with a sealed light-weight heat shield capable of operating in the pre-heat, vapour re- ow and vacuum stages of the machine. Once data capture is complete the heat shield can be opened and the data logger removed, allowing rapid cool down cycles and minimising the risk of overheating the pro ling unit.
SolderStar’s product has an external data logger with long wires making them a perfect choice for manufacturers with different soldering processes, wave etc. as one data logger does it all. There is also added ‘down the wire’ logging capabilities, via a USB connection, with live data which can be viewed by the engineer as the PCB
The 1 box approach
A data logger electronic PCB inside a sealed box.
Advantages – it is physically smaller.
Disadvantages - as it is perfectly sealed to withstand the vacuum, needs to be strong andhencethermalmass/weightishigh.
When it exits the machine it is very hot. As the unit is sealed and if it is simply left it will continue to heat and damage the battery and or electronics. Force cooling is needed such as a water bath or similar.
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| MAY 2014 ISSUE
The 2 box approach
SolderStar’s Conclusion to the Internal Testing
1. Thermal performance is adequate for most vapour phase processes, with the original spec. of 250C for 9 minutes likely to be achieved.
2. New ‘O’ ring provides suf cient seal
3. Both the red and green traces almost exactly overlay in the ramp up and peak stages, The ramp up slope and time are the same with the system inside and outside the barrier.
The vapour energy within a machine like the Quicky, is less than the machines this pro ling system is likely to be used within. The light weight shield is heated rapidly and energy thermal absorption minimised, at no point did the vapour ‘collapse’ and the process be impacted.
The SolderStar system has been proven not just through in-house testing, but also through use by manufacturers, including Rehm and IBL.
Real-time telemetry
Another technology that had to be investigated, was real-time telemetry that could reliably function within the vacuum stages of the process. To see the pro le in real-time is dif cult in any industrial machine as the RF energy is greatly attenuated by the metalwork. SolderStar’s approach was to use a system that has ‘mesh networking’ technology which is ‘self-healing’ and reliable with a network/data link. It allows routers/ repeaters to be used to relay the signal in machines where other systems would not work. As no signal is 100% guaranteed they employ an intelligent ‘2 way‘ protocol, if a ‘dead spot’ is encountered, the data logger buffers the data then of oads once the linkisre-established.
Conclusion
Vapour Phase soldering has become competitive for high volume productions. State-of-the-art machines offer high throughput in combination with high quality results. The vapour, like all gases, is tending to equally ll out a given sphere, such as a Vapour Phase process chamber. The equal temperature distribution over the boards is automatically provided by this physical effect, while in a convection oven the cross pro le can vary in temperature. The physical limitation of the maximum temperature in a vapour phase system does not require further controlling mechanisms to avoid overheating. This feature provides the highest bene ts in long-term reliability of the soldered electronic boards. In a convection oven the creation of temperature pro les needs thorough preparation, overheating cannot be securely avoided.
The excess heat needed to ensure a perfect solder result, in vapour phase soldering, is only 5°C to 10°C over the melting point of the solder paste. Other re- ow methods require 30°C to 35°C excess heat for the same task due to its lower heat transfer rate.
Lower soldering temperatures limits the stress for components, avoids delamination on PCB substrates and reduces the risk of popcorning. The vapour phase process provides an oxygen free atmosphere leading to the best possible wetting. The energy consumption is lower than convection as the energy remains in the hot liquid. Optimised insulation reduces the introduction of heat into the surroundings and thus enables the saving of all conditioning costs in the plant. Considering today’s and future complex components and processes, vapour phase is a perfect choice.
data logger is used that can be separated from the protective shield when it exits the machine.
Advantages – better protection thermally and has rapid cool down. Only one calibrated unit is needed each year, rather than multiple units.
Disadvantages - It is physically larger. Most engineers are concerned that the measurement instrument being in the process will take energy away from the vapour cloud and affect the measurement and not be a true re ection of the PCB pro le.
SolderStar’s approach to the problem of ‘physically larger’ was to look laterally at the problem. The actual problem is the thermal mass of the object. They produced a ‘thin’ wall protective shield which has a large surface area, but exceptionally low thermal mass. The lightweight skin of the shield heats rapidly, and once up to temperature the condensing on the shield is minimal.
SolderStar undertook internal testing of the system on an Asscon Quicky 450. The test was done using the smallest scale machine. It allowed a pro le to be captured with long wires, so no instrument in process chamber, and then with the instrument inside.
The purpose of the test was to;
1. Further validate the thermal performance of the new VP heat shield
2. Perform a ‘leak test’ evaluation of the new ‘O’ Ring seal
3. Monitor any effect of the thermal shield on the process
Industry News
Keep up to date with what’s new
With each issue we’ll keep you up-to-date with the latest industry news from around the globe.
STI Electronics, Inc. Receives IPC Stan Plzak Corporate Recognition Award
STI Electronics, Inc., a full service organization providing training services, electronic and industrial distribution, analytical and failure analysis, prototyping, and small- to medium-volume PCB assembly, was bestowed with the highest corporate honor during a luncheon at the IPC APEX EXPO®. IPC – Association Connecting Electronics Industries® presented STI Electronics with the IPC Stan Plzak Corporate Recognition Award.
Named after a former IPC Board Chairman who was a founding member of the Electronics Manufacturing Services Industry Management Council, the Stan Plzak Award
recognizes an IPC member company in the electronics assembly industry that has taken the initiative to actively contribute to enhancing the industry while demonstrating support of IPC though participation in technical and/or management programs.
STI Electronics has been an IPC member since 1985 and, although a small-sized EMS company, has had a big impact on IPC. Nearly all of its staff members are active with IPC, with six employees actively engaged in dozens of standards development committees. Additionally, the company has several IPC specialists in its CM and Engineering Division as well as a multitude of certi ed trainers. A leader in the industry that is always helping set the bar high, STI Electronics served as a primary development partner for IPC’s Certi cation Quality Initiative that was launched in 2013.
____________________________________
Marlin Business Services Corp., Union Bank And Seika Machinery, Inc. Launch New Financing Program
The strategic alliance facilitated by Union Bank will enable SMI’s customers to quickly and cost-effectively acquire the latest advanced machinery, including SMI’s line up of new inspection equipment, quality assurance products, surface mount technology and green technology. It will also enable Marlin to grow its presence in this industry segment.
“Marlin is proud to partner with SMI and offer an attractive and convenient nancing program to their customers,” said Allen Snelling, Marlin’s Vice President, National Account Sales. “We look forward to supporting SMI’s machinery sales as the U.S. manufacturing sector continues to expand.”
“We are pleased to offer our valued customers the combined bene ts of acquiring superior advanced machinery
along with nancial terms that can make a positive impact on their bottom line,” said Michelle Ogihara, Senior Sales manager, SMI. “We look forward to a thriving relationship with Marlin Business Services Corp. and Union Bank.”
Marlin’s wide range of exible nancing options available to customers is accessible, affordable and delivered promptly with credit decisions made within hours.
“Union Bank is excited to facilitate the alliance with Marlin and Seika Machinery as Marlin provides customized nancial solutions and streamlined nancing for Seika’s customers,” said Union Bank Vice President and Program Manager Paul Knowlton.
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OK International Closes on Minority Investment in 3D Printing Company
OK International announced that it has closed on a minority investment and product development agreement with 3D printing company TierTime Technology Co. Ltd of Beijing, China. OK International also announced that it has launched Quant 3D, a new brand focused on 3D printing for the professional and industrial markets. The Quant 3D brand will encompass both bench top and industrial 3D printers for prototyping and manufacturing applications.
The investment in TierTime aligns with OK International’s strategic focus to develop innovative and industry leading products for the industrial and commercial manufacturing markets. In addition to the Quant 3D bench top printers currently available, the two companies entered into a technology agreement to co-develop a line of 3D industrial printers that are scheduled to be launched later this year.
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| MAY 2014 ISSUE
“We are very excited about this investment in TierTime Technology, which represents OK International’s entrance into this rapidly growing segment which some industry experts predict will grow 17% annually over the next several years,” said Christopher Larocca, President of OK International. “TierTime is a technology leader in the 3D printing market and provides a strong platform for our 3D printing business. By leveraging our expertise in thermal management and material dispensing, we intend to develop and market a broad line of industrial printers across multiple 3D printing technologies.”
According to a recent market report, published by Transparency Market Research, the global 3D printing market reached US$2.2B in 2012, and is expected to exceed US$7.2B by 2019, growing at a compound annual growth rate of 16.8% from 2013 to 2019.
____________________________________
Libra Industries Names Juki Its Strategic Partner of the Year
Libra Industries, a privately held electronics manufacturing services provider, announces that it recently presented Juki with its rst annual Strategic Partnership Award. Rod Howell, Libra Industries’ President, presented the award to Bob Black, President & CEO of Juki Automation Systems, in the Juki booth during the recent IPC APEX EXPO.
Libra Industries and Juki have been working together for more than 25 years. Today Libra Industries runs four Juki lines in its Ohio- based manufacturing facility. Libra Industries selected Juki for the rst award because of the attentive, consistent customer service it has received over the years.
“Juki provides over-the-top customer service,” commented Howell. “They are one of the most, if not the most, user-friendly and responsive strategic partners we have
ever dealt with. Between Bob Black with Juki and Dave Trail with Horizon Sales, if Libra needs something – even if it is outside of their offering – they make it happen.”
Black commented, “All of us at Juki really appreciate the recognition given to us by Libra Industries. They have been a fantastic customer for more than 20 years and we really appreciate their loyalty to Juki. We look forward to supporting the continuing growth of their business in the years to come.”
____________________________________
First Meeting of NEPCON 2014 Advisory Panel Held in Shanghai
The rst meeting of the NEPCON 2014 Advisory Panel was recently held at the of ces of the exhibition organizers, Reed Exhibitions Shanghai. The ve Advisory Panel members – Jian Zhu, Director, Alcatel Shanghai Bell; Zhaochen Huang, VP, Production, UT Star; Fred Fong, Senior Consultant, Powertech Industrial (former Technology Director, Asia-Paci c, Jabil Circuit); Edward Tung, Managing Director, East West Group, former VP and GM, Flextronics Technology); and Haley Fu, Managing Director, AP, iNEMI – met for discussions with Thomas Huang, Assistant VP, Reed Exhibitions; Morris Dong, Project Director of NEPCON China, South China, and West China and Lewis Tang, Marketing Director, Reed Exhibitions.
The Panelists talked about the development of the Chinese electronics industry, future trends, marketing opportunities/challenges, participant invitations and complementary activities like forums, keynote speaker nominations, and more. These topics related to the entire NEPCON series of events in China (NEPCON China, NEPCON West China,
and South China). The talks were highly constructive and yielded a number of interesting insights on several key issues.
The organizers of the NEPCON China series, Reed Exhibitions, should be congratulated for the scope and reputation of the shows they have built up in China,” said Mr. Jian after the meeting. “The establishment of the Advisory Panel is a testament to the hard work Reed has done, and continues to do, to make the series a consistent and outstanding success.” NEPCON has achieved great results in the industry,” added Mr. Fong. “It is renowned within electronics manufacturing for providing insights into the future development of the industry, while perfectly matching the needs of visitors to those of participating exhibitors, and vice versa.”
“The Advisory Panel meeting was a great success,” said Mr. Dong. “The Panel provided us with some very useful information on how we can enhance the organization of the NEPCON series of events in China. These were highly bene cial to us and enhanced our understanding of new industry developments. I found the key messages delivered by the Panel members really inspirational. We are very pleased to have access to the full expertise and experience of such esteemed industry professionals. Further, we are con dent that, with their input, we can continue to deliver powerful events for the electronics manufacturing industry.”
Since 1982, when NEPCON was rst introducedtoChina,theserieshasgrown into the leading event in electronics manufacturingtoofferacombinationof globalresourcesandlocaltalentsupport. It is the only event of cially backed by the Ministry of Industry and Information Technology (MIIT) and the Surface Mount Technology Association (SMTA).
industry news continued...
Mictrotek Laboratories to Open European Test Lab at Gen3 Systems’ Facility
The European Test Lab will be located at Gen3 Systems’ facility in Farnborough, UK. Graham Naisbitt will be the Operations Director - Europe.
“The new facility will be fully ISO 17025 quali ed and brings together, for the rst time in Europe, the most comprehensive test capability for the electronics industry,” commented Naisbitt. “In addition to providing test results and data interpretation, Microtek provides specialised client services such as failure analysis and test program development. Our technical staff will produce customized test programs that aid in identifying the cause of manufacturing problems. Microtek can also assist in mediating and resolving customer-supplier disputes.”
In conjunction with the opening of the new European Test Lab, Gen3 Systems will merge its Test Services division. Initially this will involve SIR, ECM and CAF testing, Solderability, Cleanliness and Materials Characterisation test services, and will strongly link to the new Microtek Laboratories, East Coast lab in Baltimore MD.
____________________________________
John Perrotta Promoted to President of Europlacer Americas’
Europlacer, a manufacturer of market- leading exible SMT placement machines, announces that it has promoted John Perrotta to President, Europlacer Americas’, with immediate effect.
“We have been very pleased to enjoy a pattern of positive developments and sustained growth over the last few years in the Americas,” stated Robert Conway, on behalf of the Board of Directors of Parable Trust Limited. “We have been receiving excellent customer service feedback, and we recently installed the largest order in the history of our group in the Americas. As with all of our strategic regions, the Americas supplied signi cant in uence toward our recent ‘2014 Global Flexible SMT Company of the Year’ Award from Frost and Sullivan.”
“It is clear that there has been signi cant improvement in our delivery and that our value proposition is well received. We continue to invest in our customers and expect to see growth in revenue and market share in the coming years,” continued Mr Conway.
these positions, we had the right people for the job already in the organization,” commented Charles Scott, President and CEO. “Both Blair and Steve have a diverse background in operational and management roles that will help us continue the high standard of service and commitment that we provide to our customers.”
The recent changes will support the company’s ongoing effort to strengthen its core services and capabilities. Computrol continuously invests in versatile, high-speed manufacturing equipment and technology, as well as continuing training programs for employees. Computrol has a long history of providing electronics contract manufacturing services and support to blue- chip customers ranging from military and medical electronics, to telecommunications and computer peripherals.
____________________________________
Speedprint Appoints Manufacturers’ Representative for the Mid-Atlantic
Speedprint Technology announces the appointment of Production Solutions Associates as its newest manufacturers’ representative. Production Solutions Associates will represent Speedprint’s leading-edge stencil print technology throughout Maryland, West Virginia and Delaware.
“I am very pleased to add Production Solutions to the existing team of professional Speedprint representatives,” commented Mark Brawley, Speedprint VP. “Dale is well entrenched in his territory and I look forward to working with him to spread the Speedprint value proposition to his customers.”
____________________________________
Computrol Announces Several Promotions
Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, announces several internal promotions.
Charles Scott III has been promoted to president of Veris, a part of the Armstrong International family (Computrol’s parent company). As a result, Computrol has promoted Blair Carpender to general manager at the Orem, Utah facility. Also, Steve Dillon has been promoted to production manager at the company’s Meridian, Idaho of ce.
“It is great to have such talented and experienced people on our team at Computrol so that when we needed to ll
Page 40
| MAY 2014 ISSUE
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industry news continued...
Nordson DAGE Expands into New Research and Development Facility
Joseph Stockunas, Group Vice President, Advanced Technology – Electronic Systems, together with invited dignitaries and guests, attended the of cial opening by Sir Bob Russell, Member of Parliament for Colchester.
The move to the new location in Phoenix Square, Colchester, had been planned in line with new R & D programs with subsequent headcount expansion to further drive Nordson DAGE’s Bond Test and X-ray product development programs. The move has doubled the space and added important capability including a new clean room facility. The Nordson DAGE Research and Development team have already accumulated many patents for their innovative, market leading products and this move will allow acceleration of future developments to meet the exacting demands of our Bond Testing and X-ray inspectioncustomers. Examplesarethe newly launched XM8000 Wafer X-ray Metrology system that leverages Nordson DAGE’s unique X-ray technology for fully automatic semi-conductor wafer measurements and the 4000 Optima Bondtester, both of which are used as an integral part of the fabrication and packaging of integrated circuits or, as part of quality control and product acceptance.
Mr. Stockunas commented, “This Nordson DAGE Research and Development facility is a key component of the growth expectations for Nordson and a centre of collaboration for its market leading Bond Test and X-ray inspection products, all of which have been created from the ideas developed here. This site provides opportunities for us to grow to the next level as a Company and this investment con rms the level of
con dence the Nordson Corporation has in Nordson DAGE and this Research and Development facility.”
Phil Vere, President of Nordson DAGE, added further, “Excellence of our engineered products is at the core of Nordson DAGE’s success. This is a large R & D investment and will provide the platform for the growth into new markets and applications.”
Left: Sir Bob Russell, MP Right: Joseph Stockunas
____________________________________
Libra Industries Expands Management Sta
Libra Industries, a privately held electronics manufacturing services provider, announces that Joseph Walkos has joined its management staff as the Supply Chain Manager. He will be in charge of the supply chain and stores, reporting directly to Jen Altstadt.
Walkos joins Libra Industries from Saint- Gobain Corporation, where he held a managerial position that was responsible for purchasing, planning, inventory control, MRP processes and logistics. He has extensive leadership in supply chain holding management positions with Steris, ABB, Danaher and Pioneer-Standard Electronics.
In his new role at Libra Industries, Walkos will manage the supply chain functions and develop the processes and systems necessary to achieve desired cost, pro tability and customer service objectives
while building long-term vendor relationships. He will ensure that Libra Industries’ supply chain strategy and execution is conducted in a world-class manner to achieve best-in- class performance.
Walkos graduated from Kent State University with a Bachelor’s of Science in Aerospace Technology degree and John Carroll University with a Master’s in Business Administration. He attended the ABB Executive Management Development Course at the Fuqua School of Business at Duke University and has his Six Sigma Green Belt.
____________________________________
BALVER ZINN Grants Sub-License to Estaños & Soldaduras Senra, S.L.U.
BALVER ZINN today announced that it has granted a sub-license to Estaños Senra S.L. for the popular SN100C® alloy patented by Nihon Superior Co. Ltd. for manufacturing and sales throughout Spain. Estaños & Soldaduras Senra, S.L.U., with more than 25 years’ experience, is one of the leading Spanish alloy manufacturers of tin-silver alloys, tin-copper, high silver content ller rods, copper phosphorus rods, as well as a complete line of ux, for the mentioned products.
“We believe in continuous improvement and with granting the sub-license to Estaños & Soldaduras Senra, S.L.U. we are another step forward with SN100C®, stated Josef Jost, President of BALVER ZINN. “We welcome Estaños & Soldaduras Senra, S.L.U to our team and we look forwardtostrengtheningourrelationshipin this important region.”
Sublicensing is an important step to ensuring the known quality of SN100C®. Not every producer can guarantee a process that is constant and clean. To ensure the right microstructure of the alloy SN100C® for solder wires, bars and at least long-term solder bath stability, are several necessary process steps.
Page 42
| MAY 2014 ISSUE
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NEW UK 2014 by Keith Bryant, SMT Today’s Technology Editor
OK, so it is not NEW anymore as it is in its 7th year, but National Electronics Week UK held at the NEC Birmingham is the only Electronics Manufacturing focussed event in the UK.
Day 3 was always going to be quieter as last days tend to be, but it was still busy and exhibitors went home happy, feeling it was value for money. The visitors that I spoke to were a little disappointed that there were not many new and exciting exhibits but understood that this is really a regional event. They were happy with the location, the number and variety of the exhibits and the interactions with exhibitors. One or two remarked that they would like to see more feature areas and places where they could get unbiased advice. ____________________________________
‘‘The visitors
that I spoke to
were a little
disappointed that
there were not
many new and
exciting exhibits
but understood
that this is really
a regional event
____________________________________
In summary NEW UK 2014 was a good event for visitors and exhibitors. Alan Colquhoun from BAE Systems said, “We have a good number of leads for our contract manufacturing business and have talked with many potential customers”.
So let’s hope that business in the UK and Europe continues to blossom and NEW 2015 is even more of a success an all fronts.
The location is very central with great road and rail links and also very close to an airport. In fact, it is the only exhibition I visit in the world which is a very short walk from a main line (not underground) rail station and an International airport, so the location is great. ____________________________________
‘‘Despite being a
mainly UK show I
met visitors from
Holland and
France, all saying
how easy it was
to get there
____________________________________
Despite being a mainly UK show I also met visitors from Holland and France, all saying how easy it was to get there, but they had not spent 1 hour in stationary traf c on the M6 motorway that morning!
A 3-day event, it opened with a queue for registration, which is always good to see. From 11.00 am until 3.00 pm it was a very busy day, with lots of traf c in the aisles and stands full of people. As day 2 is normally the busy one the exhibitors left after day 1 happy with the day and with great expectations.
Day 2 was as busy as day 1 if not more so, however the SMART Group and NPL seminar area ran at standing room only for all the Cleaning and Coating presentations on both days.
This feature area was well supported by suppliers and very well attended throughout the whole show, lots of time was spent demonstrating equipment and chatting to visitors about issues they had. I rmly believe areas like this and even events with a technology focus, are the way forward in engaging with potential customers. I’ve noticed that the successful equipment suppliers are focussing on this type of event and reaping the rewards. ____________________________________
‘‘lots of time
was spent
demonstrating
equipment and
chatting to
visitors about
issues they had
____________________________________
After day 2 there were a few long faces where the expectations after day 1 had not materialised, but all agreed it was a good 2 days and the quality of the visitors was excellent.
Mike Nelson of ETEK Europe said, “This how is a key part of the UK calendar and we are con dent that from the enquiry level so far it will be a success”.
Page 44
| MAY 2014 ISSUE
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Competition Raises
Standards
by Keith Bryant, SMT Today’s Technology Editor
The IPC Hand Soldering Championship was held at IPC APEX a few weeks ago and was very high pro le at the show. From a personal perspective this was good to see. In a world full of high tech equipment, working with our hands is a skill often overlooked, but it continues to be a key focus for the IPC. As the acknowledged leader in global quality and manufacturing standards running Hand Soldering Competitions shows a real commitment to the basics.
Today I am writing this on the SMART Group and NPL Cleaning and Contamination feature area at the National Electronics Week UK show and dropping in to the rst UK heat of the IPC competition. Again a competition excellently run with very experienced IPC Trainers doing the judging and Lars Wallin managing the event. ____________________________________
‘‘PC Hand Soldering
Competition will
make its next
stop in Russia
____________________________________
In its ‘World Tour’, the IPC Hand Soldering Competition will make its next stop in Russia at EXPO Electronica, again the winner will be at APEX next year. This is also a rst time event, so the nal will be even bigger and better in 2015. I really applaud the IPC for this initiative, bringing focus to the unsung heroes that our industry could not function without.
would be representing the UK in the World Final at APEX US next year.
All of the event sponsors were happy and I was pleased that SMT Today was Media Sponsor for the event and am sure we will be partnering with the IPC here next year. ____________________________________
____________________________________
‘‘running
Hand Soldering
Competitions shows
a real commitment
to the basics
____________________________________
IPC APEX brought together the winners of the regional heats which included people from India, China, Singapore and Europe, a true global event. The atmosphere was friendly but competitive and all the contestants enjoyed the whole occasion.
‘‘excellently
run with very
experienced IPC
Trainers doing the
judging and Lars
Wallin managing
the event
____________________________________
A good number of competitors entered and support from the UK industry was superb, so it was a great success, a good sign for the rst one.
The lure of pitting your skill against the best soldering iron hands in the UK proved too much for some and you will see a picture here of my good friend Bob Willis trying his hand, just for fun, of course. But I have to say that the old man still has the skills!
The soldering stations were kept busy throughout the show and the winner announced on the last day. In what the judges described as a “very tight competition”, all of the contestants should be congratulated. Andrew Smith, a Rapid Prototyping Engineer from CIL, came out victorious and will be the rst con rmed contestant at next year’s IPC APEX US event in San Diego.
With a very high score of 167 out of 176 he was only 12 points ahead of Helen Reynolds, also from CIL. Andrew was “over the moon” with his success and “totally blown away” when he realised he
Page 46
| MAY 2014 ISSUE
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Selective Soldering with a PLUS of Flexibility
by Heike Schlessmann, Marketing Manager, SEHO Systems
Time plays a key role in modern electronic production. With the SelectLine, SEHO developed a selective soldering system featuring mini-wave processes. Its revolutionary design provides the highest precision and solder joint quality as well as a high degree of exibility: no changeover is required to dynamically process a variety of assemblies with short cycle times.
The SelectLine machine concept is consistently modular, thus ensuring clear cost bene ts. Fluxer, various preheat modules and soldering modules may be equipped individually and, depending on the requirements, can be con gured to a complete manufacturing line.
High Precision Fluxing Process
Selective soldering systems from SEHO are equipped with a micro drop jet uxer that focuses on two points: maximum precision and minimum ux consumption.
Up to three nozzle heads that are installed on the high precision XY axis system ensure a de ned ux application in the smallest areas. Therefore, throughput can be increased signi cantly when processing panels. As an alternative, two different ux types, controlled via software can be used simultaneously.
For selective soldering systems from SEHO, 100 percent process control starts with ux deposition. Both the lling level in the ux container and the function of the drop jet nozzles are continuously controlled. Highest process reliability is offered with the ux quantity control, which
actually measures the quantity of each drop that is jetted onto the printed circuit board (PCB).
Flexible Preheat Process
A reproducible and effective pre-heating process is essential to activating the ux and achieving optimum wetting activity. The pre-heat area of the SelectLine can be con gured individually by length and type. It scores particularly high because of its energy ef ciency. Quartz heating elements, that can be activated individually, ensure an effective heat transfer to the PCB’s bottom side. If needed, additional infrared heaters can be installed for topside heating. Controlled via the software, both pre- heating systems are matched to guarantee reproducible temperature pro les.
In case of processing high mass assemblies, the preheat module may also be equipped with convection heating, ensuring a complete and effective heat transfer with homogeneous temperature distribution within the preheat zone.
To constantly keep assemblies on the same temperature level during long soldering cycles, a topside heating may also be integrated into the soldering area. Of course, all heating circuits can be monitored and a touchless pyrometer can be installed for precise control of the pre- heat temperature pro le.
Twin-Select: Dual solder pot concept with two electromagnetic soldering units installed on separate z axes
Page 48
| MAY 2014 ISSUE
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feature continued...
Soldering to Perfection
The soldering area — which is the heart of the SelectLine — scores highly due to its outstanding exibility and precision. The electro-magnetic soldering unit with exceptionally stable and precise wave height as well as innovative solder nozzles ensures an ef cient energy transfer and, therefore, guarantees perfect soldering results. ____________________________________
structures on the same assembly are soldered with a small solder nozzle.
Innovative Solutions – Patented by SEHO
Maximum throughput requirements are met with the new, innovative Synchro concept, which is patented by SEHO. Typically, to increase production volume, additional soldering modules need to be added, or the machine has to be equipped with a dual conveyor to allow parallel processing of boards. These measures, of course, are related to a large investment in equipment. ____________________________________
area independently and are not linked to the same cycle. With the new Synchro concept, cycle times can be reduced by nearly 50 percent.
Soiled solder nozzles remarkably affect the reproducibility of soldering processes. This is avoided with another innovative feature from SEHO. The automatic ultrasonic cleaning for wetted miniwave solder nozzles. What previously had to be made manually and with aggressive chemicals is now automatically and environmentally friendly performed through the machine. The solder nozzles get a gentle cleaning and they are completely re-wetted. Besides a signi cantly longer solder nozzle lifetime, this unique feature guarantees process improvements and signi cant time savings.
100 Percent Process Control
The ability to reduce production costs, while maintaining consistent high quality, is essential for electronic production. Considering that manual repair soldering processes are not only expensive and time consuming but also provide poor reproducibility, the target becomes a zero-fault process. A controlled, reliable selective soldering process represents the rst and most important step towards a zero-fault production. ____________________________________
‘‘Cameras for visual
p
into the offline
teach program
for fast parameter
optimization
____________________________________
Selective soldering systems from SEHO provide a comprehensive hardware and software package to control the process sequence nearly 100 percent. Precision starts with the positioning of assemblies. Reproducible soldering results are ensured with the automatic position correction using fiducial recognition. This software tool automatically compensates various types of mis-alignment such as offset or linear shrinkage within the PCB.
‘‘
provides two
This permanently
different solder
alloys, eliminating
changeover times
____________________________________
Process management is pushed to its highest exibility with the dual solder pot concept Twin-Select. Two electro- magnetic soldering units are installed on separate Z-axes and can be programmed independently. This permanently provides two different solder alloys, eliminating change over times. Additionally, the Twin-Select concept can reduce cycle times substantially if the soldering units are equipped with solder nozzles that have different diameters. Connectors, for example, can be soldered in one pass using a larger solder nozzle while ne
Typically, to ‘‘
in
crease production
volume, additional
soldering modules
need to be added
____________________________________
The Synchro concept is an intelligent software feature that co-ordinates the soldering process for two PCBs in such a way that the total throughput is nearly doubled without the need for signi cant investment. The same soldering program is loaded for both soldering units synchronous, working in an in nite loop. The assemblies can enter the soldering
rocess control provide additional safety and can
be integrated
Page 50
| MAY 2014 ISSUE
mcServer software: Ensures full traceability of the selective soldering process and meets Industry 4.0 requirements
Additionally, loading of the correct soldering program and appropriate infeed of PCBs is controlled. ____________________________________
Special attention in terms of process control is given to the soldering area.
Stable wave heights are ensured using a measuring needle or a high-precision laser micrometer. Because the solder level in the solder pot can affect the stability of the wave, it is controlled and solder wire is supplied automatically if needed. ____________________________________
‘‘Faulty assemblies can be removed from the inline production automatically and directly passed
on to a repair workplace
____________________________________
Cameras for visual process control provide additional safety and can be integrated into the of ine teach program for fast parameter optimization. The zero-fault production turns into reality with the integration of an AOI system. Here, solder joint inspection is performed immediately after the soldering process.
Faulty assemblies can be removed from the inline production automatically and directly passed on to a repair workplace. Besides clear cost bene ts, particularly in terms of oor space requirements and board handling, evaluation of trend and series defect information enables early process optimization, notably reducing error rates.
Another innovation from SEHO is the machine communication software mcServer. The selective soldering process becomes transparent and can be traced completely. In addition, it also meets the requirements of Industry 4.0. This software feature allows comprehensive control of the soldering process with real-time access to all connected machines that are installed in different production sites worldwide. Additionally, it is possible to directly link to cameras that are integrated in a machine.
The mcServer machine communication software collects, analyzes and archives all information about the machine and production processes using a straightforward user interface. With its specific serial number, the entire process for a single PCB can be traced. Production statistics, user statistics or AOI statistics can be generated as easily as comprehensive reports for documentation. ____________________________________
‘‘
control guarantees
entire process
for a single PCB
can be traced
____________________________________
Using appropriate interfaces, every machine can be integrated into each speci c MES/ERP system for superordinate control of the process.
Conclusion
Absolutely unique is the 100 percent process control that is provided by all selective soldering systems from SEHO. Features range from ux quantity control through automatic position correction and z-height correction to continuous wave height control and the unrivalled opportunity to integrate a system for automated optical inspection directly into the selective soldering process. SEHO’s selective soldering systems increase exibility, process control and precision in the production process while decreasing defects, time and cost.
Flux quantity
flux deposition with
utmost precision
and is exactly dosed
____________________________________
The automatic Z-height correction recognizes warped assemblies caused by previous thermal or mechanical load, and automatically calculates correct Z values for all points of the soldering program.
Flux quantity control guarantees ux deposition with utmost precision and is exactly dosed. In the preheat area a touchless pyrometer control, as well as monitoring of all heating circuits, ensures reproducible temperature pro les.
‘‘
serial number, the
With its specific
red carpet
out & about in the industry
In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...
PROMATION Inc. successfully completed a robotic soldering class on the TT and G series robots. To ensure that the company’s sales teams in Mexico are updated on the latest innovations, the company conducted a two-day sales training class at its facilities in Kenosha, WI.
Libra Industries’ New Product Introduction (NPI) team completed the move from Plant One to Plant Two. In conjunction with the move, the team acquired additional equipment. With the added equipment and dedicated focus on quick-turn prototypes, Libra Industries’ NPI team was able to build and ship seven new prototype assemblies within the rst two weeks at Plant 2.
Graham Naisbitt (right) from Gen3 Systems is announced as Operations Director – Europe for Microtek’s new European Test Laboratory based in the UK. Photographed with Mike Shepherd, President/CEO of Microtek Laboratories Inc.
Gheorghe Rebegel, Etek-Europe’s Eastern European Sales Manager, accepts the Distributor of the Year Award (2013) from Josh Petras, Business Director of Inspection Products, Nordson DAGE at IPC APEX EXPO.
Page 52
| MAY 2014 ISSUE
what’s happening in your business?
send your event pictures to red@smt today.com
Speedprint Technology established a strategic partnership with 4Tech Electronics in Detroit, MI. 4Tech is a re-manufacturer of surface mount and through-hole placement equipment who has integrated and supports Speedprint screen printers. (photo Dan Trinka)
CyberOptics Corp. promoted Eugene Sitoh to the position of Asia Sales Manager. He is fully positioned to take over the Asia sales management activities that include growing the company’s Asia revenue and customer base along with managing its Asia sales channel.
STI Electronics Inc. hosted a successful open house at its new IPC approved training center in Houston, TX on Wednesday April 23, 2014. The training center is located at 9920 W. Sam Houston Parkway S., Suite 420.
Viscom completely redesigned its website. Located at www.viscom.com, the fresh layout offers intuitive navigation with a high degree of user-friendliness.
Horizon Sales recorded more than $1.7 million in orders for Juki in a two-week period ending March 13, 2014. The orders were from two companies in Ohio and one in Michigan,
and included more than ve pick-and-place machines, three printers and three ovens as well as conveyors and feeders.
Jaltek Systems, located in Bedfordshire, UK, has selected MIRTEC’s MV-7 OMNI 2D/3D In-Line AOI Machine. The MV-7 OMNI 2D/3D met Jaltek Systems’ demand for the very latest in state-of-the-art 2D/3D inspection technology at an affordable price point. (photo Zane Wall)
Watch out for our Printing vs Dispensing edition! It will be delivered to your desk and inbox in July 2014!
We hope you have enjoyed our fourth edition and found it an interesting and enjoyable read.
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“Adding MIRTEC’s MV-9 3D best in class inspection machines to our complex assembly process has improved our production ef ciency and enabled process improvements resulting in improved quality and customer satisfaction. MIRTEC’s strong support and technical expertise has made them a partner of choice for Krypton Solutions.”
Dipak Patel, Owner and Operations Mgr
OMNI-VISION® 2D/3D Inspection Technology
uDigital Multi-Frequency Quad Moiré
u 15 Mega Pixel Camera Technology
u 10 um/pixel Telecentric Compound Lens
u10 Mega Pixel SIDE-VIEWER® Camera System uSix Phase Color Lighting System
uPrecision Linear Drive Motor System
www.mirtec.com