The Choice of Publication for the Electronics Industry

Evolution of the Performance and Reliability Requirements of Soldering Fluxes

PCB Makers Struggle with Conflicting Environmental and Safety Regulations

red carpet

Who’s doing what, where?

inside

Productronica preview 2015

meet the CEos Page 8

Markus Walter, SEHO Systems GmbH (cover)

Daren Palmer and Tom Mealey of Virtual Industries Tom Wittmer of WittcoSales

Jared Sandman of Fancort Industries

Craig Rupp of Inovar

| NOVEMBER 2015 ISSUE smttoday.com

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welcome

to smt today

Welcome to the latest edition of SMT Today – a high-quality publication created for the global electronics industry which provides the best content and largest distribution through the latest technology channels.

We’ve brought the publication of this issue forward to coincide with productronica in Munich which, in addition to celebrating its 40th anniversary, continues to set new standards in promoting future innovations and giving the industry new momentum.

We’re also celebrating our 2nd anniversary as SMT Today was initially launched at productronica in 2013 with a 36-page magazine and has now increased to over 70 pages of technical articles, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts.

This edition, in particular, features an article co-written by Karl Seelig and Timothy O’Neill from AIM Solder entitled ‘Evolution of the Performance and Reliability Requirements of Soldering Fluxes’, and interviews with Markus Walter, CEO of SEHO Systems GmbH and Peter Bierhuis, President of Nordson ASYMTEK.

During 2015, we’ve attended a number of trade exhibitions, and, as a team, were delighted to meet up with many of our readers and contributors where we shared what additional services SMT Today can o er in the form of delivering responsive websites, successful marketing campaigns and e ective video productions.

The next issue of SMT Today will be published in February 2016 and will focus on IPC APEX in Las Vegas, so if you’d like to advertise with us or have any articles that you’d like included, please don’t hesitate to contact me at [email protected].

In the meantime, we would like to extend an open invitation to exhibitors and visitors to our booth A3-433 at productronica and will look forward to seeing you in Munich!

Kind regards

Lin Ramsay, Editor

Email: [email protected] Skype: lin-smttoday Call: +44 1292 834009

Page 3

inside this issue...

Shows/Events

Exhibition Focus Review

6 productronica, Munich

10 Director Spotlight Interview with industry experts

10 Markus Walter CEO OF SEHO SYSTEMS GmbH

14 Technology Today Industry experts share their knowledge

14. You Say IOT... I Say Industry 4.0!

16. SprayNozzleCon gurationsinanInlineCleanerand its E ects on Cleanliness

20. An interview with Peter Bierhuis, President of Nordson Asymtek

22. Evolution of the Performance and Reliability Requirements of Soldering Fluxes

28. PCBMakersStrugglewithCon ictingEnvironmental and Safety Regulations

32. DEN-ON’s 50+ Years of Industry Experience Proves that Quality and Service are Key to Success

38. XRHCount – The Revolution in SMT Counting

40. An interview with Curt Couch, President of Count on Tools

42. AutomaticPro lingSystemshowithasImproved Production

46. Morphology of sn Base Solder Alloy Structure with Additive Elements

60. Getech Automation Provides Total Customer Satisfaction

62. Combating Oxidation and Inter-Metallics in Moisture Sensitive Components

64. The Evolution of Cleaning methods in the PCB Reworking Process

70. Reducing the Expense and Potential Pitfalls of Servicing Diaphragm Dispensing Valves – A New Paradigm

72. SMT Planning Challenges as Flexibility Becomes Volatility

68 SMT Today People Awards 2015

34 New Products Exciting new industry innovations

52 Industry News

What’s happening in the world of electronics

66 Red Carpet

Photo gallery of industry personalities and events

68 SMT Today People awards 2015

Articles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every e ort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers for loss arising from articles/information contained and published. All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

6

productronica 2015

8

Meet the CEOs

10

Director Spotlight

52

Industry News

68

People Awards 2015

6

magazine contacts...

Editor

Design Website

Lin Ramsay [email protected] +44(0)1292 834009 skype: lin-smttoday

BBD Creative bbdcreative.com +44(0)1292 280022

smttoday.com

Advertising Enquiries

To enquire about available advertising opportunities, please contact:

advertising @smttoday.com

NEXT EDITION

February’s edition will focus on IPC APEX in Las Vegas

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10—13th November

productronica 2015

celebrating 40 years

productronica is celebrating its 40th anniversary in November. The secret to its success? Together with the industry, it has been setting new standards to promote future innovations time and again since 1975.

As in the past, this year’s productronica will give the industry new momentum. Once again, the special show promises to be a highlight. It will allow visitors to experience Industry 4.0 live and visitors will be able to look into the machines and follow complex processes between machines and workpieces that were hidden until now.

Tablets and smartphones are the perfect human-machine interface. Augmented reality is giving manufacturers of electronics machinery enormous opportunities to remain competitive.

In addition, for the rst time ever, the productronica innovation award, the electronics industry’s rst independent award, will be presented before all participating exhibitors. Besides that, this anniversary year is the perfect opportunity for visitors and exhibitors to familiarize themselves with the latest innovations in electronics production and gain insights into the entire industry.

Here’s a quick look at just a

Acculogic Inc

Hall A1, Booth 465

A global leader in electronic production test solutions, will demonstrate the newly launched Scorpion Briz Test and Programing Station.

____________________

Aqueous Technologies

Hall A2, Booth 528 North America’s largest manufacturer of fully automated cleaning/ de uxing machines and cleanliness testing equipment, will showcase the Trident ZDO and the Zero-Ion G3. A cleaning guide entitled “The Reason

sample of the customers, products and systems that

will be on display:

Data I/O

Hall A2, Booth 205

The leading global provider of advanced programming and IP management solutions, will showcase their new LumenX programming technology integrated into the award winning PSV7000 automated system and manual con gurations.

____________________

DEN-ON INSTRUMENTS

CO LTD

Hall A4, Booth 231

Will exhibit the 7th model series of DEN-ON INSTRUMENTS’ RD- 500SV Rework Station which features an Ultra HD camera with a 19” LCD display for easy visual alignment.

for Cleaning” will also be available from their booth.

____________________

BTU International, Inc

Hall A3, Booth 154

A leading supplier of advanced thermal processing equipment, will be exhibiting with its representative, EPP (Electronic Production Partners, GmbH) and will showcase their PYRAMAX re ow oven and its enhanced ENERGY PILOT software.

____________________

Count on Tools, Inc

Hall A3, Booth 181

A leading precision components and SMT

spare parts supplier, will display their new QWIKTRAY with Adopt SMT. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape and reel is not available and standard JEDEC trays do not exist.

____________________

CyberOptics Corporation

Hall A2, Booth 459

A leading global developer and manufacturer of high precision sensing technology solutions, will showcase their new SQ3000 3D Automated Optical Inspection (AOI) system and launch advanced new product features.

____________________

Essemtec AG

Hall A3, Booth 346

The Swiss manufacturer of production systems for electronic assembly and packaging, will display technical innovations in 3D assembly and jet printing with live demonstrations.

____________________

EVS International

Hall A4, Booth 141

A leader in solder recovery, will showcase their new EVS 500LF lead-free version which has been drastically reduced in size, weight, complication and footprint, while creating a greener lead-free system.

____________________

Page 6 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

Fancort Industries, Inc

Hall B2, Booth 389

A leader in the design and fabrication of lead forming and cutting equipment, will exhibit their wide selection of equipment and services designed to meet all requirements from prototype to moderate production.

_______________________________________

FS Inspection

Hall A2, Booth 532

Producer of advanced, accurate and a ordable high-magni cation visual inspection systems, will demonstrate their latest development – the VERSAMag High-De nition Inspection System.

_______________________________________

GETECH

Hall A3, Booth 405

The worldwide leader in PCB automation and depanelling, will unveil the all new GBR Bottom Router Machine – designed to route (depanelize) printed circuit board assemblies into individual assemblies without the need for PCB speci c xtures.

ULT AG

Hall A4, Booth 549

A leading vendor of high e ciency industrial air ltration systems and dust collectors, will present extraction and ltration solutions for the protection of employees, machinery and products from airborne pollutants.

Virtual

Industries Inc

Hall A3, Booth 443

A leading supplier of manual vacuum handling solutions, will demonstrate the TWEEZER- VAC Elite and ADJUST-A-VAC Elite – two new vacuum handling systems.

_______________________________________

ViTrox Technologies Sdn Bhd

Hall A2, Booth 425 and 427

A designer and manufacturer of innovative, leading-edge and cost-e ective automated vision inspection equipment and system- on-chip embedded electronics devices, will introduce the V810 Mini 3D Inline Advanced X-ray Inspection System (AXI) and the award winning V510 Optimus 3D AOI system.

_______________________________________

VJ Electronix

Hall A3, Booth 112/6

A leader in rework technologies and global provider of advanced X-ray inspection systems, will showcase the new high performance Summit II and XQuik 11 with AccuCount for counting components stored in reels.

Speciality Coating Systems

Hall A2, Booth 371 & Hall A4, Booth 155

A provider of industry-leading liquid coating systems will be showcasing their Precisioncoat V on both the SmartRep GmbH booth (A2-371) and the SMT Maschinen und Vertriebs GmbH & Co KG’s booth (A4-155).

_______________________________________

Seho Systems GmbH

Hall A4, Booth 578

A worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will highlight zero- fault production, their innovative solutions and custom-made automation technology.

_______________________________________

Storagesolution

Hall A4, Booth 201

A division of ESSEGI SYSTEM SERVICE s.r.l., will debut their new ISM UltraFlex 3600 – which builds on the strengths of its ACS/ISM 2000 predecessor with even higher speed/ throughput, powerful and improved software, an intuitive interface, all available on touchscreen devices.

_______________________________________

meet the CEOs

the people who make it happen

Our industry is driven by a global network of CEOs with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.

Virtual Industries Inc.

Daren Palmer and Tom Mealey

Founded in 1987, Virtual Industries Inc. is headquartered in Colorado Springs, Colorado. For more than 20 years, the company has been a leading supplier of manual vacuum handling solutions to the world’s high-technology rms. Co- owners Daren Palmer and Tom Mealey’s patented ESD-safe products are used by CLASS I clean room personnel, electronics assemblers, semiconductor manufacturers, universities and scientists globally. Virtual Industries’ success has come from developing innovative manual vacuum handling tools and pick-up tips based on customer requests and customer feedback. These tools provide customer speci c solutions that make assembly and processing operations more productive and ergonomic.

WittcoSales

Tom Wittmer

Serving the electronics industry since 1988, President and CEO Tom Wittmer and his sales force at WittcoSales o er a full range of state-of-the-art capital equipment and electronic consumables used in SMT and microelectronics processes. For more than 20 years, the company has provided expert service and the most advanced electronic solutions, from single machines to full lines. WittcoSales provides representation in the Southern California, Southern Nevada, Tijuana, Mexicali and Baja California areas.

Fancort Industries

Jared Sandman

Jared Sandman is the CEO of Fancort Industries, a company that provides solutions for electronics manufacturing processes including robotic soldering from Japan UNIX, SMT lead forming equipment and services, PCB depaneling solutions, hot bar bonding equipment, pneumatic and servo-presses, and ESD-safe racks for PCB handling. A manufacturer and integrator of production solutions for electronics manufacturers, the company has a strong competency in precision tool design and construction. Over the past 42 years, Sandman and his team have led the company through many successful growth periods. Today, the company sells a range of equipment through a global network of independent sales reps and distributors.

Inovar Inc.

Craig Rupp

The President of Inovar Inc., Craig Rupp, and his team believe that the company’s success comes from the motto “people do business with people.” Inovar has received numerous awards, green belts and black belts, and is on track to earn a master black belt. Success also comes from the company’s quest to give customers tier 1 service while maintaining a tier 3 approach to exibility. To accomplish this, Inovar hires tier 1 technical sta and focuses signi cant e ort into not just getting customers, but also in making sure that customers get “Inovar-quality” service and solutions at all times.The full-service EMS company o ers customers a wide range of high-quality manufacturing, supply chain and engineering solutions that suit their needs. Rupp and his team’s understanding and experience within the industry is unparalleled, helping to make Inovar the most successful it has been since it rst opened its doors.

Page 8 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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director

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an interview with

MARKUS WALTER, CEO OF SEHO SYSTEMS GmbH

by SMT today editor

Since its foundation in 1976, SEHO has become the worldwide contact partner whenever soldering is involved. Today, SEHO is a leading global manufacturer of complete solutions for soldering processes and automated production lines. Company solutions are based on performance, exibility, e ciency and technical progress.

SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development. With its systems, the company provides customers with a sustained and resource economizing production facility and continuously develops its technology in order to provide customers with a competitive advantage.

gas. This enables the most e ective and component-sensitive heating of the products with set temperatures on a low level.

‘‘Instead of using a complicated vacuum process, MaxiReflow HP is equipped with

Q. Markus, since the company’s founding almost 40 years ago, SEHO has pioneered numerous innovations in the eld of soldering, such as soldering in Nitrogen atmospheres and soldering processes for high temperature applications. Tell us about some of the company’s more recent developments.

A. Due to continuous investment in research, cooperation with industry and science partners, and our highly motivated team, we are able to quickly react to new trends in electronics manufacturing and convert them into processes and products for serial production.

Innovations from SEHO focus on one point: to increase productivity. This includes both the reduction of downtimes for machine setup and maintenance and the increase of production quality. The overall goal is a defect-free production process.

‘‘we are able to quickly react to new trends in electronics manufacturing

and convert them into processes and

developments is a plasma process that can be used to deposit ux powder, which eliminates the need for a solvent. The powder (e.g. Adipic acid) is rmly applied to the PCB’s surface and o ers long-term stability. The soldering result with a standard uxing process is identical. This new plasma process reduces creep when using masks as well as reduces residues, remarkably improving both product quality and system downtime. Additionally, eliminating the solvents allows for material cost savings.

Q. Voids in solder joints are nearly inevitable for common process conditions. How can SEHO help reduce voids in re ow soldering?

A. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, solder joint voids represent a signi cant problem. Enclosed voids can cause a displacement of electrical and thermal paths as well as local concentration of power and heat.

SEHO’s MaxiRe ow HP o ers innovative technology that ideally combines convection heat with a special hyper-pneumatic module, thus ensuring virtually void-free connections. Instead of using a complicated vacuum process, MaxiRe ow HP is equipped with an effective excess pressure chamber, allowing shorter cycle times and enabling gas convection to be used for heating assemblies. Additionally, solder balls that can be seen in vacuum processes are e ectively avoided with this technology.

Each heating zone of the MaxiRe ow HP – and the zones integrated in the hyper-pneumatic chamber – have a tangential fan that ensures absolute homogeneous heat distribution with the large volume of ventilated process

an effective exces”

s pressure chamber.

products fo”

The process is designed in such a way that the solder alloy has been molten before entering the rst section of the hyper-pneumatic chamber. In the second section of the hyper- pneumatic chamber, the solder can solidify in an excess pressure environment. This innovative concept makes existing voids nally vanish from the solder connections. Immediately after the solder’s solidi cation, the excess pressure is released and the assembly is delivered to the cooling zone.

When processing uncritical assemblies, the MaxiRe ow HP can also be operated without activating the hyper-pneumatic chamber. In this case, the PCBs go through a conventional re ow soldering process.

Q. It appears that today’s production processes face frequent new challenges with numerous component variants and uctuations. How does SEHO help solve these challenges?

A. The SEHO LeanSelect is particularly designed to meet these challenges, featuring high exibility and outstanding return on investment. While the entire process is fully automated, loading and unloading of assemblies is done manually on two separate conveyors. This allows simultaneous processing of up to ve carriers.

The work stations are arranged in a counterclockwise U-shape, thus consistently following the Lean Equipment Design Guidelines. The uxer and soldering unit

r serial production.

The demands of current and future assemblies regarding a suitable joining technology require new concepts. For example, to activate the surface of the printed circuit board (PCB) prior to wave soldering, a solvent-based ux is typically used. One of our most recent

Continued...

Page 10 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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ViTro>< Technologies Sdn Bhd ETEK Europe Ltd HILPERT Electronics AG

Etek Technology Centre (Distributor for Germany, Austria

Tel: +60—4—646 6227 (Distributor for United Kingdom, and Switzenand)

Email: [email protected] Eastern Europe & Scandinavian)

WWW-VWOX-00m Tel: +41 56 483 25 25

Teli +44(0) 1292 334 000 Email: office@hi|pert.ch

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are mounted on the same high-precision axis system to ensure highest energy e ciency and successively approach the solder joints, while the assemblies remain in a xed position.

Depending on the application, the LeanSelect can be used for both exible mini-wave processes and product-speci c dip soldering processes with high throughput. Quickly exchangeable solder nozzles and multi-nozzle tools ensure short changeover times. The LeanSelect ensures the highest productivity in the smallest footprint, with the same uncompromisingly high soldering quality as the high-end systems from SEHO.

With selective soldering systems from SEHO, electronics manufacturers are one step closer to a zero-fault production. They all provide a comprehensive, innovative hardware and software package to control the process sequence 100 percent, which is absolutely unique. Additionally, selective soldering processes can be traced completely. With our software feature mcServer, selective soldering systems from SEHO are ready for Industry 4.0. mcServer allows comprehensive control of the soldering process with real- time access to all connected machines that are installed in di erent production sites worldwide.

‘‘With selective soldering

systems from

SEHO, electronics manufacturers are one step closer

volume. Therefore, costly dual conveyor systems are not necessary.

Maximum machine availability is ensured with the automatic ultrasonic cleaning for mini-wave solder nozzles that is patented by SEHO. What previously had to be made manually and with aggressive chemicals, is now environmentally friendly and automatically performed through the machine: the solder nozzles get a gentle cleaning and they are completely wetted.

‘‘The technological highlight of the SelectLine is the patented Synchro concept, an intelligent software feature that doubles

during planning and construction, and we also manufacture, assemble and install the production line.

At the center of our attention are the employees working at the manufacturing line. We provide ergonomic, individual height- adjustable workplaces and the automatic adaption of connected handling stations as a matter of course.

Finally, customers profit from SEHO’s outstanding knowledge and experience with the provision of various seminars and individual training courses from the SEHO Academy.

Q. What are the current trends in soldering and how does SEHO manage to keep up with the ever-changing industry?

A. The globalization of markets results in stronger competition with considerable cost pressure. Therefore, the ability to reduce manufacturing costs in electronics production while maintaining a consistent high product quality is essential. The clear objective is a stable and reliable zero-fault production.

the prod”

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Besides signi cant time savings in terms of maintenance, this feature provides an absolutely stable soldering process. Both the LeanSelect and the SelectLine can be equipped with this new feature.

Q. Besides the technical solutions you o er, how can end-users pro t from working with SEHO?

A. With our modern and innovative machines, and the high quality standard of our products, we are a strong and reliable partner for our customers worldwide. Moreover, our customers pro t from complete solutions, a strategy that we have consistently implemented over the last few years. SEHO is the only manufacturer worldwide that provides innovative systems for all elds of automated soldering processes with integrated solutions for automated optical solder joint inspection.

This strategy also includes customized automation of complete production lines for board handling and material management, particularly in through-hole processes. Work places for assembly of electronic components, bu er and paternoster stations, turn stations, automatic lifts and, of course, the completely automated conveyor units in between are only a few examples. Moreover we implement manual, semiautomatic and automatic work places for the nal assembly of products and subsequent testing procedures, either in individual production islands according to Lean Production guidelines or in interconnection with the entire production process. Our engineers focus on improvements in the work ow, thus reducing manufacturing costs. SEHO assists customers with creative ideas

At productronica 2015 in Munich, SEHO will introduce a zero-fault production line for selective soldering of through-hole components that are “automatically” free from defects and completely traced. Besides the selective mini-wave soldering process, this production line incorporates an AOI system that is integrated in the selective soldering machine, a verify work station for veri cation and classi cation of detected faults as well as an automated rework soldering process. Intelligent handling units automatically allocate the assemblies to the next individual work station or bu er them until the following work station is ready to receive a board.

Because of the creative handling concept, this zero-fault production line provides the shortest cycle times and small oor space requirements.

All processes are independent from the operator and fully reproducible. Additionally, the entire board will not be reprocessed, only veri ed defects are repeatedly processed with correspondingly adapted parameters. These features, as well as the ability to completely trace all processes throughout the line, are only a few of the outstanding advantages of this zero-fault production line.

SEHO will continue to work closely with customers, industry and science partners to research new technologies and integrate innovations for the development of new products to further improve production processes.

Our particular strength lies in our innovative spirit and support, bringing our customers the next step in optimizing their pro tability and competitiveness.

ult production.

uction volume.

Q. We have read about SEHO’s SelectLine in the news lately. Can you brie y explain what this system is and why it has met with so much global acclaim?

A. Time plays a key role in modern electronics production. The SelectLine machine concept is consistently modular, thus ensuring quick reaction to changing production volumes and providing clear cost bene ts. Additional uxer, preheat and soldering modules can be integrated – even at a later date – to respond to higher complexity of board layouts or increasing throughput requirements. The soldering area of the SelectLine scores highly due to its outstanding precision and exibility. Two electromagnetic soldering units for mini-wave or dip soldering processes may be integrated.

The technological highlight of the SelectLine is the patented Synchro concept, an intelligent software feature that doubles the production

Page 12 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

SPECIALTY COATING SYSTEMS '”

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YOU SAY IoT... I SAY INDUSTRY 4.0! By Kim Sauer (@kimsauermedia)

One of the many things I enjoy about my work is the opportunity to meet companies, people and key players in the electronics manufacturing industry around the world - often at events and tradeshows, but also through the projects I’m directly working on for my clients. Having such close interaction o ers a direct insight into the key trends that are shaping the industry through discussion, collaboration, R&D, thought leadership and innovation.

Big Data

Terms around big data and the Cloud are tools used to talk about how we might manage the data driven ecosystem that we are moving towards.

The Cloud

The Cloud is simply o site storage of data communicated through the Internet.

Industry 4.0 Ready and IoM Ready or IoM Compliant

Increasingly the words ‘Ready’ or ‘Compliant’ are being added as an extension to key terms to indicate that a particular solution or service is capable of ful lling speci c requirements. As an example, an IoM Ready system is capable of reading, recording and communicating. That is to say it is able to ‘read’ every input to the machine, be that a component, a consumable or a tool like a stencil or a feeder. It is able to ‘record’ every process that it carries out, including every parameter including the operator. And it is able to communicate that data in an open readable protocol or language.

Cyber Physical Systems

Cyber Physical Systems are closed manufacturing or supply chain loops that sense the impact of processes and use that data to adjust processes, learning as they go and providing some degree of process self-improvement.

Closed Loops

Closed loops are systems that connect and inform. They may or may not learn and are an example of a Cyber Physical System.

Collaborative Robotics

Collaborative robotics are simply robots that can operate in the same environment as humans and as such collaborate or support the operator doing heavy lifting, ne work or repetitive operations at greater speed. These robots sense operator input and are able to take action on that data or on a change in their environment.

The Industry 4.0 language will evolve and many dialects will develop. It’s an exciting phase for the industry. One that o ers huge scope for advancement and innovation. What I nd most exciting is that simply by its very nature it demands collaboration and dialogue.

The language and key words used may be very di erent depending on which region of the world I happen to be in. However, they are all pointing in one very decisive direction: everyone is working towards increased productivity and exibility driven by a demand from customers for fully traceable customized solutions and products when and where they want them at a price they are willing to pay. The goal is clear and, despite the di erences in terminology used, we’re all striving towards what some refer to as the fourth industrial revolution!

Of course I’m talking about ‘Industry 4.0’ or ‘IoT’ (Internet of Things) or ‘IoM’ (Internet of Manufacturing) or ‘Smart Factory’ or ‘Made in China 2025’ or whatever other terms and synonyms are being added to the topic daily as it gains momentum. If you’re still resisting joining the revolution, then just look around and you’ll notice very quickly that there is nowhere to escape anymore. The topic is omnipresent, companies are already and increasingly launching ‘SMART’ solutions, R&D is focused on ‘intelligent’ systems, collaborations are forming along the supply chain to o er solutions that can seamlessly communicate up and down the line, and automation and robotics are enjoying lots of attention – that’s just scratching the surface!

Still not convinced? Just visit Productronica this year, where their new cluster concept includes a dedicated ‘Future Market Cluster’ which covers the entire spectrum of current trends in electronics production and aims to show what Industry 4.0 means in electronics manufacturing, what capabilities cyber-physical systems and printed electronics have and where trends in the electronics industry are going.

Personally I like that there are di erent terms in di erent regions of the world for the same or similar concepts, processes and solutions. Just like language in general, it’s what de nes us culturally and o ers a unique opportunity of

varied interpretation without the danger of being blind-sighted by a single term. But just like it’s useful to know ‘ein bier bitte’ or ‘avez–vous un menu en anglais?’, understanding some of the terminology used around the world for, what I call in my language, ‘Industry 4.0’ will come in handy.

So here’s a little intro:

Industry 4.0

Industry 4.0, also referred to as ‘i4’, started out as a German vision of a system of manufacturing that uses a batch size of one philosophy where each product communicates with the manufacturing process and the entire supply chain to bring everything together to build and ful l that product. It also suggests that the manufacturing process has some elements of self-learning as a result of cyber physical systems. It is now a term more widely adopted beyond the German borders, mainly in Europe and some Asian countries, particularly in China where Industry 4.0 is getting a lot of attention through their ‘Made in China 2025’ initiative.

IoT (Internet of Things)

IoT, a global term with its origins in the USA, is a network of connected things as the name suggests. Analysts believe we are headed to a world where fty billion ‘things’ will be connected to the Internet. These devices will identify themselves uniquely and may have some level of sensing or actuation. This ability to sense, communicate, identify and actuate are all part of the IoT and i4 puzzle.

IoM (Internet of Manufacturing)

IoM is the term used for a connected approach used in a manufacturing environment or supply chain, which may be connected externally using cloud storage, but could equally be a closed environment where data is stored securely and locally.

Page 14 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

November 10 –13, 2015 | Messe München HALL A3 BOOTH 154

SPRAY NOZZLE CONFIGURATIONS IN AN INLINE CLEANER AND ITS EFFECTS ON CLEANLINESS

By JODY SAULTZ, APPLICATIONS ENGINEER, SPEEDLINE TECHNOLOGIES

Cleaning electronic assemblies or PCBs (Printed Circuit Boards), has been essential for many years. As PCB board density has increased and stando height has decreased, so have cleaning challenges. Numerous technical studies published over the years have con rmed that post re ow ux residues resulting from No Clean, RMA and Water Soluble solder pastes can lead to failure mechanisms such as leakage current, electrochemical migration and dendritic growth, an unacceptable consequence particularly for high reliable electronic applications.

The JIC is the simplest nozzle type designed to apply maximum mechanical energy of any nozzle independent of pressure. The nozzle can be adjusted to disperse liquid via pin point or sheet pattern dependent on the process requirements.

V-Jet nozzles provide a V-shaped spray pattern. The spray pattern size is determined by the spray angle and ow rate. The V-Jet spray patterns can be assembled to meet at the process level or slightly overlap in a long at spray pattern. Utilizing a ooding action to the PCB, residues are softened through chemical and thermal energy. However, when compared to other designs, these nozzles o er the least amount of mechanical energy delivered to the PCB.

In summary, an e cient cleaning process requires the optimization of thermal, chemical and mechanical energies. Speci cally when optimizing mechanical energy, it’s critical to consider the spray manifold design and con guration as well as the spray nozzle type and quantity.

The focus of this study was to assess the in uence of the various spray manifold con gurations on inline cleaning performance and e ciency.

Methodology

This study was developed to evaluate the e ectiveness of the various spray manifold designs to clean post ux residues from PCBs. A spray-in-air inline cleaner utilizing a micro phase cleaning agent was selected to conduct all cleaning trials. The inline cleaner included pre-wash, wash, chemical isolation rinse and nal rinse and dry sections.

Four spray bar manifold designs were evaluated:

• Spray Under Immersion (SUI). Figure 1 (overleaf).

• High Volume V-Jet Nozzle (HVVJ). Figure 2 (overleaf).

• Standard Intermix Nozzle (SI) – Alternating V-Jets and JIC spray bars. Figure 2 (overleaf).

• Intermix High Volume Nozzle (IHV) – Alternating V-Jets and JIC spray bars. Figure 3 (overleaf).

In order to assess the e ectiveness of the spray manifold designs, the ZESTRON® Test Vehicle (Figure 4) was used and populated with SMT

Cleaning systems have also evolved over the years in addition to the cleaning agents available. In recent years, engineered aqueous-based cleaning agents have become prominent due to the safety of use and reduced environmental impact as compared to solvent options. Thus, spray in air cleaning equipment is widely used throughout the electronics industry.

Given plant logistics and production demands, inline cleaning machines are frequently selected for PCB de uxing applications. In general, these machine types o er high throughput per square foot of surface area and excellent cleaning results.

The major sections of an inline cleaner include pre-wash, wash, chemical isolation, rinse and dry. Key to the inline cleaning performance lies within the prewash and wash sections. Utilizing a combination of thermal (cleaning agent temperature), chemical (ability of the cleaning agent to solubilize residue) and mechanical (impingement force of the cleaning agent on the PCB surface) energy, residues are contacted, solubilized and removed. These energy sources combine to achieve the e ective removal of post re ow ux residues.

Thermal and chemical energy e ectiveness results from cleaning agent selection. Mechanical energy e ectiveness is based on the cleaning equipment design and particularly the cleaning agent delivery system. Factors to consider include immersion vs spray, cleaning agent contact time, number of spray bars, number and type of nozzles selected, and spray bar pressure.

Numerous designs have been developed and utilized including:

• Spray Under Immersion (SUI)

• High Volume V-Jet Nozzle (HVVJ) • Standard Intermix Nozzle (SI) –

Alternating V-Jets and JIC

spray bars

• Intermix High Volume Nozzle (IHV) –

Alternating V-Jets and JIC spray bars

SUI technology was developed in the 70s for cleaning PCBs with through hole components. Spray-in-air V-jet technology was developed in the 80s with the advent of SMT components as testing con rmed that greater impingement force was required for this PCB design. In the 90s, as SMT components were more widely used as compared to through hole technology, greater increases in impingement force was required. This led to the development of higher volume spray-in-air V-Jets, water curtains and coherent nozzles (solid liquid stream through a single hole). In the early 2000s, use of SMT components on PCBs continued to increase and various nozzle technologies were combined with immersion.

Within the mid-2000s, assemblies consisted mainly of SMT components, increased board density decreased stando with bottom terminated designs all combining to greatly increase cleaning challenges. Testing proved that a combination of spray technologies was still required with nozzles that provided even greater ow rates. This led to the development and introduction of high volume intermix nozzles.

The various spray bar manifolds are comprised of di erent spray nozzle technologies such as Solid Stream (JIC) and V-Jet spray nozzles.

Continued...

Page 16 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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Figure 1: Spray under immersion (SUI)

Figure 2: Standard & high volume V-Jet (HVVJ)

Figure 3: Intermix high volume (IHV)

low stando components. Five (5) components of each chip-cap type were populated on each test vehicle for a total of 45 components per substrate (Table 2).

Utilizing the populated ZESTRON® Test Vehicle, three (3) lead-free solder paste types were considered: Paste A – Water Soluble (OA), Paste B – No Clean (NC) and Paste C – RMA. All pastes were re owed per the manufacturer’s recommended pro les.

Following the cleaning process, cleanliness assessment was made via visual inspection per IPC TM-650 and Ion Chromatography analysis per IPC-TM-650 2.3.28. Thus, two test vehicles were required for each trial or a total of sixteen boards for each paste type considered (2 boards x 2 belt speeds x 4 spray manifolds). For visual inspection, all components were removed to enable component cleanliness assessment and average under-component cleanliness determined for each trial. All results were plotted in bar graphs and with Minitab software.

Results - Visual inspection

For each paste type, conveyor belt speed and

Figure 4: ZESTRON® Test Vehicle

spray manifold considered, one test vehicle was analyzed for component inspection. All components were removed and under-

Paste B – No Clean

Best results were achieved with Intermix HV (98%) at 5 minute dwell time. Std Intermix and V-Jet HV results (96%) and (95%) respectively at 5 minute. dwell time; SUI (86%) at 10 minute dwell time.

Paste C – RMA

Best results were achieved with Intermix HV (99%). Std Intermix and V-Jet HV results (97%) at 5 minute dwell and SUI result (98%) at 10 minute dwell time.

Part 2: Ion Chromatography Results

Twenty four (24) boards, one for each dwell time, nozzle con guration and solder paste type were used for ion chromatography analysis. All boards passed the ion chromatography test for the ion species and were below the maximum recommended contamination levels.

Conclusion

For any cleaning process, optimizing thermal, chemical and mechanical energy is critical to achieving best cleaning results. This study focused on optimizing mechanical energy while maintaining a thermal and chemical energy constant. Utilizing the same test vehicle populated with components using OA, No Clean and RMA solder pastes, four spray manifold designs were considered and cleanliness results evaluated using visual

inspection and IC analysis.

Test results con rmed that spray bar con guration, nozzle design and utilization impacts mechanical energy generated and the degree of cleanliness achieved. Cleaning is also impacted by the component types used for under-component cleanliness. It is more di cult to achieve under-component cleanliness with larger surface area components as compared to those with smaller surface area.

Within this DOE, Intermix HV spray manifold achieved the best results at a 5 minute dwell time for No Clean and RMA and at 0.55 min for water soluble. All SUI results required twice the dwell time as compared to the other spray manifold con gurations with results less than what was achieved with Intermix HV.

Although for all cleaning trials IC analysis yielded passing results, under-component cleanliness varied with each spray manifold con guration. In order to ensure the best possible results and minimize risk of eld failures, care should be taken to maximize mechanical energy within a spray-in-air cleaning process and select the most e cient spray manifold con guration. Within this DOE, Intermix HV achieved the best results within all scenarios considered.

Acknowledgements

Special thanks to ZESTRON for providing the test vehicles required for the trials.

For a full copy of the DOE, please contact Jody Saultz at [email protected].

Component Types Used

SOT23

0805

6032

1210

0603

1812

1206

0402

1825

Table 2: ZESTRON® Test vehicle component type population

Figure 5: No Clean Paste B Visual Cleanliness Results

component surface rated as percent clean. The cleanliness level for all components was averaged per board. For each scenario, 45 components were considered (Ref. Figure 5).

No Clean Cleanliness Results

Intermix HV produced the best results (98%) at 5.3 minute dwell time. This was followed by Std Intermix (96% at 5.3 min dwell), and V-Jet HV (86% at 5.3 min dwell). SUI resulted in 86% at 10 minute dwell time.

Result Summary – Visual Inspection

Paste A - Water Soluble Review:

As one would expect, the Water Soluble pastes were easiest to clean. Best results were achieved using the V-Jet HV at 0.55 min dwell (99%). At 1.06 min dwell cleanliness results were: Intermix HV (99%), Std Intermix (97%); SUI (99%), but at 2 minute dwell time.

Con guration

Pre Wash Upper Pressure (PSI)

Pre Wash Upper Pressure (PSI)

Wash Upper Pressure (PSI)

Wash Upper Pressure (PSI)

Standard Intermix Nozzle

55

45

70

45

Intermix High Volume Nozzle

55

45

70

45

High Volume V-Jet Nozzle

55

45

60

40

Spray Under Immersion

55

45

60

40

Table 1: Spray Bar and Nozzle Design Details (manifold)

Page 18 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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TECHNOLOGY TODAY INTERVIEW

AN INTERVIEW WITH PETER BIERHUIS,

PRESIDENT OF NORDSON ASYMTEK

by Andrea Roberts, A R Marketing, Inc.

Q. Nordson ASYMTEK has been a world leader in automated uid dispensing, jetting and conformal coating for over 30 years. Your founders started what they then called “benchtop automation” and ASYMTEK introduced the rst jet dispenser in 1983. How do you stay in the forefront of innovation over such a long period?

A. Innovation comes about in a variety of ways but the main element is maintaining a very close relationship with our customers. Customers may express a speci c need for new product capabilities; other times we extrapolate from what they are describing as their challenges and then let our engineers go to work to nd solutions. That does not happen automatically – our application engineering groups around the world are a pivotal element in putting de nition around customer requirements. Once the requirements are known, the creative process takes over.

We work hard to encourage our engineers to try new things, to challenge the way things have been done and, at the same time, ensure that focus is maintained on the core problems that we are trying to solve. Then, once the initial viable concepts start surfacing, we visit back with some of our close customers to validate the concepts. This is a very important step. It can give validation to our approach and often opens up a dialogue with the customer that inserts their perspective, leading to further re nement and new ideas. Innovation that leads to new products which solve customer needs is what it is all about.

‘‘We work hard

to encourage our engineers to try new things, to challenge the way things have been done and, at the

uid dispensing technologies. We have an internal sta of R&D engineers who work independently and also partner with universities and research institutions. The R&D team is guided by our internal Technology Roadmap which de nes the general parameters that we anticipate our products need to o er some years out.

In addition, we expect innovative suggestions from all our global sta . Sometimes just someone asking the question ‘what if’ is the spark that is needed to start a dialogue that leads to the best ideas.

when a high level of focus is preserved. The Advanced Technology segment is continuing to evolve through both organic initiatives as well as further acquisition activity. The most recent additions to the segment have been DIMA of the Netherlands and MATRIX of Germany.

Q. Can you speak a little more about Nordson’s acquisition of DIMA. How is that acquisition going?

A. The addition of DIMA Group to Nordson is a great t. There are the obvious complementary aspects of DIMA’s dispense and coating products and we are also excited about the hot bar soldering and SMT products. We have several initiatives going already in these product areas which we will soon be introducing to the market.

Adding ASYMTEK’s global reach to the DIMA products is already delivering results, with very positive response from our customers.

We have also consolidated our ASYMTEK European operations into the former DIMA facility. This is creating not only more space for our growing European business base, but we also bene t from the manufacturing capabilities that we now have available to quickly serve local needs. Altogether, we are very pleased with the addition of DIMA.

Q: Cost-of-ownership (CoO) has been a term that has been around for a long time, but it seems to be even more important today. How have you addressed that issue?

A: The highly competitive nature of the electronics industry has created a customer base that is very aware and knowledgeable about operational costs, including the cost to own and operate capital equipment. We are very aware of this and consideration of our customers’ costs to own and operate our equipment drives much of our decision-making about products, support infrastructure and applications development.

same time, ensure th”

R&D engineers who work independently and also partner with universities and research” institutions.

Q. ASYMTEK was acquired as a subsidiary of Nordson Corporation, who had been a customer of ASYMTEK for nine years, in 1996. How does ASYMTEK t into the Nordson structure and what is your role with the company?

A. We are approaching 20 years since combining ASYMTEK with Nordson and, I believe, it has been a very good experience. We were able to leverage the Nordson resources, infrastructure and coating expertise to build ASYMTEK into a global leader for precision dispensing and coating for the electronics industry. We are now part of Nordson’s Advanced Technology segment and partner with our sister companies – DAGE, MARCH and YESTECH. For me personally, it has been an exciting part of my career with Nordson. I spent the early part of my 35 years with the company in Nordson’s Adhesives segment and then came over to assume responsibility for the MARCH business after Nordson’s acquisition of that company in 1999. In 2011 I moved to ASYMTEK.

We leverage aspects of the companies in the Advanced Technology segment but maintain our individual market identities. This is important because our customers expect application expertise which is best delivered

We leverage aspects ‘‘

‘‘

internal staff of

We have an

at focus is maintained.

f the companies in the

Of course, as a foundation to being able tohaveengineersbecreativeinaddressing new and challenging applications, we need to create tools for them to deploy. For this we maintain an on-going investment in fundamental research in all types of

o

Advanced Technology segment but maintain

our individ” identities.

ual market

Page 20 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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Bond Wires

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Features:

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‘QuickView’ CT acquisition

Nordson DAGE’s CT option uses the superior, sub-micron feature recognition 2D X-ray images, that its X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. The unique Nordson DAGE X-Plane® option enables inspection of any plane in a sample without the need for cutting.

Latest News – MatriX Technologies now part of the Nordson Test and Inspection Group

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feature continued...

TECHNOLOGY TODAY INTERVIEW

In products, our number one priority is reliability. Downtime is a killer in CoO. We have invested deep in our Test and Reliability group to make sure that products are thoroughly tested, and data supported, before we release them to the market. Our standards for release are far higher than those published by the trade organizations, and typically, they also well-exceed our customers’ speci cations.

In addition, we are proud of our Continuous Improvement activities where we have an Engineering group who focus on warranty data and equipment performance reports coming from the eld. This robust system of quality and performance focus makes me very con dent that we o er the most reliable equipment in our eld.

‘‘Adding ASYMTEK’s global reach to the DIMA products is already delivering results, with very

A. We believe that our customers want complete systems solutions to their dispense and coating applications. This is where our value and expertise resides. Dispensing uids in high volume, high value environments requires more than just hardware. When we speak of a systems approach we talk about feature integration, closed loop and an optimized balance of hardware and software. For example, our vision systems and volumetric controls completely integrate with our dispense platforms – meaning that, very simply put, you can always be assured that you get the right amount of material in the right place, every time. Going back to the discussion on CoO, we look at our systems approach from the customer’s production perspective, quick change-over, easy maintenance, etc.

Q. Nordson ASYMTEK manufactures conformal coating systems. How have these changed and what are the demands?

A. Going back to the early days, ASYMTEK has been the leading provider of conformal coating systems – a fact that we are very proud of. We have pioneered many new advances in conformal coating delivering better performance at each iteration. Our work in the very demanding automotive electronics world and our close relationships with the coating uids suppliers have enabled us to really build up the premier expertise in the eld. We introduced the selective coating processes, precision coating technology, tight pattern controls and the many dispense monitoring systems that enable conformal coating systems to respond to the demanding requirements. The evolution is continuing and we are evolving our next generation of capabilities to be released in the near future.

ASYMTEK have in Europe and what are your plans in Europe for 2016?

A. ASYMTEK has been present in the European market for a long time. We support the market through a combination of strong distributors supported by a direct organization. We have our main o ce in the Netherlands. We used to be located in Maastricht, but have recently moved to Deurne (close to Eindhoven) in the former DIMA facility. Being in the new facility is a real bene t as we can expand our testing and applications development activities and have the full complement of equipment in our labs supported by our expert technical team. We are also pleased that several of our Distribution partners have set up lab and demo capabilities within close proximity to our customer base.

We look forward to participating at Productronica again and will be introducing several new products that will immediately appeal to our customers.

Nordson ASYMTEK Background

Design and manufacture a full line of equipment for semiconductor package assembly, printed circuit board assembly, LED assembly, FPD assembly, life science product assembly and other precision manufacturing. We support our products with a global service network.

Our mission is to consistently provide innovative, quality solutions that exceed our customers’ needs and expectations in dispensing technologies.

With over 30 years of experience, Nordson ASYMTEK is committed to providing innovative dispensing solutions and the best support to customers worldwide.

Peter Bierhuis’ Biography

Peter Bierhuis has been President of Nordson ASYMTEK, a leader in dispensing, jetting and conformal coating equipment and technologies, since 2011, directing the company through several years of record- breaking business and global expansion. Prior to that, Bierhuis served as President of Nordson MARCH from 1999-2011, where he expanded that business to become the industry leader in plasma processing technology and systems. Bierhuis joined Nordson in 1980 and held several important sales and marketing leadership roles within Nordson’s Adhesive Dispensing Systems segment. He holds an M.B.A. from the University of Georgia and a B.B.A. from Nijenrode in the Netherlands.

positive respon”

se from our customers.

When our customers need our help we understand that they cannot wait. Our global capabilities with both direct and distributor- based service support is unparalleled. We have representation around the world with expert service and parts in close proximity to the vast majority of our customer base.

Production yield and quality are, of course, key expectations from our customers. We respond to this by making our applications expertise available pre- and post sales and by innovating with product features that allow for maximum equipment utilization. We have applications engineers around the world and back them up with high level experts from our centers of excellence. The AE’s often spend extensive time with customers or at their locations to optimize equipment parameters to get the most out of the machines. An interesting example of a recent product innovation that looks at machine utilization is the new NexJetTM product with modular cartridge. This new cartridge minimizes the time to service the dispense valve through quick disconnect and easy cleaning. What traditionally would take up to 20 minutes is now completed within a couple of minutes.

‘‘

our Continuous

Q. There seem to be a lot of uid dispensers and jets on the market. How do you di erentiate yourself?

g from the field.

we are proud of

Improvement activities where we have an Engineering group who focus on warranty data and equipment performance reports

comin”

Q. Nordson ASYMTEK will be exhibiting at productronica. What presence does

Page 22 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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EVOLUTION OF THE PERFORMANCE AND RELIABILITY REQUIREMENTS OF SOLDERING FLUXES by KARL SEELIG AND TIMOTHY O’NEILL, AIM SOLDER

Soldering ux chemistries have been in a constant state of evolution since the beginning of electronics assembly. For example, early uxes were high solid rosin based materials that were cleaned in CFC solvents. The elimination of these solvents drove the development of water washable uxes and ultimately no clean uxes.

trait; therefore, applicable quality standards mandated the removal of residue. This task was easily and e ectively accomplished with chloro uorocarbons (CFC) which were widely used and readily available in the 1970s and 1980s.

The elimination of CFCs as mandated by the Montreal Protocol made the task of residueremovalmoredi cultanddrove ux manufacturers to develop innovative solutions. Alongside this regulatory driven change was the evolution of surface mount technology and the need for an entirely new branch of products, solder pastes. This was a period of upheaval to the traditional way PCBs were assembled and it was happening while applications for electronics were exploding. Electronics were no longer the dominion of the military as consumer and automotive electronics applications were being rapidly developed; a phenomenon that continues to this day.

On June 26th 1995, Mil-SPEC 14256 and QQS-571 were supplanted by ANSI/IPC J-Standards 004, 005 and 006. These new speci cations gave both ux developers and PCB assemblers two entirely new classes of ux materials for PCB manufacturing, ‘water soluble’ and ‘no clean’. These terms are quick references to the classes of uxes as de ned by the J-Std-004. As depicted in Table 1 below, this standard established four categories for ux, RO (ROsin), RE (REsin), OR (ORganic), IN (INorganic). Subsets of these classes de ne the activity level (L, M, and H) and the presence of halides (0 or 1).

The electronics assembly market was conditioned to removing ux residues with CFCs and the loss of these materials forced suppliers to provide their customers with an alternative. The response was the development of ux that could be removed by water alone, hence water soluble solder paste, wire solder and liquid ux. These products provided assemblers with a material that could perform similarly to rosin bearing ux while having less environmental impact. However, these materials were not equal to rosin in several key ways: 1) the residues are highly ionic and mandate complete removal, and 2) the washing process is resource intensive.

The water soluble process was quickly adopted by the emerging PCB contract manufacturing industry as it produced a product that was similar to what the end user was accustomed to; clean electronic assemblies. There was another bene t to the water soluble process,

As miniaturization and proliferation of electronics accelerates, the assembly processes and material requirements are evolving rapidly. These changes are driving ux chemistry manufacturers to develop uxes for the new processes, new materials and new equipment to meet the performance, design and reliability challenges for news and, as yet, unimagined electronics applications. Some examples of this are selective soldering uxes, PoP uxes and ‘jettable’ solder pastes.

Miniaturization and ruggedization are becoming more of a concern as electronics nd their way into virtually every aspect of our lives. Fluxes need to be more process capable than ever, yet be even more reliable under harsher conditions. Additionally, the speci cations may have to be amended to accommodate the competing attributes of residue reliability characteristics versus process capability.

This paper will outline the evolution of ux chemistry and detail the challenges in developing ux chemistries to address current and future application requirements.

Key words: Soldering ux, rosin based ux, no clean ux, REACH, RoHS, WEEE

INTRODUCTION

PoP, QFN, LGA, HiP, CSP, SPI – These acronyms and abbreviations did not exist until the new millennia. These esoteric terms are the lexicon of the constantly evolving PCB assembly and materials. Evolving alongside these technologies are the uxes that literally join all these pieces together. In this paper we will attempt to chart the evolution of ux chemistry as a way to understand how technology and market demands drive innovation and how to plan for future requirements.

BACKGROUND

Modern electronics were born in 1943 by Paul Eisler while working on the Technograph, a typewriter that was used for transcribing music. Eisler’s device soldered tubes and coils to etched metal foil onto a wooden substrate. The military quickly recognized the bene ts of this technology for avionics as it reduced weight and complexity for aircraft

instrumentation and controls. As a result, qualityspeci cationsforPCBassemblywere written for military avionics requirements were adapted to commercial applications. The two speci cations that de ned uxes and solder for electronics soldering were MIL-SPEC 14256 and QQS-571.

These speci cations refer to rosin based uxes of which there were three types, rosin (R), rosin mildly activated (RMA) and rosin activated (RA). They were either liquid or found in cored wire

Figure 1: First radio with a printed circuit board – picture courtesy of Science Museum/Science and Society Picture Library

solder as surface mount technology had yet to be invented! The common ingredient to all three types of rosin ux is white water gum rosin (WWG). WWG is naturally occurring re ned rosin usually extracted from conifers in the form of turpentine. ‘White Water’ refers to the clarity of the rosin and is the most valuable of the rosin products for its purity/clarity. Chemically, rosin consists of various resin acids, especially abietic acid.

Halide uxing additives were also incorporated in all but the rosin (R) type.

When rosin ux is used in electronics soldering, the resulting residue after soldering is tacky and amber colored. This is not a desirable

Figure 2: RMA wire solder ux core crystal

Continued...

Page 24 The Choice of Publication for the Electronics Industry

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as ux residue required complete removal; the ux developer could incorporate highly active uxing agents in the form of halides. Halides provide dramatic bene ts as uxing agents, but if not removed, can quickly cause catastrophic failures. For the contract manufacturer forced to use parts that are old, customer supplied and/or of suspect quality, these high activity uxes compensated for many of these issues through brute force. Water soluble uxes are still the mainstay of the contract assemblers soldering processes, but changes in component designs and materials are forcing them to adapt a di erent ux technology - no clean.

‘No Clean’ uxes leave residues after soldering that are engineered to be left in situ without causing electrical current leakage or corrosion.

Figure 3: Flux induced corrosion products

In the simplest terms, any ux that has the L0 or L1 classi cation per J-STD-004A/B can be called ‘no clean’. Passing J-STD-004A/B tests indicates the ux residue will pass surface insulation resistance (SIR) and corrosion testing with the residue in place, uncleaned. The J-STD-004A/B subjects specially designed and prepared test coupons to conditions that aggressively promote conductivity and corrosion. Itshouldbenoted,some uxes with ‘M’ classi cations may also pass this test and can be used as a no clean if used properly. In the case of solder paste and wire solder, no clean uxes are an evolution of the RMA chemistries with modi ed rosins and synthetic resins replacing pure WW rosin. Flux developers needed to be creative in their pursuit of materials for this new class of products. In comparison to other industries that rely on the chemical manufacturing industry for raw materials, ux manufacturing is comparatively small. Therefore, when sourcing chemicals to meet application requirements, the ux developer will often rely on using materials found in other industries including printing inks, cosmetics, food, paint and adhesives. Experimenting with new materials gives the ux

developer tools to address the inherent issue of leaving ux residue on the assembly.

First generation no clean products introduced the industry to the concept of leaving ux

Figure 4: Liquid ux bending

Figure 5. Paste medium blending

residue on the assembly. No clean uxes have a single signi cant cost advantage with the elimination of the wash step. PCB cleaning adds considerable expense to an assembly in an industry where pro t margins are often measured in single digits. With cost savings too large to ignore, more and more assemblers adopted a no clean process. OEM manufacturers were the early adopters as they were often more vertically integrated, having in-house engineering capability to assess the impactofthe uxresiduebothonreliabilityand downstream processes. Early no clean liquid uxes were developed using isopropyl alcohol and simple organic acids such as succinic and adipic acid. These simple uxes could solder e ectively and, due to their low solid content, leave very little ux residue in comparison to a high solid content rosin ux. Any residue that remained was decomposed at soldering temperatures and rendered inert. However after widespread implementation, some limitations were revealed. These limitations are exempli ed by the impact of ux residue on pin testing/ICT. When an assembly is cleaned, there is no residue; therefore ICT is not a consideration for a ux manufacturer. However, with ux residue present, it becomes a major consideration as the ux residue can

interfere with the ICT probes ability to make contact with the PCB test points.

Flux developers had to improve performance, reduce erroneous test results, false opens and test xture maintenance. Therefore the nature of the ux residue had to be manipulated. Solvent systems were changed, rheological modi ers added, waxes, petroleum gels and

Figure 6: Paste residue pin-test evaluation

esters were incorporated. Complicating development were the tangential implications of modifying the residue on SIR values and other physical characteristics. In the case of solder paste, early formulas may have had six or seven constituents, where newer formulas were doubling the number of ingredients to twelve or fourteen. These same types of advancements were occurring in liquid ux chemistries by introducing a greater variety of organic acids to reduce solder webbing or polymers to improve solder peel back. In short, all ux developers were trying to achieve the ultimate no clean ux. A ‘no residue’ product that could be incorporated into existing processes and equipment while providing the same reliability and soldering results as achieved with traditional rosin based uxes.

Eleven years following the ban on CFCs, another regulatory decree caused the biggest upheaval in the electronics manufacturing to date; RoHS/WEEE and the banning of lead (Pb) in electronic solders. Where the elimination of CFCs precipitated major changes in the methods used for PCB assembly, RoHS/ WEEE was forcing a change of materials and ultimately the entire PCB assembly process. This change was fraught with uncertainty as it was disrupting over 50 years of historical data and con dence gained with lead-bearing solders. Additionally, this change did not have any positive economic implications for the

Table 1: Test requirements for ux activity classi cation - courtesy IPC

Page 26 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

assembler. It simply increased costs and often required signi cant capital investment.

The fundamental consideration for the ux manufacturers was the new ‘SAC’ alloys that were displacing tin/lead. Tin/silver/copper (SAC) alloys have a 35°C (94°F) increased melting temperature versus their lead bearing predecessors and signi cantly diminished spread and ow characteristics. Also, Tin (Sn) largely replaced lead (Pb) in the SAC alloy system and tin is a much more reactive element than lead, complicating the interaction between the ux chemistry and metals. New uxes would have to perform functions seemingly at odds with one another. Greater ux activity was needed to overcome reduced spread and ow and generally poorer wetting. Often halide percentages were increased to improve wetting and are less a ected by the elevated temperatures required to process the SAC alloys. Solvent systems were again re- developed to improve printing performance of pastes, but this a ected the solubility of the activators in the ux. Liquid uxes doubled the acid content and incorporated higher boiling point solvents with the resulting chemical interactions increasing exponentially. High activity solder paste enhanced soldering performance, but the print performance and shelf life would be halved to where a product wasn’t marketable. Solder paste formulas bloated to over twenty components to address these developments. If one thread was pulled, it was found to be attached the rest of the product and processes, having implications throughout.

During this convulsion, there were other

regulatory and reliability testing restrictions that shrunk the list of available materials while pushing demands for higher reliability. REACH was adopted in 2007 and has an incremental phase-in. REACH, by design, restricts the chemicals that are available to the ux developer. For example, halogens are a key component of many of the materials used in PCB assembly due to their re retardant properties. In the case of ux, ionic halogens (halides) are a bene cial to soldering performance. Unfortunately, they are being swept up in the regulations despite the fact they represent a very small percentage of the mass of a PCB assembly. This forced the ux developer to use alternatives that do not have the same performance characteristics.

Concurrent to this development, the IPC and other user groups are demanding ux developers to produce no clean products that have more robust electrical reliability properties.

In 2008, J-STD-004A was updated to J-STD- 004B, representing several signi cant changes, summarized in Table 2.

The goal of these changes was to tighten loopholes in the speci cations that were allowing ux developers to incorporate quantities or classes of materials that enhanced soldering performance, but may have an adverse impact on reliability. Flux developers were essentially ‘teaching to the test’. They knew the test methods and requirements well enough to where they could manipulate a formula to pass a desired test by designing the chemistry to blind the test to formulas actual contents. This gave companies a competitive advantage but could adversely impact the reliability of the nal product.

The presence and characteristics of no clean ux residue is becoming more critical, as component spacing continues to shrink, signals are getting faster and overall package density is increasing. One of the main reasons for the transition to no clean soldering processes are the leadless, bottom terminated devices such as QFN, LGA and DFN (collectively referred to as BTC). These components are mounted so closely to the substrate that reliable cleaning is too resource intensive or simply impossible to accomplish repeatedly. This development is forcing all segments of the PCB assembly market to reconsider removal of ux residues. These material changes are driving ux developers to improve the SIR values and purity of residue and reduce volume and moisture absorption characteristics.

Inadditiontoregulatorychanges,newmaterials, equipment and manufacturing techniques also drive ux development. Selective soldering has replaced wave soldering in many operations. The machines are smaller, more exible and less expensive to operate. However, the uxes used in traditional wave machines may not be suitable for selective soldering. Selective soldering machines run the pot at higher temperatures, the ux residue is not burned and scoured o the substrate in the same way as with a full wave. The application of heat is localized and may not decompose the ux su ciently to render it inert. As a result, new uxes have been developed to address these considerations. The industry has adapted package-on-package (PoP) processes that required an entirely new family of uxes for the dipping operation and jetting solder paste is beginning to appear in the market in more applications.

Figure 8: BTC type components

Table 2: IPC J-STD-004B Speci cation Summary

These new applications represent hundreds of man hours in research and development for uxes that have unique properties to meet these new challenges. Looking further to the future; alternative alloys are becoming more prevalent and these materials have requirements di erent than Sn/Pb or SAC alloys. These alloys will require new chemistries that will make them useful, marketable and reliable. Sub-miniature devices such as 01005 are forcing the use of nersolderpowderswhichrequire uxesthat not only print ultra- ne deposits, but address new challenges such as ‘graping’ defects.

Figure 7. Shrinkage on solidi cation sometimes results in “hot tears” in SAC

CONCLUSION

In summary, the rapid evolution of the industry is driving innovation like never before. Three simple types of ux have ballooned into hundreds of uxes for applications and processes that would have seemed inconceivable just twenty years ago. Flux developers are forced to create more aggressive materials, with a wider process window and better reliability; and to do it with fewer, less e ective materials.

This article was originally published in The Proceedings of the SMTA International Conference, September 2015.

Figure 9. PoP assembly process – picture courtesy of Practical Components

PCB MAKERS STRUGGLE WITH CONFLICTING ENVIRONMENTAL AND SAFETY REGULATIONS By Mike Jones, Vice President, MicroCare Corporation

It looks like the second half of 2015 and into 2016 will be very positive for the electronics industry with estimated global growth rates set to increase. The economies of the US and most of Europe seem to be bouncing back from the most extreme economic downturn since 1929 with Americas seeing a 6% growth and Europe 4% in the electronics industry from the previous year. This growth is also seen in Asia with an estimated 6% growth and Australia, New Zealand and South Africa seeing a 4% increase (Statista).

Despite tempered expectations, most forecasters see strong growth ahead, accelerating in 2016 for overall global growth. Most forecasters expect a robust US economy to continue to lead the way, and the Eurozone’s new program of quantitative easing is a sign the region is ready for expansion. China has experienced broad improvements in macroeconomic conditions, with its economy seeing a 7% growth this year and 6.3 % in 2016 (reports global management consulting McKinsey & Company).

Japan is still the powerhouse exporter for electronics and has the third biggest economy in the world. Since Japanese Prime Minister Shinzo Abe came to power in 2012 and made a number of substantive changes to economic policies in the country, including softening the value of the yen, so Japanese exporters can be signi cantly more competitive globally. This policy has resulted in a noticeable upturn in economic activity in Japan.

All in all, 2015 looks to be a very good year for the electronics industry. Nonetheless, many companies in the electronics industry are less than optimistic. One of the primary reasons is the global instability in environmental regulations. Taking a global perspective, the electronics industry is seeing at least six di erent regulatory con icts that will cause consternation among PCB makers. These new rules are raising costs and imposing hidden taxes upon businesses, creating trade barriers, increasing commercial risks, sti ing innovation and creating an aura of uncertainty that crushes investment.

The phase-out of the last major ozone- depleting solvent, HCFC-225, has nally begun. This is going to be good for the planet but tough for companies with complex cleaning requirements.

Speaking globally, this policy was both prudent and practical: HCFC-225 has an ozone-depleting impact only 1/25th of the benchmark uid, CFC-113. Operationally, HCFC-225 is also a very good cleaner: it is non ammable, fast-drying, VOC- exempt, and has a relatively low global warming potential. For these reasons many companies migrated to it from older cleaners, which helped minimize the damage to the ozone layer. Now, as HCFC-225 is itself phased-out, most companies will nd that the fastest and easiest transition will be to move to another non ammable, solvent- based product usually to HFC, HFE and HFO solvent technologies.

This pragmatic approach to protecting the environment is the proper path for future e orts, according to Tom Tattersall, Chief Operating O cer at MicroCare Corp. “The teamwork and collaboration behind the Montreal Protocol is the optimal role-model for government-industry co-ordination,” he said.

While it has been a long-time coming, this phase-out is important. One expert estimates that the reduction in ozone damage and reduced global warming impact may be “the equivalent of removing the climate emissions from 70 million U.S. passenger cars for the next 30 years.” The main question is what cleaning process should companies switch to?

Propellant Phase-Out in Japan

Another source of concern in Japan, Australia and Europe are uncoordinated e orts to stem global warming. For example, surveys in Japan indicate this is a major issue of concern for more than 65% of the Japanese population. Should the scientists’ predictions be correct, Japan will experience heavier rains, more powerful hurricanes, declining rice yields and more frequent heat waves. Low-lying Nagoya, Japan is likely to be submerged and 2,000 square kilometers in other major coastal cities in Japan are at risk.

As one of the rst steps, Japan is making an e ort to phase-out a popular industrial

Figure 1: PCB in Vapor Degreaser

HCFC-225 Phase-Out

The leading contender for industrial aerosol propellants, such as those used in aerosols for cleaning circuit boards, appears to be a new synthetic molecule made by Honeywell. Their commercialization of HFO-1234z has the potential to replace HFC-134a in many applications. It o ers similar pressures, excellent toxicity scores and non ammable performance. Although the costs are somewhat higher today, Honeywell expects prices to drop as production e ciencies increase. Overall, the HFO innovation may become the long-term winner for critical cleaning products.

Carbon Taxes

Many countries are looking at economic incentives, like carbon taxes, to encourage the move to “green” technologies. Most recently France (2014) UK (2013) and Mexico and Japan (2012) have adopted this change, with South Africa looking to impose the tax in 2016 (worldbank.org). Australia has imposed unilaterally a series of ‘carbon taxes’ on many industrial products, including HFC-based solvents and aerosols. The laudable goal is to

HCFC-225 is only made in Japan but is sold around the world. Under the terms of the Montreal Protocol, HCFC-225 is the last of the precision cleaning solvents to be phased- out because it has the least impact on the ozone layer.

propellant called HFC-134a. This liquid is widely used as a duster and a propellant for industrial aerosols because of its low toxicity and non ammable properties. For years, HFC-134a was the optimum replacement for ozone-depleting CFC and HCFC propellants. However, while using HFC-134a is better than using the old-style uids, it still contributes to global warming and, to a nation like Japan, that’s unacceptable.

The aerosol regulatory agency in Japan has been taking the lead in this project and this body insists that HFCs have reached the end of their useful life because good alternatives are available. The agency, which regulates the importation of aerosols into Japan and tests them for safety, has prudently concluded that it will no longer accept products propelled by HFC-134a. As new products are introduced by the industry, they will be required to use the newer ingredients that do not contribute to global warming.

Continued...

Page 28 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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minimize emissions into the atmosphere. But, as so often happens, there are unexpected repercussions from this policy.

The situation is a classic case of “unintended consequences.” Until 2012, companies had signi cant success marketing HFC solvents in Australia. However, the heavy-handed carbon tax has rendered most of these low-energy alternatives una ordable. With the carbon tax, a product that was priced at A$8,000 now costs end-users almost A$12,000.

Unhappily, this policy will not protect the environment. One of the main contributors to global warming is the burning of coal to produce electricity. Aqueous cleaning systems for PCBs — the only meaningful alternative to solvent cleaning — use vast quantities of electricity to heat, pump, dry and purify the water in the cleaning system. The coal burned to create this electricity is far more harmful in terms of global warming than the solvent alternatives.

Some alternatives are available. For example, MicroCare Corp. has commercialized low- GWP aerosols used for benchtop cleaning of PCBs; these can be used in Europe, Japan and Australia. Companies can also take advantage of modern, safe and a ordable cleaning uids while also protecting the environment. These alternatives, however, cannot replace the full spectrum of cleaning choices currently rendered una ordable in Australia.

Energy Costs

Since the Fukushima Daiichi nuclear accident in northeast Japan, energy supplies and costs in Japan have been challenged. Japan had 50 nuclear power plants providing about 30% of all the electrical generating capacity, every one of which has been shut down since the earthquake. Immediately after Fukushima, Germany also began shuttering nuclear power plants and is attempting to switch to renewables, raising energy costs in Germany to punishing levels. The net result has been an instant increase in carbon emissions from these countries due to the burning of oil and gas to generate electricity. This makes aqueous cleaning of PCBs a dubious choice in those countries. Water cleaning is not, on the face of it, a bad idea. Even today for non-critical applications it can work quite nicely. Intuitively, water also seems like it would be an environmentally-friendly option. However, there are a number of reasons why the advantages do not always materialize as expected.

The unspoken secret lurking behind aqueous cleaning is the enormous energy costs. With energy costs in Japan, Germany and other parts of Asia sometimes ten times higher than in the US, the costs of “green” aqueous cleaning make it a dubious choice. In addition, one of the greatest contributors to global warming is the burning of fossil fuels to generate electricity; so aqueous cleaning is taking a double-hit. The manner in which industry will resolve this issue is still unclear.

Figure 2: Aerosol Cleaner

REACH, GHS and Local Implementations Another public policy trend that attempts to make people safer, but may have the reverse e ect, are evolving regulations concerning the ‘Global Harmonized Shipping’ procedures. In theory, if there was just one set of hazardous product labels and shipping regulations around the world, it should eliminate confusion and make shipping processes easier and safer. Unhappily, most countries are developing local implementations of the GHS system that do not exactly match the international template.

For example, a simple aerosol product sold in the USA would require a completely separate safety label in Europe, and still a di erent one in China, because the GHS implementations in those regions are all non-standard. In addition, some of the safety warnings on the cans actually contradict each other, because local safety de nitions are non-standard. Even with a single country, regulatory problems arise: products sold in New York might not be legal in California due to the air quality rules in that state.

The REACH regulations in Europe are particularly perplexing. This sweeping set of rules is attempting to de ne a new paradigm: a chemical must be proven to be safe before it can be imported into Europe. The burden of proof lies on the importer; the judge- and-jury are the REACH regulators. They can demand almost any level of testing to make sure a chemical is safe. However, the costs and delays caused by the lab testing for new products can be so expensive and open-ended that new chemical products simply will not be introduced into Europe. The result of this may be the demise of many environmentally-progressive chemical innovations that will ultimately force companies to move their production o -shore.

It’s hard to say if all of these e orts are a sincere e ort to protect local workers, or just a trade barrier in disguise but, if it looks like a duck and quacks like a duck, it probably is a duck.

The Battle Over ‘Trans’

As a general policy, cleaning with solvents is a remarkable process. Modern solvents have excellent cleaning performance, broad materials compatibility and superior toxicity pro les. In most parts of the world, companies nd the fastest and easiest cleaning answers will to a non ammable, solvent-based product. Even so, this may not be easy.

“Companies that could go no-clean went no-clean long ago,” Robert Lee, of The Chemours Company notes. “Companies that could use water are there already. There are complex reasons why companies have stuck with non ammable solvents and nding drop- in substitutes will not be a walk in the park.” However, Japan and some other countries have a long-standing ban on the use of a particular chemical additive, trans- dichloroethylene (often simply called “trans”) which is used to kick up the cleaning horsepower of the mild non ammable solvents. The problem apparently is a concern over the toxicity of one of the “trans” isomers, or atomic arrangements, which was problematic years ago when “trans” was a new formulation. Today, the troubling isomer is eliminated during the manufacturing process, leaving a very strong and safe solvent ingredient.

“Trans” is widely used in non ammable solvents because of its excellent cleaning capabilities. These include Novec® HFE cleaners, ChemoursTM HFC-based cleaners and an HFO also o ered by Chemours. The HFO option is the newest choice on the market and represents a very attractive option because it has the lowest global warming impact of any choice on the market. The Chemours HFO o ering, which is actually made in Japan, looks to be the optimal drop-in replacement for HCFC-225 products, requiring only modest changes to temperature settings and cycle times in a cleaning system but it will not be commercially available in Japan because it requires “trans.” In short, the reckless ban on “trans”-based solvents and the high costs of water cleaning may mean that there are no a ordable and safe cleaning alternatives open to many companies in the electronics industry. The result may be a migration of electronics production and the subsequent cleaning to areas with less-restrictive policies.

Summary

The precision cleaning industry today is a source of rapid and sophisticated innovation, helping to make printed circuit boards more powerful and reliable. Regulators should be careful that they do not accidentally regulate away safe and cost-e ective cleaning choices that are essential to making high quality PCBs in today’s world.

Page 30 The Choice of Publication for the Electronics Industry

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DEN-ON’s 50+ Years of Industry Experience Proves that Quality and Service Are Key to Success

By Raymond LaFleur, General Manager Overseas Sales and Marketing, den-on instruments

Established in 1963, DEN-ON INSTRUMENTS CO. LTD. researches, develops, designs and manufactures tools for the electronics industry. The company o ers a complete range of rework equipment as well as soldering/desoldering tools and preheaters. DEN-ON INSTRUMENTS has a liations with the Japan Printed Circuit Association (JPCA) and the IPC — Association Connecting Electronics Industries in the United States.

SD-3000II: This rework system is designed to remove most SMT components, including QFPs, SOPs, PLCCs SOJs, PGAs, BGAs, connectors and more. It features simple, precise operation, and does not require any special nozzles or additional accessories.

Soldering Tools

SS-8300: This soldering tool ensures that your measures for lead-free soldering will be perfect. Because it uses an internal heater only the tips need to be changed. Additionally, the temperature data underneath shows heating comparable to tip-heater cartridge designs. SS-8300 also features a Super Tip that was developed for long life, low-cost, lead-free soldering.

SS-8200: This soldering iron with power cord JIS is an ultra-compact, e cient digital soldering iron station designed to work under the highest loads with a user-friendly ergonomic design.

Desoldering Tools

SC-400A: An advanced technology soldering/ desoldering tool, SC-400A o ers powerful suction and easy clean up, and is designed for SMT and through-hole desoldering of eutectic or lead-free soldering.

SC-7000Z: This desoldering tool features a built-in pump structure with a temperature control circuit. Recognized the world over as one of the best tools, SC-7000Z provides suction capacity and a powerful hot blow system. Additionally chip and SMD component removal is done with more ease and more e ciency.

Preheaters

PH-400: Designed for lead-free, this spot heater o ers additional power with a max intense of 360W IR heater to provide the heating necessary to successfully solder/ desolder small PCBs.

PH-3100A: A fast, e cient preheater, PH- 3100A uses two 200W IR heaters and closed-loop control to enable fast and safe manual soldering. The system is designed for multilayered PCBs under lead-free solder with large heat sinks.

DEN-ON’s mantra of staying progressive and innovative at all times and always providing e cient, cost-e ective solutions for its customers will allow it to see another 50+ successful years in the industry. The company knows that customers will always look for a practical solution to reduce their cost of manufacturing and DEN-ON plans to be around to provide it.

For more information, contact the company at 1-26-10 Sekimachi-Higashi Nerima-ku, Tokyo 177-0052 Japan; 81-3-3929-6000; Web site: www.denondic.co.jp/en/.

The company was rst founded under the name of DEN-ON Corporation in September 1963. It was established with the purpose of researching, developing and designing sound systems for studios and music halls. After that, it became involved in the broader area of sound and music control boards and other similar systems.

In 1982, a signi cant portion of the company became involved in the soldering and desoldering industry and the company then changed its name to DEN-ON INSTRUMENTS to more appropriately match the new direction of the company. It was at this point that DIC Trading was established as a separate company to handle all the sales, marketing and promotion activities of the company. Additionally, DEN-ON INSTRUMENTS SALES, LTD. was founded as the company’s main distribution source.

The company has been a part of the industry for more than 50 years and has withstood numerous changes in the world economy. President Ajizu Watanabe cites the company’s success, in part, to its desire to constantly provide the best solutions to its customers’ needs by providing them with high-quality products and sustained, solid support. He added that the company strives to stay many steps ahead of technology before it is introduced to the market. Staying exible and progressive is important to DEN-ON. Just as important, Watanabe added, is that DEN- ON also provides the “basics.” As simple as it sounds, some companies move forward and forget to deliver some fundamental services, such as the ability to provide not just equipment, but the best solutions to meet customers’ needs at a price that is within reason, with reliable support.

Watanabe continues to say that DEN-ON has been built on customer support and that without it, the company would be just another product being sold on the market with a short lifespan. His belief is that companies today cannot survive without recognizing that customer service is essential before and after the sale. All of DEN-ON’s products come with the understanding that service is just as important as the technology on which they are built. They feature support in the eld and have proven track records of providing solid performance.

DEN-ON INSTRUMENTS features a variety of advanced rework systems, soldering/ desoldering tools and preheaters designed to advance customers to the top of their industry:

Rework Systems

RD-500V & RD-500SV: These are all-in-one advanced technology SMT rework stations that are compatible for all kinds of rework for di erent types of SMT components. These systems can handle multifunctional pro les at will, feature contactless cleaning and control of the Z-axis. Additionally, they provide wide support of industrial large- and small-scale circuit boards, including 01005 components.

RD-500III & RD-500SIII: Designed for standard or lead-free soldering, large or small boards, large or small components, both the RD-500III and the RD-500SIII feature 700 W upper and lower hot air heaters. By delivering hot air simultaneously from above and below, these units are able to evenly heat the component and solder connections.

SD-3500: This hot air connector removal system uses hot air for safer rework of connectors, thereby solving the challenges of ow solder rework.

Page 32 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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new products

exciting new industry innovations

Keeping you informed of the latest developments in technology and innovation within our global electronics industry.

Corstat : DuraStat Tote with Custom Ribs for LED Boards

Corstat’s design team have recently created a Durastat tote with custom thermoformed ribs. The customer was looking for storage and handling solutions for their LEDs that would t into current storage facilities and be easy for their employees to load and unload. Corstat engineers developed this tote to sit vertically or horizontally for their customer, giving them options for storage and handling depending on the situation. The thermoformed ribbing holds each LED panel in place without touching any critical or fragile areas. This design is topped o with conductive thermoformed handles and a line-bent cover to make transportation throughout the facility simple and safe.

Package Features

• Custom ribs to hold LEDs in place

• Durable DuraStat Tote with rugged design

• Permanent ESD properties

• Designed to sit vertically or horizontally

• ESD safe handles with a line-bent cover

www.corstat.com/news/ribbed-dt-tote.html

Count On Tools Inc. Introduces the StripFeeder Transition Rail

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, has released a new accessory – the Transition Rail – for its award-winning line of StripFeeder products. Each StripFeeder Transition Rail features machined tracks for both paper and emboss tape on the same rail for a seamless transition.

The StripFeeder Transition Rail allows customers to take full advantage of the StripFeeder platform when running both paper and emboss tape, simultaneously, without the loss of a component lane. The rail will be sold individually or in StripFeeder .mod and Mini kits. StripFeeder Transition kits are set up to run three lanes of paper tape and three lanes of emboss tape in 0.25” (6mm), 0.50” (12mm), and 0.75” (19mm) pocket depths. Additional rails can be added to these kits to increase the amount of component lanes, up to 10 per tray for 8mm tape.

All StripFeeder .mod and Mini systems feature removable rails that can be mounted to accommodate a wide array of tape sizes in thesamefeeder.Unlike xedwidthfeeders, the StripFeeder Mini can be adjusted by removing the rails and re-positioning them on the base plate at the desired width (4mm pitched pattern). The rails align with precision pin locaters and lock down tightly with magnets to guarantee a stable, repeatable application. All StripFeeder rails also feature a mechanical lock-spring to hold the tape in place by the sprocket hole for part registration and repeatable pick-and-place applications. This means the user only has to teach the pick-up location one time and consistently reload the unit with the same parts over and over for longer runs.

www.cotinc.com

Data I/O Announces LumenXTM Programming Technology

A revolutionary programming platform delivering managed and secure programming with unrivaled performance at an extraordinary value.

Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced programming and IP management solutions for ash, ash-memory based intelligent devices and microcontrollers, recently announced the release of the LumenXTM programming platform. The LumenX programming platform is a breakthrough in programming technology optimized for the latest generation of eMMC devices and large le sizes. The LumenX programmer delivers the highest performance managed and secured programming for the lowest total cost per part. The LumenX programming platform is available in the award winning PSV7000 automated system and manual con gurations.

The LumenX programming platform delivers ultra-fast performance with programming speeds up to 80 MBytes/second and download speeds of 25 MBytes/second, up to 5x faster than today’s programming and duplicating technology. The LumenX programmer o ers industry leading management and security capabilities, while eliminating the security risks associated with the duplication process. The LumenX Data Management Software Suite ensures data integrity from job creation through production. A comprehensive suite of Traceability Software Applications along with ber laser marking and 3D co-planarity component inspection meets the demanding process requirements for automotive electronics applications.

www.dataio.com

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF- 3050 Dry- lm Negative Photoresist for use in micro electro mechanical systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3050 is available in other thickness formats from 5 to 50um, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3050 lm is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3050 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.

www.emsadhesives.com.

Continued...

Page 34 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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VJ TECHNOLOGIES OFFICES

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ISVI Corp. Releases All-New 29 Megapixel Compact Camera Link CCD Camera

ISVI Corp., a global leader in high-speed, high- resolution camera technology, has announced the o cial release of its all-new IC-M29S-CL, a monochrome 29 Megapixel CCD camera with a base con guration Camera Link interface achieving 4.45fps.

Designed on a smaller platform than the previous IC-M29 model, the new IC-M29S-CL follows in its predecessor’s footsteps by providing unrivaled image quality, backing up this claim by consistently garnering the top place in customer’s bench- test comparisons.

There are several major di erences to the previous model. Firstly the size and weight of the camera has been reduced to a slim 75 x 75 x 43.4mm at 460 grams without lens mount. The all-new housing design is extremely compact and robust and uses a newly developed sensor positioning design to provide consistently precise sensor alignment. The addition of an active cooling fan to help eliminate temperature oscillation found on passively cooled cameras is a big advantage to applications demanding reproducible measuring results. The addition of the LM-Mount to an already large lens mount o ering allows integrators to use high-quality Leica-M and Zeiss ZM lenses with this camera. Finally, both tap-balancing and at- eld correction algorithms have been tweaked to provide even more delity to the images.

www.isvi-corp.com

Discover the Adaptable, Flexible and Universal Vault Tooling Part Holder from Production Solutions

Production Solutions Inc., a provider of Adaptive Tooling Solutions, is pleased to introduce its adaptable, flexible and universal Vault Tooling Part Holder. Vault Tooling is available in a variety of standard sizes, pin lengths and densities as well as custom solutions that can be configured for most applications and machines.

The Vault is an adaptive tool that can be used in applications where the reduction of custom tooling, xtures, molds or jigs is desired. The Vault’s patented technology uses a high density array of pins that

automatically conform to the shape of any part. Once locked, it creates a “nest” to hold the part during the desired process. After completion the Vault is simply reset to prepare it for a new part.

The Vault can be used on bench-tops, robots or integrated into machines or work cells. This adaptive tooling eliminates the expense, time and inventory management of custom molds, jigs and xtures. Whether using the Vault as a manual operation or fully automatic, setup and changeover is completed in seconds, ensuring maximum equipment uptime as well as improved productivity and quality.

www.production-solutions.com

Seika Machinery Introduces the MALCOM VDM-2 Video Capture System

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the MALCOM VDM-2 Video Capture System. Used in conjunction with MALCOM Re ow Simulators, the VDM-2 camera system captures video of the simulated re ow process.

The VDM-2 includes a video mixer that overlays the temperature/time/pro le data over the video to make it easy to track important points during re ow. It receives real-time, temperature, wettability, pro le and other data from MALCOM Re ow Simulators compliant with the VDM-2. Data is overlaid onto the video feeds taken by the video camera(s) in real-time.

The built-in scale function measures the displayed object. Up to two CCD cameras can be connected, enabling the VDM-2 to display up to two video feeds at the same time. This makes it possible to observe samples from multiple angles.

www.seikausa.com.

Techcon Systems Develops First-to-Market Disposable Material Path Diaphragm Valve

Techcon Systems, a product group of OK International and a leading provider of uid dispensing systems and products, has developed a new disposable material path (DMP) diaphragm valve. The new TS5624DMP valve features a “ rst to market” disposable material path, enabling di cult uids and pre-mixed two-part epoxies to be dispensed without the need for frequent cleaning. The entire wetted area can simply be replaced in a matter of seconds, while the valve stays on the production line.

The wetted parts are manufactured from black Polyethylene to prevent moisture and UV light from coming into contact with the dispense uids. As a result, moisture sensitive uids such as Cyanoacrylate and UV cured adhesives can be dispensed reliably and accurately.

TS5624 dispenses low to medium viscosity uids over a wide range of shot and bead sizes, down to a fraction of a micro liter. An internal spring return makes the valves fully adaptable for use with Techcon Systems controllers. A short opening stroke provides an extremely fast and positive shut-o . The seal-less valve design o ers excellent moisture sensitive resistance and the incorporated diaphragm creates a barrier between the wetted parts and the air cylinder.

www.techconsystems.com

Page 36 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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XRHCount – The Revolution in

SMT Counting!

By Lennart Schulenburg, International Sales and Marketing Manager, VisiConsult GmbH

Today, mass-market electronics are manufactured almost exclusively on high-performance assembly machines. Time is literally money. Therefore, two aspects are of particular importance: maximum quantities and minimum changeover time. When it comes to the necessity of counting components before or after the assembly process most manufacturers are still using the old-fashioned approach of manual counting devices.

VisiConsult, as a specialist for X-ray systems and automation, developed the XRHCount in order to speed up this time consuming process.

In times of an increasing demand for faster customer turnaround times and higher exibility, almost every PCB manufacturer is trying to reduce the unproductive overhead to a minimum. While the accurate counting of thousands of tiny components with manual counting machines may seem trivial, the time it takes to perform these tasks without automation can be a bottleneck in the production chain. Even worse is the high amount of personnel bound just to perform these basic tasks.

The common work ow with a manual counting machine is that an employee takes a component reel and chucks it together with an empty reel into the machine. The next step is to thread the carrier strip carefully through the counting mechanic and to attach it onto the empty reel. As soon as this is complete the counting progress begins and the components are pulled through the counting mechanic from the old reel onto the empty reel. This takes more than two minutes and is obviously scaling linearly depending on the amount of components.

VisiConsult X-ray Systems & Solutions GmbH is a family owned company from northern Germany and a leading manufacturer of custom tailored X-ray test systems. Mainly based in the eld of Non-Destructive Testing (NDT) of all kind of materials, VisiConsult was approached by a well-known PCB manufacturer with an inquiry to develop a system that speeds up the cycle time and accuracy of component counting through the use of X-ray technology and a completely automated software suite. The outcome was the XRHCount, where XRH stands for X-ray Handling System.

The work ow of the system convinces with pure simplicity. One drawer, one button and a clear output. The operator inserts the reel inside the drawer, presses the green start button and a few seconds later the result is shown on the display. Just in case of an automatic warehouse update, which is possible through a software interface, the user can scan the abstract warehouse barcode. Most manufacturers need to

charge external customers and compensate external suppliers with in-house warehouses depending on the material consumption, which demands a counting before and after the assembly process. Even if that is not the case it is necessary to count at least after assembly in order to record correct stock numbers.

The uniqueness of the system lies in the world- rst automated component estimation (ACE) system that makes a prior type selection obsolete. This decreases the handling time and leads to robust counting results. The consequence is that even new types can be processed by the system if a similar type is already implemented in the type database. The system will detect the similarity and automatically use the best solution. In the case of a completely new type, a warning is shown and a trained supervisor can easily add this into the system database in less than 15 minutes. With every new type the system e ciency increases as the self-learning neural network grows. It is also worth noting that the counting time of the XRHCount does not scale with the number of components – 50,000 components just take slightly longer than 5,000. This is a huge advantage over manual counting.

The result is a cycle time of approx 15 seconds – compared to over 120 seconds with manual counting, increasing the overall e ciency by a factor of ten! In the development reference project, this led to a reduction from 8 to 2 personnel responsible for counting which provides an organization with the opportunity to optimize their resource. As a consequence of this impressive performance the Return of Invest (ROI) for this system will be around 12 months dependent upon salaries and workload.

Due to its simplicity the XRHCount needs almost no maintenance. The small footprint of just 1.25m x 0.85m makes the setup very easy – just plug in the electrical connection and the system is ready. Of course TÜV, CE and other German standards are ful lled, which guarantees a safe handling, no X-ray leakage and an ergonomic operator position.

Combined with an international service and sales network, every customer can count on reliable and fast support that guarantees a 24/7 system uptime.

As the next logical step, VisiConsult will develop a completely automated counting process where robots do the reel placement and the growing neural network of classi ed component types provides a solid decision base.

These are ambitious plans for the future – to see the present state, visit VisiConsult in productronica 2015, Munich, where you’ll nd a completely functional demo system on their booth A2 /138. The CEO, Hajo Schulenburg, and his team will welcome you and are looking forward to providing a demonstration and in-depth consultation regarding a possible use for your speci c work ow processes.

“We’ve received overwhelming feedback and an impressive amount of interest from companies even before the o cial product launch. It seems like everybody wants to reap the bene t of being an early adaptor in order to get ahead of the competition.” states Lennart Schulenburg, responsible for the international sales at VisiConsult GmbH.

Info about VisiConsult and further refererences:

VisiConsult GmbH is a family owned company located in Northern Germany and is a specialist for customized and standard X-ray NDT systems. All our products are developed and produced locally and delivered ready to use. This leads to cutting edge technology and a high exibility. Our goal is to solve our customers’ problems with tailored systems and guarantee a premium post-sales service. More than 25 years of expertise in Automatic Defect Recognition (ADR) and image enhancement for a broad variety of industries combined with experienced engineers result in solutions that set new industry standards.

www.visiconsult.com

Page 38 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

WWW.LECTRONICS.NET

Bringing your electronic product to life

Equipped with

Actualizing manufacturing’s vision of tomorrow

TECHNOLOGY TODAY INTERVIEW

AN INTERVIEW WITH CURT COUCH,

PRESIDENT OF COUNT ON TOOLS

by SMT Today Editor

Count On Tools has been a manufacturer of high-quality, low-cost nozzles and associated components for the SMT industry for more than 24 years. Proven manufacturing and engineering expertise, coupled with commitment to service excellence and investment in the latest production equipment, has ensured that innovation and competitiveness is applied to all of the company’s extensive product range.

We recently sat down with Count On Tools’ President Curt Couch to learn more about the company and its products and services.

Along those lines, we are currently working to develop a new product similar to our StripFeeder system that will allow us to convert customers’ loose, unpackaged components into a custom machined matrix tray. This service will have a 24-28 hour turnaround and will be the most cost e ective way to repackage loose components and get them back into the assembly process. The new QwikTray system is scheduled to launch later this year, so keep a lookout for more product information around that time.

Q. Most customers in this industry know Count On Tools for the nozzles and other SMT consumables, but you also o er precision contract machining services. Can you tell readers more about that part of your company?

A. We are more than just nozzles. At its core, Count On Tools is a precision component manufacturer. All of the nozzles and tooling we o er are manufactured in our Gainesville, GA facility. We operate advanced CNC Swiss- Type Automatic Lathes with multiple-axis and multiple turning capabilities, precision machining centers, lathes, mills, quality, nishing and secondary tools. Our expertise has allowed us to expand our capabilities to manufacturing other parts for our customers in this industry and many others as well. We o er a variety of job shop services for a wide selection of materials, from standard to exotic. Whether our customers need fast turnaround, single parts, small lots, large quantities or a long-term supply with on-time deliveries, we are able to supply them with the highest quality and service. Our focus is to pass these advantages and capabilities onto our customers and, in so doing, create long-term relationships, which we believe will enhance and add value to the end user’s products and services.

Q. Does Count On Tools have any plans for continued expansion or any new product updates during the remainder of 2015?

A. We recently acquired an additional 5,000 sq. ft. of production facility that will be used over the next few years to expand our manufacturing operations. We are always looking for ways to expand our operations so that we can continue to provide excellent service to our customers and to continue meeting demands both now and in the future. We see the potential for tremendous growth with our existing product lines and look forward to launching the new QwikTray system later this year.

Q. Curt, we understand that Count On Tools recently was awarded its second consecutive Service Excellence Award from Circuits Assembly magazine. Please explain to our readers what this means to your company and customers.

A. As with last years’ service excellence award I am always humbled by recognition of this caliber based solely on customer response. It is not by chance that our dedicated, caring and responsive team always places our customers’ needs rst. Serviceisnotaproductthatcanbecreated; rather it is a culture and attitude towards others. We treat customers as we would like to be treated ourselves. I believe this award is a true testament to the caliber and dedication that our team brings each and every day.

Q. We hear a lot of customers talking about Count On Tools’ Custom Nozzle Engineering division. Can you tell us a little bit more about that part of your company?

A. It all started with our nozzles. We have been at this for more than 24 years now and we have always strived to provide customers with solutions to any issue they have when it comes to placing components. Customers come to us with problems that they experience, such as having to hand place odd-form components. We see every opportunity as a challenge to prove that we are capable of producing solutions at every level of the SMT assembly process, especially nozzles and tooling. The technology that we developed over the years has allowed us to design and manufacture custom engineered tooling for any pick-and-place equipment and for any kind of component. The real key though is our team’s openness to be creative in all situations, drawing from past experiences as well as new technology and ideas.

Q. Count On Tools recently announced that it expanded its manufacturing operations for its Custom Nozzle

Engineering division. Can you explain this expansion and how it bene ts your customers?

A. Over the last several years, we have experienced tremendous growth in our Custom Nozzle Engineering division. Most of this growth was fueled by the success of our LED nozzle solutions for solid-state LED components from companies such as Cree and Lumileds. Our primary goal is to supply customers with fast turnarounds and signi cant cost savings on custom engineered toolingfortheirequipment.Theadditionofnew equipment and more trained sta will keep our delivery times to a minimum while maximizing our ability to stay competitive and innovative.

Q. Count On Tools recently launched the StripFeeder Mini system. How does this system di er from the original StripFeeder and what bene ts can customers expect from the more compact system?

A. After launching the StripFeeder platform, we received tremendous response from customers regarding the design and function of the device. From this feedback, we decided that it made sense to o er a smaller package system that would have the features of the larger system but would accommodate smaller strips of components (2-4”). The more compact design is ideally suited for smaller prototype and rework machines as well as most SMT pick-and-place equipment. It o ers increased lane capacity with the ability to run two StripFeeder Minis in the same space as one original StripFeeder system.

Q. So, by o ering these automation tooling products, Count On Tools is moving beyond just SMT Nozzles and Consumables. What other types of solutions can you o er companies in this industry?

A. As I mentioned before, our company has been successful in part because of our ability to take on new challenges from customers and nd solutions to common industry problems.

Page 40 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

Family Values

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AUTOMATIC PROFILING SYSTEMS

HOW IT HAS IMPROVED PRODUCTION

BY PATRICK McWIGGIN, TECHNICAL DIRECTOR, SOLDERSTAR

With electronic assembly continuously evolving, it is paramount that systems are put in place that can meet today’s requirements and expectations, whether that be ensuring quality or simply cost saving.

The response time of these probes is exceptional, allowing the detection of machine faults quickly and easily so they can be recti ed, saving both time and money.

One system that has improved production signi cantly is thermal pro ling. Traditionally a profiling instrument is used to establish the correct thermal pro ling for the soldering process. Thermocouples are attached to a PCB (Printed Circuit Board) and the component level temperatures are captured by the measurement datalogger.

Verification profiles are then captured on the SMT (Surface Mount Technology) line by periodically passing the test PCB and instrument through the process.

The Need for an Automatic System

Until recently, the preferred and only way to manage assembly was through manual pro ling. Recent innovations in the area of automatic pro ling technology has resulted in increased levels of process quality and less need for labour intensive manual profiling. The need for regular monitoring of temperature pro les has always been an important consideration and past methods included obtaining temperature pro le through attaching thermocouple sensors to the PCB and recording temperature pro les using a heat protected datalogger, which travels through the process behind a test PCB. Although this method appeared to work e ectively for initial machine set-up, it does not lend itself to ongoing process monitoring in high production rate environments, something becoming ever more important.

As this system could only be deployed periodically, manufacturers were faced with having to manually take a reading at di erent times in the process and hope that in-between this time the process continues to work e ectively. This, of course, was not a guaranteed process and was based on ‘hope’. Not only was the process unreliable but every time a reading was taken production had to be stopped to allow the test board and pro ler to pass through. If a problem did occur, it would only be discovered when the next reading took place and, if incorrect, it would involve loss of production time to rectify the situation.

Developing the APS

To combat this rather ine cient method, the SolderStar Automatic pro ling System (APS) was designed. SolderStar rst developed the APS-1000, which measured the stability of the process parameters within a re ow oven. Designed with a rigid thermocouple tube with

internal thermocouple sensors mounted at the desired position, it measured the zone temperature at product level. Although it was very robust and was a far cry from the manual method, it still had disadvantages. It was found that the response time was slow and there were conduction problems between zones. It was also extremely expensive to manufacture and caused problems to distribute overseas. The physical diameter of the probe was also undesirable on bigger machines and could potentially cause shadowing of the product as it passed through the process. This obviously was not ideal and although taking the right step forward a newer, more reliable system was required.

The New and E cient APS is Developed

SolderStar worked on improving this process and designed a pro ling system that did not have the aws of its predecessor and so the APS-2000 was developed. The new system was the rst product o ering to measure the stability of the process parameters within a re ow oven, combined with assembly position tracking to produce the most representative virtual pro le possible for every PCB passing through the machine, a breakthrough for the industry. The APS 2000 continuously tracks PCB movements through the machine and also monitors process uctuations at product level. These changes are then used by a mathematical model to calculate what the resulting PCB pro le would be which is known as the virtual pro le. Process parameters can then be calculated and tested within limits.

This system has been worked on, re-designed and improved over the years and is quickly catching the attention of manufacturers across the globe. Two years ago a round of development took place and a new design was produced which solved previous problems. The original APS product was based around the same instrumentation circuits used in their pro ling systems but, due to research and experience, it was understood that a new instrumentation circuit could be developed that was speci c to the needs of the systems. The new electronic measurement system deployed in the APS 2000 would reduce the number of thermocouple conductors required to make the measurements needed. This allowed for a much smaller probe diameter to be achieved. For example on a 16 zone machine a probe diameter of typically 6mm could be used.

This combination of benefits has given manufacturers peace of mind and helped to improve manufacture. It is because of this that most recently two leading European manufacturers have decided to invest in the APS 2000, after successful long term and comprehensive testing of the system.

The SolderStar APS is a full time system for pro ling each and every PCB soldered in a convection re ow oven. The system is tailored for, and tted, to a customer’s oven so their requirements are met precisely. The system works by continuously measuring product level zone temperatures and conveyor speed and comparing these measurements to a captured process reference which the system has previously learned.

The system continuously compares each new set of measurements with the reference and evaluates any di erences.

Should the di erence between the current process and the reference exceed user de ned limits, then further boards are prevented from entering the oven by way of the SMEMA (Surface Mount Equipment Manufacturer’s Association) interface.

Special temperature probes are mounted along the heated length on both sides of the machine to monitor actual product level temperatures in real time. In addition to this, the system keeps track of the current speed and position of each assembly in the process.

The temperature probes have been designed to be smaller and can be positioned closer to the PCB providing a much more accurate temperature measurement in the vicinity of the electronic assembly during soldering. The smaller size also reduces the danger of the probe shadowing the product.

Continued...

Faults the APS-2000 can detect:

Zone temperatures set incorrectly from a de ned reference

Speed set incorrectly from de ned reference Oven zone feedback thermocouple failures Fan failures

Conveyor speed failures

Incorrect oven recipe loaded by operator Overloading of oven throughput

Thermal pro le outside process limited

Page 42 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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WHY MEASURE INDEPENDENTLY OF THE OVEN?

The APS system measures the product level zone temperatures and conveyor speed independently of the oven. This is important for two reasons:-

Firstly the machine may malfunction for example a heater or fan may give trouble.

Secondly, an operator may load the wrong recipe for the board being produced.

WHY MEASURE TEMPERATURE AT PRODUCT LEVEL?

The oven itself monitors and maintains the temperature of each zone. This measurement is made near to the heaters and does not closely re ect the temperature seen at product level which is a function of the machine convection.

The APS system adds independent temperature sensors mounted at product level close to the conveyor rails. These sensors are designed to closely measure the heating levels impinging on passing circuit boards whilst at the same time minimizing shadowing caused by the sensor itself.

As a PCB enters the re ow oven, its progress is tracked through and temperatures recorded at product level sensor as the PCB goes through the zone.

When the PCB exits the oven, the profile is mathematically calculated using the live measurements and the PCB reference pro le, it is then evaluated PASS/FAIL and recorded, making the results easy to follow. For each PCB there is a record of the process speed, each zone temperature and the mathematical pro le, so again 100% traceability is available.

Traceability, barcoding and SMEMA integration

Where barcoding is available, the APS can also integrate with internal enterprise resource planning (ERP) systems to provide automatic storage of PCB data from the production lines. Because there is barcode integration it allows the pro les in the database to be tied

to a speci c PCB produced, ensuring 100% traceability. It also has SMEMA functionality which allows the APS to control the ow of product into the re ow oven, these two features make a very powerful system.

Additionally, there is the ability to automatically detect product changeover on the production line as the PCB moves along the in-feed conveyor to the oven, the PCB barcode can be scanned and fed to the APS system. The PCB assembly type can then be determined by the APS and a decision made if the process is correct for that assembly. If not, the PCB will be held on the in-feed conveyor and an engineer noti ed. Once the oven has been changed over to the correct settings for the new assembly being produced, the APS will wait until all parameters are stabilised before allowing the ow of product to continue.

When barcoding is employed, a virtual pro le and all oven conditions are recorded for every assembly which can be retrieved later to provide total traceability of each assembly produced.

When the APS 2000 is used it follows specific steps to calculate profiles in real-time.

STEP 1:

Capture the actual pro le from a PCB using a test PCB and manual pro ler

(This gives the software the thermal model of the oven and the components/PCB)

STEP 2:

The APS 2000 analyses and records the ‘good’ state of the re ow oven

STEP 3:

The system measures in real-time any uctuations in the process. The information from Steps 1 and 2 are then used to calculate the resulting pro le. Process parameters are also calculated and tested against de ned limits.

THE APS SYSTEM ADVANTAGES

Provides full time monitoring of re ow soldering process which does not rely on repeated pro ling

An easy to understand system concept. ‘PROCESS, TEACH then TEST’

Simple to install and operate

User Process limits allow the machine to be automatically stopped if the process drifts too far away from the reference

Automatic process tracking and traceability for all products produced.

Why Use the APS System?

A system like the SolderStar APS 2000 o ers everything an electronics manufacturer would require in pro ling. It can discover ‘problems’ as they happen which can be recti ed easily and e ciently reducing down-time and man hours and is a fail safe way to ensure the PCB assembly and manufacture is correct with guaranteed traceability.

The continuous nature of the APS means that the thermal process no longer runs blind. The pro le for every single PCB is measured and meets the requirements of that particular load. Being bespoke it can also work to meet strict requirements of the manufacturer lowering the cost of production by reducing production downtime due to rework and labour.

SolderStar APS has been designed to include a sophisticated computer algorithm which uses a reference pro le, captured once from a traditional pro ling system along with live readings from the process to calculate a mathematical pro le for each PCB exiting the oven. The algorithm used by the software to produce this pro le from the live readings and reference pro le has been modi ed based on the input of a leading mathematician to yield more accurate results.

The APS system allows 100% checking of temperature pro les, an automatic analysis of the profile, and checking of production parameters against production limits. The computer software tracks the progress of the PCB through the oven allowing for the most accurate calculation of the profile seen at product level.

This latest system has captured the attention of major blue-chip companies and, with continued developments and features introduced to the system, it is gathering pace and becoming a real bene t to the electronics production industry.

Page 44 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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TheChoiceofPublicationfortheElectronicsIndustry

| NOVEMBER2015ISSUE

MORPHOLOGY OF Sn BASE SOLDER ALLOY STRUCTURE WITH ADDITIVE ELEMENTS

BY KOKI COMPANY LIMITED, ADACHI-KU, TOKYO, JAPAN

1. Introduction

RoHS Directive issued by European Union in 2003 increased the demand for Pb free solder alloy in the industry. As of 2015, Sn-Ag-Cu solder alloy group has been the standard Pb free solder alloy. However, due to the constantly increasing silver prices, the demand for low- Ag Pb free solder alloy with high electric reliability for application to the power device is increasing.

Currently, researchers from all over the world are actively conducting experiments in order to develop a solder alloy with improved joint strength, good wettability and higher joint reliability solder paste by adding di erent elements into Sn-base solder. However, since the Sn-Pb solder alloy has been in use for an extensive period of time, information regarding Sn-base alloy and various additive elements, such as multi-phase diagrams or their alloyed microstructures, etc., are not as readily available as other frequently used Fe- base, Cu-base and Al-base alloys. This makes it di cult for the solder alloy users to properly select the appropriate Sn-base solder alloy and to understand the solder alloy structure depending on the application condition.

This paper describes the alloy structure from the metallurgical point of view and describes the alloy structure of the additive elements which are frequently used with Sn-base alloys, based on the research data.

2.Alloy Structure

In general, solidi ed additive elements show up in the base metal, which is commonly referred as matrix (in the case of Sn solder alloy, the Sn matrix), as either a solid solution or a precipitation (in single phase or in compounds).

2.1 Solid Solution

Solid solution is the solid to which the additive element is dissolved into the matrix. It is similar to dissolving a little bit sugar (solute) into a glass of pure water (solvent) then solidifying it (note that, if you “freeze” the sugar water, sugar and water would freeze separately, so freezing would not serve the purpose here...). In the sugar water, sugar molecules and water molecules are forming homogeneous mixture; therefore, it is di cult to distinguish a glass of pure water and a glass of sugar water. Metals form mixture at the atomic lattice eld level and form single phase matrix as a whole.

whole. There are two kinds of solid solution: (a) substantial and (b) interstitial.

Fig. 1(a) shows the structure of substantial solid solution which consists of the additive element with equivalent or slightly smaller

atom radius and the base metal. Part of the base metal matrix has been replaced by the additive element. Unlike the lattice eld which consists of only base metal matrix, this structure gives strain to the replacing atom derived from the di erence of atom radius which prevents the atom dislocation from the mitigating and improves alloy’s strength. In this case, the larger the strain in the lattice eld further improves strengthening. Alloying structure of popular additive elements for Sn- matrix such as Bi, In and Sb typically form substantial solid solution.

On the other hand, if the atom radius of the additive element is signi cantly smaller than the radius of the base metal atom, additive element forms solid solution by invading in the lattice spacing of the base metal. Similar to (a) substantial solid solution, strengthening is obtained by invaded atom preventing the deformation of lattice force. However, there are not many additive elements which form this type of solid solution. Nonmetals, such as P, B and C, etc., to name a few, form this type of solid solution; however, application on the solider alloy is relatively small.

when adding Bi into Sn, Fig. 2(a) Sn-Bi phase diagram shows the existence of a large solid solution range for Sn-rich phase (β-Sn area appears to the left side of the diagram). This indicates that the Bi is the element which easily forms a solid solution with Sn. In contrast, there is almost no solid solution range for the Bi-rich side, meaning Sn would hardly form solid solution into Bi.

Next scenario is adding Ag in Sn. According to Fig. 2(b) Ag-Sn phase diagram shows no solid solution range on the Sn rich side and ε phase (Ag3Sn phase) can be seen around Sn 25 wt%. Therefore, the solidi cation structure of the Sn with a few wt% Ag additions will be eutectic structure of almost pure Sn phase and Ag3Sn. Ag3Sn will disperse into eutectic structure as ne particles in Sn at the solidi cation rate during re ow. In general, precipitation form will diverse as it is a ected by solidi cation condition, ratio of additive element and other additive elements.

(a) Sn-Bi

(b) Ag-Sn

Fig. 2 Binary Alloy Phase Diagram

3.1 Test Method

This report introduces alloying form of major additive elements for Pb-free solder alloys: Ag, Cu, In and Ni.

Distribution of the additive elements was analyzed using element mapping on microstructure and X-ray di raction pattern of solder alloy powder. Solder alloy composition investigated are listed in Table 1.

Continued...

(a) Substantial

Fig.1 Structures of Solid Solution

2.2 Precipitations (Intermetallic Compound)

Precipitates will not be integrated into the lattice eld of the base metal but form separate lattice eld; therefore, it precipitate as di erent phase by forming interface with base metal.

For the Sn-matrix, Ag or Cu forms, InterMetallic compounds such as Ag3Sn or Cu6Sn5, disperse into the base metal as precipitates in grain, plate or stick shape. In general, compound phase has stronger bonds among the atoms and derives higher strength and melt point. Therefore, the IMC may have been formed in the molten base metal. In addition, IMC displays

brittle characteristics owing to the atom’s low degree of freedom.

2.3. Alloy Phase Diagram and Alloy Form

Looking at the alloy phase diagram gives some idea on which alloy form the Sn-matrix and additive element may take. For instance,

(b) Interstitial

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feature continued...

Table.1 Solder Alloy Composition

Solder Sn Ag Cu Bi In Ni Alloy

S1X※ Bal. 1.1 0.7 - - -

The X-ray tube with 45kV, 200mA Cu-Ka emission line was used. The scanning speed was 10.000deg/min and step size was 0.01 degrees.

3.2 Observation and Discussion

3.2.1 Distribution of additive element in solder alloy

Fig. 5 shows the element mapping of SB6N and S1XBIG. For SB6N, Ag contrast is higher at compound as opposed to Sn which shows lower contrast at the same area. This indicates that Sn and Ag is forming grain IMC (Ag3Sn) in Sn-base solder and is distributed as a group. Same phenomena can be observed on S1XBIG as well.

Concentration of In can be seen on the same location as Ag; however, unlike Ag, In is also detected at Sn phase and its contrast ratio is smaller than Ag. Although its content is not comparable to Sn, its distribution appears to be similar to Sn. This means that In can exist in Sn phase as solid solution.

As for Cu, it shows higher contrast ratio with Sn at the compound location, which is an indication of Sn-Cu compound. Sn-Cu compound is detected in SB6N as well. The source of Cu in this Sn-Cu compound is the Cu eluted from the pads on the PCB.

Ni is S1XBIG has been detected in Sn-Cu compound; therefore, it is forming Sn-Cu-Ni compound.

As for Bi, although it exhibits slight variance in the contrast, it is distributed uniformly to almost entire Sn phase and no compound can be observed. This observation implies that Bi is forming solid solution in Sn phase. On the other hand, Bi content is smaller in precipitations such as Ag-Sn and Cu-Ni-Sn. It appears

that there is hardly any Bi in these precipitations. Similar tendency can be seen on SB6N, with small contrast ratio at the precipitations, owing to its small amount in the solder alloy.

3.2.2 XRD Pattern of the Solder Alloys

Fig.6 shows the X-Ray Di raction patterns of respective solder alloys. On each solder alloy, similar peaks derived from β-Sn and Ag3Sn are detected. Therefore, Bi in S1XBIG or Bi and In in SB6N does not form compounds or precipitations but exists as solid solution in Sn phase. As for Cu and Ni in S1XBIG, since its content is very low, despite the element mapping image indicates the formation of the Compound with Sn, no di raction peak is detected

Figure 7 lists enhanced images of each solder alloy’s β-Sn peaks around θ=32° and 44°. When taking the S1X as nominal, S1XBIG is shifted toward the lower angle on both 32° and 44°. In contrast, SB6N shows

that peak is shifted to lower angle at 32° while it is shifted to the higher angle for 44°. According to formula (1), lowered peak θ was indication of increase in lattice spacing; therefore, by adding Bi, whose atomic radius is greater than

S1XBIG SB6N \[wt%\]

Bal. 1.1 Bal. 3.5

0.7 1.8 - <0.1 - 0.5 6.0 -

※S1X is tested for XRD only.

3.1.1 Solder Sample and Element Mapping

Screen print each solder paste on test PCB with OSP treatment, mount 6330 chip resistors and re ow in hot air oven under air atmosphere. Cut the solder llet vertically, grind and polish the sectioned plane and observed microstructure using SEM imaging and element mapping. Re ow pro le is shown in Fig. 3.

S1XBIG SB6N

3.1.2 X-Ray Diffraction on Solder Powder

It is extremely di cult to observe the change in lattice with high magni cation microscope as the change is very little to the order of the atom size. Thus, evaluation of the alloy lattice change is conducted by using X-ray di raction which is frequently used to identify the crystal structure of the alloys.

As Fig.4 indicates that the synchrotron incident beams, directed at lattice eld with crystalline, will partially be re ected by the atom in lattice plane. When directed at a given angle θ, if the di erence of X-ray’s optical distance between surface and interstitial re ection (indicated in red in Fig. 4) is a multiple of an integer, di raction occurs and re ects intensi ed X-ray. This is calculated by Bragg’s law 2):

Incident beam Plane

Crystal atom

d

Changing the incident beam angle θ to obtain various

di raction patterns of the specimen enables evaluating the crystal structure and crystalline. Interstitial spacing is not uniform but varies by the direction; therefore, several di raction patterns are observed. Powdered specimen is preferred to average out the grating measuring of the planes which X-ray is directed.

The solder alloys used in this X-ray di raction evaluation is produced using a centrifugal atomizer and ltered by 20-38 μm thieves.

Continued...

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Our Lzero3 Automatic Storage Cabinet is exible and expandable. It intelligently manages inventory for near production deployment, holding almost 1600 reels. Or over 2100 with an extension module. All in 3.5 square metres of oorspace. Choose from three system variants, knowing that you can easily recon gure on-site to adapt to future inventory pro le changes. Select options like humidity control for Moisture Sensitive Devices, Stock Management Software, and o ine setup tools. But get real-time stock updates and easy MRP & ERP integration as standard.

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TheChoiceofPublicationfortheElectronicsIndustry | NOVEMBER2015ISSUE

feature continued...

Sn, lattice structure has been deformed and evenly increased lattice spacing. In Fig. 6, Sn peak in S1XBIG is shifted toward lower angle. On the contrary, In lattice spacing appears to expand and contract according to θ. By adding given % of In to Sn, γ-phase (hexagonal crystal system) is partially generated as a middle range layer from β-Sn phase (tetragonal crystal system) 3) which puts crystalline structure of β-Sn in a transitioning state. Thus, it is assumed that not all unit cells are concurrently transitioning by expansion and contraction bur rather doing one or the other depending on the direction of the lattice plane.

S1X

S1XBIG SB6N

S1X 4. Conclusion

S1XBIG This report contains study on alloying structure of each additive element

β -Sn Ag3Sn

β -Sn Ag3Sn

β -Sn Ag3Sn

SB6N by analyzing solder alloys with element mapping and X-Ray di raction. - Ag, Cu and Ni ... Precipitates as compound phase

- Bi, In ... Formed solid solution in Sn phase.

In addition, X-ray di raction revealed that Bi in the S1XBIG formed solid solution which increases the lattice spacing while the In in the SB6N formed solid solution which changes the crystalline structure of β-Sn.

However, additive elements which precipitatebyformingcompounds may form non-equilibrium solid solution in the base metal if the solidi cation rate was too fast to precipitate. It should be noted that the microstructure of the precipitates are largely depends on the solidi cation condition

Reference

1) T. B. Massalski, Binary Alloy Phase Diagrams, 1990. ASM International

2) B. D. Cullity, Elements of X-ray Di raction, Trans. Gentaro Matsumura. 1980. AGNE Gijutsu Center Inc.

3)G.V.Raynor,J.A.Lee,ActaMetall.,2(1954)616-620 .

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Industry News

Keep up to date with what’s new

With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

GETECH Delivers GSR 1290 Large Panel Depaneling Machine to Tier 1 CEM

GETECH, the worldwide leader in PCB automation and depaneling, is pleased to deliver the GSR1290, a large format depanelling machine, to a Tier 1 CEM for one of its facilities in Asia. The machine is capable of handling extremely large PCBs with very heavy construction (up to 8 mm thick).

“The machine o ers a very high accuracy capability necessary when cutting high-value PCBs,” commented Leon Tjipto, CEO at GETECH. “Such machines are not common in the industry but we have been building for this market for a number of years and continue to be impressed by the sheer scale of the PCBs being manufactured within these facilities and are pleased to be a part of the solution.”

Built on the robust GETECH GSR-platform, the GSR1290 claims the largest processing window available on the market today; capable of handling panels up to 910 x 610 mm (36” x 24”). Con gured as a single table, standalone router, the GSR1290 has the exibility to depanel thin and heavy tabbed assemblies using a 500W high-speed spindle.

Maximum performance is achieved through the use of advanced precision manipulators on all axis. The GSR1290 has three highly rigid, compact linear axes driven by maintenance-free AC servo motors. The heavy duty, preloaded linear guides have a mechanical repeatability of ±0.01 mm. Maintaining this level of repeatability ensures the user of a highly reliable, repeatable and accurate post-assembly routing process, resulting in accurately singulated boards. With cut speeds up to 100 mm/sec and positional speeds up to 1000 mm/sec, the GSR1290 is the largest, fastest and most accurate depaneling machine available today.

The GETECH software interface is a user- friendly, Windows-based program that features easy-to-use pull down menus and automatic backup of program les. Additionally, the operating software includes useful tools such as monitoring and tracking tool use and lter bags.

For more information about GETECH, visit www.getecha.com.

Inovar, Inc., a full-service EMS provider, announces that Kent Alder, former CEO of a multibillion dollar tech firm, has joined its Board of Directors.

Blake Kirby, Inovar’s CEO, said, “Kent was invited to join the Inovar Board because his values and beliefs, combined with a “no nonsense” approach to business, are directly aligned with the company’s mission, which is to improve the lives of our customers’ customer and the Inovar family.”

Alder accepted the position because he believes in Inovar’s business strategy and customer-focused culture. He added that the company has invested – and will continue to invest – in the equipment and people necessary to stay ahead of customer needs.

“I personally know Blake and the executive team, and they have the highest level of integrity,” Alder said. “I have con dence in their commitment and ability to execute the strategy. Additionally, their customer-focused culture ts my belief about how a business should be operated.

Inovar’s high-tech strategy and the ability to execute differentiates it from competitors and enables the company to provide value to customers, generating growth and solid returns. Alder added that Inovar is well positioned in the industry and has a proven history of success and growth.

Inovar manufactures some of the most complex electronic products in the world that require the highest quality standards. As a member of the Board, Alder works closely with the company to ensure that it has the resources and focus it needs, as well as a strong team in place to succeed.

“As a Board member, I hope to provide value by using my 35 years of industry experience to assist Inovar in the following areas: executing an effective strategy and adjusting to market changes, operating at the highest level of

productivity and ef ciency, and ensuring our company culture generates the highest level of customer service and employee motivation,” he added.

Alder has a strong background of growing and improving the organizations he leads by building high performing executive teams that focus on the customer. He brings many years of success and experience to Inovar. He is currently the Executive Chairman of Wasatch Photonics, on the board of TTM Technologies, and previously he was the CEO of TTM Technologies.

For more information, visit www.inovar-inc. com or contact Jed Jones directly at 801- 631-5099; [email protected].

Inovar Invests in MIRTEC’s SPI Systems to Decrease Solder Defects

Inovar, Inc., a full-service EMS provider, announces that it recently purchased and installed four MS-11 solder paste inspection (SPI) systems from MIRTEC.

The SPI systems are currently in use at Inovar on its three production lines as well as its prototype line.

Jef Nielsen, Process Engineering Manager, said that the systems allow Inovar to recognize problems with the application of solder paste onto the printed circuit boards (PCBs) in real time. The SPI machine is located directly after the screen printer machine in the production line. He added, “It is industry knowledge that a high percentage of solder defects can be attributed to problems with the solder paste application. These machines will quickly detect any de ciencies and allow for quick modi cations to reduce the defect potential.” The machines also have statistical process control (SPC) software to track defects, thereby identifying the most problematic assemblies and defect types.

The MS-11 systems are configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The high-speed precision In- line SPI system uses dual projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insuf cient solder, excessive solder, shape deformity, shift of deposition and bridging. Featuring an exclusive 15 mega pixel ISIS® vision system, the MS-11 series provides 10 micron/pixel precision telecentric compound lens design, 2 micron height accuracy, a precision closed-loop servo motor

Kent Alder Joins Inovar’s Board of Directors

Page 52 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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system, and extremely simple programming and operation. As an additional bene t, the systems provide MOIRÉ 3D phase step image processing, superior solder pro le characterization, absolute repeatability and reproducibility, and precision laser PCB warpage compensation.

For more information, visit www.inovar-inc. com or contact Jed Jones directly at 801- 631-5099; [email protected].

ISVI Corp. announces distribution partnership with 1st Vision, Inc. for the North American Automated Imaging market

ISVI Corp., a global leader in high-speed, high- resolution camera technology, has announced the signing of a distribution agreement with 1st Vision, Inc. to address the North American Automated Imaging market with sales and support of its cameras.

“North America is a rapidly growing market for ISVI and we felt the need to create more reach in order to address the expanding application areas for our high-speed, high- resolution cameras”, said Gerard White, Vice President of ISVI. “We are proud to announce our partnership with 1st Vision. With its expert team of automated imaging sales and support engineers, as well as its multiple locations in the USA and Canada, 1st Vision is very well positioned and respected in our industry. They bring with them a very high level of professionalism and dedication to serving customers which are totally in line with our own business philosophies.”

“ISVI brings to us a product line that will satisfy our clients who are pressing the limits of COTS cameras for high speed, high resolution applications”, said Scott Israel, President of 1st Vision. “Because these cameras use standard AI interfaces such as CoaXPress and Camera Link, we can offer an easy to use solution.”

For more information visit www.isvi-corp.com www.1stvision.com

VJ Electronix Appoints W-Tech for Sales of XQuik with AccuCount

manufacturing technology and processes. Like Libra Industries, ACD is an electronics contract manufacturer that produces printed circuit board assemblies (PCBAs), resulting in a synergistic relationship and a perfect cultural t. Libra Industries has hired Scott Fillebrown, CTO, and Steve Schwaebler, VP of Operations, to operate the Libra Industries in Richardson, TX. Additionally, the ACD employees will join the Libra Industries team.

From its four state-of-the-art manufacturing facilities in Northeast Ohio and now Texas, Libra Industries serves a diverse base of industries such as medical, military/aerospace, industrial and LED lighting. The company seeks customers who require customized solutions with technically sophisticated manufacturing and quality requirements. In order to do so, Libra Industries has worked hard to earn an impressive array of certi cations and registrations such as ISO 9001:2008 and ISO 13485-2003, FDA, UL, CSA and ITAR.

Libra Industries’ investment in ACD demonstrates the company’s continued commitment to providing customized manufacturing solutions to help make its customers more competitive and improve their pro tability.

Libra Industries, and now ACD customers, will continue to receive the high level of service the company has become known for over the last 35 years. For more information, visit www.libraind.com.

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, is pleased to announce that it has appointed W-Tech as its newest distributor for the XQuik with AccuCount in Europe.

W-Tech will sell and support the revolutionary XQuik component counting solution exclusively in France, Belgium, Switzerland, The Netherlands, as well as Morocco and Tunisia. Headquartered in Saint Jean de Soudain France, W-Tech offers a wide range of inventory management and storage solutions.

Don Naugler, VJ Electronix General Manager said, “We are happy to have W-Tech join our team. They have a proven track record with more than 25 years of providing products and services related to tape-and-reel, advanced packaging and storage, and humidity control.”

VJ Electronix, with 20 years of experience in the electronics industry, has a complete range of machines used in different elds wherever a high technology level is required, e.g. military, medical, NDT, etc. The appointment of W-Tech is a key step in the company’s strategic efforts to raise its pro le in the European market.

For more information about VJ Electronix, visit www.vjelectronix.com.

Libra Industries Acquires ACD MENTOR, OH -August 2015

Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce the acquisition of ACD, based in Richardson, TX. The acquisition is a major step in Libra Industries’ strategy to increase revenues and capture a larger share of the electronics contracting market. Libra Industries was founded in 1980 when the EMS industry was just getting started. Since then, the company has steadily grown because of its ongoing dedication to investing in people, quality systems, and the latest

SMD-TEC is new Viscom representative in Benelux

Viscom and SMD-TEC are now working closely together in Benelux. Effective immediately, Viscom AG, one of the leading manufacturers of inspection systems in the electronics industry, is being promoted in Benelux by the new representative SMD-TEC. General manager Tom Van Tongelen has rebuilt SMD- TEC from the former Benelux subsidiary of

From left to right: Rod Howell, CEO, Scott Fillebrown, CTO, and Steve Schwaebler, VP of Operations

Page 54 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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Industry News

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in SMT production is concerned. With his closely partnered business relationships to customers in Belgium, the Netherlands and Luxemburg, Tom Van Tongelen and his team ensure not only rst-class consultation, but are also handling on-site technical support.

Olesja Münch, who is responsible for Benelux customers at Viscom, is pleased with the collaboration: “With Tom Van Tongelen, we have a very experienced partner who has been at home in electronics manufacturing for many years. We are happy about the future collaboration and wish SMD-TEC all the best, and great success.”

SMD-TEC is located in Aarschot, Belgium. The company is taking on sales of the entire Viscom product range, from SPI, AXI and AOI systems through automatic X-ray inspection, up to manual X-ray inspection and wire-bond inspection. SMD-TEC is broadly positioned and in addition to the Viscom products offers printers, board handling, pick & place systems, soldering systems, SMT material and much more.

For more information visit www.smd-tec.be

SMTA China Announces Winners of the 2015 Annual Awards

SMTA China held its annual awards presentation at the SMTA China Annual Award Ceremony, which took place on Tuesday, August 25, 2015 at the Shenzhen Convention & Exhibition Center.

to SMTA China and events including conferences and golf tournaments, with much complimentary support in teaching and organizing the conferences and training of SMTA China for many years.

Reed Exhibitions (China) Ltd., Shanghai Branch was awarded Partner Sponsor of the Year. Reed Exhibitions has sponsored SMTA China Conferences and Meetings in conjunction with the NEPCON shows at Shanghai and Shenzhen for years. Reed is one of the premium sponsors of SMTA China to date.

SMT China Magazine was named Media Sponsor of the Year. SMT China Magazine has provided ongoing support to the SMTA China Conference Program and promoted the technology conferences, vendor conferences, training courses, annual reception and dinner as well as annual golf tournament sponsorship with the of cial NEPCON show daily publications.

Microtonic Adds the Akrometrix TherMoiré AXP Modular Metrology System to Its Demo Lab in Munich

Microtronic GmbH, a leading sales specialist of microelectronics, today announced that it has added the Akrometrix TherMoiré AXP to its demo facility in Munich. The AXP has been installed and is available in the Microtronic application lab for demos and test services. The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample’s behavior during a user-de ned thermal pro le. The combination of shadow moiré measurement and dynamic temperature pro ling is the foundation of the patented TherMoiré platform. Dynamic pro ling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

The TherMoiré AXP is powered by Akrometrix’s Studio 7.2 Software and can be used for a variety of laboratory applications, including Pb-free processing implementation, pre- production mechanical behavior quali cation, evaluation of different materials and constructions failure/defect analysis, and more.

Our customers include companies who require added solderability test, ultrasonic microscopes, circuit board repair systems, welding systems, solders and solder pastes. We offer centralised pricing to our customers with the added benefit of unparalleled delivery times from our centralized European warehouses.

For more information, please visit www. microtronic.de.

Count On Tools Inc. Launches the QWIKTRAY Custom Matrix Tray System

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is pleased to announce the launch of the new QWIKTRAY system, developed to provide low-cost, custom matrix trays for many types of electronic components. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exist. Customers no longer have to place these components by hand.

Utilizing the latest in machining and additive manufacturing technologies, QWIKTRAY will develop a custom pocket design matched to your component speci cations and machine it into a nished matrix tray. QWIKTRAYs can be designed for almost any component, including QFP, BGA, hybrid, assemblies, sockets, pins, connectors, LEDs, switches, buttons, transformers and more.

Each QWIKTRAY is CNC machined to the speci c con guration for your component and ships ready to load and install in the equipment. Each QWIKTRAY includes CAD drawings, containing pocket dimensions, rst part location, spacing, and other programing details. QWIKTRAYs come standard in non- ESD black acrylic (ESD-safe and other materials are optional).

According to Zach Shook, Operations Director of Count On Tools, Inc., “Our company understands that in order for our customers to remain competitive in today’s market, they must be able to cut costs while maximizing the capabilities of their existing SMT assembly equipment to prevent costly investments in new equipment or increased labor from hand placements of electronic components. The QWIKTRAY platform provides customers with a fast and easy way to get components back into the machines. This could be from loose components with no standard packaging, such as tape reel or JEDEC trays, or from recovered components that were miss-picked or dropped during previous production runs.”

Lin Dong, Section Manager, SMT Engineering of Artesyn Embedded Technologies, was named Of cer of the Year. Lin Dong has provided great support for the SMTA China Conference for many years, and he has been the Conference Chairman of Technology Conference for years.

Billy Shen, Area Sales Manager of JBC Soldering Tools (Shanghai) Trading Co., Ltd., was awarded Individual Member of the Year. Billy Shen has been a very active member and has been the Conference Chairman of Vendor Conference for years.

Megan Wendling, President of MW Associates, was named Councilor of the Year. Megan has provided much support over the years to all events including conferences for SMTA China and has solicited sponsors to SMTA China.

Kyzen Corporation was named Member Sponsor of the Year. Kyzen joined SMTA as a International Corporate Member 22 years ago and has provided a great sponsorship

Continued...

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The QWIKTRAY program provides rapid turnaround on the design and production of any quantity of custom matrix trays. Standard lead time is 7-10 days with optional expedited service in as little as 24-48 hours (additional charges may apply). The system is designed for any application requirements, from prototype to high-volume processes. With the QWIKTRAY platform, there is one at fee per tray with no minimum orders and no additional charges for design, programing, molds, setup, etc. Volume discounts also are available.

For more information visit www.cotinc.com.

VJ Electronix Expands Demonstration Capability in Europe

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, has expanded and enhanced its demonstration center in

Budapest. Co-located with VJE Distributor, Euro Process Solutions, the new center is equipped with the latest in rework and X-ray systems.

Located in the heart of Budapest, the VJ Electronix demo center includes an expanded range of products, including the innovative XQuik with AccuCount and the flexible Vertex II X-ray inspection S\\system. Rework capabilites include the industry-leading Summit II and the unparralled entry-level 400 Series.

“We are excited to be better able to showcase our newest technology and develop new applications in the

new demonstration laboratory,”

explains Director of Global Sales, Ron Lindell.

“The knowledge and skill of the European team is among the best in the industry.”

With factory trained technical support, the center is prepared to address sales and support inquiries from across Europe. The increased range of products will allow local development of new applications and training on the use of the latest software and tools.

For more information,

visit www.vjelectronix.com.

NeoCUT Uv Shape – Invisible Depaneling

By Marco Guolo, Osai Automation Systems

After years of permanence on the laser depaneling market for PCB and FPC, Osai presents the brand new NeoCUT UV Shape - equipment that establishes, with its unique characteristics, a new reference point on the market. The NeoCUT UV Shape is the perfect synthesis between the OSAI experience in laser processes applied to electronics and the accuracy mechanics.

designers’ goal was to make a suitable product for the heaviest production environments, support easy and quick scheduled maintenance, with easy-to-replace consumables. Ef ciency also means an easy interaction between man and machine as SW is based on clear and user friendly information with diagnostics guiding the operator step- by-step. Design has also been simpli ed with brand new graphic features enabling the development of a full cutting program in 10 minutes.

Tangible results

NeoCUT Shape is the laser system for cutting PCB, FPC, hybrids and kapton coverlay, with unique speed and accuracy and measurable results on eld. Competitive price, extraordinary component quality, low CoO, ne mechanics, reliability and ease of use are its main strengths.

In addition, Osai makes available twenty-years of experience within its LASER Department to support and optimize the productive processes of the customer by providing courses and global specialized technical assistance.

www.osai-as.it.

Technology

The NeoCUT UV Shape’s essence is its laser source, undoubtedly the state of the art for UV laser technology worldwide. The remarkable emitted power (up to 15W) and the optical characteristics of the system enable clean and fast cuts on a wide range of materials, guaranteeing a process without mechanical stress, powder or fume contaminations. Among the many innovations introduced by the NeoCUT UV Shape, it has the option to program the focal position in Z, double power feedback with the measure of the power “on the piece” and a new protection system for the optics from contamination and ageing.

Special care on the mechanical side of handling, the steel structure has been stiffened while the handling axis allows the highest dynamics still guaranteeing accuracy in range

of 20μm. A 400 x 400 mm working area enables the processing of large dimension panels and a last generation optical alignment system compensates previous deformations which may have occurred on the PCB during the production process.

Communication-oriented software is open for data sharing and parameters from DB. The integrated management of the traceability supports the connection of the ID from the panel with the data local or remote. There are also the lots’ management facility which is very important for the mass production environments.

Efficiency and reliability

NeoCUT UV Shape combines the cutting outcome quality with reliability during use in production. As for all our systems, our

Page 58 The Choice of Publication for the Electronics Industry

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Innovative Solutions for Electronic Manufacturing

Programmable focus position +/-10mm

Programmable spot size

Pressurized optical path to avoid optics contamination Automatic power meter for “power on workpiece” measurement High efficiency fumes and dust extraction

www.osai-as.it

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Cartridge Weighing, Measuring Machine (CWMM): A complete in-line, four-stage production line designed to load, weigh and measure the round and present for nal manual veri cation live 9 mm cartridges.

Healthcare

Pharmacy Automation: The Getech DDS is a turnkey digital pharmacy solution. With an integrated conveyance system, robotic pick and dispense for blister, boxes and liquid medications in bottle formats it handles inpatient and outpatient demands, freeing the pharmacy staff to deal with patient issues and questions.

Lancet Inspection and Assembly Machine (LIAM): This is a sophisticated standalone machine designed to assemble one medical lancet assembly in 3.3 seconds using a combination of motorized and pneumatic robotic axis. The LIAM features a vision inspection to verify and correct the needle height protrusion after insertion and then the needle sharpness.

This is a sophisticated handling system for cosmetic contact lenses. The contact lenses are automatically picked and placed into each blister pack in a conveyor system. Saline solution is dispensed into each blister. Packaging foils are hermetically sealed and manufacturers’ labels are printed directly with an industrial inkjet printer.

Test Automation and Handling

BGA Socket-level Tester: The VLST system is designed for high-speed CPU and GPU processor functional testing and quality analysis. The system applies the latest technology in the market for high-speed, accurate IC placement to its test socket.

Burn-in Chamber (BIC): BIC3000 is a front-loading industrial burn-in chamber that accommodates up to 144 drives for mass burn- in testing using end-user test con gurations or solution. The system is customizable to a manufacturer’s requirement and offers temperature uniformity within the chamber.

Training and Service

In addition to the above products, Getech Automation handles spindle refurbishment and replacement as well as factory and on- site training. To ensure maximum benefits from Getech machines, whether it be a PCB router, an end-of-line automated machine or a customized solution, proper training in service and operation is essential. Getech offers in-house or on-site training for all user levels.

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PCB Automation

Getech Automation has been involved in the PCB automation and depanelling Industry for more than 20 years. With thousands of machines installed and millions of PCBs handled daily, Getech is focused on developing and manufacturing machines and systems to address the changing needs of the PCBA and semiconductor industries.

Today Getech Automation offers standardized platforms for depanelling, laser marking and assembling of rigid PCBs, ex and metal clad substrates. All operations can be handled in standalone and fully automated in-line systems capable of integrating with upstream operations as well as downstream test systems. With experience in routing, sawing and laser cutting the company has the expertise to provide panel to box automation capabilities.

Allen Duck said, “We are committed to providing our clients and their end users with total customer satisfaction through our engineering, development and service teams. Our primary objective is to create and maximize long-term business partnerships by providing accurate, rapid and effective engineered process solutions for our customers.”

Industrial Automation

Gasket Dispensing Machine (GDM): One of many machines supplied to the electronics industry for automated assembly, the GDM is a standalone work cell to uniformly dispense a precise layer of glue to a hard drive housing.

Governor Assembly Machine (GAM): The GAM is a standalone work cell designed to fully automate the assembly of three small components to make a governor for “live munitions.”

Safety Fuse Assembly Machine (SFA): One of the 16 sub and nal automated assembly machines used to assemble 40 mm grenades, the SFA is an eight-station rotary table with high-precision pick-and-place of components to assemble and crimp components to form the nal “live munitions” assembly.

Cartridge Inspection, Marking and Packing Line (CIMP): This is a complete inline four-stage production line designed to load, inspect, mark

lved into a major d automation systems and semiconductor companies. Every machine and system delivers the highest degree of productivity while ensuring product quality and integrity. However, Getech’s expertise extends beyond the world of electronics to include systems delivered to governmental agencies and corporate clients involved with pharmaceutical delivery and munitions manufacture. The in-house engineering team behind Getech includes mechanical, electrical and software expertise. The team has a broad understanding of “process” and illustrates this with every turnkey project by delivering the machines and systems to meet customers’ speci cations every time, regardless of the

application.

Standard machinery includes systems for PCB routing (both in-line and standalone), marking (inkjet and laser) as well as parts placement and insertion. Once parts have been placed, laser soldering options conclude the process or vision inspection veri es that a label has been placed correctly. The company’s PCBA and semiconductor users extend from the largest high-volume PCBA manufacturers and subcontractors in the world to smaller, high flexibility companies dealing with extreme reliability applications.

Today, Getech’s reputation for delivering consistent, reliable and cost-effective solutions to complex problems is understood by the many users around the world. Allen Duck, Getech’s VP of Sales and Marketing, said, “We continue to strive to develop and push the boundaries for new and better solutions, relying on our foundation of specialized expertise around automation and robotic applications.” Additionally, Getech is certi ed as a Quality Standard ISO 9001:2008 company and has experience building machines to meet both CE and SEMI standards.

The company is fully committed to achieving constant excellence and total customer satisfaction. “We strive to maintain a close working relationship with all our customers, to understand and participate in their requirements, specifications, technologies and quality conformance programs,” Duck added. “At Getech, we meet the new and changing needs of our customers, providing high-quality products and services with short lead-times and consistently competitive rates.”

As another important customer bene t, Getech designs, assembles and tests all machines in- house. It uses state-of-the-art 3D solid modeling, allowing the company to provide customers with design solutions before manufacturing even starts. With more than 20,000 sq. ft,

marking in a small footprint with Getech’s reliability

Contact Lens Handling System (CLHS):

Page 60 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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Getech:

Taking assembly problems & creating automated solutions

Getech is a Tier One provider of standard machines and automation solutions, used by the world’s best manufacturing companies with global reach and world class service.

201 Woodlands Avenue 9 #05-50 Spectrum 2 Singapore, 738955

Ph: +65 6756 0777

Email: [email protected] www.getecha.com

815 14th Str. SW, Building D Loveland, Colorado 80537 Ph: +1 970 412 6759

Laser Marking System- GLMS

GLMS is an In-line Laser Marking machine with an integrated internal ip station for single pass dual sided marking. With a 450mm x 400mm panel size and a machine length of only 800mm, the machine is extremely ef cient. With the capability of mark- ing formats ranging from 1D, 2D matrix, QR codes and human readable the GLMS delivers big board marking in a small footprint with Getech’s reliability and performance.

MPI Realizes Outstanding Benefits from ViTrox’s V810 Standard AXI System

By SMT Today Editor

Microboard Processing Inc. (MPI) is located in Seymour, CT in the New England region of the USA. The electronics manufacturing industry’s most demanding customers trust MPI to manufacture their mission-critical electronic assemblies. Their world-class capabilities, unparalleled responsiveness and rock-solid nancial standing enable them to make customers’ product requirements a reality. In 2013, MPI purchased their rst Vitrox 3D In-line Advanced X-ray Inspection System (AXI), the V810 Standard System.

Previously, MPI had three of Agilent’s 5DX systems, the predecessor of the V810 and a VVTS Repair station. As production volume increased, MPI decided to purchase one V810 Standard system from ViTrox for its production line.

“The ViTrox V810 system has proven to be quite capable in its intended mission, helping us produce defect-free product for IPC610, Class III customers in the Defense, Aerospace, Industrial Computing and Medical market sectors. The machine is very reliable and we really appreciate the outstanding support from the ViTrox team for training, upgrades and technical information.”

Dane Wentworth, Senior Vice President, MPI

MPI Greatly Enjoys the Outstanding Capabilities of V810 Standard

V810 Standard’s software and programming environment come with the world’s fastest inspection speed performance and the widest solder related defect test coverage, which increase the yields of MPI’s production lines, as well as the return on investment. Additionally, the system guarantees minimum false call rates, low maintenance and warranty costs, resulting in the reduction of operating costs. All the above features make the production lines at MPI more ef cient and effective at a lower production cost. The performance of the rst unit made it possible to replace two of the older 5DX units. MPI was delighted to purchase a second AXI system from ViTrox – theV810 Series 2 – in May 2015 to nish replacing all of the older 5DX systems and add more inspection capacity. The strong performance of V810 Standard has made MPI very comfortable with this second purchase as a key component of their technology roadmap.

ViTrox’s V810 X-Ray Inspection System is the fastest and best test coverage AXI system in the world. The advanced X-ray machine is the latest revolution in X-ray technology, inspecting double-sided panels with high defect coverage,

high inspection speed and low false call rate. V810 Standard allows MPI to inspect board size up to 18x24”. The V810 Standard offers board thickness capabilities supporting boards up to 160 mil thick with board weight of up to 4.5 kg.

The V810 is capable of detecting many defects including shorts, opens, missing components, non-wetting, billboards, tombstones, lifted leads, solder balls, voiding, insuf cient solder, reversed tantalum capacitor and excess solder. Additionally, it has the ability to inspect the toughest hidden joint defects commonly found on the production line such as head-in-pillow, package-on-package, PTH and various types of connector joint defects to a standard far beyond other AXI machines on the market.

For more information about MPI, visit http://www. microboard.com.

For more information about ViTrox Technologies Sdn. Bhd., please visit www.vitrox.com.

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Productronica

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New Fixtureless Router coming in November 2015!

Combating Oxidation and Inter- Metallics in Moisture Sensitive Components

Provided by Richard Heimsch, Director, SUPER DRY-Totech

To avoid the damage of micro cracks and delamination during the processing of electronic components, it is essential to provide appropriate environmental storage. The introduction of lead-free soldering and the higher processing temperatures involved increases the consequent saturated vapor pressure within components considerably (up to 30 bars). The same component that could safely be processed before lead free becomes a moisture sensitive device with limited oor life. The di erence is often 2 sensitivity levels higher classi cation (MSL) and shorter allowable exposure time (“ oor life”)

at the same time. To achieve this, dry storage systems have been designed that can produce internal atmospheres of below 1% RH. With this extremely low content of humidity it is possible to protect the components against the additional absorption of moisture and to also remove the moisture already absorbed. As the diagram below shows, even storage in very clean nitrogen does not provide actual dehumidi cation of components as levels under 0.1 Wt % are not possible.

Modern Desiccant Technology

Ultra low humidity desiccant technology is now available that can sustain a low rest- humidity of <0.5% RH (0.05 grams H20/m3) effectively a “moisture Vacuum.” The latest technology also provides recovery times (after door openings) of less than three minutes. This provides practical working access throughout the day without raising the average RH above the J-Std-033C speci ed safe storage level.

Unlike clay or silica, these storage areas (which can be thousands of cubic feet in size) use a crystal known as Zeolite. It is a molecular sieve — that is to say, the size and shape of its structural openings are that of H2O molecules and these water molecules are literally sifted from the air inside the cabinet. The desiccant is never touched by operators and it never needs replacing because the systems have automatic regeneration cycles.

This 0.5% RH enables not just safe storage but an effective drying of components, even at room temperature. This is impossible to achieve with nitrogen alone. (Disagree? Put an apple in one of each type of cabinet and see what they look like after a day).

Components stored in ultra low RH cabinets utilizing such technology are thus dehumidi ed, even at ambient temperature. Increasing the temperature to 40C (the point as noted previously at which most alloys will not oxidize) while maintaining 1% RH can further accelerate the drying time of components without oxidation or inter-metallic growth and at 10% of the operating cost of high temperature baking.

By virtue of the oxidation protection explained previously, longer periods of storage without the use of moisture barrier bags are also practical. Safeguarding the quality and reliability of electronic assemblies starts with the controlled storage of components and PCBs.

www.superdry-totech.com.

Manufacturers deliver these moisture sensitive components in effective protective packaging to avoid absorption of humidity during transport and storage. After opening the package the time begins during which the components absorb humidity. Depending upon ambient humidity and temperature, the components can be safely used only within a limited time period. This time period is classi ed by the IPC/JEDEC J-Std 033C.

When a component has exceeded the allowed exposure time the component can be dried through a baking process, after which the component should be processed immediately. A repeated absorption of humidity must be avoided because the baking process should not be repeated.

Even one exposure to baking induces oxidation and inter-metallic growth, which reduces the wetting ability of the connection surfaces. In addition, inter-metallic thickness has shown to increase by approximately 50% when baking at 125C for 4 days. Thicker inter-metallic

layers can lead to a reduction in solder joint integrity and in extreme cases reduce solder ability.

SOIC 14 Chip, 60/40 Sn/ Pb alloy, type R flux, 4 hours @ 100 C

SOIC 14 Chip, 60/40 Sn/ Pb alloy, type R flux, as received

many suppliers of baking ovens provide an additional reduction of oxygen by means of a nitrogen atmosphere or vacuum during the drying process. Setting the clock back to zero for the component can take in excess of 72 hours, inevitably bringing along considerable costs for nitrogen and only a low rest-oxygen content of less than 13 ppm

stops the oxidation.

Lead Free Soldering Alloys

Because of the considerably higher content of tin in lead-free soldering alloys, the need to consider oxidation protection during storage has increased in importance. This is caused by higher oxidation tendencies of these alloys and the generally more dif cult wet ability and ow properties of lead-free soldering alloys.

The Oxidation Process

The oxygen causing the oxidation originates from two different sources. The rst is the oxygen molecule O2, found world-wide in our atmosphere. However, because of its atomic bond it only occurs at temperatures higher than 40°C. The second and, in fact, more aggressive bearer of oxygen, is the water molecule H2O. The oxygen atom is only weakly connected and considerable oxidation can be observed at low temperatures. This means that it is not the content of oxygen, but more the content of humidity which is decisive for the oxidation percentage in stored components. Technically it is possible to solve both problems at the same time. However, it is important to avoid heating above 40°C, thereby eliminating the air-oxygen as reaction partner and to provide a strong dehumidi cation of the air

To ght this well-known effect,

Page 62 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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THE EVOLUTION OF CLEANING METHODS IN THE PCB REWORKING PROCESS

By Robert Roush, Product Engineer, and Paul Wood, Advanced Product Applications Manager, at Metcal, a brand of OK International

Why contact-less solder cleaning is rapidly replacing manual cleaning in more and more applications

Today’s manufacturers of printed circuit boards (PCBs) are strongly quality driven but, even among those operations that are able to drive yields near or even above 99%, the huge volumes associated with applications such as smart phones and tablets could still leave them with thousands of boards per week that come o the assembly line damaged and in need of rework.

Since the cost of these PCBs can be well over US$200 each, most manufacturers and OEMs consider it vital to develop an e ective process for working to reclaim these boards and minimize scrap

PCBs — and the resulting losses — in their operations.

Fig. 2 - Open via and solder resist damage

tools, ensuring that sticking challenges will become even more problematic going forward.

Other risks to the circuit board assembly when performing a manual BGA cleaning are numerous. To name a few, molten solder can ow into electrical connections and vias, causing shorts in the board. Solder can be removed inconsistently among the dozens or hundreds of pads, resulting in poor adhesion of the new component. In addition, portions of the solder resist can be inadvertently removed by the wick, causing solder to ow into electrical connections when the board is put back into the rework machine, leading to bridges and shorts.

Another, perhaps even more insidious issue is that, while many manual cleaning problems can be caught in the inspection process, and the board, now expensive scrap, kept from getting to market, another common source of damage is not discernible by visible — or even X-ray — inspection. Pad craters can be created in the berglass under the pad due to the stresses caused by the mechanical pressure of operators pressing a little too hard with the soldering iron, or by excessively heated tips held slightly too long against the board.

With this kind of damage, the pad and the solder balls are still connected to each other, but the pad is not fully adhered to the circuit board, leaving it vulnerable to the smallest jolt by the consumer — and the end product brand vulnerable to reduced reliability and consumer dissatisfaction. The smaller the pads, the more susceptible they are to this kind of hidden cracking, which means that the situation has been becoming more common and will become even more common in the future as pad size continues to decrease.

Industry trends making manual cleaning even tougher

Indeed, it is vital to realize that, as common as all of these and similar scenarios have been in the past, they are about to become

Indeed, today’s environment is a far cry from the days of the limited-feature “candy bar phone” PCBs, when the value of reworking faulty boards was not overwhelmingly clear. Yet, even as board sophistication and costs escalate and global consumer demand continues to intensify, it is becoming more di cult for manufacturers to clean faulty boards manually when reworking them. Instead, contact-less cleaning, previously a specialized process utilized by only a small segment of the market, is fast becoming not only mainstream but mandatory for most PCB manufacturers. This is often driven, not only by the need to remain competitive but, for contractors, by the adamant demands of their OEM customers as well.

Traditional manual cleaning process can cause many types of damage

The rework process has long consisted of three steps: removal of the inoperative component, cleaning of residual solder from the ball grid assembly (BGA) pads which held the old component in place and replacement with a new component to create a viable PCB.

The rst and third steps — removal and replacement — have long been automated, and are completed on rework machines with operator assistance. Cleaning, the middle step — and arguably, the most sensitive and vital step when it comes to reclaiming a damaged board — is often done manually by a skilled and experienced technician. The cleaning is performed with hand tools, usually a wicking braid and a soldering iron, using standard or specialized tips. Obviously, the e ectiveness of the operation is highly dependent on the skills of the individual operator and, with emphasis often placed on speed, board damage is quite common.

For example, one common scenario in manual cleaning is the destruction of a

pad due to sticking, when the heat of the soldering iron momentarily dissipates through the board, causing the delicate pad to stick to the wick and be chipped or lifted o the board entirely when the operator pulls the tool back. Overwhelming destruction to a pad results in a wasted, scrap board.

Fig. 1 - Removed Pads

Today, in the drive to help the smart phone or other ultimate product deliver greater functionality, manufacturers are creating thicker PCBs with multiple inner layers of copper. These, unfortunately, also cause the heat to dissipate more and more quickly when using hand held cleaning

Page 64 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

signi cantly more so. In addition to boards becoming thicker, over the years, pad size and pitch size have also reduced signi cantly, with many smart phones and other devices now utilizing pad sizes as small as 0.25 mm mils, spaced at intervals of 0.5 mm. It is known in the industry that new chips are scheduled for release in the next two to three years that utilize designs calling for pad sizes as small as 0.1 mm with a 0.3 mm pitch. With adjacent parts so close together, avoiding hitting them with the wick during manual cleaning — and creating another round of rework — will most likely become impossible for even the most skilled technician.

Furthermore, traditional cleaning methods can be even less e ective when it comes to cleaning PCBsincorporatingadvancedchiptechnologies. For example, one new technology (open via and solder resist damage) is providing outstanding improvements in security, making it nearly impossible for criminals to access data stored on the processor. However, due to factors such as di ering size pads and uneven solder volumes, manual

cleaning can be a significant challenge.

Another technology, ceramic ball grid array, a specialty process used in aerospace, military and other high reliability applications, is another high value case in point. These boards, which use individual components costing tens of thousands of dollars and themselves can cost half a million or more, are notoriously hard to successfully clean manually and rework, and usually have to be scrapped if faulty. The problem stems from the fact that two di erent types of solder are used in manufacturer, with melting points of 183°-302°C respectively. Improper manual cleaning can change the melting temperature of the solder at the pads, so that when the new component is applied with solder paste, the temperature may not be high enough to form an intermetallic joint and a dry joint could result at those connections.

In addition, many Package on Package chips cannot be con dently cleaned with manual methods due to the threat of melting the bottom package. One highly advanced component, the Invensas BVA POP — which promises a fourfold increase in memory and processing speed — holds the solder balls on with shhook shaped connectors 50 microns wide and 90 microns high, barely visible to the unaided eye and spaced at 0.2 mm intervals. Su ce to say that manual cleaning is not an option for this innovation.

Automated contact-less cleaning offers safer options, increasing PCB yields

Fortunately, contact-less cleaning — or

scavenging — is an extremely e ective method for cleaning BGAs with these chips, as well as substantially alleviating the escalating challenges of manual cleaning described above. With contact-less cleaning, a software-controlled, automated machine process precisely controls temperature and placement of a soldering tip and uses a vacuum to remove the molten solder.

With these features in mind, it becomes easy to understand how contact-less cleaning can alleviate the challenges associated with manual cleaning and will most certainly supplant it entirely in many applications. For example, there is no contact made with the pad or board, reducing the risk of mechanical damage. Precision controlled tips can clean pads too small and too close together for human operators to reasonably attempt. The software and equipment continually control thermal pro les and the vacuum collection nozzle automates the task of solder removal for more consistent and complete removal and less chance of molten solder owing into undesirable areas.

Stand-alone vs all-in-one contact- less designs

Until very recently, contact-less cleaning could only be performed on very large, high end machines and/or as an optional, retro ttable add- on that would allow the cleaning function to be added to the removal and replacement steps on a single rework machine. As demand is growing in the industry for a more cost-e ective contact- less solution, “stand-alone” contact-less cleaning machines are entering the market, o ering the need for substantially less capital investment, as well as a host of other potential bene ts.

Perhaps most obviously and signi cantly, stand- alone machines can o er greater throughput. Like “all-in-one machines,” they can be run by a single operator but, unlike all-in-one machines, when used side by side with a standard rework machine performing removal and replacement, they o er the opportunity for the establishment of an “assembly line” operation to increase speed and yields.

In this scenario, the operator begins by placing a PCB on the rework machine. After the machine removes the chip, the operator will transfer it to the adjacent cleaning machine on the desktop for automated cleaning. Meanwhile, he/she puts a second board on the rework machine to remove that chip, so two boards are in production simultaneously. When they are both complete, the operator transfers the rst board, now clean, from the stand-alone contact-less cleaning machine to the rework machine for chip replacement, and transfers the second board, with its chip now removed, to the stand-alone machine for cleaning. This becomes a continuous process.

Compare this to the operation of an all-in- one scavenger, where only one board can be worked on at once, most often completing component removal, cleaning and component replacement in a serial fashion. With a “stand- alone” scavenger, yields on reworked boards can be increased by 50% or more. Further, since stand-alone scavengers tend to use standard single phase power, whereas the larger machines often utilize 3-phase power, the di erence in power consumption and cost can be signi cant, particularly in a high volume 24/7 operation and should be factored into any return on investment equation.

It should also be noted that stand-alone contact- less cleaning machines o er the opportunity for manufacturers to more exibly, quickly and cost- e ectively add contact-less capabilities to their operations. If, for example, they have more recently invested in a standard rework machine lacking a scavenger add-on option, they can readily add a contact-less cleaning machine to work side-by-side with their current rework machine, regardless of make or model, without investing in a whole new rework machine. This provides an especially useful option, for example, for contract manufacturers suddenly “forced” to quickly add contact-less cleaning capabilities by their customers. Similarly, even if their current rework machine does o er a scavenger add-on option, they can choose a stand-alone scavenger instead and gain the bene t of increased throughput, as discussed above.

Machine features vary

Another advantage to contact-less cleaning over manual cleaning is that many machines — all-in- one, retro ttable and stand-alone alike — include a second programmable pre-heater placed under the board in addition to the nozzle heater. This allows the operation to reduce the need for the higher temperatures needed when using a single heat source, such as a soldering iron, and helps maintain optimal and consistent temperature throughout, thereby avoiding the heat-related pad and board damage endemic to manual cleaning.

However, di erent manufacturers use di erent heating technologies for this dual-heater con guration, mainly di ering combinations of convection heating and infrared heating elements, including IR/IR, IR/Convection and Convection/ Convection combinations. Further, the machines using IR utilize a number of varying technologies, such as red light IR and white quartz. The bottom line is that the technologies can o er a substantially di erent level of temperature control precision and this aspect should be investigated before purchase in order to optimize yields.

Machines also di er in their degree of automation; for example, some require the operator to move the board manually at certain points, which could impact success rates and throughput. Machines can also di er in the size of the BGA matrices that they accept.

Also di ering among machines is the quality of the automation itself—how easy it is for the engineers to e ectively program, how many steps are required for the operator to run a rework or cleaning sequence, the ease-of-use of the graphical user interface, how much training is required, and so on—all aspects that should be taken into consideration before investment.

* Fig. 3 – Courtesy of Michael Meilunas, Universal Instruments Corp., Advanced Research in Electronic Assembly (AREA) Consortium.

For more information

Web site: www.metcal.com.

red carpet

out & about in the industry

In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...

what’s happening in your business?

send your event pictures to advertising@smt today.com

Bob Black signs the August edition of SMT Today for Arnold Greenberg.

Metcal Scarab named as ‘Best Emerging Exhibit’ at NEPCON South China. The award was presented to the company on the 25th August.

Libra Industries is pleased to announce the promotion of Daniel McMaster to Customer Service Supervisor for its Richardson, TX facility.

OK International announces the appointment of Allen Zou as Director of Sales for Asia.

NCAB Group, one of the world’s largest suppliers of printed circuit boards, with headquarters in Sweden, is pleased to announce the hire of Ray Vandal as the General Manager for the Southeast Division

Sono-Tek have announced the addition of Michael Delia to its Application Engineering Team.

Long Service Awards presented by Mark McMeen, STI Electronics’ VP of Engineering Services, to Angela Harbin (left) and Marietta Lemieux (right)

Page 66 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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People Awards 2015

In 2015, SMT Today introduced an awards programme that recognises, acknowledges and celebrates outstanding personal achievements and innovation against the following categories within the electronics manufacturing industry:

Top CEO, Best New Product, Best Innovation, Best Inventor, Lifetime Achievement

The nomination and voting processes were handled on-line and the winners, selected by their peers, were presented with their awards at SMTAi Chicago on Tuesday 29th September.

TOP CEO

Recognition of an individual who, through their leadership and their achievements, have distinguished themselves by making a signi cant and lasting contribution to the world of electronics manufacturing.

Winner: Brian D’Amico of MIRTEC’s North American Sales and Service Division.

Brian has more than 33 years’ experience within the industry and in 2004, with his partner, Chan Wha Pak, established MIRTEC’s North American Sales and Service Division. Leading a team of talented sales and support professionals, Brian has achieved remarkable success in making MIRTEC inspection systems a recognised leader throughout North America.

BEST NEW PRODUCT

Recognition of an individual or team who have introduced a new product/s that represent quality and add value to the industry.

Winner: Conductive Containers, Inc., for their FIFO Reel Storage Inventory Management Design which combines ESD safety with e ective inventory management.

BEST INVENTOR/S

Recognition of an individual or team whose innovation/s have not only addressed a need and solved a problem but have also been used to drive improved e ciency, productivity and performance within the electronics manufacturing industry. Winner: Tetsuro Nishimura, President of Nihon Superior

Tetsuro is recognised throughout the electronics industry as the inventor of SN100C and the pioneer of micro-alloyed solders. In addition, since his promotion to President in 2004, he has overseen the expansion of Nihon Superior to its current position as a major supplier of lead-free solder to the global electronics industry.

Page 68 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

BEST INNOVATION

Recognition of clear visionary and transformative technology within the electronics manufacturing industry. This award will showcase innovations which have not only addressed a need and solved a problem but have also been used to drive improved e ciency and productivity of an organisation.

Winner: SmartLoop

The ultimate yield improvement tool developed by YXLON International and MIRTEC which removes the barriers to real process management in the electronics manufacturing industry.

LIFETIME ACHIEVEMENT

Recognises and promotes an individual who has made an outstanding contribution, exhibited leadership and provided inspiration within the industry over a sustained period of time.

Winners: Bob Black of Juki Automation Systems (JAS) is the Executive Operating O cer of Juki Corporation

and President and CEO of Juki Automation Systems, Inc.

Bob is the rst non-Japanese Executive O cer in Juki’s 75 year history, reports directly to the top management of Juki Corporation, advises on the worldwide SMT market, o ers strategies to continue Juki’s growth in electronic assembly and assistance to other Juki subsidiary companies.

Bob Heller of Saline Lectronics who has over 45 years’ experience in electro-mechanical design and

manufacturing.

Bob has not only seen the vast changes in electronic manufacturing over the years, but has also been a direct contributor to many of the technological advancements within the industry. As one of the founding employees at Saline Lectronics, as Senior VP of Engineering, he has been paramount to Saline Lectronics’ growth and success.

Reducing the expense and potential pitfalls of servicing diaphragm dispensing valves—a new paradigm

provided by techcon systems

New Disposable Materials Path technology will reduce risk of damage, decrease maintenance costs and enable more widespread use of diaphragm valves for materials like two-part epoxies

The exponential increase in the availability and use of advanced two-part epoxy adhesives is providing valuable benefits in a growing number of manufacturing applications in industries including electronic assembly, automotive, medical device and many more. Often enabling signi cantly faster and surer bonding than conventional adhesives, two-part adhesives can, for example, create tight bonds between components with small surface areas, replace rivets or screws at lower weight and even greater strength, and deliver any number of substantial production throughput e ciencies. For many operations, the labor and materials savings

have been signi cant, and will likely increase going forward.

especially risky for production lines that have numerous valves and/or use particularly fast- curing material, and su cient manpower must be provided to ensure that the ushing of each valve can be completed within the brief window provided by the working life of the material. Getting to a valve a “little too late” is not an uncommon scenario, and is another avenue that can quickly create the need for a several hundred dollar repair or the loss of a valve entirely.

In addition to the risk, the costs relating to these currently commonplace maintenance procedures can likewise be signi cant. Su cient solvent for several rounds of ushing per day must be purchased and inventoried. And, depending on the solvent used, proper disposal procedures must be followed, and related expenses accrued, with the threat of regulatory issues and nes always a possibility. Proper equipment— often a minimum of gloves and face masks— must be provided for each technician, and health and safety risks to personnel on the line and in adjacent areas—and associated liabilities—are always of concern. And, of course, there is the added expenses of technician training and labor, and the time it takes to conduct the ushing procedure itself, which eats into the productive manufacturing time of each shift.

The high costs of avoiding automation

In addition to all this, there is a hidden cost attributed to this current state of the dispensing industry, and although not showing up on ledgers, it is nonetheless signi cant. Seeking to avoid the risk and expense of periodically losing valves to hardened material, thousands of manufacturers are actually continuing the use of manual dispensing processes long after the volume of their operation would otherwise dictate that they upgrade their operations to automated dispensing processes. That is, instead of high speed operations, many operations are utilizing rows of technicians dispensing adhesives using a syringe and a foot pedal, incurring potentially avoidable labor costs that can be considered signi cant even in lower labor cost areas. Further, not only is speed and productivity su ering by this methodology, but so is quality and repeatability, with the ability to maintain consistent size and placement of material beads severely limited in a technician- dependent process.

However, the expanding use of two-part adhesives has also exposed an unfortunate gap in the existing product lines o ered by manufacturers of automated dispensing valves, and this de ciency has until now unfortunately excluded many manufacturers from fully bene tting from the advantages that these materials can provide. This article will discuss the current state of dispensing technologies vis-à-vis two-part epoxy adhesives, and introduce a new diaphragm valve technology—Disposable Material Materials Path technology—that will, at last, enable nearly any manufacturer to take full advantage of the potential bene ts of two-part adhesives, as well as gain even greater bene ts from materials such as cyanoacrylates and UV curable resins.

Fast curing adhesives—a double edged sword

One of the most desirable properties of two- part adhesives is their rapid bonding speed and, indeed, many of these products advertise a “working life” of only a few minutes. But what this also means in real world practice is that if production lines are unexpectedly stopped, even brie y, for any of a multitude of common reasons—from a need to clear a product collision to a technician taking a break—the immobile mixed epoxies can cure very quickly in the dispensing valve. This can destroy an expensive valve, or at least lead to the need for a several hundred dollar repair, not to mention the cost of the line down time needed to remove, clean or replace the valve. Down time can easily extend to up to 30-60

minutes or more, and if su cient replacement parts or stand-by repair resources are not immediately available, it can run into a loss of production of hours or days. Many operators justify shouldering the inventory carrying costs of several valves for this reason, and/ or maintain the expense of an in-house or nearby repair infrastructure.

It should also be noted that while most of these types of issues occur with two- part adhesives, there are also similar risks associated with cyanoacrylates and UV curable resins. While, theoretically, these materials are “always” protected from air, moisture and light by proper valve selection and proper workplace procedure, many operations nd that, in the real world, a technician forgetting to put a cap on the valve after the shift can quickly lead to a valve full of hardened adhesive in need of costly repair or replacement.

The risk and ongoing expense of routine maintenance

Even under more routine circumstances, such as at the end of each regular shift, operators must take the fast-curing properties of their dispensed materials into account when developing standard maintenance procedures. For example, in many operations, immediately upon scheduled stoppage of the line between shifts, technicians must quickly perform a ush of every dispensing valve nozzle to remove residual adhesive and ensure that it does not have a chance to harden. Time can be of the essence and the procedure can be

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| NOVEMBER 2015 ISSUE

Fortunately, these manufacturers operators will soon have little impediment to upgrading their dispensing operations to a fully automated solution. And, thousands more will be able to signi cantly reduce the risks and the ongoing maintenance costs of their current dispensing operations.

Introducing the first diaphragm valve with Disposable Material Path technology

At one time, operations dispensing high viscosity materials of about 30,000 to 1,300,000 centipoise utilizing rotary (auger) dispensing valves faced very similar problems to those outlined above, but, for most rotary valve users, this situation has

path insert that was removable, disposable and replaceable in a matter of seconds. Thousands of these valves have been proven in use, forever changing the economics of dispensing for many operations.

A signi cant investment in research and development has enabled Techcon Systems to create a similar solution for operations using low- to medium- viscosity materials of 1-50,000 centipoise that are dispensed using diaphragm valves. This new Disposable Material Path (DMP) diaphragm valve is scheduled to be released in July 2015. If it is nearly as e ective as the DMP rotary valve has been, the new diaphragm valve will help

thousands of operations signi cantly reduce their dispensing costs, and help thousands more step up to the bene ts of automated dispensing of low viscosity two-part adhesives without fear of damage to costly equipment.

How it works—and how it saves

In operation, the new DMP diaphragm valve operates not dissimilarly from standard top-of- the-line diaphragm valves. Air pressure forced through the air inlet port drives a piston assembly back, opening the material path and allowing uid to ow from the material inlet to the material outlet.

Relieving the input air pressure allows the piston return spring to close the diaphragm, ensuring fast cut-o of uid and the dispensing of an accurate, repeatable bead down to .002 ml in size, and an external stroke control adjuster makes it easy to ne-tune bead sizes with a high degree of precision.

However, in the design of the materials path, similarities between the new valve and standard diaphragm valves quickly end. The wetted parts of the DMP valve are designed to be self-contained, easily removable and disposable. Manufactured from black high density polyethylene, these highly durable inserts provide long life cycle, are compatible with a wide range of chemicals, and

cost just a few dollars each. They can be quickly accessed without removing the valve from the line, simply by removing two Allen screws from the valve housing. The estimated time to remove the old insert, replace it with a new one and be ready to re-start the line is about 30-45 seconds.

Users can analyze their labor and maintenance costs and decide on an optimal cleaning schedule, choosing to continue to ush the valves each time, do so periodically or not at all, instead simply replacing the inserts quickly and inexpensively at the rate they prefer, and thereby saving signi cantly on the purchase of solvent and associated labor, equipment and disposal costs. Even more valuable to most will be the fact that the new technology brings the risk of expensive damage to the valve due to hardening material down to zero. With DMP technology, the worst case scenario becomes the need to take 45 seconds to replace a very inexpensive part, as opposed to shutting down for hours to repair or replace a costly valve, as had been the case previously.

Can you benefit?

Unfortunately, this new paradigm in diaphragm valve technology is not for every user. While the DPM diaphragm valve is compatible with most commonly dispensed materials, users of particularly abrasive or caustic materials incompatible with polyethylene will need to continue to make do with conventional valves featuring metal or other appropriate wetted path.

Techcon o ers potential users a complementary service for testing the compatibility of their dispensed material with the new valve. For those who can bene t use it, the savings in materials and labor, and the potential boost in productivity can be signi cant.

Techcon Systems, a brand of OK International www.techconsystems.com.

long been a thing of the past.

The ultimate solution was a patented micro-valve technology developed by Techcon Systems, an OK International company specializing in the manufacturer of precision liquid dispensing equipment. The company re-imagined the state- of-the-art in rotary dispensing valves, creating a highly e ective valve with a low cost wetted

SMT Planning Challenges as

Flexibility becomes Volatility

By Michael Ford, Senior Marketing Development Manager,

Mentor Graphics Corp.

SMT machines, like any other automated process, are designed to run continuously to provide the best performance and return on investment. Even when SMT lines are running with high volumes on dedicated lines, their operation from a business perspective can still be signi cantly ine cient. If the product made cannot be delivered, either the machines have to stop and wait or dormant stock has to be created—either carries serious nancial consequences.

the factory is being a ected by the raw uctuation in short-term demand. As short- term changes happen, the factory can try to build products more closely in line with what the customer wants but su ers signi cant costs and opportunity losses when doing so in the traditional operating environment. Typically, the factory can be bu ered from uctuating demand changes by building stock while taking on the associated warehousing costs and risks of depreciation.

In today’s market, neither of these actions is acceptable. Thus a better solution for SMT shop- oor planning is a compelling need for an increasing number of today’s factories.

Losing Time

Common site-level planning tools, such as those provided with ERP or traditional MES systems, are inadequate to model speci c SMT production. Planning tools provided by SMT machine vendors have limited scope when used for their speci c machine platform. However, they lack the scope needed for factory-level solutions including support for machines on di erent platforms or from other vendors, as well as manual assembly operations. The complexity of SMT mainly stems from the link between material setup and machine performance, both during run-time and also for changeover.

Each SMT machine has a theoretical placement speed that can only be achieved under certain conditions. Certain parts may need the machine to operate more slowly because of their size or may need visual recognition before placement. A signi cant factor that reduces machine performance is excess placement-head travel between the placement positions and the many hundreds of material pickup locations. Inevitably, because of layout of materials on the machine, time is lost. The question from the optimization perspective is how can this loss be minimized?

Unlike other automated processes, the change from one product to another for SMT can come with a signi cant cost penalty because machines and lines have to stop running as materials are changed between products. Grouping products that share a common feeder setup can resolve this issue, but this can result in poor program performance and line balancing. With the needs of customers now geared toward production of smaller volumes of a much higher number of products and variants, planning an optimum SMT production oor is extremely challenging. Up-front product assignment decisions made by SMT programming create restrictions even before planning is started. Losses related to these issues occur routinely, but they are often hidden behind the statistics that show targets of productivity, thus preventing improvement.

Minimizing Loss while Achieving Productivity

Many companies are making the transition from enjoying stable consistent high-volume production to more volatile higher mix production. In so doing, they are reducing overall productivity by as much as 50% or more. This loss in capacity is inherently hidden behind the production plan data, which unlike the production rate measurement against scheduled target, is rarely measured or monitored. The goal for any operation faced with increasing product mix should be to minimize the loss of capacity and to achieve comparable levels of absolute productivity no matter what the product mix or volume may be.

These planning challenges are relevant across every industry sector involved in PCB- based electronics manufacturing. Telecom, consumer and industrial manufacturing has had an extended life of high-volume manufacturing. However, the number of products and variants is increasing while the longevity of product lifecycles decreases. The signi cant depreciation in the value of products stored throughout the distribution chain, between the factory and the customer for consumer products and those that incorporate evolving technologies, needs to be considered.

Other market sectors that have been faced with high-mix production for some time, for example, automotive, medical, and aerospace, know the critical issues that have to be dealt with in the planning decision- making process. Margins on products are tight, yet these products must operate in the most inhospitable environments at a high level of quality and reliability, and many of the products are safety-critical. Production planning must orchestrate the production operation so that it can meet nancial goals, minimize customer lead-time, reduce stock and raw materials investment, while also trying to minimize variations in the manufacturing processes with volatility in short-term delivery demand.

Although the inadequacy of planning tools for SMT production has been an issue for some time, their increasing importance re ects changing demand patterns in the market, in uenced by trends such as Internet shopping and direct B2B ordering. The control of product supply and demand in the medium and long term will always be managed by product managers and marketing teams, who sense market conditions and competitor activity and in uence demand using pricing and advertising.

For the factory, however, short-term variation cannot be managed this way. With a very short or even non-existent distribution chain,

Figure 1: Optimization of SMT based on the single machine.

Continued...

Page 72 The Choice of Publication for the Electronics Industry

| NOVEMBER 2015 ISSUE

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Software available from the machine vendors create optimized machine programs, as do leading third-party optimization providers that can provide support across a number of platforms and vendors. As well as optimization of the machine program itself, optimizers need to consider the balance of work between connected machines in a line, based on the allocation of materials. This is a critical part of optimization because the line can only be as fast as the slowest machine. With machine-vendor–supplied software, where some machines or processes are on di erent platforms with incompatible software, this optimization has to be done manually with much iteration until a satisfactory balance is achieved.

Where a mix of products needs to be produced, the time taken to change from one product to another on an SMT machine has to be considered. The tear-down and setup of hundreds of materials between products, including material veri cation, can take many hours. Changeovers can reduce productivity by half or more, depending on the number of changeovers per line per day when operating in a high-mix SMT environment.

way or the other, but each also has severe performance limitations.

Interactive Automated SMT Planning Across the Factory and Across Machines

To help solve these issues, a SMT-speci c optimization program is needed that combines both the optimization of work- order scheduling with the optimization of materials grouping for machine optimization, doing both simultaneously. Such a solution needs to be able to automatically nd every possible opportunity for productivity enhancement in even the most highly volatile production operations. It needs to be able to use product detail derived from machine programs and related systems, extracting the exact material requirements and placements for products that are to be made. It also needs to have visibility of feedback from the operation on the shop- oor to understand the current status and progress. This could be the simple entry of the currently running production condition at the time of optimization, but could also extend to integration with the real-time feedback of progress from the line using direct machine-

oor so that existing work-orders can be easily cut short without the need to count, remove and re-assign the physical materials prepared in advance.

Such a production plan software would be able to take the master site plan, typically from ERP and, as part of the optimization process, create operational plans on a machine and line basis. Work-orders at the machine level would be used to associate and manage assignments of operational data, such as the machine programs, material setups and groups, as well as material consumption information used as part of the simulation and optimization process. Once optimized, the resultant work-order sequences would be ready for direct execution following the time-line provided.

Leveraging the power that such a SMT production planning solution provides would have a profound e ect on the shop- oor planning operation. The planning team simply needs to ensure that data from all sources is updated and available. The optimization policy is set up within the production plan software, specifying the relative importance of key planning optimization criteria to ensure the resulting plan exactly meets the manufacturing needs. This policy can then be adjusted to create what-if scenarios. The production planning software executes to create the best possible schedule.

Figure 2: Sequence of work-orders and materials set-up time is most signi cant.

This loss can be reduced by creating a single common material setup that can accommodate a group of products. For sequentially running products within the group, all or most of the materials will remain in the same position at product changeover. With the use of common material setups, the positioning of materials remains a critical factor a ecting SMT program e ciency. However, the order of materials on each of the machines is determined by the combination of di erent products, which means that the program e ciency for each product is going to be signi cantly slower and less. This technique also requires prior decisions to have been made about which products should be grouped together. Without thorough analysis of the delivery requirements for the shop- oor, the bene t from the grouping of products is severely limited, as lines e ectively become dedicated to a group of products, which may not match the business need of production, similar to the use of lines dedicated to a single product.

SMT planners today are faced with a chicken-and-egg situation. Should product groups that have common material setups be created with primary consideration of optimization for program e ciency to then be utilized by the planning optimizer, or should the work-order sequence be optimized following delivery demand after which product groups are created to minimize changeover losses? Current planning tools from all sources approach the problem in one

interface connections. The more accurate, detailed and timely the production progress

information, the greater the opportunity for risk-free optimization of near-term processes. A factory-wide production planning solution also needs to be able to access information about raw materials. Interfaces with ERP can yield information about available material stocks, although ERP has limited knowledge of materials on the shop- oor. An MES system tracks materials in a more positive way on the shop- oor and so yields better results, reducing the risk of material starvation when executing optimized schedules. The adoption of Lean material management software can take this one important step further, by not only providing an accurate knowledge of material availability across all warehouses and shop- oor locations, but also providing just-in-time materials logistics. The use of Lean materials logistics eliminates the storage of excess materials on the shop-

Conclusion

Sudden short-term delivery demand changes from customers is increasing pressure to improve planning by taking more consideration of the SMT machines in their environment. Because of the lead-times of materials ordering, the basic business process is unlikely to change for medium and long- term planning. However, SMT production planning focuses on near-term optimization, which requires intimate knowledge of speci c SMT production con guration capabilities, product models, material availability, and live production progress.

A new generation of production planning tool, for example, Valor Production Plan from Mentor Graphics, is able to accurately model real-world SMT performance to create an optimum production environment while also satisfying mercurial customer demand. This new breed of planning tools allows productivity levels to recover or remain at the levels of those expected from high-volume production while achieving high-mix, with exibility - an absolute must for today’s SMT manufacturing.

Figure 5: Adjusting settings to create what-if scenarios.

Figure 3: Information about production progress is an important factor for optimization.

Page 74 The Choice of Publication for the Electronics Industry

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