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Published on Jan 02,2018
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P:01

The Choice of Publication for the Electronics Industry

115 Years Emil Otto - A Story of German History

Design for Test in the US Market

WOMEN IN TECHNOLOGY

red carpet

Who’s doing what, where?

meet the CEo

David Suraski, Executive Vice President, Assembly Materials Division of AIM Metals & Alloys LP (cover)

Feature Interviews

Peter Tallian - BTU International Luis Bresil - ZF TRW

| FEBRUARY 2016 ISSUE smttoday.com

P:02

Innovative Solutions for Electronic Manufacturing

Laser Depaneling

stand 1739

Programmable focus position +/-10mm

Programmable spot size

Pressurized optical path to avoid optics contamination Automatic power meter for “power on workpiece” measurement High efficiency fumes and dust extraction

www.osai-as.com

P:03

See you at 1334 at IPC APEX booth

YOUR TEST

AND INSPECTION PARTNER

TR7700QI

Prime 3D AOI Technology

• Quad Digital Fringe Pattern projection technology

• High Resolution inspection up to 008004in micro-components

• Adaptive 3D inspection range up to 20mm

• IACS Smart Conveyor System

INSPECT WITH CONFIDENCE

Discover world-class inspection solutions chosen by leading global EMS.

SPI + AOI + CT AXI + ICT ONE STOP SOLUTION

Meet us at IPC APEX 2016 Las Vegas Convention Center Las Vegas, NV, USA Booth 1334, March 15-17, 2015

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www.tri.com.tw

P:04

welcome

to smt today

Happy New Year, and welcome to the latest, and largest yet, edition of SMT Today – a high quality publication created for the global electronics industry which provides the best content and largest distribution through the latest technology channels.

This publication coincides with the IPC APEX EXPO, “the only event for progressive education and technology to capitalise on tomorrow’s opportunities,” being held March 15th – 17th 2016, in Las Vegas. This edition of SMT Today includes an introduction to the show along with technical articles, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts.

In particular, we have interviews with Mr David Suraski, Executive VP Assembly Materials Division of AIM Metals and Alloys LP and Mr Peter Tallian, BTU International’s newly appointed General Manager. We also have many interesting features including an article written by W. Scott Fillebrown, Chief Technology O cer for Libra Industries, Inc. on Design for Test in the US Market. We also have a feature on the many companies who are Celebrating Years in the Industry this year, a new 2016 Dates For Your Diary page, along with our usual Red Carpet extravaganza.

Throughout 2016 SMT Today will be attending a number of trade exhibitions, and as a team will be delighted to meet up with our readers and contributors, providing an opportunity to share what additional services SMT Today can o er in the form of delivering responsive websites, successful marketing campaigns and e ective video productions.

The next issue of SMT Today will be published in April. This issue will focus on SMT Hybrid Packaging in Nuremberg, so if you would like to advertise with us or have any articles that you would like included, please don’t hesitate to contact me at [email protected]. The editiorial and advertising deadline will be March 13th 2016.

In the meantime, I would like to extend an open invitation to exhibitors and visitors to our Booth #3323 at IPC APEX EXPO, and we look forward to seeing you in Las Vegas!

Kind regards,

Wendy Tindle, Editor

Email: [email protected] Skype: wendy-smttoday Call: +44 1292 834009

Wendy Tindle’s career has largely involved working for 2 major multi-national companies in the comms distribution and aerospace industries, based both in the Middle East and the UK. These roles have primarily included responsibilities in the business related functions within complex cross-functional business groups.

Wendy has held management positions within these disciplines, such as sales and marketing, project/event management, customer services and procurement, working with multi-cultural, global supplier and customer bases.

P:05

magazine contacts...

Editor

Design Website

Wendy Tindle [email protected] +44(0)1292 834009 skype: wendy-smttoday

BBD Creative bbdcreative.com +44(0)1292 280022

smttoday.com

Advertising Enquiries

To enquire about available advertising opportunities, please contact:

[email protected]

NEXT EDITION

April’s edition will focus on SMT Hybrid Packaging, Nuremberg, Germany

(Editiorial deadline 13th March 2016)

8

IPC APEX EXPO 2016

14

Director Spotlight

10

Years in the Industry

50

productronica Recap

70

Industry News

inside this issue...

Technology Today

Industry experts share their knowledge

6. Reach Reversal

20. An ODE to the Unsung Technology Innovators

22. Global Architectural LED Products Market Is Expected to Reach US$ 10,751.1 Mn by 2021

24. Nextek Inc. Partners with Nordson YESTECH to Provide Tomorrow’s Inspection Technology for Today’s Products

26. Development of Halogen Free High Wetting Solder Paste

30. Why Extraction and Filtration Technology Must Be A Substantial Part in Electronics Manufacturing

32. Positive Improvements from Creating a Connected, Intelligent and Traceable Production System

34. Design for Test in the US Market

38. 115 Years Emil Otto—A Story of German Industry

44. GreatLakesEngineeringCompanyPro le

46. Interview with Peter Tallian

52. E ectOfBiContentOnPropertiesOfLowSilverSac Solders

58. Ember Industries’ Spark Cannot Be Doused

62. Finding the Perfect Partner

64. From Asset-centric Management to Service-centric Relationships

66 Interview with Luis Bresil of ZF TRW

68 Overcoming Reliability with Selective Wave

76 Women in Technology

78 Ask Fred Cox

80 Yamaha Advanced Assembly Technology Maximizes Opportunities in Rising Markets

Shows/Events

IPC APEX EXPO 2016, Las Vegas

14 Director Spotlight Interview with industry experts

14. David Suraski, Exec VP, AIM Metals and Alloys LP

36 Years in the Industry People awards 2015

42 New Products Exciting new industry innovations

50 productronica Recap 70 Industry News

What’s happening in the world of electronics

74 Red Carpet

Photo gallery of industry personalities and events

Articles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every e ort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers for loss arising from articles/information contained and published. All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

6

8

P:06

REACH Reversal

TECHNOLOGY TODAY INTERVIEW

By Fern Abrams, Director of Regulatory Affairs and Government Relations, IPC

A September 2015 European Union (EU) Court of Justice ruling on the de nition of articles under the EU Registration, Evaluation, and Authorization of Chemicals (REACH) regulation will have a profound and far reaching impact on manufacturers of electronics and other complex articles.

at the level of the “simple” article, rather than at the aggregate level of the “complex” article that was currently being used. The updated guidance confirms that “the substance concentration threshold of 0.1% (w/w) applies to every article supplied. This threshold applies to each article of an object made up of more than one article, which are joined or assembled together.”

What it Means for You

The court ruling directly a ects the disclosures required under REACH Articles 7 and 33. This means that manufacturers must understand and report the presence of candidate list SVHCs (current count is 163) at a much lower level in their products. So rather than disclosing only if the level of an SVHC is above 0.1% by weight of your entire product, manufacturers must disclose its presence for each wire, cable, plastic casing, etc. that contains it above 0.1% by weight.

Companies throughout the supply chain should already be taking steps to evaluate their infrastructure to ensure that they can support the collection and storage of substances of concern data for each component article in their products.

Electronics companies already collecting Restriction on Hazardous Substance (RoHS) data at the homogenous materials level are likely well positioned to meet this challenge by extending their data collection e orts to include REACH SVHCs. However, even for electronics companies used to complying with RoHS, compliance with this ruling will present a signi cant challenge as new substances are added to the REACH SVHC list approximately every six months. Although these requirements existed before the ruling, the OAAAA decision means a much larger number of articles will be found to exceed the REACH thresholds. Manufacturers of large, complex articles, who previously could ignore SVHCs in small parts will now be subject to REACH.

Companies that are using tracking spreadsheets and may not have an IT system in place to e ciently manage the new obligations will want to reevaluate their strategies and consider a software solution that follows accepted standards such as the IPC-1752, Materials Data Exchange Standard.

Companies will also need to assess their compliance systems to ensure they have a strong process in place for assuring compliance and cooperation from parts suppliers. The source, reputation and the quality of information provided within the supply chain are increasingly becoming a factor in sourcing activities for companies and is key to overall regulatory compliance.

Failure to comply may result in enforcement action by the EU authorities. Equally of concern is the potential for non-governmental organizations (NGOs) and consumer organizations to launch damaging public campaigns against high pro le companies found to be in non-compliance.

This March, IPC will offer two workshops to help industry understand the changes and o er suggestions in updating regulatory compliance programs. For more information, visit IPC’s Calendar of Events at www.ipc.org/events.

The REACH Regulation

The REACH Regulation, which was issued in 2006, regulates the production and use of chemical substances in the EU. REACH reporting requirements apply not only to chemical producers, importers and suppliers, but also to companies whose products, including nished goods, are sold in the EU.

REACH de nes an article as “an object which during production is given a special shape, surface or design which determines its function to a greater degree than does its chemical composition.” However, the REACH regulation did not previously de ne how products that contain several articles (components) should be interpreted.

REACH contains several tracking and reporting requirements for manufacturers of articles containing chemicals regulated under REACH. Because the applicability of these requirements was based on the percentage by weight of chemicals in an article, the de nition of article is a critical determinant of applicability.

REACH Requirements for Producers of Articles

The main requirements applicable to articles manufacturers are contained in Articles 7 and 33 of the REACH Regulation.

Article 7(2) requires producers and importers of articles to notify the European Chemicals Agency (ECHA) if the articles contain a substance on the Substances of Very High Concern (SVHC) Candidate list, If the total amount of the substance in all articles produced or imported into the EU exceeds one ton per year, and if the substance is present above the threshold concentration of 0.1% weight by weight. Noti cation is not required if the manufacturer can exclude exposure to people or the environment during use, or if the substance has already been registered under REACH for your particular use.

Article 33 requires suppliers of articles containing an SVHC above the 0.1% threshold to inform the recipient of the article, and, on request, the consumer, and to provide similar information in response to consumer inquiries within 45 days.

The Dispute

The thresholds for both Articles 7 and 33 are based on a percentage by weight of the SVHC chemical relative to the weight of the article. Because the Regulation did not address complex articles made up of many smaller articles, this issue was left up to interpretation. In its original 2008, and revised 2011, guidance on reporting SVHCs in articles, ECHA, which was created to implement

REACH, suggested that the 0.1% threshold should be based on the weight of the entire article as imported or as provided to the customer.

However, six countries (Austria, Belgium, Denmark, France, Germany and Sweden) disagreed with this guidance. The key issue of disagreement was whether or not components or parts of nal product continue to be considered articles once they are assembled into a nal product or if only nal product itself is considered an article. The dissenting countries position is summarized with the phrase

“once an article always an article (OAAAAA)”

The countries argued that SVHC that is above the 0.1% level in any individual article (component) within a product may pose a health or environmental risk and should trigger the reporting and communication obligations for the SVHC.

In 2014, the French Federations of Commerce and Distribution Undertakings (FCD) and of DIY and Home Improvement Stores (FMB) lodged a request for a preliminary ruling with the French Council of State. The request challenged the position of the French Ministry of Ecology, Sustainable Development and Energy, seeking a ruling on whether the obligations, resulting from REACH Article 7(2) and Article 33, apply only with regard to the assembled article, or to each of the elements which meet the de nition of’ “article.”

The French Council of State referred the case to the European Court of Justice, asking for a preliminary ruling. Written observations were submitted to the court by the six dissenting member states, plus Norway, Greece, Ireland and the Commission.

Shifting De nitions

On September 10, 2015, the EU Court of Justice released a ruling siding with the dissenting states. The ruling states that producers must calculate the levels of SVHCs in their products at the level of the “simple” article, rather than at the aggregate level of the “complex” article that is currently being used.

On December 17, 2015, the European Chemicals Agency (ECHA) published updated guidance on requirements for substances in articles. The guidance is a “fast-track update” to make “quick” corrections to the guidance so that it conforms to the September 10, EU Court of Justice ruling on the calculation of levels of SVHCs in articles under the REACH Regulation.

The Court of Justice ruling said that producers must calculate the levels of SVHCs in their products

Page 6 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

P:07

FOR TOMORROW’S TECHNOLOGY

Think Forward

PLAN NOW FOR IPC APEX EXPO 2016

Where will you prepare for tomorrow in 2016? At the premier electronics manufacturing industry event: IPC APEX EXPO 2016, of course. Get ready to experience a renowned combination of education, technology,

networking, and the largest collection of industry suppliers...all geared to

LAS VEGAS/NEVADA

provide the forward thinking you need to create tomorrow’s technology.

SEE YOU IN MARCH!

Join our keynote speakers for a unique look at how the industry will rede ne the concept of “business as usual”.

Dean Kamen, Inventor & Entrepreneur

“Inventions and Innovations”

Peter Singer, Strategist and Senior Fellow at the New America Foundation

“Inside the Rise of the Warbots”

LAS VEGAS CONVENTION CENTER

CONFERENCE & EXHIBITION: March 15-17 MEETINGS & COURSES: March 13-17 www.IPCAPEXEXPO.org

PREPARE FOR TOMORROW’S TECHNOLOGIES BY REGISTERING TODAY!

P:08

IPC APEX EXPO 2016

las vegas, USA | 15th – 17th march

IPC APEX EXPO®—’the only event for progressive education and technology to capitalize on tomorrow’s opportunities.”

How do you capitalize on tomorrow’s opportunities? By being a forward thinker. IPC APEX EXPO 2016 state that they will deliver a critical combination of progressive education and tomorrow’s technology. Come along and be part of the year’s best opportunity to learn and experience applied technology with real-world applications for tomorrow’s needs. This is Forward Thinking for Tomorrow’s Technology

IPC APEX EXPO 2016 is a ve-day event like no other in the printed circuit board and electronics manufacturing industry. Professionals from around the world come

together to participate in the Technical Conference, Exhibition, and Professional Development, Standards Development and Certi cation programs. These activities o er seemingly endless education and networking opportunities that can impact your career and company by providing you the knowledge, technical skills and best practices to address any challenge you face

By attending IPC APEX EXPO 2016 you will have access to: the latest technical research; industry best practices; the solutions and subject-matter experts you need to solve challenges in a fraction of the time it takes on the job; the largest electronics industry collection of top suppliers, live demos, and extreme innovation; connections in educational sessions, on the show oor and during networking events - 47 di erent

countries and 49 U.S. states are represented in the show attendance!

Every Representative of the supply chain – PCB manufacturers, designers, OEMs, EMS companies and more, attend IPC APEX EXPO! Therefore, this is your opportunity to strengthen business relationships through access to a diverse range of colleagues and thought leaders.

This year IPC APEX EXPO 2016 has changed location and is being held in Las Vegas Convention Centre from the 15th – 17th March 2016, and is shaping up to be one of the most exciting and successful exhibitions yet. In this article we’ve compiled a snapshot of what some of the exhibitors will be displaying on theshow oor:-

Page 8 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

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Akrometrix Booth No. 1623

Akrometrix LLC, the leader in elevated temperature surface characterization, will exhibit Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix will also demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production re ow processes.

BTU International Inc Booth No 1837

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will showcase its Recipe Pro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), as well as highlight the latest version of the Energy Pilot software and Industry 4.0 compliant solutions. Integrating ECD’s recipe generator technology into BTU’s advanced re ow systems o ers manufacturers a streamlined and e ective approach to initial recipe generation for higher yield results. The pro ler will reduce non-productive time by streamlining the set-up process. Recipe Pro is the only recipe generation tool in the industry to include convection rate in the recipe generator algorithm, pairing it perfectly with PYRAMAXTM’s closed loop convection control.

Cogiscan Booth No. 2325

Cogiscan Inc, the leading track, trace and control solutions provider for the electronics manufacturing industry, will highlight the latest version of its Factory Intelligence Software. The latest release includes

signi cant changes in terms of functionality and user experience. Factory Intelligence is a powerful tool designed to drive continuous improvements in operational e ciency. This is accomplished by real- time monitoring of all operations through the use of intuitive and meaningful dashboards presenting Key Performance Indicators (KPIs). The new Cogiscan Factory Intelligence also will be demonstrated in the Juki booth #763. This new module is a simple add- on to the Juki total line TTC software solution that is also developed by Cogiscan.

Acculogic Inc Booth No. 1166

Acculogic Inc, a global leader in electronic production test solutions, will be demonstrating the FLS980 Series III and new Scorpion Briz Test & Programming station. The FLS980 Series III with the Ultimate Accuracy Package Option along with high throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution and MicroScan miniature image observation and testing solutions also will be displayed. The Scorpion Briz is a compact, totally customizable, all-in-one test station. It can be con gured to perform in-circuit, functional and boundary testing, and in-system programming. As a result, in one manufacturing stage users can achieve the highest level of test coverage, perform device programming, and meet and exceed throughput requirements. This makes the Scorpion Briz a truly a ordable tester.

AIM Solder Booth: 3100

AIM Solder, a leading global manufacturer of solder assembly materials, will feature their groundbreaking M8 No Clean Solder Paste along with their full line of solder assembly materials. M8 No Clean Solder Paste has been formulated to address the most demanding requirements confronting today’s SMT assembly market. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8’s post-re ow residue passes all IPC, BONO and tough changing environment test speci cations, making it the ideal choice for automotive and high performance/high reliability applications. M8’s robust characteristics and stable performance improves every facet of the PCB assembly process.

Computrol Booth No. 1546

Computrol, Inc, a world-class provider of mid- to low- volume, high-mix electronic manufacturing services will have representatives available to discuss high-mix electronic manufacturing and lot traceability capabilities. Utilizing state-of-the-art manufacturing equipment and processes, Computrol focuses on prototyping and low to medium volume, high-mix production of PCB, box build, cable harness and backplane assemblies. The company’s world-class team has the experience to make any design project a success.

Count on Tools Inc Booth No. 2801

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will celebrate COT’s 25-year anniversary with several promotions and giveaways. Additionally, the IPC APEX EXPO will mark the o cial launch of the QWIKTRAY program for the U.S. market. The new QWIKTRAY

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system has been developed to provide low-cost, custommatrixtraysformanytypesofelectronic components. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exist. Customers no longer have to place these components by hand.

The LumenX programming platform is a breakthrough in programming technology optimized for the latest generation of eMMC devices and large le sizes. The LumenX programmer delivers the highest performance managed and secured programming for the lowest total cost per part. The LumenX programming platform is available in the award winning PSV7000 automated system and manual con gurations.

Juki Automation Systems Booth No. 763 Juki Automation Systems (JAS), Inc., a world- leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, will display a high-mix line along with several updated exible solutions designed for both high-volume and high mix environments.

Kurtz Ersa, North America Booth No. 1326 Kurtz Ersa North America, a leading supplier of electronics production equipment, will introduce its new line of selective solder, re ow and rework equipment and more. These new products include; VERSAFLOW 4/55 the next generation of the worldwide leading VERSAFLOW inline selective soldering system; Ersa stencil printer VERSAPRINT S1-3D combines precise stencil printing and 100 percent 3D-SPI in one system; ERSA’s ROBOPLACE brings in a new era in man - machine collaboration during the soldering process. With its exible dual-arms technology it frees up the operator to turn to more demanding tasks; Ersa Hybrid Rework System HR 600/2 forms the base for the VOIDLESS Rework System. In modern electronic manufacturing, components with solder pads located on the underside of the component body are often used. During the re ow process gas inclusions in the joints have occurred, the so-called voids, which can, especially in power electronic applications, cause premature eld failures. Reworking the assembly is therefore

inevitable, and just for this type of rework, the Ersa Hybrid Rework System HR 600/2 VOIDLESS has been developed.

Essemtec Booth No. 962

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging will display technical innovations in 3D assembly and jet printing with live demonstrations.

Europlacer Booth No. 1410

Europlacer, a manufacturer of market- leading flexible SMT placement machines, will demonstrate its full line configuration, representing unparalleled exibility and value. Core to the con guration is the ability to manage the entire SMT line without compromise. Europlacer o ers the capability to print, dispense, inspect, place, test, convey and re ow the full range of devices from 01005 and 0.3 pitch BGAs to 99mm connectors and 300g heatsinks. Europlacer has it all in a single line solution developed, manufactured and supported under one roof. Products to be displayed during the show include the EP710, the iiNEO and a suite of o ine productivity systems.

CyberOptics Booth No. 2721

CyberOptics Corporation will showcase its new SQ3000TM 3D Automated Optical Inspection (AOI) system. The SQ3000TM 3D AOI system maximizes ROI and line utilization with multi- view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary Multi-Re ection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms o ers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

Data I/O Corporation Booth No. 1635

Data I/O Corporation, the leading global provider of advanced programming and IP management solutions for ash, ash-memory based intelligent devices and microcontrollers, will showcase the new LumenX programming technology integrated into the PSV7000.

Page 10 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

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EVS Booth No. 1141

EVS International, the leader in solder recovery, will showcase the new EVS 500LF lead-free version and EVS 8KLF.The simple but ruggedly designed EVS 500LF is highly ISO14001 compatible as it complies with the ISO mantra of reduce – reuse – recycle, enabling the customer to reduce solder consumption by up to 50+ percent, an unheard of reduction in the electronics production industry. The EVS 500 also can help to reduce dedrossing time by 75 percent and waste dross o -site by up to 85 percent. The system meshes perfectly with environmental control systems and also helps to reduce customers’ carbon footprint, an important environmental imperative, by utilizing the latent heat already imputed to the dross to help the recovery process.

Fancort Industries Inc Booth No. 3010

Fancort Industries, Inc., now in its 44th year, will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its new line of SMT products, including the new FD Series Desktop Robotic Dispensing, inline and oor mounted depanelers and laser marking from Getech, the JAPAN UNIX SOLDER MEISTER® Desktop Soldering Robot DF Series and its new Magnetic Universal Fixture.

FS Inspection Booth No. 1445

FS Inspection will exhibit their complete series of high magni cation visual inspection systems and demonstrate their latest development – the VERSAMagTM High-De nition Inspection System. FS Inspection has designed its inspection systems to meet the varied needs of electronic component and assembly applications. Each system is ergonomically designed with state-of-the-art technology to provide a complete line of advanced, accurate and a ordable inspection products.

Japan Unix Booth No. 3010 Japan Unix, a solutions provider for manual and soldering automation, will showcase a range of desktop soldering robot, laser and ultrasonic soldering solutions. Products on display will include: Solder Meister High Performance Soldering Robot: UNIX-410 Series, Laser soldering robot and

Ultrasonic Soldering: No need for ux - Ultrasonic soldering helps manufacturers to reduce or eliminate the use of halogen material, which is the main chemical in ux.

®

Kester Booth No 757.

Kester’s booth will o er attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products, including the recently launched NP545 a zero-halogen, lead-free, no-clean solder paste with a six-month unrefrigerated shelf life; NP505-HR a zero-halogen, lead-free, no-clean solder paste formula developed speci cally for high-reliability applications; and NF372-TB a zero-halogen, no-clean, low solids liquid ux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies. On March 15 at 3:30PM, Kester’s Denis Jean will be presenting “How to Choose the Right Flux for the Selective Soldering Application”. This session will focus on the modern alternatives to the classic wave solder process.

KIC Booth No. 2628

KIC will demonstrate how its smart oven technologies lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand. Over the last decade, re ow oven manufacturers have done a great job of making their ovens more stable, reliable and less expensive. Looking forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies.

Inovaxe Booth No. 2322

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, will highlight its SMART InoAuto Mix part Storage System and its patented Smart InoMSD cabinet. The InoAuto SMART Mix part cart stores 480 of 8 mm equivalent 7” reels and 160 of 8mm equivalent 13” reels. It also contains a 42” by 15” SMART Tray to store printed circuit boards, wa e trays, and or bulk materials. One platform can accommodate multiple part sizes

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challenges the electronics industry is now facing, such as improvements in reliability, thermally stable joining, and lead-free die attach. Products such as SN100CVTM P506 D4 and the Alconano Nano-Silver Paste will be demonstrated.

Koki Company Ltd Booth No 2613

Koki Company Ltd. is launching new Halogen Free Solder Paste S3X58-M501, a halogen free solder paste with higher electrical (Surface Insulation Resistance / Electro-migration Resistance) and Chemical Reliability.

To follow the transition to halogen free products, solder paste without halogen activator was facing the challenge of maintaining equivalent wetting ability and heat / electrical resistance as activator with halogen. The new activator in S3X58-M501 maintains activation ability in the solder ux by suppressing reaction at room temperature.

Scienscope International Booth No. 1038 Scienscope International, a complete inspection solutions provider, will launch their new AXI5100c X-ray Component Counter for the rst time and showcase some of its agship AXI products: X-SCOPE 1800, X-SCOPE 6000 and AXI- 8000. The AXI5100c is a new innovation in counting components, capable of counting the latest 03015s as well as (4) 7” or (1) 15” reels of various thicknesses. Beyond counting reels, the AXI5100c can also count components in ESD bags, storage sticks, and trays. Even more interesting, the AXI5100c also can perform traditional X-ray inspection of electronics and counterfeit component detection, making it the obvious choice for exibility. The AXI5100c -i is a fully automated inline system that can handle loading and unloading of components using various conveyors, loaders/unloaders and even robots.

Specialty Coating Systems Booth No. 2925 Specialty Coating Systems (SCS) will showcase the Precisioncoat V, Ionograph® BT Series and Parylene coating services for the electronics, defense, medical device and automotive industries. The SCS Precisioncoat V provides more than a dependable layer of protection, it is a total system solution that ensures accuracy, repeatability and high throughput for a wide range of automated material application, all in a smaller footprint to maximize valuable production oor space. The SCS Ionograph BT Series is available in small, medium or large sizes to accommodate customer board requirements. The ionic contamination test systems o er the same convenience, accuracy and reliability as their predecessors, but have been modi ed to enhance safety and ease of maintenance.

SEHO North America Inc Booth No. 1850 SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight the SelectLine-C and GoSelective- LS selective soldering machines. SEHO continues to release new technologies to ensure higher productivity in electronic productions with exible and innovative machines. The SelectLine-C machine concept is consistently modular, thus ensuring clear cost bene ts. With the new GoSelective-LS, SEHO has introduced an innovative system that represents the smart entry into selective soldering. Featuring an outstanding ROI, the GoSelective-LS e ciently replaces manual soldering processes.

Metcal Booth No. 3412

Metcal will show their USF-1000 Solder Wire Feed System for the rst time, which adds a new level of control and convenience to the soldering process. Metcal will also be demonstrating their proven rework and repair equipment, including the Scarab Site Cleaning System which ensures accurate and repeatable cleaning of the component pad in one user-friendly system; the Scorpion Rework System which ensures accurate and repeatable cleaning of the component pad in one user-friendly system; the MX-5200 Soldering System and more.

Nihon Superior Co. Ltd Booth No. 2610 Nihon Superior Co Ltd, an advanced joining material supplier, will showcase newly developed products that o er solutions for some of the

Seika Booth No. 1145

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will be exhibiting more than 20 SMT Machines at APEX. The Seika team will be available to demonstrate industry-leading equipment from Sayaka, Hioki, SAWA, McDry, Eightech, Unitech, Andes, MALCOM and DENON INSTRUMENTS.

Page 12 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

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Sono-Tek Corporation Booth No. 1141 Sono-Tek Corporation will showcase a new integrated ultrasonic nozzle generator for all uxers in its SonoFlux line. Beginning in 2016, Sono-Tek will be incorporating its latest ECHO ultrasonic generator technology in all new SonoFlux spray uxing systems, including the SonoFlux Servo, SonoFlux EZ and SonoFlux 2000F systems, resulting in process improvements. ECHO enables very fast swap out of any nozzle without changing any settings, making maintenance and replacement of nozzles a breeze. In addition, the ECHO is more than twice as energy e cient as its predecessor, and is certi ed CE and RoHS compliant.

Viscom Booth No. 1763

Viscom will present the world’s rst and only combined in-line 3D AXI/3D AOI system. They will unveil the new and completely redesigned version of its most successful and well established X7056 in-line automatic X-ray inspection system .Now equipped with powerful digital at panel detectors and X/Y stages, the new X7056 FPD allows for even more accurate planar 3D analysis of hidden ne-pitch solder joints such as μBGA, QFNs and stacked packages (PoP), achieving an immense improvement in X-ray image quality. On top of that, the X7056 combo system is now optionally equipped with Viscom’s new high-speed 3D XM camera module with high resolution top-down and up to eight angular views. Fast shadow- free 3D automatic optical inspection (AOI) and simultaneous 3D automatic X-ray inspection (AXI) enable operators to reliably detect 100 percent of visible and hidden solder defects with highest exibility at maximum throughput.

VJ Electronix Inc Booth No. 1834

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, will demonstrate their

improved Micra system, XQuik II with AccuCount Technology, Summit II and Vertex II. The enhanced Micra provides a larger 35 mm alignment eld of view, expanding its range of applications into more automotive, medical and military/aerospace products. The revolutionary XQuik II with AccuCount Technology is helping manufacturers around the world keep accurate inventory of their component reels; the new XQuik II handles reels from 7 to 15”; the new Summit II is the latest semi- automated rework system. Improved ergonomics combined with next-generation controls and proven heating technology provide the greatest performance and exibility. Finally, the Vertex II incorporates the latest advances in X-ray imaging components with o -axis viewing, all in a smaller footprint. The system o ers VJ’s proven production readiness, superior uptime and unmatched value. The Vertex II, now CT ready, is equipped with a standard high contrast, high resolution CMOS digital detector, can be con gured with a variety of X-ray sources and optional detectors to meet speci c application needs.

KYZEN Booth 1869

KYZEN announced that it will reveal the latest research ndings from controlled laboratory tests conducted in the interest of improving stencil printing reliability. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key ndings and related video proofs also will be shared.

MIRTEC Booth 1334

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems. “We are very excited about the products that we will be presenting at APEX 2016,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “MIRTEC will feature a total of seven (7) inspection systems speci cally designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry.”

Zestron Booth No. 2624

Introducing the ZESTRON® EYE CM, a concentration management closed loop control system for aqueous based cleaning processes. Incorporating the ZESTRON® EYE 3P-Technology, the ZESTRON® EYE CM monitors and controls wash bath concentration in real time. Wash bath solution is continually pumped through the ZESTRON® EYE CM for real time concentration analysis. An integrated PLC receives and interprets the data and actuates the ZESTRON® EYE CM pumps to accurately dose DI-water and concentrate cleaning agent into the wash bath as required; thereby, maintaining the desired concentration level within 1% of set point. All concentration data is continually monitored and recorded for process traceability.

P:14

director

spotlight

Page14

TheChoiceofPublicationfortheElectronicsIndustry

| FEBRUARY2016ISSUE

an interview with

David Suraski - Executive Vice President, Assembly Materials Division, AIM Metals & Alloys LP

by SMT today editor

Photo by: Mansour Bethoney Photography

Founded in 1936 in Montreal, Canada, AIM is a leading global manufacturer of tin-lead and lead- free solder assembly materials for the electronics industry.

AIM is a family-owned manufacturing company with roots in the metals industry and production facilities in Canada, the United States, Mexico, Poland and China, as well as local support o ces throughout North America, Asia and Europe. Currently the group employs more than 1,500 multi-skilled people worldwide.

AIM is about to celebrate 80 years in business this year, so it was perfect timing for SMT Today’s Editor to meet up with David Suraski, their Executive VP, Assembly Materials, to discuss their long term success and future plans.

led to a product that has the widest process window of any product on the market today. These key performance characteristics have made M8 the paste that everyone running a no clean paste should be using.

Q. David, could you give us some background on your professional career to date and your current responsibilities within AIM?

A. I was a young man when I started with AIM backin1997! My rstpositioninthecompany was in the customer service department. From there I moved into the technical support department, where I was able to increase my product and applications knowledge. That led me into technical marketing, where I worked closely with Karl Seelig, our vice president of technology, and learned a tremendous amount from him. Honestly I still learn a lot from Karl. From there I moved into marketing and eventually became the global director of that department. Somewhere along the way I became responsible for the operations of our US facility.

In 2006 I had the bright idea to move my family and myself to Asia to serve as the managing director for our Asia-Paci c business. Now that was a learning experience! It was not easy but I am proud to say that our team there built up a successful and sustaining business. I came back home in 2011 and moved into the role of executive vice president of AIM’s Assembly Materials Division. I do what executives do and support our teams throughout the world with day to day issues but especially focus on helping to set and attain the mid- and long-term goals of the company.

I’ve been extremely fortunate to have the support and mentoring of my boss, Rick Black, as well as his father Herb and uncle Ron. I’m just one small part of a high-performing, aggressive team located throughout the world.

It has been an exciting

18 years and I have been very fortunate to have been part of AIM’s global expansion throughout the Americas, Europe, and Asia.

Q. AIM’s product line includes a wide variety of solder assembly materials for the electronics industry. We’ve heard a lot about your new M8 solder paste lately. Can you tell us about what sets this paste apart?

A. M8 represents the outcome of a close collaboration between AIM’s eld technicians and its R&D department. Our technical sta brought the most common customer requests to R&D and asked for a solder paste that would address voiding on BTCs, printing 0.50 area ratios, soldering-related defects such as HiP and longer print and open times. M8 solder paste is the culmination of these e orts and delivers on all counts. M8 produces nearly void-free soldering in air on QFN, D-PAK, and other di cult to solder leadless devices. M8 can print area ratios of 0.50 with Type 4 powder with pauses up to 60 minutes without print degradation. These claims aren’t just lab data under ideal conditions. The collaboration didn’t stop with the introduction of M8; it has been consistently reinforced by detailed eld trials and customer evaluations that are still ongoing. It is this deep understanding of the variables that can adversely impact outcomes that have

Q. Having a global presence is important to a company’s success today. We understand that AIM is no di erent. Can you tell our readers about your global footprint and what makes it so successful?

A. AIM’s philosophy is to be where our customers need us. In practice that means following them around the world, whether that means Mexico, China, South America, Eastern Europe, or elsewhere. The result is that we have become a leading global manufacturer of solder materials. Our headquarters are in Montreal, Canada and we have manufacturing facilities in the United States, Mexico, China, Hong Kong, and Poland as well as partnerships in Brazil, Western Europe, and even Australia. Additionally, we have technical support personnel and o ces throughout the world, including India, Philippines, Singapore, and Brazil. And of course we have distributors in every market in the world, from the Midwest US to the Middle East.

The ability to service large multinational customers with high quality, consistently

Continued...

P:15

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M8 N0 CLEAN SOLDER PASTE has been formulated to address

the most demanding requirements confronting today's SMT

assembly market. M8 is proven to improve production yields and

product quality, whether printing 0.50 area ratios or eliminating

voiding on QFN and LED packages. M8’s post—ref|ow residue passes

all IPC, BONO and tough changing environment test specifications,

making it the ideal choice for automotive and high performance/

high reliability applications. M8’s robust characteristics and stable

performance improves every facet of the PCB assembly process.

AIM Solder has 'iiLl tiplc locations :'oun:.i tlii: worlt. Listed bcli:iw air: oui ii_ill—li'ic 'iifll7Lll'r\]Ctl_lfll'l; iairilitits

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P:16

director

spotlight

feature continued...

manufactured, competitive products, on a global, localized basis is imperative. Those who cannot will eventually be forced out of business, or relegated to the side-lines. Our success has been based on our willingness to open facilities wherever customer demand justi es it.

Q. Advancing technologies continue to present challenges and opportunities for both customer and supplier. How does AIM address these needs?

A. Electronic devices continue to get faster and smaller and more powerful. That puts a lot of burden on the materials themselves, from wetting to reliability and everything in between, and that requires constant innovation. We have a very aggressive R&D program, which helps us to stay ahead of the trends. The investments we make into R&D and technical support as well as partnering with important OEMs enable us to stay ahead of the curve in terms of metallurgical, chemical, and application advancements. The result is the development of products like M8, which address the challenges of today and the future.

Once the right products are in place, we o er a great deal of technical support as well. Our support people are highly skilled, degreed engineers who work with our customers on a regular basis to ensure that they improve their throughput, that they solve any issues that they may be having even if they’re unrelated to our products, and they have the capability to embrace new technologies. It may sound like a cliché, but we really do consider our customers our “partners”, and that has allowed us to maintain very long-term business relationships throughout the world.

Q. Customers expect suppliers to add tangible value at all levels, performance

maximisation, overhead reductions and getting the product to market quickly. What programmes does AIM have in place to tackle these requirements?

A. Weconcentrateondoingthe“routine”things better. Our technically advanced products, exceptional technical support, and rapid delivery lead times are examples of value- added services that instil and preserve loyalty among our customer base. AIM wants to be regarded as a supplier, a partner, that is easy to do business with and that o ers service and support beyond the norm.

Q. What sets AIM apart from other suppliers?

A. There are a lot of companies that o er similar products at similar prices around the world. We believe that our expertise and value-add philosophy to customer service and technical support is what makes AIM an industry leader. Whether it be a last-second shipment because a customer’s production unexpectedly increased, or providing technical support on a 24/7 basis, or solving complex technical challenges, AIM sets itself apart by o ering unparalleled support to its customers. We have more technical support personnel than we do salespeople, and we nd that is a key to maintaining important customer relationships. We may be large rm with a global reach but we still operate as the hands-on, family-run business that we are by o ering personalized local support and always putting the customer rst.

www.aimsolder.com

See Page 52 – 52 for AIM Technology Today Feature on E ect of Bi-Content on Properties of Low Silver SAC Solders.

Page 16 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

P:17

KEEPING TRACK OF COMPONENT INVENTORY JUST GOT A LOT EASIER

with AccuCount Technology

XQuik with AccuCount Technology combines VJ Electronix’ X-ray imaging with AccuAssembly’s image processing and inventory management to provide a highly accurate count of components stored in tape-and-reel.

FEATURES:

• Automatically “counts” components as small as 01005

• No programming required

• One button operation

• No need to remove reel from antistatic moisture barrier bag for counting

• Substantially speed up part counting process • 7” through 15” reels

• Integrated barcode printing

• >99% part count accuracy

• May also be used for electronics inspection VJ TECHNOLOGIES OFFICES

Bohemia, NY Suzhou, China Paris, France Budapest, Hungary Bengaluru, India

VJ Electronix, Inc.

234 Taylor Street,

Littleton, Massachusetts USA 01460

www.vjelectronix.com

Email: [email protected] Tel: +1 631 589 8800

Fax: +1 978 486 4550

“Because Performance Matters!”

See us at APEX — Booth 1834

MW-VJ-20-XQuikII_SMT Today.indd 1 1/14/16 5:45

P:18

Find your parts in seconds

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Reduce reel storage space by 60%

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Page 18 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

ROI in less

than six months

P:19

True Moisture

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Moisture control in every cell

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InoMSD cart is a true solution for managing moisture sensitive devices through its innovative individual cell design which manages multiple reel sizes and waf e trays.

Included with each InoMSD cart is our revolutionary InoMSD tracking and timing software solution.

The InoMSD cart solution continues in the Inovaxe philosophy of inventory control through Single Package Single Location.

InoMSD cart is available in two versions:

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Digital display shows temperature and relative humidity percentage within the InoMSD cart

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P:20

An ode to the unsung Technology Innovators By Kim Sauer (@kimsauermedia)

The start of the new year is always one where we re ect on the year gone by and look forward to the year ahead. Maybe it’s the holiday that allows us all to slow down in unison, to ponder, to assess, to prioritize, and to plan as we spend more time with family and friends and recharge our batteries with turkeys, sherry and copious amounts of chocolate! It is also a time of the year when the latest and greatest developments in consumer electronics are on show at the annual CES (Consumer Electronics Show) in Las Vegas, celebrating the innovators, shakers and movers in the technology world.

thermal performance, exibility, impedance & conductivity. This is where technology innovation starts - it’s the core ingredient that sits at the heart of any electronic device.

There are the software developers who are collaborating with equipment vendors and manufacturers to offer seamless ‘connected’ solutions that improve the manufacturing process, increase productivity & efficiency, reduce manufacturing costs and enable transparency and traceability.

There are the equipment vendors who are manufacturing machines that are faster, more accurate, more e cient, Industry 4.0 compliant and all that on a smaller footprint.

There are Test & Measurement solutions providers who are innovating with more accurate, more reliable and more detailed solutions.

The list goes on, with every aspect in the entire manufacturing supply chain including consumables, components and supply chain consultants.

They are also not doing all this behind closed doors in isolation. Collaborations, special OEM teams, Industry 4.0 work-groups and futuristic Innovation Centers are at the forefront of today’s electronics manufacturing solutions company’s business strategies. For 2016 and beyond it’ll become even more important and although we’ll all be discussing, implementing and promoting ‘Industry 4.0’, IoT, IoM, Big Data and all the ‘trendy’ terms and synonyms that they bring with them, the fuel for these initiatives is technology innovation, and that can only come from those great people along the manufacturing supply chain.

So, yes, I love what those CES stars are doing and coming up with, but let’s be honest... could they really do it without the framework provided by those unsung Technology Innovators that supply them with the enabling technology?

But who is really innovating here in real technology terms? Aren’t those ‘technology’ innovators that are getting all the media attention actually really ‘functionality innovators’ that are con ned by the limits of where the enabling technology can take them? Aren’t the real innovators here those busy people along the manufacturing supply chain that are continuously coming up with the solutions that are making things smaller, faster and more connected? I’m talking about those unsung heroes behind PCB materials, components, manufacturing equipment, software, supply chain management, etc.

Not so sexy to talk about high speed laminates, 01005’s, placement speeds or Industry 4.0-ready reflow solutions, I know! But that is where the real technology innovation is happening!

My inbox has been over owing with press releases, articles, invites, videos, reviews and announcements all shouting loudly about the latest innovations at CES that are going to improve our lives. Huge attention gets given to the start-up community, as they launch the next wearable, gadget or accessory. And yes, no doubt these guys are quite rightly named as innovators, creators and disruptors. It’s also quite easy to write and report about them and it’s no doubt a subject matter that readers can easily identify with and get excited about so no wonder the press jump at every opportunity to make them the heroes of innovation.

Let’s be rational for a moment though. What are they really innovating? Is it technology? Are they not just using existing technology to innovate in the way it is used? CES announced many more brand collaborations on the wearables arena as ever before. That’s where

we are now seeing di erentiation, not through technology innovation, but through style, niche target markets and brand associations. Functionality, i.e. technology driven innovation is pretty much limited by what is possible from a manufacturing perspective, so what we are seeing is the use of sensor technology applied to di erent products that will hopefully make our lives easier, healthier, more organized and more fun.

How much power have these companies really got in terms of technology innovation anyway, when in actual fact their product runs are relatively small and NPI (New Product Introduction) costs high with an inherent high risk factor for the manufacturing partner? And is the ‘technology innovator’ hype around them maybe disproportionally high when compared to how much these start-ups are really worth in manufacturing terms? I’m not talking about the handful of success stories like Go-Pro or Fitbit that make it big. I’m talking about that majority of start-ups that pop up at the top of the innovations hit list as a one-hit wonder and disappear just as quickly as they arrived or remain a very small niche player. And in any case, aren’t even those that do make it big simply using existing technology as a core rather than innovating the technology itself?

So who really are the technology innovators? In my work, I’m lucky enough to meet them all the time, all along the manufacturing supply chain and it’s time they get their star on the technology walk of fame.

There’s the laminate & pre-preg manufacturers that have a whole team of product developers hidden away in their labs working on the next generation materials that improve reliability,

Page20

TheChoiceofPublicationfortheElectronicsIndustry | FEBRUARY2016ISSUE

P:21

SMARTFLOW 2020 Selective Soldering System from Ersa – The undisputed world leader in selective soldering!

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individual user interfaces | top and bottom preheating | electromagnetic pumping system | drop jet fluxer for precise flux application | shortest downtimes and lowest TCDs | 20” x 20” board capability | offline programming capability |

An AFFORDABLE state of the art selective soldering machine with the high quality and reputation only Ersa can guarantee.

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13-17 March 2016 Las Vegas, Nevada

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Plymouth WI 53073 | USA

Tel: +1 920 893 1779

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P:22

Global Architectural LED Products Market is

Expected to Reach US$ 10,751.1 Mn by 2021

By Glen Hare/Addie Thomas of Persistence Market Research and Marketing

According to the latest market report published by Persistence Market Research, titled “Global Market Study on Architectural LED Products: Driven by Price Commoditization and Signi cant Growth in Enhanced Performance”, the architectural LED products market is estimated to be valued at US$ 3,997.5 Mn by the end of 2015 and is anticipated to expand at a CAGR of 17.9% from 2015 to 2021 in terms of value, to account for US$ 10,751.1 Mn by 2021.

Corporation), Philips Lumileds Lighting Company, Osram Lict AG, Epistar Corporation, Cree Inc., Verbatim Ltd, GE Lighting Solutions, Samsung Electronics Co Ltd, Toshiba Lighting & Technology Corporation and Galaxia Electronics Co Ltd.

Architectural LED lights are used mainly for illuminating monuments, museums, building structures, residences and bridges with the artistic integration of light source. Architectural LED lighting can be used for decorative purpose and can be applied both indoor and outdoor.

Currently, the global market of architectural LED products is driven by factors such as government regulations, encouraging construction companies to deploy LED lighting systems. LED lighting systems help in increasing energy e ciency and reducing carbon emissions. Due to the longer life span of architectural LED lighting products, the market is witnessing a paradigm shift from the adoption of conventional lighting solutions, to the more efficient architectural LED products. Increasing consumer inclination towards luxurious lifestyle is projected to boost demand for architectural LED lighting products across the globe in the residential sector, which in turn is expected to be the primary factor contributing to the growth of the architectural LED products market.

On the basis of products, the global architectural LED market is segmented as solar and conventional products. In terms of value, the conventional products segment is expected to account for 93.7% share of the global architectural LED products market by the end of 2015, and is anticipated to expand at a CAGR of 17.7% during the forecast period (2015–2021). In terms of volume the solar LED products accounted for 9.3% in 2014.

The conventional products segment is further classi ed into strip & linear products and lamps. Strip & linear products accounted for the 68.3% share in terms of the value of the conventional products segment in 2014. In terms of value,

the lamp segment of the global architectural LED products market is anticipated to expand at a CAGR of 14.9% during the forecast period and in terms of volume units, the lamp segment of the global architectural LED products market is anticipated to expand at a CAGR of 34.9% during the forecast period.

On the basis of application, the architectural LED products market is segmented as cove lighting, wall washing, in the ground, backlight and others. Among these the wall washing segment dominated the market in 2014, and is expected to account for 38.8% share of the global architectural LED products market by 2015 end in terms of value. Increasing adoption of architectural LEDs luminaries and lamps by government o ces and other historic monuments, as part of smart city initiatives, is expected to drive the market growth of wall washing segment during the forecast period.

The report provides in-depth information about various trends driving each segment and provides analysis and insights about the potential of the architectural LED products market in speci c regions. On the basis of region, the global market of architectural LED products is segmented into ve regions; among these, Asia-Paci c is expected to dominate the market representing 47.1% share by the end of 2015 in terms of value, and is analyzed to remain dominant by 2021.

View Detail Report:

http://www.persistencemarketresearch.com/ market-research/architectural-led-products- market.asp

Key players in global architectural LED products market include Cooper Industries PLC (Eaton

The global architectural LED products market is segmented as follows:

By Product type:

• Solar

• Conventional

• Strip & Linear

• Lamp

By Application:

• Cove Lighting

• Wall washing

• In ground

• Backlight

• Others

By End User:

Residential

Commercial

• Retail

• IT & Telecom

• BFSI

• Media & Entertainment

• Healthcare

• Others

By Region:

• North America

• APAC

• Europe

• The Middle East and Africa (MEA) • Latin America

www.persistencemarketresearch.com

Page 22 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

P:23

Vacuum Tweezer Solutions

For nearly thirty years we have been a leading supplier of vacuum handling solutions to the world’s high technology firms. Our patented ESD safe products are used by CLASS I clean room personnel, electronic assemblers, semiconductor manufacturers, the optics industry and universities around the world. Our success comes from developing innovative manual vacuum handling tools and pick-up tips based on customer requests and customer feedback. These tools provide customer specific solutions that make assembly and processing operations more productive and ergonomic. Parts range in size from 0.13mm (0.005”) up to 300mm (12.0”) for easy handling.

• Self-contained vacuum tweezers

• Portable, battery-operated continuous vacuum handling systems

• Bench top 110/220 volt vacuum tweezer systems

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These hand tools replace tweezers and other gripping means for many applications, making them ideally suited for ergonomic manipulation of parts during assembly, inspection, rework and service operations.

Virtual Industries offers a broad line of accessories including miniature rubber vacuum cups, PEEK wafer handling tips, and precision machined handling tips for critical handling operations.

Visit our website or contact us for additional information.

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P:24

Nextek Inc. Partners with Nordson

YESTECH to Provide Tomorrow’s Inspection Technology for Today’s Products

By Justin Langford, Director of Business Development at Nextek Inc

A niche market, technology-driven electronics manufacturing services (EMS) company that was founded in 1995, Nextek Inc. provides precision electronics assembly and engineering services to customers with needs- driven, non-commodity products.

The manufacturing specialty company o ers advanced design, analytical, manufacturing services, prototype/NPI services, and box assembly to OEMs in the electronics industry. Its focus is high-function electronics assemblies using advanced interconnect technologies to bring customer products from physical design to production. Rick Gunn, VP of Engineering/CTO, said that Nextek partners with companies that have unique product needs and that seek high levels of reliability, commitment and professional service from their manufacturing partners.

To help continually provide this high level of reliability, Nextek works only with manufacturers whose technology and quality policies align with Nextek’s. One of these partners is Nordson YESTECH. Nextek uses three of its FX-12-10 inspection systems with four side cameras, one top down camera and the optional laser height measurement system for BGA planarity measurements. Nextek also implemented Nordson YESTECH’s o ine programming to review and rework components as well as an x-link Aegis adaptor that ties the FX systems to the Aegis system for automated defect data transfer by serial number. The rst two FX systems were purchased in April 2013, and the third was purchased in July 2014.

Nordson YESTECH’s FX AOI systems have advanced 5 megapixel color camera imaging technology, o ering high-speed PCB inspection with exceptional defect coverage to inspect solder joints and verify correct part assembly, enabling users to improve quality and increase throughput. With one top down viewing camera and four side viewing cameras, and one Laser, the FX Series is con gurable for all line positions. Additionally, the systems are equally e ective for paste, pre-/ post-re ow and nal assembly inspection. O -line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

Gunn added that the YESTECH AOI systems the company purchased replaced some legacy AOI systems that were in place when he joined Nextek. He said, “The new systems have helped Nextek reduce the amount of rework in the factory as well as reducing potential escapes to customers since day one of their installation.” While Nextek has o cially worked with Nordson YESTECH for the past two years, the companies’ personnel have had a working relationship for many years. Gunn has known some of the YESTECH core for more than 18 years and has always found both the equipment and the people to be capable and forward looking.

He said that these two qualities are important to Nextek and indicated that YESTECH was going to be a good t. “My history with the company made working with them an easy decision. Their products last in the market for many reasons, including ease of programming, high repeatability, good cost points, and excellent support and service.” He added that as Nextek continues expanding, he foresees the relationship with Nordson YESTECH also expanding.

As a full-service provider, Nextek performs surface mount as well as prototype/NPI services and box assembly. A large percentage of Nextek’s contracts are in the military and aerospace markets and the company has been AS9100 certi ed for many years. Nextek is also certi ed to ISO 13485 Quality Management Systems for Medical Devices. The AS9100 and ISO 13485 standards are highly structured quality management standards, indicative of today’s advanced technologies used in aerospace, defense and medical systems. Nextek has operated as an AS9100 certi ed company for more than 14 years and gaining Rev C certi cation demonstrates the company’s continued commitment to customers in the aerospace and defense industry.

Also, as an early leader in grid arrays and CSP with a high-mix, low- to mid-volume customer base, Nextek is capable of placing any variety of parts from 1005 passives, ip chip and 0.2 mm pitch CSP/BGAs to standard SMT, and through-hole.

The manufacturing specialty company provides customers with numerous other bene ts, including a range of services that consists of PCB design, advanced manufacturing, prototype/NPI services, product assembly, box assembly, system integration, manufacturing process development, as well as complete material and process analysis capability. Nextek specializes in the design/ development of needs-based products and the assembly of high-function printed circuit boards (PCBs) and electronics products. Using Nextek’s services, customers gain rapid access to leading- edge design and assembly technologies whilst minimizing their own investment in development, production and personnel. Nextek also supports OEMs in most major vertical market segments. This exposure to a wide range of applications in multiple market segments enables the company to provide creative solutions, leveraging technologies and processes from one market to another. Service areas include wireless, medical, telecom/datacom, industrial, specialty optical, avionics/aerospace/ defense, specialty computing, embedded systems, and test/instrumentation/data acquisition.

The company strives to provide advanced assembly services from PCB design through mid-volume production and test, as well as box assembly and integration. This o ers customers numerous

industry advantages, including:

• Customer and service focused business model • Wide spectrum of advanced manufacturing

technologies

• Broad range of services (design through

production)

• Extensive engineering, process and material

analysis capabilities

• Extensive materials and supply chain

management capabilities

• Industry experienced personnel at all levels

• Investment in continuous quality improvement

“We feel that the comprehensiveness of these services are a valuable resource to our customers,” said Gunn. “As we continue to grow the company, we are always looking for ways to add value and to become a complete solution partner to our customers.”

He continued, “In the high-reliability market space that we work in, we need to produce assemblies as consistently and awlessly as is possible. The YESTECH systems are a big part of this, we run every assembly through the systems in real time so if problems arise we can eliminate them immediately, and prevent rework. Nextek’s customers have come to expect this level of excellence in all that we do for them, and the YESTECH machines are an important part of that.”

Nextek also believe that customer service is just as important as product quality, and appreciates that same value in Nordson YESTECH. Gunn said that YESTECH has a strong support team in place, and that the company has been very responsive to Nextek’s need and concerns whenever they have arisen during the past couple of years.

Nextek’s design and manufacturing services are advanced solutions that provide value-based technology solutions. It’s Design for Testability includes electrical design services such as schematic capture, comprehensive PCB layout, DFX review/veri cation, diverse technology and product mix, high-speed, HDI, high layer count, controlled impedance, di erential pairs, matched lengths, buried/blind/micro via, ip chip, rigid- ex, emerging technology and more. It also provides advanced manufacturing services including quick turn prototype assembly, production circuit card assembly, higher level assembly, box build assembly, material technology and test engineering.

www.nextekinc.com www.nordsonyestech.com.

Page 24 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

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P:26

Development of Halogen Free High Wetting Solder Paste

PROVIDED BY KOKI COMPANY LIMITED

Halogen Free (HF) has become one of the major requirements in Electric/ Electronics Industry in order to reduce the environmental impact. Halogen compounds have been used in electronics industry for e.g., as ame retardants in the printed circuit boards; however, they are known to generate dioxins, one of the highly toxic organic pollutants, when they are disposed or are incinerated. Starting from the regulation on Chloride and Bromide by IPC/ JEDEC, electric/electronics industry has been rapidly moving toward Halogen Free.

poor melting-ability and inferior product stability. Since the ux and solder alloy starts reacting at lower temperature range (room temperature), the ability of ux to activate is no longer available by the time temperature reaches to melting point of the solder alloy. On the other hand, ux A+ which has undergone stabilization process selectively reacts at the particular temperature, inhibiting the activator from reaching the temperature induced reaction to maintain thermal and chronological stability which allows su cient activation during solder melt and realizes high wettability.

Fig. 5 shows the change in viscosity when stored at 30°C for stabilization evaluation. Conventional HF solder paste starts reacting at around 30°C and shows unstable behavior such as increased viscosity. By adopting

activator stabilization process, S3X58-M555 suppresses the reaction between solder powder and the activator in the ux and remains stable from the storage in a refrigerator or at a room temperature to the usage such as printing.

Results from product melting-ability evaluations are as follows.

As for the soldering material, Japan Electronics and Information Technology Industries Association (JEITA) released “De nition of Halogen-free Soldering Materials” and IPC has revised “Requirements for Soldering Flux” to J-STD-004B to follow the halogen free trend (Fig. 1).

Fig.1 Halogen Free Standards

On contrary, halogen compounds have been widely contained in the paste ux for solder pastes. Flux’s major function is to remove the metal oxides (reduction) from the metallic surface when the solder paste interconnects the component and the PCB. Schematic image of the reduction can be seen on Fig. 2. Fig. 2 shows Halogen’s catalytic property during metal oxide reduction as 1- Halogen reacts with metal oxides and produces metal halides, 2- metal halide and organic acid react, and release halogen, and the process repeats. Another important feature of halogen is its reduction at a wide temperature range (Fig. 3).

In short, halogen in the solder paste ux acts as an activator which works e ectively when used in small quantities. Since the HF ux does not contain halogen, the reduction action is lower than the ux with halogen content. Therefore, it is often seen that HF ux is associated with soldering defects resulted by poor wetting ability. (cold solder joints, solder balling or de- wetting). In order for the HF ux to have the equivalent wettability as the conventional ux with halogen content, substantial amount of the activators must be added; however, containing too much activators will hamper the solder paste process-ability due to low product stability (print defect due to increased viscosity or deteriorated insulation resistance.

Design Concept of High Wetting Halogen Free Solder Paste and Introduction of S3X58-M555

Halogen Free High Wettability solder paste is developed by keeping its focus on the activation temperature to counter the loss of wettability by eliminating halogen. Flux in the HF solder paste would need not only the activation at the higher temperature range to substitute the halogens but also the stability as a solder paste in the viscosity.

New technique to stabilize the activator is indicated in Fig. 4. Investigation accommodated both high wettability and product stability in an HF solder paste. A conventional HF solder paste which contains activator “A” shows

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TheChoiceofPublicationfortheElectronicsIndustry | FEBRUARY2016ISSUE

Fig.2 Cleaning property of the ux toward the metallic surface.

Fig.3 Activation Temperature comparison of Conventional

Product (with and without Halogen)

Fig.4 Improved Flux Activation by Stabilization Process

Fig.5 Chronological Viscosity Change at 30°C Storage

Heat Resistance

Recent downsizing and high density trends in surface mount technology, packages such as BGAs, QFPs are getting very popular and most of the new circuit boards would encompass

P:27

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feature continued...

either one or both of the above mentioned packages in large quantities. However, these new component brings along new assembly defect concerns which most of the times are impossible to detect just by visual test, for e.g.head-in-pillow.

Fig. 7 shows the soldering

performance test on degraded substrate samples as follows: print solder paste using stencil 60μm in thickness, pre-dry at 180°C, mount BGA with SAC305 solder bumps and heat to melting temperature.

Conventional HF solder paste may not retain the activation ability till the oxide lm on the BGA solder bumps is completely removed during the re ow as the ux has already lost its heat resistance and might get a head-in-pillow (solder joint failure). In contrast, S3X58-M555 maintained ux activation at a wider temperature range owing to optimized activators in addition to the stabilization process (Fig.6). As the ux heat resistance improved, S3X58-M555 can be used e ectively on BGA solder bumps and inhibits head-in-pillow under the same condition.

Wettability to Various Substrates

Fig.8 shows the wetting evaluation test results on various degraded substrates. Test samples were heated at 150˚C for 16 hours in an oven, then a conventional soldering process is completed with stencil printing and hot air re ow process. Since the

solder paste with conventional HF ux lacks activators such as halogen, oxidation lm was not fully removed from the metal substrates and is likely a result of poor wetting (de-wetting). As for S3X58-M555, despite being halogen free, new technique to stabilize the activator and optimized activator composition can be seen to remove oxide lm e ectively for better melting ability to any substrate. It is expected to exhibit superior wettability to a component or PCB in a poor quality.

It is evident that the demand for the electric/ electronics industries to reduce the environmental impact will continue for the future. As a leading company of the soldering material, KOKI will strive to provide our customers with the products which not only exceed customers’ expectations but also are environmentally responsible.

www.ko-ki.co.jp.

Fig.6 Improving Meltability by Adding Activators E ciently

Fig.8 Wetting Evaluation on Degraded Substrate

Fig.7 BGA Joint Evaluation on Degraded Substrate

Page 28 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

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Why Extraction and Filtration Technology

must be a Substantial Part in Electronics

Manufacturing

provided by Stefan Meissner, Corporate Communication at ULT AG

Capturing and Filtering of airborne Substances is anything but simple

utilised in the best way possible.

What Extraction and Filtration Technology must accomplish

What do users of extraction and ltration systems expect? Primarily, such systems must meet various requirements to guarantee minimal maintenance e ort, health protection and high quality of work. This includes:

There is something in the Air

Occupational health and safety in electronics production companies have become increasingly important in recent years. Today it should be seen as a part of the job rather than an annoyance. Manufacturing processes have gained in complexity, and resulting pollutants have become smaller and particularly more exotic. “From chipping come chips” is a popular saying. Today, the chips cannot be seen with the naked eye any longer since particle size of resulting dusts and fumes has arrived in the nano range.

Pollutants of any size always a ect humans, machines and the environment. In addition to social and human aspects, a high sickness absence rate of employees has adverse economic e ects on a company just like malfunctioning machines due to pollutions. Maintenance expenses, rework and nally loss of reputation and falling demand are the predominant adverse e ects.

These factors lead to a rising demand for extraction and ltration technology, which reliably protects equipment and employee health, and furthermore, takes account of changing process parameters. By now, extraction and filtration technology covers a wide range of airborne substances. Many processes to be found in the electronics manufacturing industry are supported. From interconnection and separation technologies, surface processing such as drilling, sintering and milling, the utilisation of uxes or production processes such as rapid prototyping by means of laser, soldering and gluing – all these processes generate harmful substances that might show

extreme impact on health.

Figure 1: Overview of dust particle sizes

Laser Smoke as an Example of hazardous Substances

Laser processes are increasingly utilised in electronics manufacturing, e.g. drilling, welding, • cutting, engraving, sintering etc. For example,

in metal processing dusts containing heavy • metals are released that may accumulate in

the human body. During processing of alloyed metals, contained substances such as nickel, cobalt and chromium are released. The pyrolysis

of organic substances may generate dioxins • or hydrogen chloride. Moreover, laser smoke contains ne dust that may, at worst, lead to respiratory diseases, cardiovascular problems

and an increased cancer risk.

Apart from bad quality of work due to permanent smoke and odour emissions, machines may be a ected or damaged due to pollution and chemical reactions of their products. In particular, in the case of nest precision mechanical works, each

kind of impact by particles must be avoided Figure 2: Impact of hazardous substances on

the human organism

Legal Provision

In many countries, there are clear regulations and laws to remove hazardous substances in the breathing air. Users of air ltration plants do not necessarily have to know all these regulations, however, vendors of extraction and ltration systems must know them in detail. They need up-to-date expert knowledge on the full range from checking the medium to be ltered, particle size distribution and characteristics (adhesive, subliming etc.), up to tests of hazardous substances and ammability.

Clean air return is not regulated by law but strengthens economic and ecological acceptance and self-interest. From the point of view of a healthy air balance and heat-loss avoidance, extraction and ltration technology should be

Complete removal of all dusts, smokes, vapours, odours and gases.

Incremental ltration: Utilisation of pre- lters for coarse particles (sedimentation dust > 10 μm) to avoid premature saturation of ne dust lters (for particles < 10 μm) and adsorption lters.

Adaptation to relevant contaminants: An extraction system must absorb all particles, vapors and gases. Therefore, the capacity of the lter media must be adapted to the emitted amount of particles. For example, a large amount of coarse dust requires high-capacity lters to avoid too frequent replacement. Too low saturation conditions lead to extremely high maintenance e orts for the extraction system. On the contrary, if ne dust is largely produced, coarse lters may have low capacities.

• Adaptation to work places: In large production plants, attributes such as ‘space saving’, ‘mobile’ or ‘silent’ do not matter. However, such characteristics are welcome at individual and manual workstations. Filter technology must not be annoying – it should never disturb work routines, neither physically nor acoustically.

Figure 3: Cartridge filtration principle in an extraction system for laser processes

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capturing at a manual work place Basically, the appropriate capturing element can deliver a substantial contribution to the quality of the extraction and ltration device. The degree of capture rate forms the basis for subsequent high-grade ltration, nally providing high overall e ciency and low residue in the returned clean air.

Fundamentally, the place of capturing plays a key role. A general rule says that twice the distance between emission source and capturing element requires four times the exhaust performance in the extraction and lter system — a particularly noteworthy energy context in times of ever increasing energy costs.

Conclusion

Extraction and ltration in electronics production goes far beyond the vacuum cleaner principle. It is not just a case of dirt removal but to eliminate hazardous

substances in the air that may cause more than a dust allergy. The precondition for users is knowledge about their materials and processes. Vendors of extraction and ltration technology propose a suitable system. They have expert knowledge concerning legal regulations and chemical and physical characteristics of the media to be extracted and ltered. They nally adapt a system for air puri cation suitable to the operating conditions in a facility.

It takes more than hard work and willpower to win the race. Smart use of technology makes the difference between first and second place.

Figure 4: Influence of distance to the required air ow

Capturing hazardous Substances

The capture of contaminants is regulated by law in various countries. These regulations determine risk categories for specific hazardous substances, e.g. in terms of re and explosion risks or in types of health damaging e ects (carcinogenic, mutagenic or toxic for reproduction).

Demand for particle capture at the point of origin makes sense, because:

● Large quantities of pollutants can be captured

● There are relatively low capture e orts ● Good ltration opportunities are given ● Low energy consumption possible

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Positive Improvements from Creating a

Connected, Intelligent and Traceable

Production System

By Davina McDonnell, Saline Lectronics, and Mitch DeCaire and Anouk Hurbutt, Cogiscan

Saline Lectronics examines the bene ts to Cogiscan’s enhanced traceability and the positive outcomes of creating an interconnected, intelligent factory.

raw part numbers for a wide range of customers. Careful management of this inventory, including correct stocking, precise counts and inventory movement, is crucial for daily operations. With the TTC System’s Inventory Management software, Lectronics now has real-time information regarding the location of parts, exactly how many are remaining and when to re ll a machine.

Setting up a job for production is one of the most critical tasks in a manufacturing environment, and being able to accurately locate parts allows for a smoother set-up experience. If an error is made during set-up, or if set-up is delayed due to lost or missing materials, it has the potential to wreak havoc on the rest of the assembly process. Cogiscan’s Inventory Tracking System has drastically enhanced set-up operations at Lectronics, and in certain cases of assemblies with a large number of components, improved set-up time by 33%.

Now that Lectronics has real-time visibility of inventory, technicians are no longer wasting time looking for parts as the software communicates

Different types of machines automatically communicating with each other and seamlessly sharing data is no longer a scenario only seen in science fiction novels. Today’s leading manufacturers are gaining a competitive edge by embracing current technologies and trends, including Industry 4.0, to create a more connected and intelligent manufacturing environment. Many manufacturing companies are equipped with intelligent machines capable of not only collecting and analyzing enormous amounts of data, but are also capable of talking directly with other machines in order to create a smart and uni ed production system.

Recognizing the ability to seamlessly link production machines together, Saline Lectronics, a domestic electronic contract manufacturer, has intentionally designed its Surface Mount assembly operations around this connected production system concept. Utilizing intelligent

software to create a connected factory, Lectronics has seen positive improvements in job set-up and changeover time, defect rates, and overall throughput.

In April 2014, sensitive to changing trends and emerging advanced traceability requirements, Lectronics installed Cogiscan’s Track, Trace and Control (TTC) System. TTC System o ers enhanced traceability of materials used on a PCB assembly, plus traceability of all test results and management of any required repair steps. It is also used to error-proof line set-up, monitor stock levels and provide real time visibility of products and raw materials throughout the entire factory. Additionally, the TTC software serves as the link between all of the di erent machines that are used to manufacture a nal PCB assembly.

Inherent to electronic contract manufacturing, Lectronics manages an enormous amount of

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the very precise location of a component. Lectronics’ has expanded on this software system in such a way that component locations can even be a bin! For example, before developing this inventory system, if a technician pulled a part from the stockroom for set-up, the system would show that part in set-up, but not the precise location within that set-up area. Now Lectronics’ technicians can not only see that the part was pulled for set-up, but can see exactly where in set-up the reel is located, whether that’s a trolley, a bin or a shelf.

Additionally, rather than verifying the correct set-up through a manual process, Lectronics now utilizes barcode scanning and Smart Feeders with RFID technology to ensure that the right component is located in the correct slot. A user-friendly and graphical software interface guides the technician throughout the setup process. This can also be performed o ine, so technicians can verify trolley setup prior to actually loading trolleys to the SMT machines. Instead of nding an error when the trolleys are loaded on the line and ready to go, Lectronics can now identify any incorrect reel placements prior to starting the job.

Naturally, with a reduction in set-up time, Lectronics has also seen an average of a 33% time saving during job changeovers. O ine set-up is a major contributor to this because jobs are ready to go well before an SMT line is free. Since all of these set-ups are previously validated before being loaded onto the machines, Lectronics no longer loses any time rearranging reels into the correct locations.

Furthermore, the Cogiscan software is integrated within Lectronics’ Juki SMT machines. This connection enables Juki machines to talk directly with Lectronics’ Juki Fortress, proactively issuing a low-level alarm to tell the Fortress to automatically dispense a component for the Operator to pick-up before the SMT machine runs out. Thanks to this automatic communication, the required reel is ready to be loaded on the line before the machine is down. This enhanced machine to machine communication has greatly improved asset utilization and productivity.

A typical SMT line will stop several times per hour due to feeders running empty. In traditional set tings, lines frequently and unnecessarily, sit idle while Operators frantically search for components to replenish the empty feeders. In contrast, at Lectronics the Operators have been empowered to minimize such downtime, as the system senses which component will run out next, then triggers the Fortress to make this component available to the Operator just in time.

Another important side e ect of connecting all of the machines together within SMT, was a positive improvement in defect rates found at Automated Optical Inspection (AOI). Analyzing the defect rate for the previous two years, Lectronics placed 139 million

components in SMT in 2014, compared to placing 271 million components in 2015, while reducing the defect rate by 150%.

While a large portion of this improvement can be attributed to tighter process controls, and the addition of Mirtec’s Solder Paste Inspection machine, the TTC System plays a signi cant role in monitoring and lowering the defect rates. Due to the enhanced machine to machine communication, Lectronics’ Juki SMT machines will not run if a feeder is located in the wrong location or if an incorrect part number gets loaded on the trolley, thus eliminating any defects due to human error. Additionally, any defects recorded at AOI are automatically recorded by defect data software, which ensures that a failed product cannot proceed to the next operation until it has been repaired and re-tested with a passing result.

Overall, Cogiscan’s TTC System Software has better enabled intelligent communication between the di erent machines within Lectronics’ Surface Mount Department. This communication has not only drastically saved precious time and labor hours, but has also created a better understanding of materials and work ow. The enhancement to an interconnected and uni ed factory that intelligently tracks traceability and error data has also positioned Lectronics to be the preferred electronics manufacturing provider for many new clients.

www.cogiscan.com www.lectronics.net

P:34

Design for Test in the US Market

By W. Scott Fillebrown, Chief Technology Officer for Libra Industries, Inc.

With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/ high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue.

Superior test coverage on this type of product includes the use of boundary scan (JTAG) technology to significantly increase the test coverage as well as reduce test time. Stating the obvious, this presumes that the components on the board are boundary scan capable. Assuming this is the case, the five signal boundary scan daisy chain circuit needs to be connected. Generally, the electrical engineer connects them, but not for test purposes. Instead it is seen as a method for programming components. It is important to note that the original intent of boundary scan was to test and not program; however, it is used more often for programming.

Implementing boundary scan for test can be no different than your current programming routine. Simply connecting the chain opens up the possibility of test, and is a great beginning but only the beginning. It is recommended that a test engineer who specializes in boundary scan test review the schematic before layout begins. Doing so typically will yield a faster, more thorough test. Test throughput also increases by removing all circuits tested at boundary scan from the ying probe test program. This approach has been used on boards with more than 35,000 test points, which resulted in 95+ percent test coverage.

So the challenge has been met. It is possible to have a highly tested product built in the United States at an affordable price. Amazingly, what has been outlined here requires less upfront and design work than the traditional bed of nails in-circuit test and can be used in all phases of development, including prototype, pilot and production runs. www.libraindustries.com

Here is the challenge: the US market mainly is comprised of higher technology/lower production quantity assemblies. In many cases, in-circuit bed of nails testing is not an option due to development time and cost, not to mention the di culty associated with nding a place for 30-40 mil test points. These same test points also create signi cant EMI concerns for most electrical engineers. The challenge is to nd a way to thoroughly test a fully populated circuit in a timely, cost-e ective way, without compromising signal integrity.

Depending on the technology, the challenge can be as simple as making minor design changes, which actually can happen at the gerber level versus requiring a significant revision to the board in question. First let’s conquer the simple. For analog, RF and lower technology digital boards the approach is the simplest. Typically, straightforward ying probe test is the answer. The better EMS companies use a dual-sided flying probe tester as shown in the figure. For this test approach, the test engineer simply asks that the vias not be covered with soldermask, which can be a simple change handled at the CAM/ gerber level. Because flying probe testers can generally test a via with a 20 mil pad and a 10 mil hole, the holes do not need to be plated shut. Depending on the test coverage, the test department may recommend adding vias, assuming the design can handle it from an electrical perspective. Many CAD systems can add the via as a test point. One via per

net provides 100% access, increasing the odds for very good actual test coverage. If vias are being avoided, as in sensitive analogs or RF technology boards, the tester may be able to test at the solder joint. The challenge with this approach is many sensitive analogs or an RF design can minimize the size of the pad, increasing the chances of testing at the lead not the pad. This should be avoided due to the risk of damaging the component. Also the customers need to be open minded about “witness marks” left behind by the tester. Harder solder – for example lead-free – reduces this problem. Testing this technology typically results in higher test coverage approaching 100 percent.

Higher technology product can pose a much more signi cant challenge. The technology in this class includes high-speed digital, via in pad, blind buried vias and high BGA count. The curve ball in this case is the number of circuits that actually never see an external via, making it impossible to probe the circuit. The previous advice still applies: try to have a via exposed for every circuit. This includes making sure they are not covered by a component or soldermask. Test coverage can be enhanced if the engineer allows all exposed vias to be unmasked. This approach will give the test engineer options to test the circuit; solving common problems like testing around tall components. Typically, this results in “okay” test coverage, but no one wants to be just okay!

Page34

TheChoiceofPublicationfortheElectronicsIndustry | FEBRUARY2016ISSUE

P:35

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Celebrating in the indus

Aqua Klean Systems

Announces Its 20th Year

in Business

Aqua Klean Systems, a leading provider of advanced PCB cleaning equipment, has announced the company’s 20th year in business. Over the last two decades, Aqua Klean has consistently expanded as an international company serving its customers throughout the world.

Mike Schwager, President of Aqua Klean Systems, commented,

“These last 20 years have gone by fast. I am proud to see how far our company has progressed and the milestones we have and will continue to achieve.”

For more information visit www.aquaklean. com.

Count On Tools, Inc. Hits

25-Year Milestone

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is pleased to announce the company’s 25-year anniversary. In 1991, Curt Couch, President of Count On Tools, became a U.S. distributor of PB Swiss Tools, formerly known as PB Baumann Hand Tools. This business led to his further research in the surface mount technology and electronics manufacturing industry and, ultimately, the creation of Count On Tools Inc.

“I feel honored at the thought of where I started and where Count On Tools is today as a company,” commented Curt Couch,

“We came from humbled beginnings, but strived for excellence. This, combined with many other factors, has allowed us to continue to grow year after year. I am proud of our 25-year track record of organic growth and sustained profitability while delivering global solutions for SMT nozzles and consumables to this industry.”

Horizon Sales Turns 25

Horizon Sales, a leading manufacturers’ representative corporation, specializing in the sales and marketing of premier electronics assembly equipment, announces that it will celebrate its 25-year anniversary in 2016. Horizon Industrial Systems, Inc. (DBA Horizon Sales) was incorporated in January 1991. The company takes great pride in its ability to maintain a strong customer base as a well as the stability and longevity of its core product lines.

Dave Trail, President of Horizon Sales commented,

“I am both thrilled and humbled as we enter our 25th year of operations. When I started this company 25 years ago, both our industry and the world were much different than they are today. However, our conviction to serve our customers to the best of our ability has not changed throughout those years.”

For more information about Horizon Sales, visit www.horizonsales.com

For more information visit www.cotinc.com

Page 36 The Choice of Publication for the Electronics Industry

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years ry

OK International

Celebrates 70 Years in

2016

OK International has announced its 70-year anniversary. The company traces its roots back to 1946 when it was founded as OK Machine and Tool Corporation, specializing in precision machining of metal parts primarily for the defense industry.

“We would like to thank our customers for the success that OK International has achieved over the past 70 years,” said Christopher Larocca, President of OK International.

“This milestone is a testament to OK International’s commitment to continued innovation and technology development. We look forward to delivering industry- leading products to the market for many more years to come.”

For more information please visit www. okinternational.com

SEHO Celebrates 40 Years of Innovative Technology

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is pleased to announce its 40-year anniversary. Since its foundation in 1976, SEHO has become the worldwide contact partner whenever soldering is involved.

“With continuous investment in research, we are able to quickly react to new trends in electronics manufacturing and convert them into processes and products for serial production,”

commented Markus Walter, CEO. “We are proud that many pioneering innovations in the eld of soldering originated at SEHO”.

For more information visit www.seho.de, www.sehona.com

Techcon Announces 55

Years of Growth

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is pleased to announce that 2016 marks the company’s 55- year anniversary.

“This year marks a double anniversary for Techcon Systems, 55 years since the company was founded and 20 years since we became part of OK International,” said Bryan Gass, Vice President of Sales and Marketing.

“We are proud of the long history that has made Techcon Systems a recognized leader in the fluid dispensing industry, but the biggest thanks goes to our customers for the success that Techcon Systems has achieved.”

For more information, visit www. techconsystems.com.

t

P:38

115 Years Emil Otto—A Story of German Industry

by Florian Schildein, Butter and Salt Tech Marketing GmbH

Emil Otto Flux- u. Ober ächentechnik GmbH will be celebrating its 115th anniversary in 2016. The Rheingau ux manufacturer can look back on an eventful company history, which re ects German history in all its facets.

continued to work in Magdeburg with 50% private and 50% state capital.

In 1972 the conversion of medium-sized industries into state-owned enterprises (SOEs) had been decided by law in the GDR. Private shareholders were bought out and lost their shares. Emil Otto KG became Löt- und Poliermittelwerk SOE. A second site was established in the Berliner Chaussee in addition to the main site in Magdeburg’s Maxim-Gorki Street. Löt- und Poliermittelwerk SOE was entrusted with a few central tasks such as application research, quality assurance, central library, among other things, by the specialist group agship operation, Härtol SOE.

With the fall of the Wall in 1989 and the subsequent reunification of the two German states, the company’s management unbundled the Härtol Combine and the privatization agency offered to transfer the formerly independent companies to the former shareholders. The owning families took over the firm of Emil Otto as a retransfer community with the respective shares of the earlier shareholder structure retroactive to 1 Jan. 1991. The retransfer community as a landowner organized itself as a GbR.

EMOPOL Flux- und Ober ächentechnik GmbH was founded at the site in Magdeburg. The new company was under the management of Mr Leitreuter, the managing director of Emil Otto GmbH, and shareholder Dr Herzog. After Dr Herzog’s death, Mr Leitreuter began to unbundle the commercial unit run as a community of heirs and transfer it completely into his possession. The GmbH was liquidated and Emil Otto e.K. assigned as a plant section. The rm of Emil Otto lead by Mr Leitreuter with its headquarters in Eltville/OT Erbach and the branchinMagdeburgemergedonceagain for the rst time as a unit.

During the course of development, the emphasis of development and production increasingly shifted from the traditional assortment of polish and solder technology toward uxes for the electronics industry. Beginning in the 1970s, Emil Otto GmbH continued to steadily develop the products in order to follow ongoing development in the electronics industry. The wave- soldering process was supported right from the beginning; the conversion to lead-free soldering processes, new environmental

‘Likely just a few mid-sized companies have a history so closely connected with the political changes of the past 100 years in Germany as Emil Otto GmbH does’, summarizes Markus Geßner, authorized signatory of Emil Otto, while lea ng through the company’s chronology. The company can in fact look back on an eventful past.

The firm of Emil Otto was founded in Magdeburg in the year 1901. Magdeburg had developed into the centre of Germany’s heavy machinery and plant engineering at the turn of thecentury.Companiessuchas Krupp-Gruson and Buckau Wolf needed chemical additives for industrial metalworking

Drilling oils, and pickling and polishing agents as well as ux for soldering and brazing ferrous materials along with copper and brass came in touse.Chemicaladditivesasprocesssupport for the metalworking industry became ever more important in order to produce quickly and e ciently. The rm of Emil Otto devoted itself to manufacturing these consumables, developing and producing a variety of chemicals.

The emphasis was on ux here.

The company continued to steadily develop, surviving the turmoil of the First and Second World Wars. The production building was heavily damaged in a bomb attack on January 16, 1945 so that production had to be temporarily continued in the cellar rooms. The manufacturing plants were rebuilt after the war so that production could be quickly resumed.

The company was transformed by law into a parastatal limited partnership in 1957, a move which a ected nearly all of the companies in the former GDR. In the course of this, executive management decided to found a branch o ce in Hamburg. The company’s division was cemented in 1961 with construction of the wall. The company’s private partners coming from the founding family nally abandoned the former GDR before this happened and went to Hamburg.

The partners acquired the present site in Erbach (Eltville) in the year 1961 and rebuilt the premises formerly used as a tinning factory into a chemical production facility. The Emil Otto company had thus found its new site and supplied the German market with chemical products. In the GDR, Emil Otto KG

Page 38 The Choice of Publication for the Electronics Industry

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trends such as water-based uxes, and the development of selective soldering processes in larger scope were not just supported but actively in uenced.

In the nal years, Mr Leitreuter was no longer able to pursue the full scope of his activities due to a serious illness. He reorganized the company and created the possibility of leading the business operation out of the partnership with the founding of Emil Otto GmbH. The married couple Geßner took over the company in 2014 after his death. Investments in the development of product sales now became urgently necessary due to the many restructurings of the last 20 years. ‘We took over Emil Otto in an extremely di cult situation’, says Barbara Geßner, managing director of Emil Otto GmbH, in retrospect. In addition to rebuilding the marketing and sales structures, the entire product range was purged and adjusted to the electronics industry’s present-day needs. The rst trade fair activities were conducted in 2015. Emil Otto GmbH was liberated from its sleeping-beauty slumber and returned to the limelight of the professional public. New products such as cleaning media and SMD

adhesive were integrated into the product portfolio. Partnerships with KiWo and other manufacturers were also entered into in order to place the company on a broader foundation.

we wanted to move more forcefully into the users’ focus. These high-quality products were previously known only to a small group of the professional public and hardly a customer is familiar with Emil Otto’s entire product range. This is going to change beginning in 2016. The product groups will also be made known and actively presented to a broad public in future’, says Geßner.

The story of Emil Otto GmbH continues to write itself. ‘I think that the company has participated quite a lot in recent decades. But what always endured was the awareness to deliver the highest quality. As the new executive management, we have also prescribed this awareness for ourselves, because tradition is not resting on history. Tradition must be lived and pursued. We’re convinced that Emil Otto GmbH is heading for successful times’, says Barbara Geßner looking optimistically into the future.

www.emilotto.de

‘And this path should continue to be trod’, con rmed Markus Geßner.

‘We will also continue to actively follow this path and align ourselves with the customers’

needs. That’s how we’re going to continue to work on optimizing our product range. We will already be presenting additional innovative products at the SMT in April 2016. The sales network will continue to be actively expanded and optimized. Discussions with potential distribution and cooperation partners are being conducted so that the market may expect many novelties from Emil Otto in the near future’, says Geßner in summary But Emil Otto is also going to venture new steps in an additional area. ‘In addition to the electronics industry, we also have products for tool and machine construction, for hard and soft soldering, as well as in cooler construction and strip tinning. These lines of business were not being tended and here too

Page 40 The Choice of Publication for the Electronics Industry

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At Mycronic, we are committed to developing solutions that improve e ciency for your entire operation. We go beyond the assembly line and eliminate bottlenecks throughout the factory. With our 360 degree approach to SMT manufacturing, we help bridge your performance gaps and bring real value to your business.

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new products

exciting new industry innovations

Keeping you informed of the latest developments in technology and innovation within our global electronics industry.

Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System

Unique “Single Shot” full eld of view for warpage measurement on FOWLP panels up to 600 x 600 mm

Akrometrix LLC, a leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, have announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full eld of view warpage metrology system for panels up to 600 x 600 mm. Scalable manufacturing technology is driving the industry’s need to move from wafer sized limitations in the FOWLP market to panel based manufacturing. This is a logical step to move beyond wafers to panel sized substrates, which have been used in the LCD industry for years. Akrometrix’s AKM600P warpage measurement system enables customers to complete single shot warpage measurement of the entire panel and individual die on panels up to 600 x 600 mm simultaneously. The complete measurement and analysis of a panel of this size provides z-resolution down to 1.25 μm and takes less than two seconds to complete using the patented Shadow Moiré technology. Additionally, warpage measurements can be conducted at room temperature or up to 300°C for those needing thermal pro les.

www.akrometrix.com.

Engineered Materials Systems Announces DF-1000 Series Negative Film Photoresists

Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, introduces the DF-1000 Series Negative Film Photoresists. The DF-1000 series is available in various thickness formats from 5-50 μm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-1000 series lms are tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (by DMA Tan Delta) and a moderate

modulus of 3.5 GPa at 25°C. Additionally, the lm is hydrophobic in nature, providing for both chemical and moisture resistance. DF-1000 series lmsarethelatestadditiontoEngineered Materials Systems’ full line of lm and liquid negative photo resists formulated for making micro uidic channels on MEMS devices and TSV passivation/sealing applications.

www.emsadhesives.com.

Nutek Europe: The new revolutionary Nutek LMC-S3 with label feeder and applicator

In the past, customers have had to choose between direct part marking a PCB using a laser source, or printing and applying a label. Many preferred the direct marking based on the lower running costs and process reliability. However, there were always few products which were not suitable to be laser etched for various reasons forcing you to purchase a label placement machine instead of the preferred laser marking system. The Nutek LMC-S3 with label feeder and applicator is the answer to the above dilemma. Nutek have incorporated a label feeder and applicator nozzle into their standard laser marking cell (LMC-S3). With the use of heat resistant laser printable labels the Nutek LMC-S3 with label feeder and applicator will give you ultimate exibility;

Option 1) Laser mark the PCB using the CO2 or bre laser source.

Option 2) Apply a label which immediately after placement, is marked using the laser source.

Option 3) Combination of direct marking and label marking is also possible per product.

To reduce the impact on the cycle-time they have tted the label feeder and applicator

on the X-Y gantry, next to the laser source. While marking the label on the PCB and repositioning the gantry, a new blank label is transferred from the label feeder to the applicator, ready to be applied when new position is reached. No initial label requirements, but want to be exible for possible future requirements? No Problem, the Nutek LMC-S3 can be electrically and mechanically prepared so that the label feeder and applicator can be retro tted on- site at a later date.

www.nutek-europe.com

Quant 3D Introduces New, Faster Q300 3D Printer

Quant 3D, a division of OK International, which is an operating company of Dover Corporation, is pleased to introduce the new Q300 3D Printer. The Q300 o ers improved printing speeds – 30 percent faster than the Q200 – and is available for immediate delivery. The Q300 features a large build volume of 10 x 8 x 8” (255 x 205 x 205 mm). It is equipped with a HEPA lter to remove airborne contaminants and fumes, and well-engineered with an internal steel chassis and 100 micron resolution. With fully automatic platform leveling and height sensing, no human interaction is required with the Q300. With an MSRP set, users can now acquire a professional grade 3D printer at an a ordable price. The Q300 provides outstanding print quality in both PLA and ABS plastic, and printing resolutions at 100, 150, 200, 250, 300 and 400 microns. The system features a heated build platform, automatic platform leveling calibration and nozzle height calibration. It comes in a compact size that ts on virtually any workbench or desk, and comes standard with one spool of premium ABS plastic (white). Many colors of lament are available. “The Q300 represents a major breakthrough for Quant 3D’s product line, providing users a desktop-sized 3D

Page 42 The Choice of Publication for the Electronics Industry

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printer capable of building durable, accurate models in both PLA and ABS plastic,” said Brent Denston, Director of Sales for Quant 3D. “The envelope-size, speed and operational cost of the Q300 will appeal to designers, engineers, architects, educators and makers using 3D creation tools. With the Q300, they can now own a high-quality 3D modeling system that’s actually a ordable to use.” The Q300 turns ideas and designs into professional 3D models at the touch of a button.

www.quant3d.com.

Saline Lectronics Installs a Flexible Assembly Flow Line

Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed a new assembly ow line. The line is setup in a systematic, unique con guration in order to provide a truly exible lean system. With this new system, Lectronics is able to assemble an endless number of customer product con gurations and volumes. Since the system is programmable, Lectronics’ manufacturing team can customize the line to provide the most e ective method to assemble each client’s end-product. The line also is designed to support quick changeover scenarios, allowing Lectronics’ production team to easily switch to another assembly on-the- y. Additionally, the ow line successfully allows endless operator balancing scenarios with di erent assembly cycle rates.

The line utilizes an 18” wide belt, ESD protected and non-marring, to accommodate larger customer electro-mechanical box build products. It is ergonomically friendly due to the exible height adjustments allowing for optimum operator comfort. Touch-screen computers have been installed on the line to display interactive, clear work instructions for operators.

The line also can be programmed to set speci c production goals, which are monitored and displayed to the production team members in order to ensure goals are being met. The system collects critical line data and indicates when and where bottleneck operations are present, allowing Lectronics to keep the line balanced and continuously owing.

“As part of Saline Lectronics’ vision to be a true lean EMS organization, the launch of this new ow line brings us one step closer to achieving a complete lean manufacturing system on the production oor,” commented Je Riedel, Lean Champion.

www.lectronics.net

Techcon: Update to Manual Syringe Assembly

Techcon Systems, a product group of OK International and a leading provider of uid dispensing systems and products, have announced the availability of the new 1ml manual syringe assembly, MSA401L-1. The MSA401L-1 consists of a barrel, a plunger and a piston all fully assembled without any lubrication. The manual syringe assembly provides simple and quick dispensing solutions, without the need for compressed air. The barrel and plunger are made from Polypropylene resin. The piston is made from thermoplastic rubber. This product is available in a bulk package of 1000 pieces. Below is the ordering part number:

PART NUMBER

DESCRIPTION

MSA401L-1-1000

MANUAL SYRINGE ASSEMBLY, 1CC, QTY = 1000

www.techconsystems.com.

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P:44

Great Lakes Engineering Company Profile

by SMT Today Editor

For almost 30 years, Great Lakes Engineering has prided themselves on providing exemplary service to their customers and supporting their local community. Founded under the name Electro-Precision Inc. by John M. Carr in 1986, the company was built around Carr’s talent as a chemical engineer. The business was based on the only real viable technology at the time (Photochemical Machining) and manufactured high quality etched parts and surface mount stencils.

Their expertise in manufacturing thin foil metal parts and surface mount stencils is second to none, and their turn times and customer service lead the industry.

Next up for Great Lakes Engineering is partnering with Etsy.com, a marketplace where people around the world connect to make, sell and buy uniquegoods. Etsyrecentlylaunchedthenewest phase of the site, Etsy Manufacturing. The beta version of the Manufacturing portal launched in October 2015 and now allows designers to build direct relationships with partners they can trust.

“We’re excited to explore this new and unique avenue to meet customers globally, and help them achieve their goals through our manufacturing services,” commented Bruce Weaver, co- owner at Great Lakes Engineering. “We’re always looking for ways to branch out and reach new demographics, and Etsy is providing a strong portal for this.”

Etsy designers can now search for and contact manufacturing partners like Great Lakes Engineering on Etsy to help bring their designs to fruition.

Great Lakes Engineering continues to thrive by creatively reaching new customers in di erent sectors, and by continuously proving their dedication to their loyal and satis ed customers.

www.greatlakeseng.com

In April of 1999, the business was purchased by Carr’s three sons who all had worked several years for their father. John J. Carr, Martin Carr, and Chris Carr, along with new-comer Bruce Weaver, purchased the business, changed the name, moved the facility, and added new technologies while still keeping its core expertise Photo Chemical Etching. A new era of manufacturing began. John M. Carr still is crucial to the company’s existence and continues as a consultant and master chemist for new technologies and process control.

What truly sets Great Lakes Engineering apart from other companies is their dedication to their employees and community. In 2015 alone, they have been recognized with the 2015 Best in Class Award in the category of MRO/Consumables/ Equipment awarded by Electronic Systems Inc., they were the 2015 recipient of the Best of Maple Grove Award in the category of Assembly & Fabricating Service, and they participated in the 5th annual ‘It’s All About The Kids’ charity event bene tting the Children’s Hospitals & Clinics of Minnesota.

“We are really just normal guys working to make a decent living for us, our families, and our employees,” commented Bruce Weaver, co-owner of Great Lakes Engineering. “We started this business with dreams of getting rich,

but over time we realized that we had a much more important role. We feel this tremendous responsibility to provide our employees a good place to work, and with a good living for them and their families. This is our number one responsibility, followed by the service and support we need to provide our customers. The relationships we have with our customers and service we provide them are critical to our success and our customers’ which in turn helps provide all of us with a good life. We are involved in our community when we can be, but our focus is really on our employees, their families, our customers and their families.”

Great Lakes Engineering strives to give their customers what they need, on time, mistake free, and at a fair price. They are continuously looking to the future and improving their process, expanding their markets, and nding new and innovative products to provide their customers.

Today Great Lakes Engineering boasts many capabilities including laser cutting of thin foils, photo chemical machining, metal etching, Electro- Forming of thin Nickel stencils and parts, photo plotting, engineering services, squeegee blade manufacturing, and are also a proud distributor for Henkel products, including solder paste. They also have a large jewelry/decorative business that is growing quickly.

Page 44 The Choice of Publication for the Electronics Industry

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P:46

Interview with Peter Tallian - general manager

of BTU international

By SMT Today Editor

BTU International is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics assembly and alternative energy manufacturing markets. BTU has a unique set of capabilities, know-how and experience supporting precision temperature and atmosphere applications up to 1800˚C. The company has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the USA, Asia and Europe. Our editor recently spoke with Peter Tallian, BTU International’s newly appointed General Manager to nd out more about Peter’s role and how the company plans to keep its competitive edge moving forward.

applications and eld support are the primary drivers of our growth. Regionally, we are seeing strong demand in Asia including China, Mexico and the USA, compelling us to further strengthen our support teams to meet this demand. From a segment point of view, we have been strong in our partnership with the Taiwanese SATS providers and continue to gain share in the automotive market.

Q. We understand you’ve had measurable success in Mexico through your representative SMarTsol. What needs does the Mexican market have that BTU can ll better than competitors?

A. We are really pleased with the excellent partnership we have with SMarTsol in the rapidly growing Mexican market. SMarTsol knows and supports the customer base in a superior and highly e ective manner. They are the partner that all the furnace suppliers want to have on their side. We are growing our installed base in Mexico due to the robust technical strength of our equipment supported by excellent, on-site eld service. The automotive market is a key driver in Mexico and we are selected due to the quality, repeatability and technical capability of our solution. Our closed-loop convection technology is fundamental to this market, enabling oven repeatability run-to-run and line-to-line.

Q. In the news recently, we have noticed a focus on the company’s commitment to re ow and high-temperature belts. What is the reasoning behind this strategy? What bene ts does this provide to customers? How does this focus t into your overall growth strategy plan?

A. BTU has a 65-year history of excellence in re ow and high-temperature belt furnaces. We have thousands of machines installed and operating – many for decades. Following the merger with Amtech Systems, the BTU team is actively focused on its areas of strength and success. We believe focus strengthens our commitment to our customers and supports our growth plan. We’ve always felt that our high-temperature expertise is a bene t to our re ow customers. Our expertise does not end at 350° or even 400°. Our engineers routinely handle problems upto 1800°C, greatly increasing our knowledge base in solving critical thermal processing problems.

Q. PYRAMAX is quickly becoming an industry standard. Over the years, it has developed and grown in order to bene t more than electronics manufacturing. What other markets or industry segments can bene t from the PYRAMAX technology?

A. Our PYRAMAX product is focused precisely on the re ow market and we are constantly innovating to reduce operating costs and to broaden its use within solder re ow. Our well-

Continued...

Q. Peter, congratulations on your new role within BTU International. Can you give us a brief description of your professional background?

A. Thank you. My career has been focused primarily on high-technology manufacturing businesses with worldwide operations. I gained a very solid foundation at IBM’s semiconductor operations for 13 years and then moved through executive positions at technology leaders in telecommunication, semiconductor and specialized manufacturers. I am trained in nance with degrees in nance and management.

Q. How long have you been involved with BTU International and what roles have you held over the years?

A. I joined BTU in 2009 in the role of CFO. In 2012, I added the responsibility of Chief Operating O cer. With the acquisition of BTU by Amtech Systems at the beginning of 2015, I assumed the role of General Manager.

Amtech Systems, Inc. is a global supplier of advanced thermal processing equipment to the solar, semiconductor/ electronics, and LED manufacturing markets.

Q. What does the title of “general manager” mean within BTU International? What do you hope to accomplish in this role?

A. The general manager of BTU is responsible for the overall performance of the BTU division and sets the strategic goals of the organization in all aspects of the business. We have sales and service locations throughout the world. Each Amtech division is run in a similar fashion with a high degree of independence.

Q. BTU International has long been recognized within the industry as a technology leader and innovator. How will you continue this strategy presently as well as in the future?

A. BTU International started out as BTU Engineering and has been in business for over 65 years. BTU’s approach to delivering innovative solutions to our customers is multi-faceted. Our re ow and belt furnaces are customized to speci c user applications. We start with the detailed knowledge

and expertise of our worldwide agents and distributors who have been with BTU for decades. We continue with a deeply experienced sales force that works with our engineering experts in China and the USA. As you listen to our customers, you will hear of the long-term partnerships, the applications and the engineering expertise that we bring to each of our working relationships.

It is not unusual for us to have shipped 40 or 50 machines to a customer and, in some cases, we have shipped well over 200 machines to currently active customers. We partner with other Amtech divisions, leading research institutes and startup ventures on applied R&D. BTU takes great pride in its proven engineering capability.

Q. What are your growth plans moving forward? Which regions are growing the fastest currently?

A. Our growth plans focus on our two core businesses, reflow equipment and high- temperature belt furnaces for multiple markets. We are pleased with the level of new customers that we add to our customer base each year and are working hard to expand to adjacent markets. Our proven skill in manufacturing top quality equipment supported by strong

Page46

TheChoiceofPublicationfortheElectronicsIndustry

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feature continued...

proven and carefully engineered convection technology has been used in many other markets. We have a con gurable o ering through our custom furnaces group that extends the use of convection heating to other markets. The closed- loop convection plenums can be con gured for very wide widths, long heated lengths and heavy loads. This type of convection dryer is called a CHT. As a result, we’ve been able to deliver a highly customized solution that has the built- in, eld-proven reliability of a volume product. Convection is by far the best choice for heating and cooling at lower temperatures.

Q. From what we understand of the PYRAMAX platform of ovens, it would be an ideal t for LED production. Is that the case? Is the PYRAMAX gaining popularity in the LED market? If so, what features make it a good t for LED production?

A. The PYRAMAX was developed originally to handle very large backplane boards that were common during the communications ramp-up years ago. These boards were so large and so heavy that only PYRAMAX could handle

the job. Now, what’s old is new again: LED boards that are three or four feet long are not uncommon. For LED, we are seeing demand for our longest Pyramax con guration, the 12 zone Pyramax150z12.This gives LED manufacturers the throughput they need while ensuring thermal uniformity on a very long board. The process repeatability of our closed-loop convection technology is an added bene t to ensure yield on these high-value boards.

Q. BTU has continued to maintain a strong global service infrastructure to support customers in both the electronics and LED markets. Please describe your service infrastructure for our readers.

A. We are justi ably proud of the BTU global service and support team. We provide BTU support out of more than 30 locations worldwide, including parts depots on three continents. Our BTU support is supplemented by excellent teams managed by our key distributors. The success factors of our support are the quality of the BTU product, and the training and experience of a service team with a willingness to move mountains to keep our customers up and running. www.btu.com

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productronica 2015 recap

Positive atmosphere at productronica 2015

by Bettina Schenk, PR Manager, Messe Muenchen

On its 40th anniversary, productronica featured plenty of innovations including augmented reality, robotics in electronics manufacturing and the productronica innovation award. Some 38,000 visitors from nearly 80 countries took part in the World’s Leading Trade Fair for Electronics Development and Production. The share of visitors from Asia was up considerably.

innovation award play an important role for the economy, but also for the scienti c sector, and they strengthen horizontal and vertical cooperation. In doing so, they satisfy a key prerequisite for rapid implementation in system development and the user industry.”

Of the more than 70 submissions, awards were presented to the following winners in ve cluster categories: Fuji Machine in the PCB & EMS

Falk Senger, Managing Director at Messe München, drew a positive conclusion: “During the past four days of the fair, we have experienced the industry’s unbelievable innovative strength. That underscores productronica’s position as an international industry gathering for electronics development and production.”

Rainer Kurtz, Chairman of productronica’s Technical Advisory Board, CEO of kurtz ersa and Chairman of the VDMA Electronics, Micro and Nano Technologies (EMINT) Association, sees positive signals for the industry:

“There are so many opportunities to drive our business forward. Industry 4.0 is a new market with a great deal of growth potential, and in automotive electronics, all the driver assistance systems are giving electronics production a considerable boost.”

The latest gures from a VDMA survey about the business climate verify that. According to studies, growth rates of approximately 15 percent are expected between now and 2018—among other things due to Industry 4.0, the automotive industry, wireless network technologies and mobile communication.

According to a survey by market research institute TNS Infratest, 93 percent of visitors

said that productronica met their expectations regarding innovations. Some 38,000 visitors from nearly 80 countries attended the trade fairinMunich—roughlythesamehighlevel as in previous years. According to a survey by market research institute TNS Infratest, visitor satisfaction is very high: 97 percent of visitors gave the fair a rating of good to excellent. The sharpest increase in attendance was the number of visitors from Asia - from China, Japan, Malaysia and Singapore in particular. After Germany, the countries with the largest number of visitors were as follows (in this order): Italy, Austria, Switzerland, the Czech Republic, the Russian Federation and Great Britain. Successful premiere: productronica innovation award

Panel member Prof. Lothar P tzner from the

Fraunhofer Institute for Integrated Systems and Device Technology IISB, is convinced by the award’s concept: “Given global competition, it is important to further strengthen machine manufacturers, material producers and information technology suppliers in Europe. productronica and the brand new productronica

cluster, Rehm Thermal in the SMT cluster, F&K Delvotec in the Semiconductors cluster, Schleuniger in the Cables, Coils & Hybrids cluster, and Asys in the Future Markets cluster. Additional information: www.productronica. com/en/award

IT2Industry

IT2Industry, the Exhibition and Open Conference for Intelligent, Digitally Networked Working Environments, was held in conjunction with productronica for the rst time ever. The nal report for IT2Industry is available in the press section of its website at www.it2industry.de

The trade fairs productronica and electronica are held in alternating years, making Munich the most important place for the electronics industry to meet. The next electronica takes place from November 8 to 11, 2016, and the next productronica takes place in Munich from November 14 to 17, 2017.

Extensive photo materials for productronica 2015 are available at http://media.messe- muenchen.de/productronica/aktuell.jspx

productronica 2015—For the rst time ever, the fair featured robotics for electronics manufacturing

productronica 2015—SMT cluster —Hall A4g

Page50

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EFFECT OF Bi CONTENT ON

PROPERTIES OF LOW SILVER SAC

SOLDERS

Mehran Maalekian, Ph.D. and Yuan Xu, (Montreal, Canada) and Karl Seelig (Cranston, RI, USA) AIM Metals & Alloys

ABSTRACT

Since the adoption of RoHS and REACH regulations for electronics manufacturers, Sn-Ag-Cu (SAC) alloy systems have largely replaced the Sn-Pb solder alloys with Sn-3Ag-0.5Cu (wt%) (SAC305) the most widely accepted. This high silver content SAC alloy (greater than X percent) has a major de ciency however, the relative fragility of the solder joint. This is due to the formation of primary Ag3Sn platelets crystals in the solidi ed structure leading to poor drop-shock performance causing major concerns for portable devices. Lowering or eliminating Ag content of SAC has been proposed as a solution but with limited success. In this work, a systematic study is presented to address the e ect of Bi content on soldering and mechanical performance of low silver SAC alloys. Thermal behavior (melting and solidi cation), wetting and spreading performance, and tensile and hardness properties of alloys are compared and a promising lead-free SAC-Bi solder alloy that also demonstrates tin whisker mitigation properties is recommended.

low (0.5%) to high (22%) values. Soldering and mechanical performance of the alloys are studied and compared. EXPERIMENTAL Twelve alloys with varying Bi content (Table 1)

80 60 40 20

0

2003 2005 2007 2010

Figure 1. Global consumption of lead- free versus tin/lead solders (in wt%). In 2010, for example, worldwide consumption of lead free solder was at 70%, whereas it was 30% for tin/ lead \[5\].

Key words: Lead-free solder, electronic assembly, wettability, mechanical properties, melting, tin whisker

INTRODUCTION

Soldering is the most important part of assembly process of electronic components. Among many various criteria for creating a robust solder joint are wettability, spreading, thermal behavior (melting and solidi cation), mechanical properties such as tensile strength and creep resistance, thermal and electrical conductivity and cost. Prior to RoHS, Sn- Pb alloys had been widely used as the main solder material for electronic packaging due to its low cost, relatively low melting temperature, superior wetting behavior, high reliability and relatively good mechanical performance. However, due to environmental and health concerns from the toxicity of lead (Pb), it has been banned for use in electronic and electrical devices, resulting in extensive study to nd a suitable replacement. Fig. 1 illustrates how rapidly the global solder industry responded to the demand for lead- free solders in many electronic applications. Among the lead-free alternatives, Sn-Ag-Cu (SAC) alloys are regarded as the de facto replacement for Sn-Pb solders. The most popular of these alloys is SAC305 containing 3% silver, 0.5% copper and the balance (96.5%) tin (wt.%).

The relatively high silver content of SAC305 introduces two major concerns related to performance and cost. SAC305 is prone to drop-shock and creep failure due to the formation of large Ag3Sn platelets and poor creep resistance \[6,7\]. SAC alloys exhibit high undercooling that is associated with the di culty of nucleating Sn solidi cation as a pro-eutectic phase. Thus, during slow cooling, e.g., in ball grid array (BGA) joints where cooling rates are slow (<0.2°C/s), the high undercooling of the joints can promote formation of undesirable pro- eutectic intermetallic phases, particularly Ag3Sn blade-like phase, that tend to coarsen drastically making the as-solidi ed solder joints more brittle \[6\]. In addition, the price of silver has increased drastically over the last several years driving the industry for lower silver or lower cost solder alloys.

The aim of this study is to examine a low silver content alloy to reduce the solder cost and improve mechanical performance by elimination of primary large Ag3Sn platelets. However, by lowering Ag content of SAC alloy, melting temperature will increase. The addition of bismuth (Bi) as a low cost element can reduce the melting temperature and improve mechanical properties. Bi may also reduce mitigate tin whisker growth which is very important in the context of lead-free solders in high reliability electronic assembly. Thus, in this work binary Sn-0.7Cu is taken as the base solder alloy. The presence of copper (Cu) reduces the copper dissolution rate from the terminal pad. The silver (Ag) content of the alloy is kept below 1% and the added Bi from

were prepared in an electric pot with graphite crucible. The composition of solder alloys was analyzed by arc emission spectroscopy. The molten alloys were cast into round ‘dog-bone’ shape in a stainless steel mold for tensile testing. The tensile specimens with the dimensions shown (Fig.2) were annealed at 125°C for 96 hr. to remove any residual stress or inhomogeneity induced during the sample preparation. Tensile tests were performed at room temperature with a constant strain rate of 10-3 s-1. For each alloy at least ve specimens were tested to ensure reproducibility of the tensile test results. Hardness of all the specimens was also measured by Vickers micro-hardness testing machine with 10gf load and 10s impression time.

Thermal behavior of the alloys was investigated with di erential scanning calorimetry (DSC). A piece of 50-100mg alloy was heated in an aluminum cell at heating rate of 10°C/ min under nitrogen atmosphere followed by cooling to room temperature at -10°C/min cooling rate. Each alloy was tested twice and the reading was based on the second run. Wettability is a critical factor when evaluating

Table 1. Compositions of solder alloys (wt%)

Sn

Cu

Ag

Bi

Bal.

0.7

0.6

0-22

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Table 2. Wetting balance test parameters

Molten alloy temperature

265°C

Pre-heat time

10 sec

Immersion speed

20 mm/s

Immersion depth

6 mm

Immersion time

5 sec

Figure 2. Dimensions of round bar tensile specimen (dog-bone).

the performance of a solder alloy. The wetting process is dynamic during soldering and the solid/liquid interfacial tension between solder and substrate varies as the wetting proceeds. Wettability can be quanti ed with wetting balance technique that measures wetting force between molten solder and solid substrate versus wetting time. Wettability of the alloys was therefore quanti ed with wetting balance technique. A copper plate coupon (25mm×6mm×0.5mm) used as the substrate was immersed in a bath of liquid solder alloy and the wetting force was measured over time. The wetting balance curve displays the vertical component of force (F) applied by the wetting balance load cell on copper coupon (see Fig. 3). This technique will provide real-time wetting force that can be evaluated as wetting performance of solders and uxes. In the typical wetting balance curve shown in Fig. 3b, ‘t0’ is the time for the wetting curve to recross the buoyancy force line and the contact angle falls to Θ =90°, this time is called zero cross time. In this study, the time ‘t0’ and the maximum force are taken as wetting time and wetting force, respectively. An alcohol based no clean ux (AIM NC 265) was used to ux/prepare the substrate surface. Each test was repeated three times and the average value was reported. Details of wetting balance test condition are shown in Table 2.

In order to evaluate tin whisker growth, a 2mm diameter copper wire was uxed and dipped into the molten solder pot followed with wiping in order to give a uniform coating thickness. The coated wire was then stressed by making a “U-shaped” bend to 90 degrees. These samples were exposed to an accelerated whisker growth condition, i.e. in an environment chamber with 60°C temperature and 85% relative humidity. The surfaces of samples were regularly examined with scanning electron microscope (SEM) for tin whisker growth.

RESULTS AND DISCUSSION

Thermal behavior

DSC heating curves (heat ow versus temperature) are shown in Fig. 4. The valleys represent intense endothermic phase transitions, i.e. melting. Based on thermal behavior of the alloys DSC diagrams are separated in two plots in Fig. 4: the top diagram for relatively low Bi alloys and bottom diagram for high Bi alloys. DSC results clearly show that high Bi content SAC-Bi alloys that form very low melting temperature phase (circled) and are not suitable for further consideration. Thus, the focus of this work was directed to lower Bi content alloys.

In order to better understand e ect of Bi on the thermal behavior of the alloys, a thermodynamic calculation based on Scheil-Gulliver solidi cation model was carried out using the FactSageTM thermodynamic software \[8\]. The calculated weight percent of liquid phase in each alloy as a function of temperature is illustrated in Fig. 5. The solidi cation model which is partial equilibrium approach (full di usion of solute in liquid but no di usion in solid) shows that the low melting temperature phase is signi cant (>15%) in alloys with Bi content of 10% and above. However, the low amount of liquid phase solidi ed at low temperature (~140°C) in low Bi alloys (Bi<6%) explains the absence of detectable low temperature peak in DSC curves.

For solidus determination of the alloys the temperature of the rst visible onset of melting has been taken. In other words, as soon as a de ection from the baseline of DSC curve occurs, melting is taking place. For liquidus the peak temperature is taken. Fig. 6 depicts that the solidus and liquidus of SAC-Bi alloys decrease linearly in parallel fashion with increasing Bi content up to about 3wt% Bi. However, the solidus and liquidus parallel lines start to deviate at higher Bi content as depicted with dashed line at 3% Bi in Fig. 6. Pasty range which is de ned as the di erence between solidus and liquidus temperatures (see Fig. 7) increases slightly with Bi content up to 3 %; however, the increase is drastic above 3% as depicted in Fig. 7

Figure 4. Heating curves (heat ow vs. temperature) of the alloys at the heating rate 10°C/min: top diagram shows low Bi (Bi<6%) content SAC0607-Bi alloys and bottom diagram shows high Bi (>9%) content SAC0607-Bi alloys with low melting phase peak.

Figure 3. (a) Wetting balance test running on Cu coupon immersed in molten solder bath. Wetting force (F), contact angle (Θ), surface tensions at the solid-liquid (γSL), solid-vapor (γSv) and liquid-vapor (γLv) interfaces are schematically shown. (b) Typical wetting curve shows the wetting balance force versus wetting time.

Figure 5. Calculated liquid fraction vs. temperature of SAC-Bi alloys at di erent Bi contents.

Figure 6. Solidus and liquidus temperatures of the alloys determined by the rst de ection of the baseline in DSC curve. Parallel solidus and liquidus lines deviate at 3% Bi.

Continued...

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feature continued...

Figure 7. Variation of pasty range of the SAC-Bi alloys with Bi content.

Mechanical properties

Tensile stress-strain curves of the alloys (Fig. 8) show that by increasing Bi content the strength of SAC-Bi alloys increases while ductility decreases. Bi bearing alloys all show higher strength as compared to that of SAC305. Fig. 9 shows that the increase of tensile strength with Bi content is linear. However, elongation decreases with addition of Bi content in a non- linear fashion and follows a power law function up to 3% Bi as shown in Fig. 10. The elongation of 6% Bi alloy falls below the power law tting equation indicating a rapid reduction in ductility of the alloy. Furthermore, consistent with tensile strength results, hardness data (Fig. 11) also demonstrates that the hardness of alloys increases linearly with Bi content.

Solid solution of Bi in Sn is the main strengthening mechanism \[9\]. Precipitation of Bi in β-Sn matrix at higher Bi content may also contribute in strengthening of the alloys. A thermodynamic calculation of equilibrium phases illustrated in Fig. 12 con rms that all Bi dissolves in the matrix at Bi concentrations below 3wt%. Therefore, the only strengthening mechanism is solid solution of Bi in β-Sn. Since Ag and Cu contents are kept constant, concentrations of intermetallic phases, i.e. Ag3Sn (0.8 wt%) and Cu6Sn5 (1.8 wt%) remain identical for all the alloys. The equilibrium calculation also shows that when Bi content is above 3 wt% the concentration of Bi particles increases as a result of limited solubility of Bi in β-Sn. Thus, precipitation hardening mechanism may also contribute in mechanical properties of the alloys.

Wetting behavior

The wetting balance test results are shown in Fig. 13. It is found that bismuth addition above 2wt% improves wettability of SAC-Bi alloys by increasing wetting force and reducing wetting time as demonstrated with the shifting wetting curve towards top left of SAC0607 curve. Graphs of wetting time (t0) and wetting force as function of Bi content are shown in Fig.14. Fig.14a clearly shows that Bi addition increases the wetting speed. The trend is captured with a single polynomial function. The fact that addition of Bi reduces the melting temperature of the alloys (see Fig. 6) can explain why wetting time decreases with Bi additions at constant wetting test temperature. Trend for wetting force (Fig.14b) is slightly di erent. Wetting force increases with addition of Bi up to about 3%. When the Bi content increases further (Bi>3%) maximum wetting force drops to lower values. In other words, the optimum Bi content to improve wetting force is about 3 wt%. As shown in Fig. 14b the maximum wetting force follows a parabolic diagram with highest wetting force around 3% Bi content.

Figure 9. Tensile strength of SAC-Bi alloys changes linearly with Bi content.

Figure 10. Tensile elongation of the alloys in the annealed condition. Up to 3% Bi the elongation ts with a power law equation. Elongation decreases more rapidly in alloy with higher concentration of Bi (6%).

Figure 13. Wetting force balance curves of the alloys at 265°C

Figure 11. Hardness of the alloys in the annealed condition.

Figure 8. Tensile stress-strain curves of annealed specimens. SAC305 is shown for comparison.

Figure 12. Equilibrium calculated wt% of Bi phase precipitated in β-Sn at 25 0C for the alloys Sn-0.6Ag-0.7Cu-XBi. Other phases calculated for the alloys are: 0.8 wt% Ag3Sn, 1.8wt% Cu6Sn5 with balance of β-Sn.

Figure 14. (a) Variation of zero cross wetting time, and (b) maximum wetting force with Bi content. Wetting time (t0) decreases with addition of Bi content in all concentrations studied, whereas wetting force shows a peak around 3% Bi.

Continued...

Page 54 The Choice of Publication for the Electronics Industry

| FEBRUARY 2016 ISSUE

P:55

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Tin whisker

For tin whisker evaluation the alloy with optimum properties that is SAC-3Bi was evaluated against reference SAC305. Fig. 15 shows SEM image of the bend area of wire where observation of whiskers was carried out. Tin whiskers are observed in SAC305 samples soaked in testing chamber for 2600hr and 3100hr (see Fig. 16). However, there is no obvious trace of whiskers on SAC-3Bi sample after 2600hr and 3100hr soaking. Nevertheless, some signs of whiskers nucleation may be realized for SAC- 3Bi sample soaked for 3100hr (Fig.16). The results show that whisker growth is e ectively suppressed by Bi addition which is consistent with previously published references \[10, 11\]. Mitigation of tin whisker growth with addition of Bi is attributed re ning of grain size structure and also suppressing intermetallic growth at grain boundaries allowing grain boundary migration and releasing compressive stresses. In this work we did not perform detail microstructure study to verify the suggested mechanism for mitigation of tin whisker growth

SAC-3Bi (2600hr)

SAC-3Bi (3100hr)

Figure 16. SEM surface evaluation of copper wire coated with SAC305 and SAC-3Bi after 2600 hr. and 3100hr in 60°C and 85% RH chamber.

SUMMARY

A systematic study on low silver SAC0607-Bi solder alloys was carried out in order to propose an alloy with optimum soldering and mechaincal properties. Properties such as thermal behavior, wetting performance, hardness and tensile strength, as well as tin whisker growth were investigated and compared with reference SAC305.

The following conclusions can be summarized:

• Alloys with Bi contents higher than 6% form a detectable low melting temperature phase

• Melting temperature of SAC-Bi alloy decreases linearly with increasing Bi content up to 3%.

• Pasty range which the di erence between solidus and liquidus temperatures increases drastically with Bi content above 3%.

• Tensile strength and hardness both increase linearly with Bi content in the range of 0-6 wt%.

• Tensile elongation decreases with Bi addition. The trend is more rapid in the alloy with high concentration of Bi, i.e. 6%. This is attributed to additional strengthening mechanism; precipitation hardening that is activated at high Bi contents (Bi>3%).

• Wetting time decreases with Bi additions. Optimum wetting performance (short wetting time and high wetting force) is obtained for the alloy with 3% Bi.

• Tin whisker growth is mitigated in SAC-Bi alloy as compared with SAC305.

Based on the soldering and mechanical data in this study, it is concluded that SAC0607-3Bi is the best choice in terms of melting, wetting, mechanical and reliability performance as compared to SAC305.

Future work will include the manufacturability, process capability and product reliability of SAC0607-3Bi for electronics assembly.

ACKNOWLEDGMENT

The authors would like to thank Dr. Amir Nobari for the thermodynamic calculation.

REFERENCES

M.M. Schwartz, ASM handbook:

vol. 6, Welding, Brazing and Soldering, editors: D.L. Olson, T.A. Siewert, S. Liu, G.R. Edwards, ASM Int.1993, 126-137.

L. Zhang, C.-W. He, Y.-H Guo,

J.-G Han, Y.-W Zhang, X.-Y Wang, Microelectronics Reliability 52 (2012) 559-578.

G. Zeng, S. Xue, L. Zhang, L. Gao, J Mater Sci : Mater Electron (2011) 22 : 565-578.

M. Abtew, G. Selvaduray, Mater Sci Eng 27 (2000) 95-141.

IPC Market Research Services, Global consumption of tin/lead versus lead free solder, www.ipc.org.

A.J. Boesenberg, I.E. Anderson, J.L. Harringa, J Electron Mater 41 (2012) 1868-181.

A.Z. Miric, SMTA Int. Conf., Orlando, FL, Oct. 2010.

C.W. Bale, P. Chartrand, S.A. Degterov, G. Eriksson, K. Hack, R. Ben Mahfoud, J. Melancon, A.D. Pelton, S. Petersen, CALPHAD 26 (2002) 189-228.

M. Maalekian, Y. Xu, A. Nobari, K. Seelig, International Conference on Soldering and Reliability, Toronto, 2015.

N. Jadhav, M. Williams, F. Pei, G. Sta ord, E. Chason, J. Electron. Mater. 42, 312 (2013).

J. Jo, S. Nagao, K. Hamasaki, M. Tsujimoto, T. Sugahara, K. Suganuma, J. Electron. Mater. 43, 1 (2014).

www.aimsolder.com

Figure 15. SEM picture showing the bend area of the wire where tin whisker growth is examined.

SAC305 (2600hr)

SAC305 (3100hr)

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Ember Industries’ Spark Cannot Be Doused

by Rob Cardenas, Production Manager

With the help of a strong industry partnership, the company not only survived a potentially devastating ood but came out of it stronger than before

time the project is run. This engineering and production documentation, coupled with Ember’s various levels of quality metrics, creates an extensive history of every product produced, and is the basis for its continuous improvement initiatives.

Ember Industries has implemented a full ERP system that allows instant access to the production process including WIP tracking, material control, labor analysis and complete historical database such as lot numbers, date codes and serialized numbering of lots and complete ECN history.

In addition to the strong services and capabilities it o ers, Ember Industries is an environmentally conscientious company. It is fully compliant to the requirements of the RoHS initiatives and recycles much of the waste materials and byproducts resulting from the assembly process.

“We are committed to the continuous improvement of our quality, costs and efficiencies as evidenced by the various awards presented to us from our customers, suppliers and associate organizations,”

added Leonardis. “We recognize that we are a small part of the communities where we work. We believe in giving back to the community and the people who have supported us through the years.” Ember’s employees have volunteered and served on public boards, community organizations, and public service organizations. Company employees have organized and participated in many service organization events to raise funds for organizations and individuals in need of assistance from others.

Ember believes that strong employees make for a successful company. As such, it has worked hard to put together a strong production sta . Each member has extensive experience in the electronics assembly industry. The average years of experience of the company’s production sta exceeds 10 years, its engineering and manufacturing management team has more than 25 years of experience in the manufacturing of electronic assemblies, and its senior management team has an impressive history in growing and managing successful organizations while improving pro tability and increasing stakeholder value.

Leonardis also said that the company’s success has been realized through a business model that achieves its core competencies while partnering with technology leaders to provide all the necessary components of a complete solution for its customers.

Headquartered in Texas, Ember Industries is a full-service electronics manufacturing services (EMS) company that provides full turnkey assembly of printed circuit assemblies, electronic and electromechanical devices, wire, and cable and wire harness assemblies. Ember Industries serves a diverse group of customers throughout the commercial and industrial markets. Its customers’ products serve the healthcare industry, access and security markets, high- intensityLEDlightingsectors,professionalaudio equipment, and various test and measurement equipment that cross several market segments.

The company was established in 1986 as a smallcontractdesign rm.Throughtheyears, it has progressed into a full-service contract manufacturingcompany.CEOTomLeonardis said that Ember’s rst focus has always been to provide the best service and support as possible to its customers. This focus has helped the company grow into the successful organization that it is today.

Leonardis added, “We are committed to continuous improvement and use state- of-the-art systems and best practices to

bene t all customers and stakeholders. We achieve customer success by providing our customers with quality, reliability and service that exceed expectations.” As such, Ember’s capabilities are advanced and relevant to today’s most challenging technologies. These include automated SMT and through-hole technologies, ball grid array (BGA) placement, automatic optical inspection (AOI), in-circuit testing (ICT), automated and function testing, cable and wire harness assembly and testing, manufacturing process management (MPM), and integrated process control and documentation.

Ember Industries provides a complete portfolio of EMS services using documented and streamlined processes to handle all its customers’ needs from prototyping to medium-volume manufacturing and assembly. It begins with fully engineering the project by using a PCB assembly solution for machine programming and document generation in an easy-to-understand graphic representation. The extensive documentation procedures provide a reliable, repeatable process that ensures the same high-quality product each

Continued...

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One such partner, Juki Automation Systems Inc., has been working with Ember Industries for almost 10 years. “When it was time to upgrade our SMT equipment, we looked at the marketplace and compared competing systems. We did have some experience with a small semiautomatic machine that was made by Juki and marketed under another name,” he added. “Our engineers felt that the Juki equipment was bulletproof. Additionally, they said that the equipment was easy to set up and operate, and urged us to consider Juki in our buying decision. That started what we consider an outstanding relationship.”

Ember began acquiring Juki 2050 and 2060 series pick-and-place machines in 2006 for additional capacity. In 2007, it purchased another machine to replace an older piece of equipment. Then the company purchased and installed another line in 2011, and expanded that line in 2014.

Ember currently operates six Juki pick-and- place machines on three lines. Additionally, it has purchased screen printers and re ow ovens from Juki, as well as uses various software tools provided by Juki to improve operational e ciencies. Leonardis added that in the contract manufacturing environment, the Juki systems have provided the company with a signi cant amount of range in part types that the systems can place. This, in turn, has allowed Ember Industries to have a large portfolio of customers from di erent industries.

Besides o ering exible, reliable equipment, Juki Automation Systems believes a strong partnership must include strong customer support. Leonardis con rms that Juki’s service and support is outstanding, and that Ember Industries receives a multifaceted customer service approach:

Ember saw Juki’s belief in customer support rsthand when it experienced a devastating ood over Memorial Day weekend 2015. Juki was instrumental in getting new equipment installed as quickly as possible.

The ood occurred in the early hours of May 24, 2015. Leonardis said that the company sustained considerable damage as the ood water level reached 33” throughout the building. The Juki systems in operation at that time were completely ruined. As a result of the ood, Ember was in cleanup mode for the next several weeks. Juki delivered and installed new SMT lines that were in operation around June 22. As cleanup continued, the company was able to bring additional operational functions online.

“Chris Guest, our sales rep, was onsite on Monday, May 25. Within a couple of days, Juki had made a commitment to Ember that it would get us back up and running. The first of the three new lines was installed and operational around June 22. We had visits from stakeholders, suppliers and customers who were in awe at how quickly we were up and running,”

continued Leonardis. “There is no doubt that without Juki’s involvement in our recovery, we would not have been back in operation as quickly as we were. Chris was here and orchestrated the ordering, delivery, installation and setup of the new Juki lines.” Chris Guest said very matter of factly, “These are not just my customers, they are my friends and business associates. Their families count on me in the same manner as I count on customer loyalty. For many of these customers, Juki is their “disaster recovery plan.” In Rob’s case, they needed 27 systems to replace the three lines lost to the ood. By that Monday afternoon, we had 24 of these systems identi ed and ready to ship as soon as the facility could be ready. We had three loaners ship as well to make sure the recovery was complete as their preferred systems were shipped from the factory. As soon as Ember got the clearance to place equipment, Juki’s team was onsite and had the rst line producing boards within a couple of days. This is what we do. Customer service and support is de ned by needs, not Webster’s dictionary or as a tagline that disappears when the deal is closed.”

Ember Industries did not lose a single customer as a result of the flood and subsequent downtime. The company kept its customers informed of its progress while rebuilding the operations. Leonardis added that customers were extremely patient and understanding of the situation and even o ered assistance during the recovery.

“I firmly believe we are a stronger company than before the flood. We know that we can survive a major crisis. Our relationship with our customers has strengthened. Our relationship with our suppliers has strengthened.”

“Our employees worked diligently in very harsh conditions during the cleanup stages. We are all grateful that no one was injured. Some of our folks lost their homes or belongings and our fellow employees came to their aid. Yes, we are stronger today,” concluded Leonardis.

www.emberindustries.com www.jukiamericas.com.

• •

Sales customer service is prompt and face to face, delivering product in a timely manner, and providing useful information and/or recommendations.

Engineer customer service provides knowledgeable step-by-step assistance over the phone on any issue concerning machine software or minor hardware problems.

Field customer service reps are second to none when it comes to hands- on troubleshooting. They deliver assistance in a timely manner and are very knowledgeable in every area of the machines.

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Finding the perfect partner

By Terry Morgan, CEO of Voxvia Consultancy

The challenge of selecting and managing sales networks for equipment and materials in today’s electronics assembly market.

Whether you’re making screen printers or producing solder paste, whether you’re part of a multi-national conglomerate or you’ve spotted a niche and you’ve launched a start-up company, one day you’ll need someone to nd you new business, sell your stu and keep your customers happy.

their credentials in terms of environmental and employment policies.

For partnerships to work, both sides must have faith that what is promised is what will be delivered. Channel partners need con dence in the security of supply and pricing structures and OEMs need to value channel partners’ locally established personal customer relationships. A workable sales strategy and timely targets are essential for a mutually bene cial and professional relationship to develop and thrive.

A means of sharing KPIs and project details via a CRM or some other form of integrated database and sales ordering platform helps consistent and accurate communication.

Performance is the watchword at a technical level: OEMs must provide the technical, logistical and administrative support for channel partners to physically deliver, commission, and train operators, deliver customer service, and handle warranty events. The product needs to do what has been promised, and to do it on time, every time.

And finally, ignore the respective legal responsibilities of a partnership at your peril. Understand:

• the legal structure of the entity you are engaging with and its creditworthiness;

• the fail over plans in the case of business interruption:

• any necessary product or public insurances or licences required to trade legally and that might be a ected by any regulatory standards or approvals (i.e. CE or WEEE compliance);

• the need to observe Non-Disclosure Agreements (NDA) and data protection requirements.

Transparency is essential in a successful partnership. There’s an awful lot to be said for knowing who does what and when, for whom and for what return. As ever, the key to success lies in the detail!

www.voxvia.net.

Whether you’re making screen printers or producing solder paste, whether you’re part of a multi-national conglomerate or you’ve spotted a niche and you’ve launched a start- up company, one day you’ll need someone to nd you new business, sell your stu and keep your customers happy.

At some point all sizes of SMT equipment manufacturers (OEMs) and consumable materials makers will rely on a network of ‘channel partners’ to engage with, sell to, and service their customers. These partnerships take many forms, ranging from a one-man (or woman) band to country-wide distributers, or even super-distributers, working across continents.

The way the partnerships work varies with the demands, responsibilities and consequent legal obligations of those involved. It’s a fast evolving business: as manufacturing technologies converge to satisfy the customer’s need for greater exibility, faster operation and smaller product, so there’s a growing imperative for channel partners to understand the applications and technology of the machinery and materials they support.

Add continual shifts in economic, legal, cultural and environmental factors to the mix and these partnerships can be tested – which is challenging because they’re vital for delivering consistent sales, great communication and the quality of service that customers expect, and you want to deliver.

Everyone in the partnership should have the same goals: to maximise sales and build a reputation for providing the best value, with the best available technology, and exceptional customer service.

The rewards for a good partnership are increased margins and improved sales turnover, built through repeat orders and referrals. (A good reputation is a prize all too often underestimated when it comes to the bottom line.)

However, nding the right balance of qualities when matching OEMs to channel partners can be a challenge.

Get the partnership wrong and the result could not only be low sales performance, but the more drastic implications of poorly serviced global key accounts (GKAs), or interminable and expensive legal wrangling to solve disputes, or worse.

For a successful partnership it’s essential to understand who is responsible for each of the fundamental steps in the chain that drives the business. No matter what the product or service on o er, or where in the world it is, the chain can be broken down into four steps:

• Marketing

• Lead Generation

• Lead Conversion

• Operations

When it comes to marketing, it tends to be OEMs that set the direction. The target client group will be dictated by the nature of the equipment, its capability and price point (or in case of materials makers, the type and application). What a channel partner needs to show is a systematic and consistent means of lead-generating among those target clients.

Larger OEMs may also be concerned with areas of CSR (corporate social responsibility) so channel partners will also need to prove

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From Asset-centric Management

to Service-centric Relationships

By Pasi Röppänen – Director of Customer Service Solutions, JOT Automation Ltd

Consumers expect more powerful, yet eye-catching smart devices, with better quality at more a ordable prices. The highly competitive and fast-paced market of the consumer electronics industry pushes manufacturing plants to maximize the output in quantity and quality, whilst minimizing the costs of operations in all of its aspects.

Automated test and assembly solutions enable global consumer brands to aim for 100% quality, to design ner products, lower operational costs in a sustainable manner and to shorten the time-to-market. Billions of performance and design-driven devices just cannot be shipped without exible automation.

The consumer electronics and electronics industries have been labor-intensive, but the automation boom is speeding up. IHS predicts that the industrial robot markets in these industries will grow the fastest because of the increasing necessity to automate processes. A heavy investment round is shaking the industry globally, particularly China.

Isn’t the high level of automation enough to secure production excellence? The question remains, why also pay for maintenance? The answer is straightforward. Sacrificing maintenance expenditures for an immediate improvement in pro tability, leading to poorer performance, quality and productivity, adversely a ects long-term pro tability.

Preventive care of production equipment and timely planned maintenance are key elements of the operational excellence in mass manufacturing of ever smaller and smarter devices. The importance of life-cycle and warranty support is well recognized by the industry giants manufacturing smart devices.

The trend has been for some time to move from a reactive approach to a proactive one in the provision of services for production automation, both lines and stand-alone equipment. Automation integrators and robotics providers aim to sell value-added business services, instead of selling only manufactured products.

The move from an asset-centric management to a service-centric relationship model drive manufacturers towards choosing an automation partner that has all the expertise and capability to help manage their changing needs over the entire equipment lifetime. More importantly, they seek from automation integrators the willingness to actively look for new solutions to perform service tasks more cost e ectively on a global scale.

Why Reinvent the Wheel?

Why reinvent the wheel if you can rely on the expertise of standardization organizations? Industry standards, like PSK 6201 and SFS_EN 13306, specifying technical and managerial areas of maintenance, are a good starting

point for improving the cost e ectiveness of life-cycle support of production automation tailored for speci c customer needs.

Figure 1. Pasi Röppänen from JOT Automation said that the best way to scale the production is to know on the machine level whether the factory oor is running e ectively. JOT has built a dedicated lifecycle support program for the company’s G test product family.

As an example, JOT Automation has built a dedicated lifecycle support program, based on these standards, for the company’s G test product family, including the JOT G3 Final Tester, enabling all-encompassing and more e ective customer support. The results are promising (Figure 1).

In the case example, a regular health check was de ned as a starting point for the preventive care of the company’s test automation solutions. In many cases, timely planned check-ups were enough to ensure non-stop functionality and avoid costly breakdowns and downtime. A careful inspection of the equipment’s environment in the production line and all technical interfaces, like cables, sensors, connectors, control units and fan, was carried out by experts.

This way, routine and more comprehensive overhaul maintenance tasks can be optimized generating remarkable cost savings and production reliability. The three-step approach in preventive maintenance (Figure 2) also has

Figure 2. Regular health check as

a starting point is important for preventive care. Routine and overhaul maintenance tasks can be optimized by this three-step approach.

improved service agreements and feedback reporting with customers.

Smarter Services for Smart Factories

Industry 4.0 and Big Data are key topics in current discussions and maybe the most important trends in the industry shaping the future of process-based manufacturing by taking it beyond computer-integrated manufacturing. Big Data enables the unifying of daily production to nancial metrics and contextual recommendations, resulting in greater value for manufacturers. With the use of advanced analytics tools for the pro table scaling of operations, improving yield rates and reducing costs will increase tremendously.

The best way to scale the production is to know on the machine level whether the factory oor is running e ectively. More in-depth operational insights can be delivered based on always- connected production equipment and sensors providing machine activity data and sending alerts for preventive maintenance.

Furthermore, maintenance tasks can be carried out by remotely or virtually guided self-service. Remote services become a strategic asset and a key customer satisfaction factor for global manufacturing networks.

Development of remote services is identi ed as a core area for JOT Automation’s product and service development. Remote services and machine on-line monitoring are not new features in the company’s portfolio, it has provided such solutions for years.

Now, the company is taking the next steps on the roadmap of remote services. The aim is to enhance customers’ ability to analyze data by developing plug-and-play type standard interfaces for ERP systems and reporting. That’s the most powerful way to provide the greatest return on investments (ROI) for future smart factories.

www.jotautomation.com.

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TECHNOLOGY TODAY INTERVIEW

Interview with Luis Bresil of ZF TRW

by SMT Today Editor

ZF TRW is a primary developer and producer of active and passive safety systems and serves all major vehicle manufacturers worldwide with an established footprint that includes facilities in more than 20 countries. It maintains 22 technical centers and 13 test tracks in vital markets around the world.

The world of automotive safety is rapidly changing as the convergence of active and passive safety systems become the foundation for automated driving functions. ZF TRW is already providing many driver assist and semi-automated functions today, such as adaptive cruise control, lane keeping assist, blind spot detection, lane change assist, emergency steering assist, and emergency brake assist and collision mitigation systems. In the ercely competitive automotive electronics manufacturing business, the company is constantly looking for ways to reduce cost and improve quality. The goal is to stay pro table while keeping satis ed customers. To meet that goal, ZF TRW has been using KIC technologies for years, including in its Limeira, Brazil, facility. Here we speak to Luis Bresil, the operations supervisor of ZF TRW’s Brazil facility to nd out more about the region’s trends and how KIC has been able to help improve ZF TRW Brazil’s facility and processes.

pass yield, and full control of WIP, nished goods and all the manufacturing process.

Q. What future improvements are you looking for? Why?

A. Some customers are being more critical in terms of assembly quality, especially because this division of ZF TRW is dedicated to safety products, where faults are not acceptable. To be compliant with this trend, the products are moving to exceed IPC class 3 requirements. Part of the factory is fully capable to achieve such a level of assembly, but post-re ow inspection is a bottleneck now, so it is natural that we move from a 2D to a 3D system in the future.

Q. Why have you implemented an automatic pro ling system and thermal monitoring system in your re ow oven?

A. We did this to guarantee process repeatability, which is essential to achieving the high level of quality our customers require. I cannot think of a better way to guarantee product quality without looking to full-time monitoring of the oven pro le. This is particularly important for products with very di erent component sizes, where the thermal mass is di erent and, consequently the heat transfer. A stable pro le, with low PWI and high CPk, is essential to keeping the product on the right track.

Q. What are the problems this system solves? A. Minimal di erence on the pro le or a process

trend moving to the limits of the spec is promptly alarmed and the process stops, avoiding the risk of non-conforming products, with traceability of all batches produced within a de ned time window. In other words, we avoid creating problems and throwing away both company and customer money.

Q. What additional bene ts have you experienced?

A. Preventive maintenance can be better planned based on the oven’s behavior, and some behavior is only possible to detect when you follow your process 100% of the time.

Q. Have you experienced any quanti able improvements in quality, cost, production downtime or other as a result of your KIC investment?

A. Yes, using 24/7 saves signi cant changeover time because it gives us temperature pro les as quickly as the oven turns on the green light. That is impossible using a manual stand alone pro ler. I cannot quantify how much money we have saved using the 24/7 because we started using this system since the beginning of our operation, so my baseline is exactly what I have now.

Q. Can you explain the human role in your automated production line?

A. Basically, the human operator’s function is to feed the equipment, prepare the shipment, and keep up with machine maintenance. All quality parameters, inspections and process ow controls are automatically controlled.

www.trw.com

Q. What are ZF TRW Brazil’s long-term goals (5 years)?

A. Our long-term goals are very much related to gaining new business and expanding factory capacity with new products and new customers. Because safety electronics is a new segment in Brazil – it has been a national regulation only since 2014 – and our factory here has less than two years of full operation, our main goals are focused on upgrading the factory to help advance us as a high-quality player in the market.

Q. What opportunities is ZF TRW Brazil pursuing for the moment and in the future?

A. ZF TRW Electronics in Brazil is responsible for supplying air bag control units and anti-lock braking systems (ABS) to the main players of the automotive market in Brazil. Currently, we are pursuing new customers with lower volumes, but higher levels of product features, resulting in more complex assemblies.

Q. Currently, what are ZF TRW Brazil’s biggest manufacturing challenges?

A. We are working to stabilize test equipment. We work with an average rst pass yield of around 98% on most test equipment; however, some systems exhibit an unstable behavior, making them unpredictable. In terms of PCB and nal assembly, the factory is very stable.

Q. Please brie y elaborate on ZF TRW Brazil’s competitive landscape.

A. ZF TRW is the rst safety electronics factory in Brazil to produce air bags and slip control units. As previously mentioned, this market is relatively new in Brazil, but most of the automotive manufacturers still import their controllers from overseas suppliers. As the pioneer of this product line in Brazil and supplying to the main players in this market, our challenge is to stay competitive while continuing to bring in new customers.

Q. How is technology changing your manufacturing applications?

A. The word “stand alone” almost does not exist in our factory. All equipment is connected to a complex system of databases, scanners, cameras and traceability systems, where human beings have low interaction with the quality of the product.

Q. What trends do you see in the demands that your customers place on ZF TRW Brazil?

A. The most common demand is lower cost. To achieve this, ZF TRW works on continuous improvement and reducing cycle times and product changeover times, among others. E ciency is a key for our business.

Q. Please describe brie y your production philosophy and the production line features and capabilities.

A. ZF TRW Brazil works on the following philosophy: Getting it right the rst time and continuously improving every process. This is our baseline. All production systems are based on a proprietary traceability system that ensures the operation follows the baseline. All equipment is connected to this system and any operation can proceed after checking that the part on the process (POP) was approved on the previous operation. This is called “prior step check.” If the answer is NOT APPROVED, all equipment after is automatically locked for the POP. Only the quality department can unlock this chain. Everything is connected from the opening of the box of raw material to the pallet of nished goods inside the truck.

Q. Do you utilize an MES System (Manufacturing Execution software)?

A. We can consider our traceability system to be a type of MES because it is not just for trace, but also for process ow route and control. Any information regarding cycle time, production, quality, test values, etc. can be found on this system.

Q. Why did you invest in these machines and capabilities?

A. We invested in these machines and capabilities in order to guarantee high-level quality of products, prevent shipment of defective parts to the customer and to support the customer on the chance that a eld issue is detected.

Q. What are the main bene ts that the current production line and supporting systems have provided for ZF TRW Brazil?

To make a long story short, the main bene t is that we have a very low rate of issues with the customer. Internally, we help guarantee low scrap rate, high rst

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®

Overcoming Reliability with Selective

Wave

submitted By Michelle O’Brien, Marketing and Communcations Specialist, Kester

Everyone has seen it, the ugly white or yellow ring of ux residue marking the openings of a selective wave pallet. We know that it is inevitable when a no-clean is used in a non-wash process. But are all uxes built equally? Do all chemistries remain equally reliable in these scenarios? Now what happens if a little of that ux leaks underneath an older worn pallet? Will all residues still

be equally safe? The answer is no.

humidity levels in the eld. Kester has spoken with more than a few customers facing this unfortunate and solve-able failure mechanism.

Kester’s new line of soldering chemistries for the wave and selective solder applications, including the NF372-TB no-clean wave solder ux have been speci cally designed to overcome these challenging situations. NF372-TB has been tested and found to pass 40C/90%RH and 85C/85%RH SIR testing in both the required pattern up and pattern down formats as well as when only partially heated (cool preheat) and when no heated at all (no preheat, no wave). This maximizes the available process window and ensures that the end product will remain reliable and working even when occasional mishaps are made on the production oor.

www.Kester.com.

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Residual ux after the soldering process is to be expected; however we also expect that those “no-clean” residues are safe. Flux residues are designed and tested to remain safe when heated by the vicinity of a solder wave. This is tested under the IPC JSTD-004 ux classi cation tests for “Pattern Up” and “Pattern Down” in the Surface Insulation Resistance (SIR) test methods 2.6.3.7 and the older 2.6.3.3. However even in the harsher pattern up condition, the test board is allowed to be preheated and sees substantial temperature when crossing the wave.

Do these same conditions still apply when ux gets trapped under a 4mm thick near solid

sheet of Durostone® or other pallet material? Possibly not. We nd as pallets degrade, their ability to form a solid gasket between the pallet and board also degrades. This non-gasketing combined with excess spray pressure allows ux residue to seep up under the pallet and be protected/shadowed from the heat of preheat and solder contact.

Several no-clean chemistries fail standard SIR testing when not sufficiently heated. Some water-based VOC-free uxes may not even fully evaporate. These residues remain excessively high in ionics, and can cause corrosion and current leakage failures when mixed with high

®

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Industry News

Keep up to date with what’s new

With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

BE FIRST TECH Judy Bao

Acculogic Appoints New Agent in China and Hong Kong

Acculogic Inc., a global leader in electronic production test solutions, announces the appointment of BE FIRST TECHNOLOGY CO., LTD. as its representative throughout China and Hong Kong. BE FIRST TECHNOLOGY has locations in Beijing, Shanghai, Shenzhen, Xi’an and Chengdu.

Saeed Taheri, Acculogic’s CEO, interviewed many possible distribution partners for China and Hong Kong. BE FIRST TECHNOLOGY was simply the best match for Acculogic’s sophisticated ATE product line. The BE FIRST TECHNOLOGY team selected Acculogic to add to its portfolio because of the company’s high level Flying Probe System, In-Circuit tester, Functional Tester and Boundary Scan. Judy Bao, General Manager at BE FIRST TECHNOLOGY has provided sales and service for similar equipment for many years, and is con dent that this will be a complimentary partnership.

With experienced sales and service teams in each area, BE FIRST TECHNOLOGY has established strong relationships with many world famous manufacturers and customers over the last ten years. BE FIRST supplies Micro-Electronics, SMT, LCD, LED, OPTO-Electronics, MEMS, BIO-Electronics, manufacturing equipment, test instrument, R&D tools and consumables. The company’s mission is: “Supply rst-class products to the customers; Supply rst-class service to the customers; Set up and keep rst-class relations with the cooperators.”

www.be rst-tech.com www.acculogic.com

BajaBid.com Expands into Europe with BajaBi.eu

BajaBid in America have expanded their organisation into Europe with the announcement that BajaBid.eu is their new European asset management partner with Stuart Hendry taking on the role of Director.

Stuart is well-known within the EMS industry and brings over 30 years’ experience within operations including 15 years leading operational excellence across the EMS, Medical, Military and Aerospace sectors. “I am delighted to join the team at BajaBid Europe and to have the opportunity to work with a dedicated team of customer focused professionals. I look forward to building my relationships with our partners and being a part of BajaBid’s continued growth and success.”

With a service provided by a team of industry professionals who possess many years of direct experience in the electronics manufacturing and assembly industries, BajaBid Europe are totally committed to ensuring that both buyers and sellers are provided with a pro table and productive experience.

This EMS industry-focused asset management service, helps clients turn excess assets into working capital and can also support the procurement of EMS industry equipment by utilizing their industry knowledge and access to extensive sales and client databases.

In addition, for those clients with an urgent need to liquidate their assets, BajaBid Europe are in a unique position to provide a cash purchase solution.

Stuart Hendry - Director of BajaBid Europe

www.bajabid.eu.

BTU and ECD Partner to Develop a Comprehensive Recipe Prediction Tool

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced that it has partnered with thermal measurement innovator ECD in a joint development initiative to integrate the company’s new Recipe Generator technology directly into BTU’s Wincon furnace operating system. ECD’s Recipe Generator is currently available through ECD’s M.O.L.E. series of thermal pro ling systems, and the new integrated feature will be released in early 2016 as part of BTU’s Pyramax re ow product line. The technology will be the industry’s most comprehensive recipe prediction tool to-date, due to its process settings for zone temperatures and belt speed, which take into account the convection rate - the most signi cant element of heat transfer.

Todd Clifton, ECD President and CEO, commented, “BTU is an ideal partner for this new, comprehensive prediction tool. BTU’s closed-loop pressure control technology, which maintains consistent convection pressure, allows for precise pro le control and repeatability oven-to-oven and line- to-line. Integrating ECD’s Recipe Generator technology into BTU’s advanced re ow systems o ers manufacturers a streamlined and e ective approach to proper initial in-spec recipe generation for higher yield results.”

“Our on-going focus is to enable our customers’ success with ovens that have the highest productivity and lowest running costs. This tool decreases oven setup time, provides customers a quick and e cient method of generating a starting recipe for new SMT assemblies,” said Peter Tallian, General Manager of BTU. “We are proud to partner with ECD, as they have a long history of understanding the e ect of the convection rate on the reflow process. This comprehensive tool is head and shoulders above the competition as it incorporates the most important element - convection rate - as part of the Recipe Generator.”

www.btu.com. www.bakewatch.com, www.ecd.com, www.smartdry.com.

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Circuitronics, a leading supplier of customized manufacturing solutions for the energy, industrial, communications and mil-aero markets, announce that it has successfully completed its 2015 external audit for ISO 9001:2008.

ISO 9001:2008 is the international standard for Quality Management Systems. Circuitronics prides itself on the quality of all products and services that are manufactured, assembled and tested at its facility. Circuitronics is continuously looking to improve the quality of all products and systems to ensure the highest level of customer satisfaction. The company’s next step in 2016 will be the implementation of ISO 9001:2015.

Whether investing in new production tools, such as state-of-the-art surface mount technology, implementing advanced business automation software, or deploying cutting-edge communication and collaboration tools, Circuitronics is dedicated to providing its customers and partners with advanced solutions that they can count on.

reward for outstanding e orts in marketing and support within their territory. Technology events, seminars and a general high pro le throughout the industry have all helped to boost AB Electronics and Nordson DAGE’s presence in the Spanish and Portuguese markets – the award is very well deserved by the AB Electronics team.”

Nordson DAGE’s award winning X-ray inspection systems have been speci cally and ergonomically designed for the circuit board (PCB) and semiconductor industries, o ering high-resolution nano-focus X-ray systems. Continual investment in research and development enables Nordson DAGE to o er its distribution channels “best in class” products.

“We are very proud to receive this award for the third time since our company was founded in 2001. Nordson DAGE is one of our most prestigious brands. This award is a re ection of the continuous hard work that the AB Electronic’s team performs every day. We have made continuous growth to become the leading distributor of SMT equipment for the Spanish and Portuguese markets; we are extremely proud of our reputation for after- sales support and service. We hope to receive more awards like this in the future,” Adolfo Barbé commented.

www.nordsondage.com

DEN-ON INSTRUMENTS, CO., LTD. Appoints Distributor in Malaysia

DEN-ON INSTRUMENTS, CO., LTD. is pleased to announce the appointment of SWK Venture Sdn bhd as its distributor in Malaysia. Located in Penang Malaysia, SWK supplies and provides technical services for production machinery and equipment such as PCB Conveyor Handling, PCB Routers, Stencil Cleaners, Ultrasonic Cleaning Systems, Laser Markers, Resistance / Spot Welding etc.

“SWK is a great new addition to our worldwide sales and support team,” commented Raymond LaFleur GM of DEN-ON commented. “The company brings a group of technical sales engineers with many years of experience and expertise in the electronic manufacturing machinery. They provide a fresh and energetic approach to our territory in Malaysia which will bene t our customers. We are looking forward to the start of another great long-term partnership.”

SWK has invested in the purchase of demonstration equipment and the training of their engineering and sales sta at the DEN-ON headquarters in Japan to provide the customer base with the best support.

Mr Sunny Lim, General Manager of SWK stated, “The DEN-ON lineup of products will help us to strengthen our position and broaden the wide range of solutions that we bring to the electronics manufacturing industry.”

SWK Venture provides its customers with quality and reliable equipment supported by a team of highly skilled and well-trained technical personnel. The company has a strong reputation for its quality products, competitive prices, on-time deliveries and the dedicated services and prompt support that it o ers its customers. SWK is committed to investing in hiring, training and maintaining inventories to support the installed base. The company’s objective is to grow in line with customer demands and maintain long-term partnerships with its principals.

www.swkventure.com.my. www.denondic.co.jp.

Ersa Adds Comtree/Northtouch in Canada to Its Rep Network

Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce its new manufacturers’ representatives for Canada. Ontario-based Comtree Inc. and Montreal-based Northtouch Canada Inc. in Montreal will work with Kurtz Ersa, representing its leading-edge technology, quality and reliability for its full range of wave, re ow, selective, rework, inspection and hand soldering systems.

Comtree and Northtouch have been working together to provide sales and support to the Canadian electronics manufacturing industry for more than 20 years. Irrespective of mix or volume, the company’s broad base of complimentary products can outfit an entire manufacturing facility and have been carefully chosen to provide

Recognizing that a company is only as good as the people it keeps, Circuitronics has invested heavily in training and employee development over the years. The company continues to provide its employees with opportunities for development and growth. Circuitronics is certi ed to ISO 9001:2008, IPC J-STD-001 and IPC A-610, as well as ITAR registered.

www.circuitronics.com.

Nordson DAGE Announces AB Electronic Devices as European Distributor of the Year 2015 for X-ray Systems

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), have announced that their X-ray distributor for Spain and Portugal, AB Electronic Devices, has been awarded the X-ray Distributor of the Year Trophy for 2015. The award was presented to Adolfo Barbé, AB Electronic’s founder and President, by Richard Frisk, Nordson’s European Sales Manager for Inspection Products, at the recent Nordson Test and Inspection European Distributor meeting held in UK.

Richard Frisk commented, “AB Electronic have enjoyed a long-term partnership with Nordson DAGE; their excellent sales results have been the

SWK Venture Sunny Lim

Established in 2008, SWK Venture provides customized solutions for unique applications and customer needs. The company’s primary product lines are imported from Japan, Korea, Singapore, United Kingdom, Taiwan, etc.

From left to right: Ernesto Provenzano – Comtree, Graham Gibson – Comtree, and Benoit Giroux – Northtouch Canada

Continued...

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Industry News

feature continued...

excellent quality at various value-price points. Todd DeZwarte, Product Manager, Rework, Inspection & Tools at Ersa commented,

“We are excited about our partnership with Comtree/ Northtouch for Canada with all of our products and their expertise in the Canadian market.”

www.comtreeinc.com, www.northtouch.com www.ersa.com.

KIC Announces Global Rebranding – “Making Ovens Smarter”

KIC has announced a global rebranding. As part of the rebranding, the company has introduced a new tagline to better represent its goals: “Making Ovens Smarter.” For nearly 30 years, KIC has been leading the industry for automated thermal process tools and systems for re ow, wave, curing and semiconductor thermal processes.

Over the last decade, re ow oven manufacturers have done a great job of making their ovens more stable, reliable and less expensive. Looking forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies. These new capabilities lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand. The smart technologies can be grouped into the following areas:

Process transparency: Automatically measure the PCB pro le and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and x issues faster.

Flexible + Fast: As electronic product variety keeps growing, the result is more frequent production line changeover. Productivity is lost when a multimillion dollar production line waits 15-30+ minutes on a $50,000 oven to stabilize on the new recipe. KIC’s technology provides either near instant oven changeover time or dramatically reduced downtime.

Automation: Humans have many wonderful

talents, but consistency in repetitive tasks is not one of them. KIC’s automatic systems eliminate manual tasks such as periodic manual pro ling and reduce the opportunities for human mistakes in setting up and running the ovens.

Reducedelectricityconsumption:KIC’sovensetup software has proven to reduce oven electricity use

by up to 15 percent in numerous case studies.

One exciting aspect of these smart technologies is that they are retro table on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies.

www.kicthermal.com.

Libra Industries Purchases a Heller Reflow Oven for Its Corporate Headquarters

Libra Industries, a privately held electronics manufacturing services (EMS) provider, has announced that it has purchased a Heller 1707MKIII-IR Ultra Low Power Consumption Curing Oven with IR Heater Modules. The new oven was installed at the Libra Industries corporate headquarters in Mentor, OH in January 2016.

The Mark III Series is lead-free certi ed and features an intuitive control system. With enhanced heater modules and a new ux management system, the oven o ers the best technology and overall value in the industry. Additionally, the MKIII system features programmable cooling and integrated CPK software.

The breakthroughs associated with the Mark III re ow system provide Libra Industries with an even lower cost-of-ownership. Heller’s heating and cooling advances deliver up to 40 percent reduction in nitrogen and electrical consumption.

Scott Fillebrown, Libra Industries’ CTO, commented, “Libra Industries’ purchase of the Heller oven to support our growing conformal coating requirements is one of the many indicators that we are committed to expanding and improving all areas of our facilities to not just meet, but exceed our customers’ expectations.”

Libra Industries continues to invest to provide customized manufacturing solutions to help make its customers more competitive and improve their pro tability. For more information, visit www. libraind.com.

MIRTEC MV-6 OMNI 3D AOI Machine

MIRTEC Co. LTD, “The Global Leader in Inspection Technology,” reports continued growth in sales revenue for its North American Sales and Service Division for 2015. “We are very pleased to announce that sales revenue for our North American Division has grown by more than 52 percent for Q4 2015 with respect to that of 2014,” stated Brian D’Amico, President of MIRTEC Corp.

D’Amico attributes this impressive growth to the overwhelmingly successful launch of MIRTEC’s MV-6 OMNI 3D AOI Platform. The MV-6 OMNI combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera Technology with the proprietary OMNI-VISION® 3D Digital Multi-Frequency Moiré Technology to provide precision inspection of SMT devices on nished PCB assemblies. “In September of 2015, MIRTEC set a new standard within the highly competitive Electronics Inspection Industry with the launch of our award-winning MV-6 OMNI 3D AOI System”, continued D’Amico. “This revolutionary AOI machine provides unprecedented 3D inspection performance in a cost-e ective platform, making it an ideal solution for electronics manufacturing companies of all sizes. The recent release of this new product line, combined with an extremely talented team of sales and support professionals, has resulted in unprecedented growth of our North American Division in Q4 2015.”

MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For more information, www.mirtec.com.

Osai open the USA Subsidiary:

Osai A.S. S.p.A. is proud to announce the opening of Osai Automation System USA Corporation, the new subsidiary based in Lewisville, TX.

This subsidiary will be responsible for North and South America market, a fundamental part of the World in the international expansion of Osai A.S.

“We have decided to base the Subsidiary in Texas because it is a strategic location where to be: in less than 4 hours it’s possible to get to

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Dallas Fort Worth Airport from all Canada, USA and Mexico major Cities. Our Customers can visit our Show Room and be back at home in one day. Furthermore, our Customers and our Reps will have the opportunity to see their dedicated demo for all the machines of Osai USA portfolio: Laser marking machines, Mechanical Routers and Laser Routers. We expect to have great results starting from the very rst year says Giuliano Gallizio, CEO of Osai USA”

Giuliano Gallizio, CEO of Osai USA

American market is already a strategic and growing one for Osai A.S, the USA subsidiary will help this growth.

Osai A.S. S.p.A is an Italian Manufacturer operating in Automation Systems, Electronics, Semiconductors and Industrial Laser machines; for more informations

visit www.osai-as.it

STI Appoints Julio Estrada to Training Center Manager for Its Houston Facility

Mr. Estrada has trained personnel first on the NHB5300, then on the NASA-STD-8739 Workmanship Standards, and now on the IPC J-STD-001F, including the Space Addendum. He has devoted his entire career to helping others achieve their goals by becoming pro cient in the work they perform for their employers. Estrada has worked at respected companies including the Johnson Space Center in Houston, TX, and has experience developing course curriculums for premier companies such as NASA.

www.stielectronicsinc.com

Valtronic Strengthens X-ray Inspection Capability with Purchase of Nordson DAGE System

Valtronic, manufacturer of miniaturized electronic products for trusted medical device partners, announces that it has purchased and is in the process of con guring an XD7500VR Jade FP X-ray system from Nordson DAGE on its production oor in Ohio.

According to Randy Meyer, Valtronic Process Engineer and Senior Expert - Advanced Electronics, the system will be used for in-process inspection of BGA and wire bonded devices. Additionally, it will be used as an analytical tool to verify, troubleshoot and improve Valtronic’s internal processes.

The XD7500VR Jade FP from Nordson DAGE provides superior X-ray image quality for all PCBA X-ray inspection applications in the value-oriented market segment and uses the latest technology at panel detector, providing a market-leading, cost-e ective approach where high-quality, real- time imaging is needed for production tasks. The long lifetime CMOS digital detector with 1.3 Mpixels features 10 fps full-frame real-time image acquisition and real-time image enhancements for easier fault nding.

www.valtronic.com

Alpha® Selects YAMAHA YCP10 High- Performance Compact Printer for Key Laboratory Facility

Yamaha Motor IM has announced that Alpha (‘Alpha Metals’), the world leader in the development, manufacturing and sales of innovative electronic materials used in the electronic assembly process, has chosen the YAMAHA YCP10 High-Performance

Compact Printer for purchase and installation at a key laboratory facility in New Jersey. After rigorous print testing, the YCP10 demonstrated the ability to deliver the consistent printing results that the Alpha evaluators were seeking.

“The evaluation included the use of an advanced Solder Paste Inspection (SPI) system,” states George Babka, Sales General Manager for the SMT Business Group of Yamaha Motor IM America, Inc. “The YCP10 demonstrated a high degree of consistency in the print from edge to edge, and the adjustable squeegee angle feature made a signi cant impact on aperture ll not only with solder paste but with new materials using our unique 3-S print head. This feature allowed for easy adjustment of the squeegee angle for optimum results with both paste and experimental materials. This will allow users to benchmark printing parameters for squeegee angle for best results going forward.”

The YCP10 features an easily- controllable operation system and is supplied standard with a user-friendly, easy to operate touch panel, including multiple language options. A wide range of optional features includes a remaining solder detection function that monitors the remaining solder on the stencil to enhance printing quality, and a printing inspection function that carries out minute and effective solder printing inspections using a purpose-designed high- performance optical camera. The YCP10 complies with CE safety design standards, enabling the equipment to be sold worldwide.

Julio Estrade - Training Center Manager

STI Electronics, Inc., a full service organization providing training resources, analytical/failure analysis, prototyping, and small-to-medium volume PCB assembly, announces the appointment of Julio Estrada as Training Center Manager for its Houston training center.

“Julio’s skills will allow STI to have a local presence in the Gulf Coast area,” commented Pat Scott, Director of Training Services. “Being bilingual, Julio will allow STI to bet ter serve its Hispanic customer base.”

In addition to teaching classes, Estrada will ensure that daily operations of the Houston training center run smoothly. Estrada also serves as the VP of Membership for the Houston chapter of the SMTA.

www.yamaha-motor-im.com

P:74

red carpet

out & about in the industry

In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...

CCI Donates to Minnesota Elite!

Recently, CCI had the opportunity to make a donation in support of the Minnesota Elite Basketball group – located in the Twin Cities Metro. Minnesota Elite is a basketball league that provides coaching, practices, and games for 4th grade to high school athletes, along with an innovative educating platform designed to stop bullying in every school and community.

CCI’s donation will be used for two major things. First, it will help cover administrative costs that go into coordinating the league. Second, the donation will give the Minnesota Elite team the nancial support they need to attend the national basketball tournament this year. In past seasons, the costs of travel were too much for the athletes to cover to attend the tournament – but not this year. CCI’s donation will help get the team to the national tournament to put their skills to the test!

www.corstat.com

Inovar Further Strengthens Its Board of Directors by Appointing Industry Expert Charlie Barnhart

Inovar, Inc., a full-service EMS provider, announces that Charlie Barnhart, a well-known EMS industry insider, has joined its Board of Directors.

Barnhart is the founder and principal of CBA Consulting, and has been involved in the global EMS industry for over 35 years. He began his career as an electrical engineer and worked his way up through a succession of progressively senior positions leading to his election as a corporate o cer in the F500. Additionally, he has served as a guest lecturer and advisor at the university level. Charlie is also a veteran of the United States Marine Corp and holds a Bachelor’s of Science degree in Electrical Engineering and a Master of Business Administration (MBA) in International Business.

www.inovar-inc.com

JAS, Inc. Awards Southwest Systems Technology ‘Representative of the Year – Highest Sales’ for 2015

Juki Automation Systems (JAS), were awarded Southwest Systems Technology, Inc. ‘Representative of the Year – Highest Sales’ for 2015. JAS, Inc. Bob Black, President and CEO of JAS, Inc., presented the award to Dee Claybrook, Principal at Southwest Systems Technology at the recent awards banquet held during the Juki Americas National Sales meeting that took place at Juki’s facility in Fremont, CA.

www.jukiamericas.com www.swsystems.com

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Sono-Tek Corporation Sells 4,000 Fluxers in 40 Years

Sono-Tek Corporation (OTC BB: SOTK) is proud to announce the sale of its 4,000th uxertoJabilCircuitInc. ThismilestonewasachievedinSono-Tek’s 40th year in business.

Pictured above are some of the members of Sono-Tek’s production and service team

what’s happening in your business?

send your event pictures to advertising@smt today.com

STI Recognizes Mel Scott’s 15-Year Anniversary

STI Electronics, Inc announces Mel Scott’s 15-year anniversary. Scott is STI’s DirectorofQuality,andisresponsibleforqualityassuranceandISOinitiativesfor the Engineering Services division. David Raby, President/CEO, is shown presenting Scott with a certi cate in appreciation of his 15 years of dedicated service.

Interview with Dr Martin Lechner, Executive Director of Business Unit New Technologies, Messe Muenchen GmbH

Winners of the Amazon Fire Stick prize draw from SMT Today’s ra e at productronica

Third winner was Tim Kunz, Fabula, Germany (photo unavailable).

SMT Today at productronica

Wendy Tindle presents Lila with Emmanuel Delamay’s prize from Adex Electronique

Anders Lind being presented with Sheila Ringqvist’s prize from Scanditron, Sweden

P:76

WOMEN IN TECHNOLOGY

BY HUSNA T. GHANI, MBA, VICE PRESIDENT, TELERIC CORPORATION INC

Women are the number one consumers in the world. They drive the economy at a whopping 70-80% according to Forbes. Women not only are the consumer decision makers for themselves, they are also the decision makers for a unit that consists of multiple family members. However, when it comes to being a part of technology, women still haven’t broken through the 40% ceiling, and in many cases, a lot less.

publishers to change that. Take physics for instance, as a former physics teacher, I always noticed that texts that explain projectile motion, velocity, and acceleration would have sports examples with boys as the main characters. Parents, teachers, and textbooks have already disillusioned girls from math and science before they even nish high school. According to the Girl Scouts of America, only 13% of teenage girls have considered a STEM (Science, Technology, Engineering, and Math) career as their rst choice. According to the College Board, there are less than 15% females enrolled in AP Computer Science. As you may predict, this trend then continuesonthroughoutcollege. Accordingto research conducted by Forbes, it comes down to a problem of numbers. Women do not go into technology because there are not enough women in technology. Wait, what? Yes, exactly!

Let’s go back to our original question. So how do we fix this? There is no one simple solution. However, there are several “not that difficult” solutions.

First, let’s have young girls engage in analytical and design toys. Second, let’s have textbook publishers and curriculum developers redesign texts to include girls. Third, let’s train educators to encourage more female participation and inquiry in science and math classes. Schools possess more power on this front than any other entity. We should not say “more girls should do this” or make it a “female” dilemma. We should make these subject matters exciting and engaging for both genders and provide equal opportunity to both genders to succeed. Fourth, if there are o erings of computer science or technology classes either within the school curriculum or in the community, parents and teachers should encourage girls to participate because it is an exciting opportunity, not because “they need more girls in the eld.” Fifth, have colleges help connect female students who exhibit interest and skills in science and technology with STEM related internships, scholarships, and female mentors who are currently in the eld. Sixth, change the narrative so we can change the problem. Let’s not enable competitive showiness in classrooms that can intimidate. Instead let’s encourage succeeding through dedication and hard work. Seventh, and nally the simplest yet most debated solution; have equal pay for equal work.

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According to research done by the American Association of University Women (AAUW), the percentage of women who are in the computing elds has fallen in the past two decades.

The percentage of women has decreased in the eld of computer and mathematical occupations and has pretty much remained stagnant in the eld of engineering. With all the hoopla around having more women in the eld of technology, we haven’t moved forward. In fact, we are moving backwards.

So how do we x this? The rst thing to ask is “how did this happen?” Let’s start from the beginning. As children, girls are generally given dolls, stu ed animals, and toys that have a “dress up” or aesthetic component. In the same age range, boys are given building blocks, cars, electronic gadgetry, and things requiring setup, building, and scienti c inquiry. The analytical skills are developed in the early years. When we give a child an activity, that activity becomes a part of their brain’s “data.”

By the time children are in the midst of elementary school, stereotypes are already mastered and both girls and boys consider math to be a “boys’ subject” whereas language arts and reading are a “girls’ subject.” This thought process continues on in middle school and in high school. Boys are called upon more in math and science classes. Not only are they called upon more, they have a longer “wait time” where the teacher gives them more time to think and respond to a question before going on to the next student. In those same classes, girls are given less time to answer and if they answer incorrectly, the same question is asked to a boy in anticipation of the correct response. So in these scenarios, we are carving a path for boys to be more engaged in math and science.

Another reason includes the actual textbooks used in teaching these subject matters. In the past several decades, math and science textbooks have used more traditionally male names and sports analogies, although in more recent times, we are seeing an attempt by

1 04/02/2016 15:58

Complimentary Women in Electronics Networking Reception

Join your colleagues from across the supply chain to share your ideas and experiences as a woman in the industry and build your industry network.

Date: Wednesday 16th March 2016

Proudly Sponsored by

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T F

MORE INFORMATION:

Education Email: Website: Phone:

[email protected] smta.org 952.920.7682

2016 EDUCATIONAL PROGRAMMING

High Reliability Cleaning and South East Asia Technical ConferenceCOCNonFfoErmRaEl CNoaCtinEgSConference

Toronto, Ontario Rosemont, IL

WEBTORIALS

Rosemont, IL October 18-20

San Jose, CA

October 25-27

SouthEastAsiaTechnical InternationalConferenceon SympoCsiEumRTonIFCoICunAteTrfIeOitN

on Electronics Assembly Technologies

Rosemont, IL

Conference on Electronics Assembly Technologies

Soldering and Reliability

Parts & Materials SMT Processes

Penang, Malaysia April 12-14

May 9-11

June 28-30 May 9-11

Penang, Malaysia

Toronto, Ontario November 28-December 1

College Park, MD Toronto, Ontario

LED A.R.T. Symposium

International Conference on Soldering

and Reliability (ICSR) SMTA International

SMT Processes International Wafer-Level

May 9-11

September 25-29

September 27-29

TBA

Medical Electronics Symposium

January 27 & 28 | 1:00pm EST

Solder Joint Voids- All You Should Know

TBA

Packaging Conference

Symposium on Counterfeit Parts

High Reliability Cleaning & LED A.R.T. Symposium

Guadalajara Technical and Materials

Jennie S. Hwang, Ph.D., H-Technologies Group

June 28-30

October 25-27

TBA

WEBTORIALS

TBA

Ning-Cheng Lee, Ph.D., Indium Corporation

Forum & Expo

Conformal Coating Conference

November 29-December 1

October 5-6 College Park, MD

February 9 & 16 | 12:00pm EST

Guadalajara, Mexico

Rosemont, IL

Printed Circuit Board Failures - Causes and Cures

Medical Electronics Symposium

January 27 & 28 | 1:00pm EST

Bob Willis, Bobwillisonline.com

Solder Joint Voids- All You Should Know

Solder Paste Printing for

Bob Willis, Bobwillisonline.com Chrys Shea, Shea Engineering Services

SMTA International

Jennie S. Hwang, Ph.D.,

September 25-29

H-Technologies Group

SMT Processes

May 9-11 Toronto, Ontario

SMT Processes

May 24-26 Querétaro, Mexico

SMT Processes

September 27-29 Rosemont, IL

...More locations to be announced.

March 29 & 31 | 1:00pm EST

February 9 & 16 | 12:00pm EST

March 29 & 31 | 1:00pm EST

PrintedSColidrceur iPt aBsotearPdrinFatinilugrfeosr B- eginners

CahurysseSshaenad, SChueraesEngineering Services Beginners

Rosemont, IL

April 26 & 28 | 1:00pm EST

April 26 & 28 | 1:00pm EST

Solder Re ow Fundamentals - May17&19|1:00pmEST

International Wafer-Level

Thermal Pro les & Defect Mitigation It Is Time For Low Temperature -

Solder Reow Fundamentals -

Packaging Conference (IWLPC)

Fred Dimock, BTU International and

hermal Proles & Defect Mitigation

Low Temperature Solders, New

October 18-20

Karl F. Seelig, AIM

...More topics to be announced.

red Dimock, BTU International and S a n J o s K e a , Cr l AF . S e e l i g , A I M

Development, & Their Applications Ning-Cheng Lee, Ph.D.,

Guadalajara Technical Forum and Expo

It is time for low temperature -

May17&19|1:00pmEST

Indium Corporation

Low temperature solders, new development,

CERTIFICATION

and their applications

P:78

ask fred cox

BY fred cox

Want to know what the buzz is about nano-coated stencils? We sat down with Fred Cox from MET to ask him about this new technology. As President of MET, Fred gave us some insight on new innovations and what we can expect from the stencil industry in the future.

What was the core reason for developing a nano-coating for SMT stencils?

NanoSlic® Gold was developed by Florida CirTech. They analyzed feedback from stencil users and saw the printing envelope was being pushed ever smaller. This combined with the desire to improve reliability through less rework is the market need. NanoSlic® Gold certainly does both. NanoSlic® Gold xed them all. MET was excited to be licensed with this product. It enables us to stay on the leading edge of stencil technology.

How is NanoSlic® di erent from other stencil coatings on the market today?

NanoSlic® Gold is the only coating in the market which combines reduced under

stencil wiping, reduced rework, improved paste transfer e ciency and tremendous durability. Some other coatings can claim one or even two of the bene ts above. But only NanoSlic® Gold provides them all.

What challenges do you see coming from this new technology entering the marketplace?

Whenever you bring a “value adding” product to market you must overcome the customers’ perception that what they have works, why pay for something additional? Everyone printing solder has developed their best practice. NanoSlic® Gold will improve upon their best practice. Every customer that tries NanoSlic® Gold has concluded that it does what is promised. So, I believe the biggest

challenge is to overcome inertia. We have to get it into their hands. The results will sell themselves.

Besides nano-coatings, what other trends do you see in the future for stencil manufacturing?

MET is always striving to be the innovator in stencil technology. Our EZ Step and Mesh Welding technologies are prime examples of this. The demand for greater technology will drive some consolidation of stencil makers. The demand for lower cost will bring many stencil users to seek out a “high-tech” stencil maker. The ability to reduce rework and failure costs will far outweigh a small price di erence in the stencil.

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P:80

TECHNOLOGY TODAY INTERVIEW

Yamaha Advanced Assembly

Technology Maximizes Opportunities

in Rising Markets

provided by oumayma grad, marketing communications manager, yime

The latest generation of surface-mount assembly equipment incorporates numerous advanced technologies to deliver the exibility, productivity and quality expected by diverse end-user markets industrial, lighting and automotive.

have introduced several additional advanced technologies to the market, including overdrive head control for advanced speed and exibility, and LED-die recognition to tackle challenges speci c to the solid-state lighting market.

To help automate the assembly of unusual components such as large automotive connectors, new types of picking solutions and feeders are entering the market. The connectors are often through-hole components that are supplied in bulk packaging and typically assembled by hand. To enable automated assembly a new Swing Head is able to pick bulk components from a tray and rotate the component ready for insertion, as gure 1 shows.

Introduction: Diverse Markets Seeking High- Tech Solutions

Important industries such as automotive, smart energy, solid-state lighting, cloud services and communications are demanding increasingly advanced electronics to meet the demands of customers and legislators. The electronics industry is responding: to name just a few innovations, chip fabrication processes are now progressing well below 20nm; new power semiconductor devices and packages are boosting energy e ciency and current density; and tiny chip-size packages such as 03015 (0.3mmx0.15mm) have minimised the PCB real-estate occupied by passive components.

Progress is rapid and wide- ranging, and is challenging electronic manufacturers to place highly miniaturised, fine- pitch packages on circuit boards quickly and accurately, while also striving to increase throughput and quality.

In addition, individual industries impose their own particular challenges. Automotive electronics is one of today’s fastest growing markets for semiconductors, and grew by 10 percent in 2014 according to analyst IHS. Major market drivers include compulsory safety features such as tyre-pressure monitoring and electronic stability control, the emergence of advanced driver assistance systems and connected-car applications, and demand for sophisticated infotainment. However, electronic design and manufacturing are relatively new to the automotive industry, and many traditional electrical components are still being used. Examples include multi-pin connectors in shapes and sizes that are unfamiliar to electronic manufacturers. Special care is needed to automate the assembly of these types of components.

Lighting, also, is a sector becoming ever more closely aligned with electronic design and assembly. The transition began with electronic ballasts and controllers for uorescent lamps and energy-saving CFL bulbs, but the market is now moving quickly to LED-based lighting. The advantages of LED lighting include not only lower power consumption, but also longer lifetime as well as opportunities for new lighting e ects and lamp styles.

Building highly miniaturised multi-channel electronic LED controllers is within the comfort zone of conventional SMT processes, but picking and placing LED emitters introduces several new challenges. These include handling and aligning

the LED emitters, and accommodating unusually long boards as used in some specialist light engines. Perhaps the most complex challenge lies in recognising LED Brightness Index Numbers (BINs) and adapting placement programs on the y to ensure that only emitters of similar brightness are picked and placed in a given assembly.

New Pick and Place Technologies

For OEMs and contract electronic manufacturers, simply keeping pace with market requirements demands investment in today’s most advanced surface-mount capabilities. The latest generations of equipment such as mounters introduce significant advances compared to their predecessors, and so o er higher capabilities and throughput to meet today’s assembly challenges.

New high-speed servo drives incorporating the latest motor-control technologies enable mounters to place components as small as 03015 accurately and at high speed. In fact, there are numerous improvements to motion- control mechanisms, including down-sizing of subsystems like cameras, to achieve greater precision while also minimising inertia.

Yamaha’s latest high-e ciency modular YSM20 mounter further improves mounting performance by incorporating a newly designed z-axis linear motor as well as a miniaturised, lightweight placement head. Yamaha’s one-head solution concept enhances productivity by using a multi- purpose 10-nozzle head to handle components from 03015 up to 45mm x 100mm x 15mm high. This allows sustained high-speed operation, avoiding the delays associated with changing heads to handle special components. A super- wide-range 5-nozzle head for components from 03015 to 55mm x 100mm and up to 28mm in height is also available. The YSM20 can be speci ed as either a single-beam machine or dual-beam allowing any combination of the 10-nozzle and 5-nozzle heads for optimum speed (cph) and component range.

In addition, features such as automatic nozzle cleaning, high-speed side-view component detection, and smart component recognition, which are typically only available on specialised high-end machines, are also being o ered on the mid-range mounters. The modular YSM20 platform also gives exibility for customers to upgrade capabilities or throughput in the future as desired.

Among the current selection of high-end ultra- high-speed machines, the Yamaha Sigma series of high-capacity chip mounters brings technologies such as multi-function heads and splice-free self-loading feeders. These machines

Figure 1. A new placement head design enables insertion of odd-form leaded components.

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| FEBRUARY 2016 ISSUE

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Alternatively, the connectors may be packed in sticks for transit. In this case, it is e cient to feed components directly from the stick. Automatic stick feeders are compatible with conventional feeder interfaces, and can hold multiple vertically stacked sticks. Loading each stick in turn allows continuous operation without human intervention. Yamaha has developed an automatic stick feeder that can accommodate the majority of stick types in common use today.

Alignment is a new printer technology that allows operators to ne-tune alignment during setup without waiting for SPC analysis to calculate any necessary o sets. This and other features such as print stability control, which replenishes the paste roll automatically at the optimum interval, enhance productivity by saving the time normally needed to print a number of trial boards to help optimise process settings.

Post-Placement Inspection and Closed-Loop Feedback

On the downstream side of the mounter, improvements in inspection technology help to ensure reliable inspection results and reduce programming time. These include multi-image, multi-angle inspection using a combination of red, green and blue visible wavelengths as well as infrared to improve defect detection and eliminate false positives. The latest platforms also add laser-based checking for correct component height and coplanarity.

The latest best practice, as far as Automatic Optical Inspection (AOI) is concerned, is also changing. Traditionally, AOI has been performed after re ow soldering. If defect detection is left until this late stage, the only options for some boards may be time-consuming manual resoldering, or simply to scrap the board. Moreover, if the defect is caused by an equipment problem such as a faulty feeder or a blocked mounter nozzle, several boards can be a ected before the problem can be detected and xed. Inserting AOI after placement and before re ow provides the opportunity to detect equipment problems earlier and isolate any a ected boards before they are re owed.

Yamaha created its closed-loop feedback system and QA Option software to be used in conjunction with pre-reflow AOI. Closed-loop feedback takes advantage of Yamaha’s proprietary machine communication protocol, which supports rich data interchange and real-time analysis, to enable machines in the SMT line to exchange diagnostic information.

This gives the ability to highlight the causes of any detected defects, down to the level of an individual mounter nozzle, component feeder or stencil aperture. Moreover, analysing data collected over longer periods helps streamline process development and enables predictive maintenance.

The QA Option user interface provides the nal link between machine-level data and the operator by generating on-screen alerts and indicating the exact location of the problem responsible for the defect ( gure 3). There is also an optional app called Mobile Judgement, which sends information to the operator’s smartphone when a defect has stopped the line. The operator can then quickly decide whether production can be restarted or if intervention is required.

Figure 3. QA Option error report.

On the other hand, new and advanced line or oor monitoring software enables equipment operators to check production progress in real-time, and also identify trends and pinpoint the causes of any stoppages. The latest release of Yamaha’s M-Tool monitor, for example, includes multiple user-selectable reports that give the option to assess individual machine status, number of boards completed, estimated time to nish the current batch, and diagnostic information ( gure 4).

Figure 4. Various reports can be extracted from real-time monitoring software.

Conclusion

Electronic manufacturers constantly expect more speed, greater precision and better diagnostics from automated SMT equipment. This pressure is a given in the industry, driven by the requirements of established markets such as telecom, industrial automation and consumer electronics. Emerging markets such as automotive electronics and solid- state lighting have brought exciting opportunities,

while also demanding new and more versatile solutions for feeding, picking, aligning and placing unfamiliar and non-standardised components.

ABOUT YAMAHA MOTOR IM

Yamaha Motor IM is a subdivision of Yamaha Motor Corporation. Yamaha IM surface mounters are highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/ electronic parts being mounted on circuit boards.

Yamaha Motor IM has created a strong business in the surface mounter industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, ip chip hybrid placers and dispensers. This allows Yamaha Motor IM to o er a full line of machines for electric/ electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.

Yamaha Motor IM has sales and service o ces in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients.

www.yamaha-motor-im.eu

Figure 2. The Automatic Stick Feeder can handle unusual component sizes.

Pre-Placement Advances

Improvementstomountingcapabilities must be matched by advances in solder paste deposition. Surface- mount manufacturers understand that pre-placement capabilities set the standard for the rest of the line.

This has been shown many times in practice, including recently at Interconics, a UK-based high- tech contract manufacturer that seeks to o er the highest possible capabilities to customers in demanding sectors such as advanced automotive, motorsport and 5G mobile. Interconics recently completed its investment in a complete new SMT line by installing one of the latest YSP printers incorporating new technologies such as the 3S Swing Single Squeegee mechanism. The 3S head is capable of dynamically adjusting the squeegee angle to maintain optimum aperture lling and paste release under all operating conditions. This continuous automatic adjustment has enabled Interconics to print paste at high resolution for ne-pitch components. The single squeegee also eliminates the unavoidable inconsistencies in motion control experienced with dual-squeegee systems, which can cause variations in print quality.

Fiducial alignment is another important aspect of screen printing that is enhanced in the latest- generations of equipment. Graphic Layer Base

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2016 DATES FOR YOUR DIARY 10 – 11 FEBRUARY

8 – 9 JUNE

Cite, Centre De Congress, Lyon, France

ENOVA, the platform of Technology and Services (Electronics, Embedded, Iot, Measurement, Vision, Optics) will be held for the second time in Lyon in 2016. Products being exhibited cover 4 Technological Areas:

• Electronics/Production/Testing Components

• Software and Embedded Systems/M2M/Smart Devices • Measurement/Instrumentation/Metrology/Vision

• Optics/Photonics

15 – 17 MARCH

Las Vegas Convention Center

IPC APEX EXPO 2016 is a ve-day event like no other in the printed

circuit board and electronics manufacturing industry. Professionals

from around the world come together to participate in the Technical

Conference, Exhibition, and Professional Development, Standards

Development and Certi cation programs. These activities offer

seemingly endless education and networking opportunities that

impact your career and company by providing you the knowledge,

NEW-EPDT-jan16.pdf 1 13/01/2016 16:06

technical skills and best practices to address any challenge you face.

BIRMINGHAM NEC 12th – 14th April 2016

DESIGN & TEST NENTS & POWER

EMBEDDED & SOFTWARE PRODUCTION & EMS

NATIONAL ELECTRONICS WEEK 2016

Birmingham NEC

National Electronics Week will run in Hall 2 alongside MACH and Drives & Controls, contributing to the biggest UK visitor attendance of an electronics and manufacturing event. Over 30,000 visitors from the industry will descend upon the NEC to see the latest designs and innovations from all over the world. With the new Resort World opening in time for the event, it is set to be bigger and better than ever before with networking opportunities in plentiful supply.

26 – 28 APRIL

Nuremberg, Germany

SMT Hybrid Packaging is Europe´s leading event on System

Integration in Micro Electronics. Meet the industry’s leading

companies for SMT-Equipment, Components and SMT-Services.

Angers Expo Congrès - Parc des Expositions, Angers, France

ENOVA exhibitions bring together almost 10,000 visitors seeking innovative products and services. From R&D and Industry, Start- ups, industrial rms, technology providers, digital professionals, research laboratories and designers; here to explore new uses and technologies, to generate a real climate for doing business and to bring their projects to life.

THE 22ND PRESENTATION

30 AUGUST – 1 SEPTEMBER

SOUTH CHINA 2016

Schenzhen Conference & Exhibition Center

NEPCON SOUTH CHINA is one of the biggest product and technology procurement platforms for the electronics manufacturing

COMPO

With 33% foreign exhibitors, the event offers not only a wide, but also an international spectrum. The perfect platform to get the latest

26 - 28 APRIL

industry in South China. Boasting the longest standing history, it gathers 33,000 high-end buyers, decision makers, engineers, and technicians from EMS/OEM/ODM, including consumer electronics, communications, and the computer, automotive and medical electronics sectors. Sideline activities such as the EMA Pavilion, CS Show, and EMS Sourcing Hub provide the most advanced industrial automation technologies and products in China, as well as the most comprehensive PCB products. The event offers a great opportunity to showcase the best in electronics manufacturing, design, and delivery solutions.

14 – 15 SEPTEMBER

Paris Expo Pore de Versailles, Paris, France

Technical and professional experts related to the sectors of electronics and measurement will attend this event and will

get an opportunity to share their expertise with the attendees. Developmental changes which are taking place in the elds of optics and photonics will be highlighted in this event and will attract a large number of technocrats and professionals from all over the world related to these elds. Enova Paris is designed to provide useful and relevant information to the manufacturers and suppliers of measurement and control equipment and Manufacturers vision systems and Components. These manufacturers and suppliers can share their knowledge and experience with each other by attending this expo.

27 – 28 SEPTEMBER

Donald Stephens Convention Center, Rosemont, IL

This year in Rosemont, attendees and exhibitors can expect a focused event with the strongest technical conference for which SMTA International has come to be known. SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.

8 – 11 NOVEMBER

Messe Muenchen

electronica is the very rst place to see which components, systems or applications make new developments such as smart homes and connected cars possible in the rst place. The entire industry meets here, electronica hosts a comprehensive range of exhibits on an international business platform, with an extensive supporting program. In short: the entire world of electronics.

THE 22ND PRESENTATION

SOUTH CHINA 2016

information on newest trends and developments.

CHINA 2016

CHINA 2016

Shanghai World EXPO Exhibition & Convention Center

The event is one of the biggest and longest standing trading

and sourcing platform in Asia, featuring all major brands in the electronics manufacturing world. The Electronics Manufacturing Automation (EMA) Pavilion to be debuted at NEPCON China

2016 will showcase the most advanced industrial automation technologies and products in the electronics manufacturing industry. It is the only dedicated trade and purchasing platform in China to feature automation solutions for both electronics manufacturers and electronics manufacturing equipment vendors.

Page 82 The Choice of Publication for the Electronics Industry

Upcoming tradeshows 2016.indd 1

2016 dates for your diary

12 – 14 APRIL

| FEBRUARY 2016 ISSUE

22/01/2016 15:14

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