SMART VISIONWITH DR. DETLEF STECK INSIDE SMT TODAY • Meet the CEO – Dr. Detlef Steck, Yxlon International • Interview with Abby Tsoi, Anda • Additive Manufacturing Brings New Opportunities to Electronics Design and Production, Nano Dimension | NOVEMBER 2017 ISSUE smttoday.com

Exhibiting in Hall A2, booth 331Getech GBR“Fixtureless Depanelling Machinery”High Speed PCB RoutingIn machine Sorting of Good/Bad PCBsTouchless ProcessPost router downstream integration capabilities Getech LIRM “Laser Depanelling Machinery” Green Laser technology with 532 nm wavelength Twin table design for continuous cutting operations Zero stress, zero vibration process Ideal for thin substrates and sensitive electronics applicationsGetech GLSGMetech Laser Singulation“Laser Marking SysLtiegmht” Years Ahead in PCB Singulation30W CO2 Laser for marking e ciency12MW/sitshcLaanserartSeinfogrulsaptieoendthe issues of Stress, Vibration and Dust are dealt with. Today the advent of2 mNicarnoonsreecsoonldutpiounlsfeodr lraesaedrsabwiiltithyshorter wavelengths and increased power offer a clear alternativeIntertnoatlraFdlipitiosntaatliomnecfohradniocuabl rleoustiedres.mUasrinkginag scanned Top Down process PCB tabs are cut using a photochemical process rather than a thermal process creating clean carbon free cuts. The process can be conducted inline or standalone using simple fixture designs in a light safe environment. Stress Free | Dust Free | Vibration Free | Simple Fixturing +1 970 412 6759 | [email protected] 2 getecha.comElectronics Beyond Content | NOVEMBER 2017 ISSUE

IGnedt cuonsnterctyed4w.i0thi40todViasity.com Part of the SMT Today Group

welcome to smt todayeditor’s notes Editorial director Wendy TindleHello and welcome to this latest issue of SMT Today! [email protected] SMT Today Team have certainly been very busy this past month, and wecannot believe that this is the last issue of 2017. SMTAi Chicago was a great global salessuccess as always, of which we have a roundup and some photographs in Andrew Carpenterthis issue. This trip was closely followed up by our invitation to the COMET [email protected]’s Lab ONE Opening, in San Jose, CA. It was a privilege to be invited to thisprestigious event, which took place on 4th October 2017, and was hosted by Mr creative assistantPaul Smith, Senior Vice President of Global Product Marketing. More information Cameron Shawand photographs from this event are also included inside. [email protected] new issue of SMT Today is released in line with productronica, being held inMesse Muenchen, Munich, Germany, running from November 14th – 17th, 2017. Published byYou will find an extract of press releases within this issue of clients who will beparticipating at the show, and where they will be located. The SMT Today team Electronics Beyond Contentwill be attending the exhibition, meeting with clients old and new, conductinginterviews, videoing demo equipment and keeping you all up to date with all the designed bylatest press releases from the show through our website www.smttoday.com Big Blue Dog Designand all our social media platforms. If you would like to schedule a meeting withus, or tell us about any exciting news you may have, please email us at hello@ contactssmttoday.com. SMT Today Ltd, 1 Dow Road,SMT Today features Dr. Detlef Steck, President of Yxlon International, on the front Prestwick International Aerospace Park,cover of this issue. We had the pleasure of catching up with Detlef recently, tofind out more about Yxlon, their history, their SmartLoop solution, successes and Prestwick, Ayrshire, UK, KA9 2TUaspirations for the future. We also have some interesting feature articles fromAkrometrix , KIC, Nordson YESTECH and interviews with Mr Abby Tsoi from Tel:+44(0)1292 834 009Anda and Mr Randy Ferrell from Saline Lectronics. We hope you find these Email:[email protected], both informative and interesting, along with our popular Industry News,New Products and Red Carpet sections. All right reservedWe are very excited to introduce our new platform focussing on the hot topic of The content of smttoday is protectedIndustry 4.0, namely i4.0 Today. The preview of this brand new magazine is out by copyright law, full details of whichnow. This new publication will go hand in hand with our new Industry 4.0 website, are available from the publisher. Whilewww.i40today.com, 4.0 Technology Events hosting industry leading speakers, great care has been taken in the receiptglobal email campaigns and premium sponsorship opportunities. Stay at the helm and handling of material, productionof your industry, and make i4.0 Today your go to for all Industry 4.0 related content. and accuracy of the content in this magazine, the publisher will not acceptThe next issue of SMT Today is due out early Feburary, just in time for APEX. any responsibility for any errors, loss orEditorial deadline for this is 17th January 2018. If you would like to advertise withus, contribute articles, news or high profile press releases, or simply to make an omissions which may occur.appointment with us at the show, please do not hesitate to contact us at [email protected]. Wendy Tindle, Editor Email: [email protected] would like to take this opportunity to wish our readers, subscribers and clients asafe and successful show. Skype: wendy-smttoday Call: +44 1292 834009Pick up your SMT Today and i4.0 Today Preview in Hall A2, Booth 409.WendyPage 4 Electronics Beyond Content | NOVEMBER 2017 ISSUE

magazine Editorial & Advertising Enquiries NEXT EDITIONcontacts... To enquire about available advertising February edition will opportunities, please contact: focus on APEX, San Diego [email protected] Deadline for content: Website smttoday.com 17th January 2018 inside this issue...6 6 Shows/Events PRODUCTRONICA 2017Productronica 2017 7. Exhibiting Companies 16 Director Spotlight Interview with industry experts Dr. Detlef Steck, General Manager of YXLON International 20 Technology Today Industry experts share their knowledge 20. Flexible assembly production thanks to fully automatic cleaning process control of multiple machines at JUMO GmbH & Co. KG 20 24. Etek Europe shares best practice alongside Prime Minister Theresa May in The Parliamentary Review Technology Today 28. KIC-What Is the Reflow Oven Really Supposed to Do? 30. Akrometric - Measuring Die Tilt Using Shadow Moiré Optical Measurements 38. GKG - Insight to the future 42. Yxlon - CT Technology advances imaging microelectronics to assembled products16 46. Interview with Abby Tsoi Director Spotlight 48. Nordson YESTECH Helps Trenton Systems Ensure Consistent Quality and Best Practices for Its US-Made Technologies 40 50. ULT - The Influence of Clean Air on the Value-Added Chain in Electronics Production Industry News 54. Comet Group’s Lab One Grand Opening 58. Nano Dimension - Additive Manufacturing Brings New Opportunities to Electronics Design and Production 60. Virtual Industries Proves that Good Things Do Come in Small Packages 64. SMTTODAY Out and About 66. An interview with Randy Ferrell, Senior Process Engineer 40 Industry News What’s happening in the world of electronics62 62 Red CarpetRed Carpet - CalcuQuote and Tech Edventures Team Up forAfter-School Engineering CampArticles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every effort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers forloss arising from articles/information contained and published. All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

PRODUCTRONICA2017 Messe,MÜnchen14th - 17thNOVember 2017Future technologies, industrytrends, growth markets -Investment decision-makers,industry experts from aroundthe world - At the right timeand the right place. Only atthe World’s Leading Trade Fairfor Electronics Developmentand Production - Welcome toproductronica 2017.There are plenty of good reasons for you to attend productronica.After all, in this form, productronica is unique in the world ofelectronics production.productronica is THE leading international trade fair for thedevelopment and manufacture of electronics. It is the onlyplace in the world where you can find: The entire value chain in electronics manufacturing under a single roof – from software to process control, from technologies to applications, and from products to system solutions All of the industry’s key players The latest developments and innovations, which gives you a look at the future of electronics manufacturingMore than 1,200 companies of all sizes—global market leadersand industry start-ups—and innovative exhibitors from allelectronics manufacturing sectors will present their impressiveproduct / service portfolios at productronica 2017.The SMT Today team will be introducing thepreview edition of i4.0 Today in Hall A2, Booth 409Page 6 Electronics Beyond Content | NOVEMBER 2017 ISSUE

shows/eventsThe following is a snapshot of exhibiting companies...Alpha to Showcase Latest Industry 4.0 including vacuum parameters. CyberOptics DemonstratesProducts for SMT Assembly at Additional features include: New MRS-Enabled AOI, SPI andproductronica, Munich, Germany • Automatic sequencing CMM Solutions at productronica • Programmable control of vacuum level and GermanyHall B3 Booth #272 hold time Hall: A4 Booth No: 239Alpha Assembly Solutions, the world leader in the • Pass-through mode for non-vacuum operationproduction of electronic soldering and bonding CyberOptics® Corporation (NASDAQ: CYBE) willmaterials, will be exhibiting its latest range of Existing PYRAMAX customers can easily transfer demonstrate the SQ3000™-DD 3D Automatedproduct solutions, alongside its sister company their process to the new PYRAMAX Vacuum Optical Inspection (AOI) system with the new Ultra-MacDermid Enthone Electronics Solutions, at the reflow oven. Bob Bouchard, BTU’s corporate High Resolution Multiple-Reflection Suppressionproductronica exhibition in Munich. marketing manager, commented, “The industry (MRS) Sensors. The company also will unveil the has recognized that vacuum processing is a new SE3000™ 3D SPI and SQ3000™ 3D CMM,Alpha will present its latest stencils innovation, proven way to reduce solder voiding during both powered by MRS technology.ALPHA® tensoRED® Master Tensioning Frame the reflow process. The PYRAMAX Vacuumat the show. ALPHA® tensoRED® enables a reflow oven features the industry-leading thermal The new SQ3000-DD 3D AOI dual lane, dualhigher and more even tension compared to performance that the PYRAMAX is known for and sensor system maximizes flexibility catering toALPHA® Tetra Frame. will allow for easy process transfer for existing varying PCB widths. This unique design provides Pyramax users.” the ability to inspect high volume assemblies, the“Due to the innovative design of ALPHA® convenience of inspecting different assembliestensoRED®, no air pressure on the frame is www.btu.com and board sizes simultaneously on different lanes,needed resulting in reduced maintenance costs or even switching from dual lane to single laneand improved reliability,” explained Donald Corlett, Cogiscan to Introduce Factory mode to inspect very large boards.Stencils Manager for Alpha Assembly Solutions, Intelligence – Analytics ata MacDermid Performance Solutions Business. productronica Not only does the SQ3000-DD provide the PCB“ALPHA® tensoRED® also delivers several inspection flexibility, it also provides the flexibility toprinting process benefits associated with higher Hall: A2 Booth No: 361 choose two of the same or two different proprietarytension such as less paste smearing*, reduced MRS sensors, both of which meticulously identifyvariation in and improved positional alignment on Cogiscan Inc. will introduce its new Factory and reject multiple reflections caused by shinyvolume deposits*”. Intelligence – Analytics. Cogiscan will introduce the components and reflective solder joints. second major phase of evolution for the award-ALPHA® tensoRED® is now available in all winning Factory Intelligence OEE software, along The new Ultra-High Resolution MRS sensorcommon printer sizes, as well as configuration with SmartRep, its new sales and service partner option provides an even finer resolution thanoptions for full 29” printer openings. for Germany and other German-speaking regions. the standard, delivering superior inspection performance ideally suited for 0201 metric andIn addition, Alpha will showcase its newly The first phase of Factory Intelligence was focused microelectronics applications where an evendeveloped solution for void reduction under bottom on real-time performance monitoring. The new greater degree of accuracy and inspectionterminated components (BTC), the ALPHA® Analytics package offers a series of capabilities reliability is critical. The unique architecture of bothAccuFlux™ BTC-578 Preform System. The system to analyze metrics and KPI over a period of MRS sensor options simultaneously captures andcombines Alpha’s AccuFlux™ BTC-578 preform, time. Being able to collect and analyze key transmits multiple images in parallel, while highlysolder paste, engineered stencil designs and metrics such as machine OEE is key to enabling sophisticated 3D fusing algorithms merge theoptimized processing parameters to dramatically manufacturing staff to quickly identify any deviation images together, delivering microscopic imageand consistently decrease voiding. from expected performance and quickly drill down quality at production speed. to the root cause for corrective actions. Thiswww.AlphaAssembly.com. will guarantee that all assets always operate at The new SE3000™ SPI system is the very first SPI optimal conditions. system to incorporate the industry-leading MRSBTU to Introduce New Pyramax sensor technology with a finer resolution for theVacuum Refow Oven at The Analytics module of Factory Intelligence best accuracy, repeatability and reproducibility –productronicaInternational is designed for ease-of-use. Its open and even on the smallest paste deposits. Combined modular architecture enables different modes of with the award-winning, easy-to-use software,Hall: A3 Booth No: 154 implementation: solder paste inspection has reached a new level of precision for the most stringent requirements.BTU International, Inc. announced plans to 1. Factory Intelligence comes with a set ofintroduce its new PYRAMAX™ Vacuum reflow preconfigured dashboards and a tool for the “We’ve incorporated our MRSoven. The system will be on display for the first creation of user specific dashboards. sensor technology into multipletime in Hall A3, Stand 154 at productronica 2017, platforms for AOI, SPI andscheduled to take place Nov. 14 – 17, 2017 at the 2. Alternatively, customers can integrate the CMM,” said Dr. Subodh Kulkarni,Messe München in Germany with EPP Electronic Analytics data with an existing third-party Business President and CEO, CyberOptics,Production Partners GmbH. Intelligence (BI) dashboard application via a “Providing our customers standard OLAP layer (Online Analytical Processing) with the best combination ofThe PYRAMAX Vacuum reflow oven has been accuracy, speed and ease-of-designed around requirements of large EMS/ Factory Intelligence runs on the standard Cogiscan use to maximize their yields andhigh-volume automotive customers. The unit platform, which means that it is a very simple productivity.”is configured with 10 zones of closed-loop upgrade for existing Cogiscan customers. Withconvection heating and a maximum production the largest library of machine interfaces in the The new SQ3000 3D CMM (Coordinatewidth of 18”. Nitrogen atmosphere capable, the industry, Cogiscan can deliver a complete solution; Measurement) system, powered by Multi-PYRAMAX Vacuum reflow oven offers a maximum including connectivity middleware and applications Reflection Suppression (MRS) technologyprocess temperature of 350° C. such as material control, traceability and analytics. utilizes CyberCMM™, a new comprehensive software suite for coordinate measurement. In aThe unit features integrated controls with BTU’s www.cogiscan.com lab or production environment, the MRS-enabledproprietary Wincon™ windows-based control SQ3000 CMM system is extremely fast andsystem and full integration with factory MES/ highly accurate, with repeatable and reproducible measurements for metrology applications in

shows/eventsmanufacturing of a wide variety of products nature of the cured resin is naturally resistant The Productronica show is a great opportunitysuch as PCBs, semiconductors and consumer to the yellowing effects of UV light, making to see the broad equipment offering from ITWelectronics. it useful for a range of outdoor applications. EAE. Engineers and Applications Experts will UR5640 is also scratch resistant and offers high be on hand as well as Sales and ManagementCyberCMM™, an extensive suite of CMM resistance to weather, acids and alkalis, water to answer questions and offer solutions. Thetools, provides 100 percent metrology-grade and mould growth. combined knowledge and experience of the ITWmeasurement on all critical points much faster than EAE group has generated some breakthrougha traditional CMM, including coplanarity, distance, UR5641 has similar optical properties to UR5640 innovation which is speeding the developmentheight and datum X, Y, to name a few. A fast but with the added bonus of being flame-retardant of next generation technology.and easy setup can be performed as compared and eminently suitable for the protection of LEDto a slow, engineering resource-intensive setup luminaires exposed to hazardous atmospheres, There will be a special focus on equipment forthat typically requires multiple adjustments with such as emergency lighting, or lighting intended manufacturing automotive electronics featuring for installation in ATEX rated/zoned environments. PCB printing, dispensing and soldering solutionstraditional CMMs. The resin’s halogen free aliphatic chemistry ensures that meet the increasing throughput, yield and resistance to the yellowing effects of UV light, performance demands from this market. Solutionswww.cyberoptics.com. again making it useful for both exterior as well to the challenges of fine pitch printing and as interior applications. component miniaturization will also be addressed.Electrolube Launch InnovativeNew Conformal Coatings and The third resin to be launched by Electrolube at While we are highlighting our differentiatedResins at Productronica 2017 this year’s Productronica is the ER2225 RoHS- solutions for the automotive market, we are 2 compliant, black epoxy potting compound, also excited to share our solutions to the world’sHall: A4 Booth No: 466 formulated to meet the exacting requirements leading EMS and Smartphone providers,” said of the automotive sector and other industrial Pat O’Brien, ITW EAE Vice President /GeneralElectrolube will demonstrate its technical prowess applications that require high temperature Manager. “Miniaturization continues to demandin specialist electro-chemicals with a selection resistance, good thermal cycling performance enhancements in speed and precision, and we areof new conformal coatings and encapsulation and the ability to withstand attack from a wide excited to showcase our capabilities in these areas. resins that will make their debut at Productronica. range of chemicals, fuels and aggressive fluids. We also welcome the opportunity to continue our discussions with leading manufacturers onTwo brand new products to Electrolube’s innovative ER2225 can be used to encapsulate electronic Industry 4.0 and the collective advantages thesetwo-part (2K) Conformal Coatings series, include assemblies and PCBs subject to an operating capabilities can bring in preventive maintenance,the 2K350 and 2K550 polyurethane coatings. temperature range of -40 to +180°C; ER2225 will yield improvements, overall2K350 is a solvent-free coating which is opaque even tolerate short excursions of up to +210°C.blue for ease of inspection. The UL94V-0 compliant The resin shows good thermal conductivity www.itweae.comcoating is highly flexible and effectively combines (1.1W/m.K), making it suitable for industrialthe protection and properties of an encapsulation applications requiring good heat transfer across .resin, with the ease of a coating application. 2K350 a wide temperature range. While ER2225 doeshas an operating range of -40 to +130°C and contain fillers, in tests the resin shows excellent KIC and SmartRep introduce real-provides excellent coverage, even in tight spaces, flow around components and is easy to process time dashboard, traceability andwhile its extreme flexibility offers protection even in a fast-moving production environment. data analytics at productronicaaround delicate components. The hydrophobiccoating gives excellent water immersion, salt mist The new polyurethane and epoxy resins are all Hall: A2 Booth No: 361and humidity protection, making it an excellent initially available in handy 250g pack and 5kg kitchoice for automotive electronics. The new 2K550 sizes to meet every need, from prototyping and The KIC team will debut the new ecosystem ledis a tough, flexible, high performance coating, product development to full production. by the Vantage network software system andwhich also provides the protection of a resin with discuss the SPS smart profiler.the ease of application of a conformal coating. As a complete solutions provider, ElectrolubeThe UL94V-0 compliant coating is characterised offers a wide range of electro-chemical solutions, The new KIC Vantage software is designed toby greater coating thickness and enhanced edge which include thermal management products, help engineers gain insight into their reflow andcoverage and shows improved adhesion, hardness encapsulation resins, conformal coatings, contact wave solder processes to enable better andand scratch resistance. 2K550 has excellent clarity lubricants and cleaning solutions. Visitors to faster decision making. It provides a real-timeand resistance to discolouration, humidity and Productronica 2017 are invited to meet the dash-board for thermal processes, accessiblecondensation. The new coating also features a Electrolube team in Hall A4 of the Messe München, anywhere, from any authorized PC or mobilefluorescent trace to aid inspection. Booth 466. During the course of the show, device. The process data is automatically stored in Electrolube will be hosting live selective coating a central location where the engineer can quicklyHFAC is an additional product launch from demonstrations on a PVA system. Visitors are retrieve and share all relevant data.Electrolube and provides an alternative solution welcome to put their process and applicationfor manufacturers who require a coating without requirements to the team, who will be happy to The Vantage delivers value to users, not throughthe use of aromatic solvents or chlorinated and discuss solutions that will really make a difference. massive amounts of raw data, but throughbrominated flame retardants. For specific customer convenient access to only relevant and/orapplications, HFAC will entirely eliminate the www.electrolube.com actionable data. For example, with a few mousenegative issues associated with halogenated clicks, the user can access traceability data formaterials and issues with aromatic solvents, ITW EAE to Display Latest every assembled PCB within a certain time frame,making it safer for operators. HFAC is flexible Advances in Electronics oven, shift, client name, or all of the above.and transparent with improved flame retardancy, Assembly Equipment atgood clarity and excellent UV resistance, making Productronica Show The new KIC SPS smart profiler collects theit suitable for use in LED applications. The UL94 profile data and compares it to the processV0 approved HFAC is a versatile coating which Hall A4, Booth #554 specifications. Within seconds, the new smartcan be sprayed, dipped or brushed. The coating profiler also suggests an improved reflow ovencan also be easily removed for rework. ITW EAE, the Electronic Assembly Equipment setup. It utilizes smart factory technologies to division of ITW will be attending Productronica, acquire and analyze thermal process for newTwo new optically clear polyurethane resins November 14-17, 2017 in Munich, Germany. insight and actionable data leading to increased– UR5640 and UR5641 – offer ‘water white’ The ITW EAE booth will be displaying and production line utilization, reduced rework andtransparency, making them ideal for encapsulating demonstrating the latest advances in the MPM, electricity use.LED luminaires. UR5640 cures to provide a flexible, Camalot, Electrovert, Vitronics Soltec andprotective and aesthetically pleasing covering over Despatch product lines. www.kicthermal.comthe luminaire elements, and the aliphatic chemicalPage 8 Electronics Beyond Content | NOVEMBER 2017 ISSUE

shows/eventsMonitor Your Cleaning Process Connection Validation Selective Soldering these multi award-winning technologies to thewith ANALYST Data Services System visitors at this year’s event.”Hall: A4 Booth No: 413 Robotic soldering is becoming more commonplace The award-winning MV-6 OMNI 3D AOI Machine as manufacturers look to reduce risk and increase is configured with MIRTEC’s exclusive OMNI-KYZEN’s growing Analyst Data Services platform productivity. Metcal’s new CV Selective Soldering VISION® 3D Inspection Technology that combinesnow supports the Process Control System System addresses these needs by combining the 15 Mega Pixel CoaXPress Camera Technology(PCS). The advanced customizable analytics are its patented CV technology and a new Smart with MIRTEC’s revolutionary 8 Projection Digitalpackaged in attractive, user-friendly dashboard Interface System. CV reduces unnecessary dwell Multi-Frequency Moiré 3D system in a newlyformats to support your unique reporting needs. time by signalling to the system to move to the designed cost-effective platform. MIRTEC’s next solder joint in the program after a good joint 15 Mega Pixel CoaXPress Vision System isSince the introduction of the KYZEN ANALYST™ is formed. The Smart Interface System simplifies a proprietary camera system designed andlast year, not only has it been in high demand, but the programming process by integrating system manufactured by MIRTEC for use with ourit has received two prestigious industry awards for controls through an easy to use interface. The complete product range of 3D inspection systems.innovation. productronica attendees can receive Connection Validation Selective Soldering System MIRTEC’s 8 Projection Digital Multi-Frequencya live demo of KYZEN’s new ANALYST Data is the newest example of Metcal’s Industrial Moiré Technology, provides true 3D inspection toServices to discover how they work seamlessly Ingenuity yield precise height measurement data used towith the KYZEN PCS. Attendees also will find detect lifted component and lifted lead defects asout more about plans to expand the KYZEN Hot Air Pencil well as solder volume post reflow. Fully configuredANALYST Data Services line of enabled cleaning the MIRTEC MV-6 OMNI machines feature fourprocess applications. The HCT2 series of Digital Hot Air Pencils have (4) 10 Mega Pixel Side-View Cameras in addition always included an array of nozzle sizes for to a 15 Mega Pixel Top-Down Camera.You no longer need to be precision control. The new HCT2-200’s improvedstanding at the production thermal performance allows the user to target The MS-11e 3D SPI Machine is configuredline or manually logging data. a larger variety of components. New features with MIRTEC’s exclusive 15 Mega PixelANALYST Data Services allow include a 200-Watt ceramic heater and dual CoaXPress Vision System, providing enhancedyou to access your data from stage air pump, a new replaceable hand-piece, image quality, superior accuracy and incrediblymultiple production sites in and optional bent nozzles for easier access and fast inspection rates.one secure location. Quickly use under a microscope.compare performance across The machine uses Dualproduction sites in Europe, High Thermal Demand Projection “Shadow Free” 3DNorth America and Asia. Moiré Technology combined The new High Thermal Demand (HTD) solution, with a Precision TelecentricLet KYZEN’s Analyst Data Services monitor and comprised of a new hand-piece and a selection Compound Lens and Precisiontrend your process in real-time (24/7) and alert of thermal efficient cartridges, is designed for Laser PCB Warpage Compensationyou if an anomalies occur. Have peace of mind use with Metcal’s MX line of power supplies. to accurately characterizewhile you are away or tackling other challenges. HTD transforms a Metcal MX-series soldering each solder deposition post station into a powerhouse for applications with screen print.www.KYZEN.com high thermal loads, such as dense boards, without damaging sensitive components. Solder Tip Cleaner Metcal’s innovative new Solder Tip Cleaner removes oxidation and extends the tip life of your soldering tip. This easy-to-use cleaner senses the tip when inserted into the unit and activates automatically, saving the operator time. For more information about any of Metcal’s electronics assembly bench tool solutions, visit www.metcal.com.Metcal makes strategic move in Best Rated Cost, Flexibility & The MS-11e precisely measures solder volume,industrial ingenuity – Learn more Technology – MIRTEC’s MV-6 area, shape deformity and X/Y position andat productronica OMNI 3D AOI System at inspects for bridging between adjacent solder productronica depositions. Furthermore, the MS-11e providesHall A2, Stand 135 “Real Time” closed loop feedback to the screen Hall: A2 Booth No: 329 printing system to effectively eliminate defectsMetcal has been making a strategic move in before they occur!industrial ingenuity by introducing multiple new MIRTEC is pleased to announce plans to exhibitproducts in 2017. The company will show its its award-winning MV-6 OMNI 3D AOI System at The MV-3 OMNI Desktop 3D AOI Machine isbrand new Connection Validation (CV) Selective productronica 2017. Additionally, the company will configured with MIRTEC’s OMNI-VISION® 3DSoldering System at the show for the first time, show the MS-11e 3D SPI, MV-3 OMNI Desktop Inspection Technology which combines ouralong with a range of soldering tools. 3D AOI and INTELLISYS® software. exclusive 18 Mega Pixel CoaXPress Industrial Camera Technology with our revolutionary 8CV Soldering System: David Bennett, President of MIRTEC Europe Ltd., Projection Digital Multi-Frequency Moiré 3D commented: “We are excited to show our latest system in a newly designed Desktop platform.CV is Metcal’s latest patented technological technologies, as MIRTEC has again pulled away Fully configured the new MIRTEC MV-3 OMNIinnovation that is reinventing hand soldering! from the competition by introducing new features machines feature four (4) 10 Mega Pixel Side-Built on the company’s SmartHeat™ technology, on the market-leading MV-6 OMNI. Another model View Cameras in addition to the 15 Mega Pixelused in all Metcal soldering systems, CV evaluates that is already showing its leading position is the Top-Down Camera making this system the mostthe quality of the solder joint by calculating the MV-3 OMNI – a 3D version of the famous MV-3L. technologically advanced Desktop AOI machineintermetallic compound formation and providing The MV-3 OMNI offers the highest specification far in the world! There is little doubt that this newclosed-loop feedback to the operator, mitigating outperforming competitive inline offerings, whilst technology will set the standard by which all otherrisk in the process. Additionally, Metcal just allowing the customer the best in cost, flexibility inspection equipment is measured.released the CV Monitoring Software that will and technology. We look forward to demonstratingimprove your solder process traceability and For the first time, MIRTEC will introduce thecreate a performance baseline to quickly analyze NEW MV-9 SIP “System in Package” inspectionyour soldering performance, identify changes inyour solder conditions, and allow you to makechanges to your process.Page 10 Electronics Beyond Content | NOVEMBER 2017 ISSUE

shows/eventssystem specializing in CSP components utilizing • Show delegates are invited to visit the Nano the 4800 system the pinnacle of automatedthe MIRTEC 25mpx camera with combined 2D Dimension team to learn about the company’s wafer testingand 3D inspection technologies. The system is full range of technologies for electronicsable to handle 0.1mm ~ 3mm thicknesses via development. Nano Dimension team members The 4000Plus Bondtester with Camera Assista vacuum block. will offer professional advice to any company Automation is ideally suited for pull-and-shear looking to use 3D-printed electronics for a testing of wafer interconnections, lead frames,MIRTEC’s total quality management system specific application – whether for proof of hybrid microcircuits or automotive electronicsoftware, INTELLISYS® also will be on display concept, design validation, testing or final packages.at productronica. This software suite promotes parts – at any stage of a company’s additivecontinuous process improvement by allowing manufacturing journey. Nordson MATRIX - the market leader for automatedmanufacturers to track and eliminate defects on inline X-ray inspection and pioneer for innovativeinspected assemblies. www.nano-di.com inspection technologies will present the latest additions to its product portfolio.www.mirtec.com Nordson Test & Inspection Announces Line Up for The new XS-series is a high-speed inline automatedNano Dimension Showcases productronica X-ray inspection platform designed to achieve aAdditive Manufacturing for smaller footprint (1300 mm width) for small andElectronics at productronica 2017 Hall A2 Booth 445 medium board sizes (350 x 250mm) targeting Nordson DAGE, Nordson MATRIX, and Nordson automotive and semi-backend applications. TheHall: B2 Booth No: 201 YESTECH, divisions of Nordson Corporation XS-series allows high-speed 2D/2.5D/3D X-ray (NASDAQ: NDSN), will exhibit in at productronica inspection of PCB-assemblies, samples in traysNano Dimension Ltd. will be demonstrating its new 2017. as well as hybrid applications. Newly designedDragonfly 2020 Pro 3D Printer for professional sample table and state-of-the-art linear drivenprinted electronics. The trade fair is taking place The Nordson Test & Inspection team will showcase detector motion system allow outstanding 2.5DNovember 14-17 at Messe München in Munich. a suite of award-winning systems including the & 3D imaging speed. Quadra™ 5 and Quadra™ 7 X-ray inspectionContinuously growing demands systems, the new Inline X-ray inspection platform The X#-series is the most flexible AXI platformfor speed, agilityand innovation XS-series complemented by the X#-series and series in the Nordson MATRIX product portfolio.are putting pressure on XCT-1000 as well as the FX-940 ULTRA 3D AOI The system is available with two different handlingengineers and designers. Nano system. On the bondtester side, the company modes (left in – right out / left in – left out) andDimension is responding to will demo the 4800 configured for ball shear is equipped with a verification terminal at itstheir needs with the DragonFly on a 300mm wafer and a 4000Plus bondtester output. The embedded Barcode scanning gantry2020 Pro 3D Printer, which configured for battery testing. (BCR) enables automated scanning of productoffers advanced capabilities bar codes, provides the ability to add productthat can optimize development Nordson DAGE’s flagship system – the new changeover flexibility and increases systemworkflows by delivering Quadra™ 7 represents the cutting edge of X-ray throughput. With the showcased X2.5# high powerenhanced agility during inspection performance. 6.7 MP ultra-high quality setup, Nordson MATRIX presents an innovativeelectronics and hardware images are displayed at full one-to-one resolution and sustainable solution for the inspection ofdevelopment. over two 4K UHD monitors ensuring you see the power hybrid applications (e.g. IGBT) which clearest features today, and for all your products has become a demanding requirement in theThe DragonFly 2020 can completely transform the in the future. automotive industry.way product development teams work becauseof its ability to quickly and easily produce proofs The Quadra™ 5 offers high performance and ease The XCT-1000, representing MATRIX’ XCT-series,of concept, design validations and prototypes of use for 2D and 3D X-ray applications. 0.35μm complements the existing AXI portfolio with CT-in-house. There is no more waiting for weeks for feature recognition up to 10 W of power, makes the technology. This platform is especially suitablea custom professional multilayer PCB prototype Quadra™ 5 the leading choice for printed circuit for the inspection of small to medium productionto be fabricated off-site. The revolutionary printer board and semiconductor package inspection. volumes, sample tests or for the use in laboratorycan 3D-print an entire multilayer board overnight, environment. A new introduction launched atallowing users to test and iterate on-the-fly for The Nordson DAGE 4800 Advanced Automated productronica 2017 is the XCT-1000 HR withincreased innovation. This process can radically Wafer Testing bondtester is at the forefront of a dedicated setup for super-high resolutionreduce development risks and shorten time to wafer testing technology catering for the testing applications for electronics and semiconductormarket. of wafers from 200mm up to 450mm. Advanced applications (µ-solder-joints on PCB or Flex, wire- technology guarantees unsurpassed accuracy bond inspection, wafer-bumps). Implementingproductronica Highlights: and repeatability to provide total confidence in the latest model of the Nordson DAGE tube as product quality. A range of powerful camera and X-ray source and state-of-the-art digital flatpanel• For the first time at a trade show, Nano optical systems optimize load tool alignment, technology accomplish CT-Voxel-resolutions less Dimension’s new Dragonfly 2020 Pro 3D Printer auto programming and post-test analysis make than 1µm. will be on display. Visitors to Hall B2, Booth 201 will also see fully-functional 3D-printed circuits Visit us and find out more about our unique X-ray printed on the DragonFly. inspection system portfolio.• Also on display in the Nano Dimension stand will The Nordson YESTECH FX-940 ULTRA 3D AOI be high-performance inkjet materials for printed with cutting-edge 3D technology is ideal for the electronics, including conductive and dielectric inspection of solder defects, lead defects/lifted materials similar to FR4 in their properties. leads, component presence and co-planarity of chips, BGAs and other height sensitive• Visitors can also learn more about Nano devices. With its Advanced Fusion Lighting and Dimension’s novel Switch software, which comprehensive inspection tools including angled offers virtually limitless design flexibility to a wide cameras, full-color digital image processing and range of research and development prototyping both image and rule-based algorithms, the FX- and custom manufacturing projects. 940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The Nordson YESTECH M1m AOI system offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submicron levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 m2. www.nordson.comPage 12 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Accurate, Intelligent, Fast! Component Counting Made EasyAXC-800 X-Ray Component Counter:Manual component counting can turn into a full-time job wasting valuable resourceswhile still having the possibility of many miscounts. This can result in machinedown-time, inaccurate Inventory management, and ultimately reduced profit margins.Seamless and flexible automation means more up-time on the assembly line andincreased productivity. Component counting using Scienscope’s X-Ray technology cantake only seconds for an entire reel. Increase productivity with the most accurate, fast,and easy to use component counter available.Key Features Include:• Greater than 99% accuracy • Scan inside ESD bags• Fast • Small footprint• Scans (4) 7” reels simultaneously • Easiest interface• Scans 13” or 15” reels • Built in library• Scans JEDEC trays and counts BGA balls• Scans loose wound components or tightly wound components

shows/eventsScienscope Announces X-ray selective soldering process with automatically that offers complete defect coverage with highLineup for productronica controlled removal of solder balls and integrated precision metrology. The 5K3D is a 100 percent optical inspection – to intelligent handling systems 3D AOI based on laser technology with angledHall: A1 Booth No: 402 and automatic separation of defect assemblies cameras. It offers a wide range of z-measurement, by means of a robot. mcServer allows complete up to 25mm, while maintaining high accuracy andScienscope International, a complete inspection monitoring of all integrated processes and speed. With limited shadow effect, this new systemsolutions provider, announced plans to exhibit in at machines, and provides real-time information comes with the best accuracy and repeatabilityproductronica 2017. Company representatives will from systems – including those installed at different of the market.demonstrate the X-Scope 2000 X-ray Inspection production sites worldwide.System, X-SPECTION 6000 X-ray Inspection The awarded PI Series 3D SPI offers newSystem and AXC-800 X-ray component reel Additional functions effectively support the horizons with programming-free software andcounter. operator, such as easy generation of production unprecedented accuracy for small pads. The statistics, continuous traceability of production PI Series offers the only inspection systemsThe X-SPECTION 6000 X-ray Inspection System is parameters for each product serial number, that program automatically. The series hasScienscope’s most technologically advanced automatic monitoring of maintenance cycles been recognized by the industry as the mostcabinet style X-ray inspection system. It features or automatic notification in case of machine innovative SPI product since the introductiona fully integrated 130 kV micro-focus high power failures. Collected process and machine data of Moiré systems. With 360° Moiré technology,closed X-ray tube and 5” x 5” or 4” x 3” high are made available for other applications, the PI Series offers a unique extra-large 3Dresolution and ultra-resolution CMOS digital flat such as customer networks or MES systems. image for unprecedented review interface andpane image detectors. With a 60° camera tilt for Also, integration in Pulse or Hermes software outstanding accuracy.oblique angle viewing and a rotating work table, the architecture is easily possible.X-SPECTION 6000 offers the ultimate in flexibility. www.vitechnology.com High mix, and simultaneously high volumes, areThe X-Scope 2000 X-ray Inspection System is a possible with the new features for wave soldering Material Handling Automation andfull featured high-performance X-ray inspection systems. A new preheat concept from SEHO Semi-Automated Rework from VJsystem with an unbeatable price to performance allows minimum distances between the boards, Electronix at productronicaratio. The system features a fully integrated 90 kV even with very different thermal requirements. Inhigh power closed X-ray tube and 4″ x 3″ high the soldering area, an innovative dual solder pot Hall A3, Booth 102/5resolution CMOS digital flat panel image detector. concept based on electro-magnetic waves allowsAdditionally, the 50° camera tilt enables oblique product changeover within seconds. The company will demonstrate material handlingangle viewing. automation for the XQuik II AutoLoad with A new development from the field of reflow AccuCount Technology, along with the SummitThe table-top AXC-800 is an Automatic X-ray soldering reduces maintenance times and II rework system. Additionally, an XQuik II withInspection Component Counter designed for optimizes energy consumption. Because of its Accucount Technology will be on display inthe inspection of components on traditional innovative details, the SEHO MaxiReflow has the SmartRep GmbH stand. SmartRep wasreels, from 01005 to odd-form devices. It can won several technology awards in the past. As recently appointed as the company’s distributorhandle up to (4) 7” reels in one inspection, or a an alternative to the proven process gas cleaning throughout Germany and Austria.single 13” or 15” reel. Additionally, the AXC-800 system with cyclone technology, this innovativecan count devices on JEDEC trays and inside reflow system now also can be equipped with With newly introduced materialESD storage bags. It can be used with barcode a new pyrolysis unit. What is special about this handling automation, the XQuikreading and label printing in order to manage feature: the pyrolysis unit is completely integrated AutoLoad system automaticallyand track inventory with 100 percent confidence. in the heating chamber which completely excludes counts components at up toData also can be transferred directly to inventory any loss of energy. twice the original speed. Newmanagement systems and various types of factory parallel processing tehniquescontrol software. The SEHO team is looking forward to welcoming allow the system to aquire visitors at productronica in booth A4-578 images and calculate componentwww.scienscope.com count in parallel with bar code www.seho.de. scan, loading and labelingIntelligently Linked: Approaching of reels. The revolutionarythe Smart Factory with Vi TECHNOLOGY prepares for a XQuik II and XQII AutoLoad withCommunicating Machines busy productronica AccuCount Technology are now faster than ever.Hall: A4 Booth No: 578 Hall: A2 Booth No: 421 The Summit II is the latest semi-automatedSEHO Systems GmbH, a worldwide leading Vi TECHNOLOGY, a leading provider of 3D rework system from VJ Electronix. Improvedmanufacturer of complete solutions for soldering inspection solutions for PCB assembly, will exhibit ergonomics combined with next-generationprocesses and automated production lines, will in at productronica 2017. The Vi TECHNOLOGY controls and proven heating technology providesfocus on the complete networking of manufacturing team is preparing for a busy show, with plans even better performance and flexability. Summitlines at productronica. Further highlights at the to bring two 5K3D AOI systems and two PI II features a smaller footprint, yet larger boardSEHO booth in will be presented from the field of 3D SPI systems as well as the new software capacity with easy to adjust board supportwave soldering and reflow technology. module Sigma Line. productronica is the world’s fixtures. Enhanced SierraMate software takes the leading trade fair for electronics development and popular user-friendly operation to the next levelInstead of single machines, SEHO will present a production, and Vi TECHNOLOGY is bringing the with a simple icon driven GUI and unmatchedcomplete production solution that will provide users latest innovations from its leading product line to flexibility through easily customized operationwith ideas for optimizing their own manufacturing offer live demos. sequences.processes. All machines in the production lineare linked with the SEHO mcServer, the machine By coupling these two measurement systems, www.vjelectronix.com.communication server from SEHO. Vi TECHNOLOGY’s Sigma Line module offers a real-time combination of 3D SPI and 3D AOIThe production solution continuously exchanges inspection measurements. By considering alldata – from placement control, to a flexible inspection systems as one tool, the results is a new way to optimize the SMT process and converge to the zero defect line. Also, it is the prerequisite to transform large volumes of data into actionable data. The 5K3D is a new patented 3D AOI combinationPage 14 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Yamaha to Spotlight at The award-winning 4-beam YSM40R with in the line in real-time to resolve any mountingProductronica 2017 New unbeatable 200,000 cph placement speed problems extremely quickly.Innovations to Maximize Line will show how its 1-meter line length deliversProductivity and Total Factory a performance edge for space-constrained Yamaha Factory Automation willEfficiency with Yamaha Total Line enterprises. give a glimpse of how the YamahaSolutions & Yamaha Factory Advanced Robotics AutomationTools 4.0 Visitors looking for maximum speed with flexibility Platform can help electronics will find their target in the updated Sigma G5S2, businesses boost assemblyHall A3 Booth 323 which is improved to reach 90,000 cph high- productivity even further.Yamaha Motor Europe IM Division will showcase speed placement. Ultra-configurable thanks to Yamaha’s robotics portfolioits Total Line Solution, delivering the latest in two-head type placement and the integrated like orbit SCARA and cartesianhigh-accuracy, high-speed, high-quality & flexible Overdrive Control System, the G5S2 introduces robots are already setting thesurface-mount assembly and new Factory innovations such as die-feature recognition for pace of automation in numerousTools 4.0 at a new custom-designed booth for optically-accurate LED placement. industries, and visitors canProductronica 2017 this November. now see how this technology The YSM20 90,000 cph machine from the is ready to deliver affordable,The new booth layout is designed to welcome new high-speed modular YSM family optimizes reprogrammable solutionsand inform, enabling visitors to overview the Total productivity with features like smart component- for electronic manufacturingProduct Portfolio and focus on individual display shape recognition, automatic accuracy assembly.areas to gain deeper insights into equipment and compensation, time-saving 1-head placement,software of special interest. and advanced features for fast changeovers. A dedicated software area will help visitors understand the power Yamaha Factory ToolsAuto Loading Feeder European audiences will also get their first view 4.0 bring to the enterprise. This complete suiteThe biggest improvement in line productivity & of the new YSM10 mounter, part of the game- includes tools for NPI with virtual sticky tapeefficiency is the introduction of the Yamaha Auto changing high-speed modular family. The 1-beam, checks, multiple grouping and efficient setupLoading Feeder (ZS-ALF). This feeder allows the 1-head YSM10 delivers best-in-class 46,000 cenarios, monitoring, traceability and planning,addition of a second reel to supply in the same cph placement speed, benefiting from the High- and enables real-time status visualization at everyfeeder at any time during operation. The ALF speed Multi head, versatile component feeding, level of the factory. In addition, the AOI inspectiondesign removes any need for splicing materials or multi-camera, e-Vision, and smart component database, iProDB, captures inspection resultsoperators with good splicing skills, while reducing recognition of the high-end YSM40R and YSM20. from post-mounting & post-reflow to help optimizetape waste and paper dust particles. The ALF These machines will also be on the booth, processes and improve design for manufacture.also reduces machine down time, increases line alongside the YSM10. There are also apps like Mobile Judgement, whichefficiency, and boosts placement quality. keep supervisors informed wherever they are and Special Focus on Latest Advances minimize the time to fix stoppages.3D MID production platformThe SMT industry is at the beginning of a new era Yamaha’s total line solution is completed with the www.yamaha-motor-im.eucontaining advanced and innovative products built YSi-V high-speed 3D automatic optical inspectionwith 3D printing materials and printed electronics. (AOI) system. With a further boost to inspection Compare Cleaning Machines atFor this type of production Yamaha will introduce speed, introduced in 2017, as well as increased Productronicathe S20- 3D MID (Molded Interconnect Device) resolution for ultra-high accuracy inspectingmachine. Built on a standard S20 mounter components down to 0201 (metric), YSi-V now Hall: A2 Booth No: 359paltform, this new machine is able to dispense sets the highest performance standards in theadhesive or solder and mount components on industry. After SMT Hybrid Packaging in May, ZESTRON3D substrates at any angle. will be exhibiting a selection of state-of-the-art The YSi-V family provides versatile choices cleaning machines from leading internationalThe outperforming prining quality of the YCP10 from entry-level 2D-only to dual-mode 2D/3D manufacturers at Productronica from thescreen printer, featuring the unique 3S head inspection, 5Mpixel or 12Mpixel cameras, and Technical Center in Ingolstadt, Germany. As awith variable-angle squeegee and easy-to-use the high-speed camera of the HS2 type. result, tradeshow visitors who are looking for agraphical stencil alignment, is taking over the new cleaning machine can compare different,printing market. More and more customers are Checking the boards immediately after placement innovative and proven technologies directlyrecgonizing Yamaha printing technology as the from four angles and with multiple wavelengths on site. ZESTRON’s process engineers andbest printing solution ever made. including infrared ensures faultless defect capture representatives from equipment manufacturers with zero errors. Laser height checking also verifies are available for questions regarding the features coplanarity and perfect pin-in-paste insertion. as well as the optimally adapted cleaning agents. In addition, integrated software that converts from mounter data, combined with the intuitive Further trade fair highlights are the pH neutral YSi-V graphical user interface (GUI), ensure new PCB cleaning agent VIGON® N 640, providing product introduction (NPI) achieves the fastest excellent cleaning performance on the latest possible ramp-up. YSi-V can be used for post- fluxes in specific batch systems, as well as the placement, post-reflow, or in both locations - and single-phase stencil cleaning agent HYDRON® the closed-loop data interface with the Yamaha SC 300 designed to effectively remove SMT mounters enables the unique Quality Assistence adhesives without leaving streaks after drying. (QA) software to send data to Yamaha mounters www.zestron.com

TECHNOLOGY TODAY FEATUREan interview with dr. detlef steck,General Manager of YXLON InternationalBY smttoday editor Sounds interesting, please tell me more? Many companies are looking to eventually be fully connected through Industry 4.0. From purchasing to shipping, these companies want all processes to be self-optimizing, self-controlling, and totally connected. However, this is often not possible due to either the age of the hardware or the high costs necessary to gain full connectivity. Additionally, by committing to full connectivity, a company may also end up being tied to a particular brand or software program. This is where SmartLoop and SmartLink come in. As the first step toward full automation, they offer flexible and simple solutions to get processes on track to total connectivity.Yxlon has been the leader in industrial X-ray and CT inspection systems As you know, any sort of testsince 1998. However, its foundations in imaging date all the way back or quality assurance systemto the discovery of the X-ray by Roentgen in 1895. In 2007, Yxlon will likely generate some falsewas acquired by Comet Group and FeinFocus’ open microfocus tube positives or false negatives.technology was integrated into Yxlon. The microfocus technology was That means when detectingan important completion of our portfolio and enabled us to serve the which parts have defects severeelectronics market. enough to warrant not movingWhile Yxlon played an important role in industrial X-ray applications, on in production, X-ray systemslike automotive foundry and welding in tube and vessel construction, may make mistakes and eitherit now provides the single most effective way to non-destructively prevent a well-built part frominspect materials for a variety of industries and applications. For being sold or worse yet, allow aexample, we’ve expanded our reach into aerospace, electronics, tire faulty part to be sold.and wheel inspection, additive manufacturing, and R&D. The birth ofCT technology has allowed us to focus on creating solutions for even Of course, every manufacturer wants to maintainthe most demanding fields, including metrology for manufacturing their production flow and short processing timesand science. even when a part has failed. This is where SmartLink can really help. This software alerts theThe next step for us is to gain ground in the monitor all stages of production in real time. Since system that there is a part that could potentiallyfuture-proofing of our systems. Industry 4.0 is taking these initial steps into Industry 4.0, we have fail and it transfers the data about the defect totaking over and it’s all about connectivity. We started working together with a number of partners the at-line X-ray system. From there, it is easy forwant to not only give our customers information to develop a fully connected and integrated quality operator to quickly inspect only the indicated areaabout their components and various parts, but assurance system that will undoubtedly improve and make an informed decision without affectingalso about their production processes as a whole. production quality and reduce costs. the flow of production. Once a decision has beenOur goal is to deliver holistic data analysis and made, follow up statistical and root cause analysispredictive maintenance to create self-optimizing Q. So, what is SmartLoop? can be done to prevent similar defects in the futureprocesses in every stage of production. That is and further optimize processes.where we are headed. A. SmartLoop is the next stage in the development of Industry 4.0. With SmartLoop we take the data But it’s not an automated solution?Q. X-ray inspection is an integral part of generated by in-line inspection systems and useQuality Management. Considering the the at-line system to verify any area the in-line SmartLoop is not an automated solution, butconvergence toward Industry 4.0 and more system cannot provide a reliable result for. This it is a huge step forward in quality control andsystem integration; do you see off-line or is extremely beneficial for those in the business production process management. The programat-line systems playing a role in this? of using bottom-terminated components to enables the beginning of connectivity for those produce QFNs, BGAs, Flip Chips, etc. In these companies intent on becoming fully automatedA. Absolutely. In fact, Yxlon began pushing off- applications, high quality 2D X-ray is needed to and it provides a great solution for those who wantand at-line systems into Industry 4.0 over a year view the interfaces and determine joint quality. to maintain the human intervention of Industry 3.0.ago, when we partnered with SmartLoop. The These results are sent back to the in-line systems It also brings huge improvements in yield andSmartLoop software connects SPI, 3D AOI, and MIS and can be stored and retrieved with the product consistency, and greatly reduces reworkat-line X-ray to a central Management Information in-line data. and scrap costs. It’s really the ultimate jumping offSystem (MIS), effectively allowing the technician to point for the creation of Smart Factories. Q. So, is that the end of the story? A. We understand that technology is fast paced and that the fully integrated Smart Factory is on the horizon. That’s why we have a team of Industry 4.0 experts working closely with our developersPage 16 Electronics Beyond Content | NOVEMBER 2017 ISSUE

DISCOVER THE NEXT GENERATIONOF ELECTRONICS INSPECTION. The next step for us is to gain ground in the future-proofing of our systems. Industry 4.0 is taking over and it’s all about connectivity. We want to not only give our customers information about their components and various parts, but also about their production processes as a whole.November 14 -17, 2017Munich/Germany, Booth #A2/405

feature continued... the food packing industry a resource-saving technique to sterilize beverage packaging or cure various materials such as ink. We are incredibly excited to not only provide the best in non-destructive testing to more customers than ever before, but also to work together with clients using all of Comet’s core technologies to come ever closer to Industry 4.0. Q. Several other X-ray system companies have tried to cover a broad spectrum of markets and had difficulties. How has Yxlon been so successful with this strategy? A. For all our long history, we have been fully dedicated to X-ray, this is all we do. Working closely with our customers, trying to understand their future needs and matching these with our technological capabilities, we’ve created a space in markets. We do not focus so much on industries that are generic in nature, nor industries that require highly customized solutions. A prime example is our work with computed tomography (CT). We have managed to develop flexible and functional CT and digital X-ray systems like the new YXLON FF35 CT Metrology that seamlessly integrate into automotive, aerospace, electronics, foundry, new materials, and R&D applications. Our all-around and multifaceted approach has brought much success over the course of Yxlon’s development. www.yxlon.comin Hamburg to reach higher levels of integration, calls for integration across the entire productionbringing us closer to full Industry 4.0. We are also floor, not just through the production line itself.involved with several external industry partners Several equipment vendors from the industryin both hardware and software integration fields have come together to provide the customerand those efforts are progressing very well and with intelligent, yet simple solutions; a strategyvery quickly. Yxlon is very familiar and comfortable with. We see this collaboration as an important step in ourQ. Are you involved in the Hermes Standard? continued growth.A. Yes, Yxlon is the first at-line system partner in As the Smart Factory concept spreads beyondthe Hermes Project, a project contributing to the in-line solutions, we will be ready with effectiveSmart Factory concept. The Hermes Standard solutions in quality control and root cause analysis.is for vendor non-specific machine to machine Thanks to the Hermes Standard and othercommunication in SMT assembly. It uses TCP/IP initiatives in which Yxlon are involved, we areto enable all machines on an SMT production line, rapidly approaching the objectives of the Smartlike printers, conveyors, placement machines, AOI Factory, while continuing to devote our companysystems, and reflow ovens to talk to each other. to the sustainable and reliable customer-oriented solutions our partners have come to know.It also employs expandable XMLdata structures to transmit Q. So in addition to being busy with Industryinformation like board IDs, 4.0, I heard the Comet Group recently openedconveyor speeds and circuit a new test facility in the US called Lab One.carrier dimensions to themanagement information system. A. Indeed. Our group has brought all of itsThe Hermes standard is available major technologies represented by COMET PCT,to all SMT equipment vendors at ebeam and YXLON, together under one roof tono cost. And since the protocol create a space where customers together withwas designed to be expandable, our experts can collaborate closely utilizing ourusers will, over the medium systems to create future solutions with X-ray, CT,term, be able to pass additional and Metrology. LabOne opened in San Jose oninformation down the line. October 4th and has already started to draw visitors with not only Yxlon’s latest systems butAt Yxlon, we see ourselves as a key player in the also radio frequency (RF) and ebeam technologies.next stages of Hermes. The true Smart Factory RF is used in semiconductor manufacturing for a myriad of commercial and industrial goods, from phone touchscreens and small memory chips to large server farms. ebeam has a wide range of possible application. For example, it providesPage 18 Electronics Beyond Content | NOVEMBER 2017 ISSUE

MEETINGS & COURSES FEBRUARY 24 – MARCH 1 CONFERENCE & EXHIBITION FEBRUARY 27 – MARCH 1SUCCEEDAT THE OF TECHNOLOGY IPCAPEXEXPO.ORG #IPCAPEXEXPO A FAST-MOVING INDUSTRY TAKES FAR-REACHING IDEAS Technology you need to succeed. Education that keeps you up to speed. All at IPC APEX EXPO 2018. Plan now to take you and your company in the right direction: join us back in San Diego in 2018!A VERY SPECIAL THANK YOU TO OUR IPC APEX EXPO 2017— SAN DIEGOVOLUNTEERS, SUPPORTERS, SPONSORS, EXHIBITORS, INSTRUCTORS,SPEAKERS, COMMITTEE LEADERS AND COMMITTEE MEMBERS CONVENTION CENTER CALIFORNIA > USA

TECHNOLOGY TODAY FEATUREFlexible assembly production thanks to fullyautomatic cleaning process control of multiplemachines at JUMO GmbH & Co. KGBY SASCHA HACK, PRODUCTION OPERATOR, JUMO GMBH & CO. KGAutomation, traceability and Industry 4.0 have been buzzwords in the fields of measurement, control and automationelectronics manufacturing industry for some time. Now, JUMO GmbH technology, and as a global market leader in the& Co. KG, Fulda has become the first company in the world to operate temperature sensor sector, maximum qualitythe first fully automatic concentration measurement and dosage system and precision are central to their concerns.for assembly cleaning – one that can link several cleaning machines Headquartered in Fulda, the company hastogether, control them simultaneously, and be integrated into the over 2,000 staff worldwide and operates 12company’s network. production sites.In order to achieve consistent cleaner again. Until a few years ago, measurement was Fig.1: JUMO GmbH & Co. KG in Fulda.concentration, and thus guarantee consistently carried out exclusively by manual methods,good cleaning results, concentration monitoring using chemical quick tests (e.g. acid-basehas been, and remains, a vital step in assembly titration or phase separation processes).cleaning work. Cleaner concentration in a At JUMO, issues of process security and thecleaning plant fluctuates as a result of carry-over long-term reliability of the assemblies producedand evaporation of cleaner and demineralised have top priority. As an international, high-water, and therefore must be regularly monitored tech provider of innovative products in theand brought within the desired application rangeCOMPARECLEANING MACHINES BEFORE YOU BUY Independent Evaluation. Informed Decision.Start now: www.compare-machines.comsmt-today-oPktaogbeer22.i0ndd 2 Electronics Beyond Content | NOVEMBER 2017 ISSUE 16.10.2017 17:13:42

The cleaning process at JUMO – a While the concentration measurement using • Flexible adjustment of cleaning processkey element of production for many the chemical quick test certainly enabled the capacityyears operator to measure the cleaner concentrationIn order to fulfil customers’ stringent surface quickly on-site, nevertheless, owing to the manual • Shortening the cleaning cyclequality requirements, and to ensure the method used, it was still only a random process. Developing a flexibly expandable,necessary climatic reliability, for many years However, for processes used to clean high-end fully automatic cleaning processthe assemblies for pressure measurement electronic assemblies, complete measurement control systemtechnology have been cleaned in a Miele and documentation of process parameters, To achieve the desired goals, contact wascleaning machine. This equipment is provided particularly with regard to traceability and ISO established with the machine manufacturerby MATTHES Maschinen-Industrietechnik, and certification, are indispensable. It is not only MATTHES Maschinen-Industrietechnik, andis operated using an aqueous VIGON® cleaner ‘online’ measurement of these parameters that the chemicals and process supplier ZESTRON.in a tried and tested, 95-minute process. In the is important, however, but also automatic, direct The world’s first fully automatic measurementpast, when this cleaning stage was omitted, harmonisation of any deviant values with the and dosage system that can control thepartial corrosion of the assemblies occurred, prescribed process target values by additional concentration of several cleaning machinesor dendrites were formed. Moreover, cleaning dosage of demineralised water or cleaner simultaneously was then developed on theincreased the surface tension, so that the concentrate. To achieve this, JUMO opted for basis of JUMO’s requirements.protective coating applied in the next process the online real-time concentration measurement The module is equipped with a 100-litre tankstage adhered better to the assembly. The system, the ZESTRON® EYE. with heating system, so the dosage systemconcentration of the cleaner in the machine In addition, the goal was to shorten the cleaning is designed for connection to two cleaningwas first monitored using the ‘Bath Analyzer cycle from 95 minutes to 75 by reaching the machines.test kit’, a manually applied, chemical quick cleaning temperature more quickly. As well as the tank, the module includes atest based on the phase separation process. A further requirement was to design the cleaning control cabinet with PLC (programmable logicSubsequently, in order to check the surface process so as to be as flexible as possible, thus controller), dosage and circulation pumps, filter,cleanliness, randomly sampled assemblies were making it possible to quickly adjust or increase indicator light, space for a cleaner canister andsubjected to a contamination measurement, cleaning capacity. a suction lance for additional dosage, plus aand an ink test was carried out to check the Summary of process goals: connection to the demineralised water supply.surface tension. • Increasing process reliability and traceability The concentration measurement system, builtRequirements for the full • Automatic concentration measurement and into the module and connected to the PLC, takesautomation and flexibility of the over the task of concentration measurement. Tocleaning process additional dosage without intervention by ensure complete process control, the moduleTwo key reasons for JUMO’s decision to optimise operator also includes temperature, filling level andits cleaning process, which already functioned pressure sensors in addition to the sensor forsmoothly, were process reliability and traceability. Principal Engineer Stefan Strixnersmt-today-oktober2.indd 3 16.10.2017 17:13:44

feature continued... Summary: Thanks to the close collaboration of the three companies involved in this project, the world’s first fully automatic measurement and dosage system for multiple cleaning machines in the electronics production sector could be realised by integrating the JUMO sensor technology with the MATTHES dosage unit and the ZESTRON concentration measurement unit. Fig. 2: Diagram of the new cleaning process “To ensure complete process control, the module alsoconcentration measurement. Before the changeover, the concentration usually includes temperature, fillingThe decision to choose this new cleaning fell by two to three per cent over the course level and pressure sensorsprocess was based on a number of factors: of the day as the result of carry-over, so that in addition to the sensor for• On the one hand, the tried and tested additional dosage had to be supplied during the concentration measurement.” late shift. The module now performs this task combination of the cleaning machine and fully automatically, so the defined concentration Since it went into service, process reliability cleaner used could be retained. is always present in the cleaning bath, and it is has been significantly increased thanks• On the other hand, the module could be no longer necessary for work to be passed on to the fully automatic control of cleaning tailored to JUMO’s specific wishes in such from the early shift to the late shift. This also by the dosage module, and a further step a way that all requirements for the future means that the occupational safety of the users towards Industry 4.0 has been achieved. The cleaning process could be fulfilled. has been improved, since there is less need for constant cleaner concentration achieved by• JUMO’s measurement technology was contact with the cleaning agent than before. the automatic additional dosage, and the integrated into the assembly, so that all The goal of reducing the cleaning time from a flexibility of cleaning capacity are additional sensors were produced in-house, except total of 95 minutes to 75 has also been achieved, bonuses. The concentration measurement unit for the concentration measurement device. thanks to the new heating system. By means of guarantees precise results, and ensures that the• In addition, the filter assembly was due for this, one extra washing cycle can be carried out traceability requirements are implemented by renewal. The new, two-stage demineralised per day, and the cleaning capacity is flexible. continuously recording cleaner concentration water preparation system was already In order to further increase capacity, there and temperature. connected to the module, so this requirement are plans to acquire a second Miele cleaning www.jumo.net was also met. machine, which will also be connected with the www.zestron.comSignificant simplification of process dosage module. www.matthes-maschinen.de/For over a year now, the optimised cleaningprocess using the world’s first module forstocking, preparation and concentrationcontrol of several cleaning machines has beenoperating to perfect satisfaction. It has beenpossible to significantly simplify and shortenthe entire process.The continuous recording of concentration andtemperature by the concentration measurementsystem fulfils the traceability requirements. Themeasurement frequency is selectable (from onemeasurement per second upwards), and in thisway it has been possible to achieve the goal ofmeasuring at least once per washing cycle. Dueto a link with the company network, this datacan be saved and used e.g. for ISO audits oras verification for customers. Furthermore, thecleaning results are regularly checked with thecontaminometer, and with a resin and flux test.Thanks to the automation, the time burden on the Fig. 3: The cleaning process at JUMOprocess staff has also been reduced. Before theconversion, the twice-daily manual recording anddocumenting of concentration took 15 minuteseach time. In addition to this, there was the timespent on manual additional dosage.Page 22 Electronics Beyond Content | NOVEMBER 2017 ISSUE

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TECHNOLOGY TODAY FEATUREEtek Europe shares best practicealongside Prime Minister Theresa May inThe Parliamentary ReviewBy SMT TODAY EDITOREtek Europe appears alongside Prime Minister Theresa May in the time, gain unlimited access to Etek Europe’s2016/17 Parliamentary Review. team of factory-trained engineers and product specialists. These services include:Established by former minister The Rt Hon Aerospace Campus – an established centre Cleaning – Electronic cleaning systemsDavid Curry in 2010, The Parliamentary Review’s of excellence for maintenance, repair and including contamination testing and waterSeptember release is now a key fixture in overhaul (MRO), aero structures and designthe political calendar. Etek Europe features engineering – it is well placed to become the Mike Nelson, Managing Directoralongside the Prime Minister and a small number main organisation in its field.of outstanding organisations in a document Etek Europe – which has just celebratedthat looks back on the year in industry and its 10th birthday – has grown to become aWestminster. The main aim of the Review is to quality provider of production equipment,showcase best practice as a learning tool to consumables, training and services to a diversethe public and private sector. Across all policy range of industries. This includes the aerospace,areas, The Parliamentary Review is sent to automotive, defence, medical and electronicover half a million leading policymakers. The manufacturing industries across Europe, thearticles in the Review act as both a blueprint Middle East and Africa.for success and a template for reform. The With a workforce exceeding 40 skilled employeesPrime Minister commented that ‘this year’s based across the UK, Ireland and EasternParliamentary Review follows a significant Europe, Etek Europe has continued to build uponyear in British politics’ and this is reflected in its proven successes. It is continually developingthe articles from leading journalists and best- strong relationships with its customers andpractice representatives alike. the world’s leading equipment suppliers. ThisEtek Europe features alongside the Prime ensures that it continues to deliver premiumMinister and a small number of outstanding solutions at highly-competitive prices and isorganisations in a document that looks back able to identify future business opportunities.on the year in industry and Westminster. The With over 1,800 customers and an installationmain aim of the Review is to showcase best base of 5,000 systems, Etek Europe has onepractice as a learning tool to the public and of the largest installation and service teamsprivate sector. in Europe. Over time, Etek Europe’s team ofRead on to hear the Etek Europe story: engineers has developed unrivalled productEtek Europe is a leading provider of production knowledge and experience in all aspectsequipment, consumables and services to the of planning, supply, installation, testing,European electronics industry. It was born in commissioning, maintenance and training.2007 and grew from the vision of Mike Nelson, Etek Europe has also invested heavily inwhose career in the manufacturing industry developing a Technology Demonstration Centrehas spanned more than 30 years. Its growth at their European Headquarters in Scotland.was supported by financial incentives from This creates an environment where clientsthe local government and Scottish Enterprise. can test and evaluate some of the industry’sWith its Headquarters in South Ayrshire, most advanced equipment while, at the sameScotland, nestled amongst the PrestwickPage 24 Electronics Beyond Content | NOVEMBER 2017 ISSUE

IR-E6 XL IR-E3Ultimate Performance, BGA Rework Ultimate Performance, BGA ReworkSystem for Very Large PCBs System for Small-Medium PCBs IR REWORK SYSTEMSIR-D3 IR-C3Professional BGA Rework System Entry-Level Upgradeable SMT/BGA Rework Station FOR THE ULTIMATEPERFORMANCE IN BGA REWORKPDR Americas www.etek-europe.com For the Ultimate3869 Dividend Drive, Performance inShingle Springs, BGA ReworkCA 95682, USAT: (530) 676 6262 F: (530) 676 6265 www.pdr-rework.comE: [email protected]

feature continued... The kids, aged between 9–12 years, were shown around the centre and were able to see different machines working and were taught their uses. The children learned that these machines created the circuit boards that will eventually make their way into their smart phones and tablets. By causing a buzz around the technology, it is hoped that, in the future, these children will not think negatively of the industry but instead will grow to believe it is an exciting business of which to be a part. Indeed, following technological patterns shows that children entering primary school now will be taking on jobs that don’t yet exist. “We are preparing for the future, and showing the world we know the importance of having product specialists” High speed placement machine, JUKI KE-3020 VAL In addition to this, a local Ayrshire company, JB Management, has partnered with Etek Europe totreatments. Etek’s dedicated team of service security, and technological innovation. The get young people working in the industry. Theirand application engineers helps customers world is at the beginning of the fourth industrial Modern Apprenticeship programme is open to allmatch their cleaning processes with equipment revolution – dubbed Industry 4.0 – which is ages and is relevant to individuals looking to startand chemistry to ensure the best results are characterised by the increasing digitisation and their career, and to those seeking work at seniorachieved. interconnection of products. With this revolution management level. Etek Europe benefits from aFume extraction – Offering fume extraction comes the need for a more skilled workforce, skilled and productive workforce and has actuallyequipment and know-how, including Local and millions of jobs. There is a huge demand continued to employ some of the apprenticesExhaust Ventilation (LEV) testing, spare parts to fill these positions already, but not enough after their contract was due to end. Etek Europeand filters. Etek’s regional service and support trained people to take them on. has found that investing in individuals creates ateam provides comprehensive servicing and workforce that is enthusiastic and loyal and it is aLEV testing on all fume extraction equipment. “Etek Europe’s team of experts scheme of which they will continue to make use.Imaging – Etek’s Imaging Division offers a range offers unrivalled customerof innovative and cost-effective equipment for support for all equipment and Next stepsAutomated Optical Inspection (AOI), Solder inspection requirements”Paste Inspection (SPI) and inline or standalone By investing in their Technology DemonstrationX-ray inspection from world leading X-ray The workforce is aging and, along with this, there Centre, Etek Europe is preparing for the futuremanufacturers. Etek Europe’s team of experts unfortunately seems to be a stigma attached and showing the world they know the importanceoffers unrivalled customer support for all to the word manufacturing that is causing of having product specialists. Etek Europe isequipment and inspection requirements. youngsters to avoid pursuing a career in the continually training and investing in these productManufacturing – An extensive manufacturing industry. To them, it’s a world that sounds as specialists – along with all members of staff. Thedivision offers a range of world-leading, high- though it doesn’t have a future. technological revolution is happening now and,performance and cost-effective equipment It’s this stigma that Etek Europe wants to while there is a need for the younger generationused in the aerospace, defence, medical and eradicate – and they’re in a fortunate position to learn new skills, Etek Europe knows that itelectronics manufacturing industries. This where they can train not just engineers, but the can’t be left behind by waiting. By investing inis backed by Etek’s team of factory-trained next group of great salespeople. their current members of staff, and partnering withengineers that provides unmatched 24/7 service The encouragement starts from a young age apprenticeship schemes, they’re hoping to fill theand support. – as part of science, technology, engineering, skills gap that is inevitably on its way.Production equipment – One source to provide and mathematics (STEM) week, children fromall daily consumable requirements from an local schools visited the Etek Technology Manufacturing – and Industry 4.0 – is where theestablished company customers can trust. As Demonstration Centre to take part in workshops. future lies. Etek Europe is ready for it – they justwell as offering value for money, Etek Europe hope the next generation is too.is also committed to bringing customers thebest in customer service. www.etek-europe.comServicing and support – With a large teamof service and applications engineers basedthroughout the UK, Ireland and Eastern Europe,Etek Europe has a team of equipment andprocess specialists capable of providing 24/7rapid-response, frontline support and trainingto complement your own technical personnel.Looking to the futureWith the manufacturing industry booming, EtekEurope wants to encourage a new generationto get involved.This industry remains vital to sustaining Adapting to Industry 4.0 will require a highly skilled workforceeconomic growth and prosperity, nationalPage 26 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Together in Process PerfectionTogether we are meeting increasing demandsof automotive and smart device manufacturersWith the exponential growth of electronics in cars, smart phones and homes, manufacturers are demandingimprovements in throughput, yield and performance. Miniturization and other technical challenges requirecontinuous advancement in manufacturing equipment. ITW EAE brings together the world-leading brandsof electronics assembly equipment. Brands with reputations for advancing process perfection. The combinedknowledge and experience of the ITW EAE group is driving further innovation and speeding the developmentof next generation technology. See our latest developments at Productronica - Booth A4.554, Nov. 14-17Learn more at www.itweae.com A division of Illinois Tools Works

TECHNOLOGY TODAY FEATUREWhat Is the Reflow Oven ReallySupposed to Do?By Freddie Chan, VP, KICIn my job, I spend a significant amount of time visiting customers to gain on the same fixture at the same oven settingsinsight into the challenges they face, what they are trying to achieve, result in a similar profile, then the oven has notwhat makes them successful and more. changed and, therefore, the reflow oven will continue to provide the same quality on all pcbI need this insight to help them improve, and assemblies with the same conditions.to provide input to our R&D team for future “it is ironic that while a reflowproduct development. One interesting insight I oven can provide thousands ofhave gained can be illustrated by the following datapoints a minute on a vastexchange: array of variables such as zone temperatures, conveyor speed, O2 level, static pressure, etc.” Verifying the pcb profile on a fixture rather than the pcb assembly leads to a discussion on machine monitoring vs. process monitoring. I do not think that these two concepts are at war with each other, nor are they mutually exclusive. Machine monitoring is important for a range of reasons such as information for the preventive maintenance technicians, and for troubleshooting purposes. If the fundamental question from the client is “Were my assemblies processed in spec?” only process monitoring will reveal that. It also is commonly accepted that the PCB profile can change without machine changes, or at least without timely changes in the machine. Two examples illustrate this: The tendency for exhaust and thermal load changes to impact the PCB profile without any (or any timely) response from the reflow oven. “if the reflow oven produces good quality at a certain condition, then it is a simple routine to measure the pcb profile on a fixture at that time”So, the reflow oven is supposed to create strong the one variable the reflow oven cannot provide The other dimension to this debate is thesolder joints within certain limitations. Those is arguably the single most important: What is frequency of profile runs. Whether running alimitations are measured by what is called a the PCB profile, and how does it compare to pcb profile once a month or once a shift, thethermal profile which is compared to the process the established process window? thermal process is being run blind. The clientspecifications set by the component, solder It is fair to say that the industry has accepted that wants to know whether his assemblies werepaste and substrate providers. It needs to create that the pcb profile must be measured. Where processed in spec may be satisfied to knowan in-spec PCB profile. In other words, the reflow opinions and execution differ is what profile to that the minute before production began, theoven is a “profile making machine.” The reflow measure and how often. Some factories will reflow oven produced an in-spec profile. Moreoven has other obvious responsibilities, such measure the PCB profile once a month per reflow clients want traceability and evidence that theas providing adequate throughput, managing oven, others once a shift. Some factories will profile for each pcb assembly was correct. Thatflux to avoid performance-changing build up not measure the PCB profile but profile a fixture. condition requires a continuous and automaticetc. However, the PCB profile is key. Therefore, The logic is that if the reflow oven produces thermal profiling system.it is ironic that while a reflow oven can provide good quality at a certain condition, then it is a It makes sense that if the fundamentalthousands of datapoints a minute on a vast simple routine to measure the pcb profile on a responsibility of a reflow oven is to profile anarray of variables such as zone temperatures, fixture at that time, and if periodic profile runs assembly within the process specifications, thenconveyor speed, O2 level, static pressure, etc., that profile must be measured and monitored. The SPI monitors the output from the printer in terms of X, Y and theta accuracy, the component placement machines will monitor its output, or an AOI machine will do so, why not the black box reflow oven? www.kicthermal.comPage 28 Electronics Beyond Content | NOVEMBER 2017 ISSUE

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TECHNOLOGY TODAY FEATUREMeasuring Die Tilt Using Shadow Moiré OpticalMeasurements; New Techniques for Discontinuousand Semi-Reflective Surfaces – Phase 2By Neil Hubble, PRESIDENT & CEO, akrometrixAbstract study covering the effectiveness, strengths,When dealing with production of Flip Chip Packages in semiconductor and weaknesses of using shadow moiré forpackaging the angle between the die and package substrate is critical die tilt measurement. However, the necessityfor maintaining product yield and reliability. Current outgoing quality for managing die tilt is mentioned in numerouschecks for die tilt can be time consuming to measure heights via point other publications, not limited to applicationsto point measurement techniques. Existing die tilt measurement such as substrate-on-chip packaging, solderapproaches can also have reproducibility issues from user to user. attachment of large power dice, QFN packaging, etc. [5] – [7].Shadow moiré technology is a full field optical die surfaces or dark substrate areas. Even with The limitations for using shadow moiré toinspection technique commonly used for these improvements a key point for the shadow measure discontinuous surfaces are discussedflatness characterization in the semiconductor moiré approach for die tilt measurement, is that in Reference [1], as well as in older publications.industry, particularly at elevated temperatures. it does not work for all surfaces. In the phase A shortened explanation of this step heightTwo limitations to shadow moiré apply when 1 study, 3 of 4 observed samples types were limitation is given as follows.discussing outgoing QC of die tilt: 1) shadow measureable and 1 of 4 was not, based on Early shadow moiré, prior to any phase steppingmoiré requires a diffuse reflective surface for the specularity of the measured die surface. technology, was based on counting transitionsmeasurement; 2) shadow moiré is unable to Samples that are too specular appear like a of dark and light fringes (Fig 1). The geometrymeasure sudden step heights. mirror without any shading. Many surfaces with of shadow moiré allows calculation of a specificThis paper focuses on case study data for high levels of specularity can still be measured height associated with each fringe, known assamples with two or more separated planes. Die if some of the light reflects in a diffuse manner. “Fringe Value”. Inherent to this approach is thetilt measurement techniques from phase 1 of this In all cases, the sample type should be validated limitation that transitions between each fringestudy are applied to the case study data. Using as viable for the shadow moiré technique, before must be counted along a path. Therefore,shadow moiré for this measurement technology pursuing this approach for die tilt measurement. very steep slopes or sudden changes in heightcan reduce measurement and user time as well In laboratory use, surfaces measured by shadow loose the count or order of the fringe. As aas improve consistency of measurements from moiré are often coated with a white paint or general rule changes greater than one fifth ofuser to user. As shadow moiré tools are often talc powder before measurement, but die the measurement Fringe Value between twoused for at temperature flatness measurements, tilt measurement is meant to be an outgoing adjacent pixels can start to introduce issues.this added application can reduce the number of QC procedure, and not conducive to sample This translates to a maximum measurable slopedifferent measurement tools needed in QA labs. preparation.I. Introduction Phase 2 of this study goes on to propose a Fig 1. Shadow moiré intensity imageThis paper is a phase 2 study building on the method for measuring the standoff height of an of the surface of approximately 0.2, which isfinding of an earlier study. Phase 1 of the related elevated platform, or exposed die, based upon equivalent to an angle of 11.3°.study on die tilt measurements, using phase an initial height estimation made by the user. III. Shadow Moiré Workflow tostepping and the shadow moiré technique, Specific accuracy requirements are discussed Measure Die Tilt Anglecovers approaches and techniques to use for the initial height prediction. Some strategies While Phase 1 of the die tilt study was mostlyshadow moiré for the measurement of the tilt have been proposed, historically, for using the done by hand and implementation was moreof a die surface, or of other elevated surfaces shadow moiré method to measure step heights. theoretically, software development has sinceseparated as two independent planes. [1] [3] However, this type of approach requires extra been underway, and die tilt angle now existsShadow moiré is an optical full field warpage/ measurement time and more involved moving as a gauge in Akrometrix’s Surface Analysisflatness measurement technique that uses parts. Whereas, much of the goal for a shadow processing software. This development isdirectional light, a camera, a vertical motion moiré based die tilt solution is to maximize mentioned briefly here only to support thesystem, and a piece of glass with periodic die QC throughput, maintain high system workflow and scalability of the case study toopaque lines in the glass. [2] Traditionally, robustness, and keep cost of goods down. calculate die tilt angle in a batch fashion andshadow moiré measurements have been used Additionally, a case study is performed on with minimal user interaction.to define warpage or flatness of a continuous an exposed die flip chip. Other techniquessurface having no ability to measure surfaces for measuring the tilt of a die relative to awhere height changes occur suddenly, by surrounding substrate are available in theeither exceeding a maximum slope of 0.2 or a industry. Reference [4] covers one such method,maximum step height between two adjacent using an optical non contact scanning probepoints no greater than approximately 100 system. The specifics of the sample used inmicrons, depending on grating pitch. the case study are not provided for proprietyThe initial phase 1 study went on to detail the reasons. The flip chip sample is between 25-approach of die tilt calculation based on shadow 30mm in size and close to square.moiré images, having a common reference II. Uses of Die Tilt and Shadow Moiréplane, the grating, between the two separated on Discontinuous Surfacessurfaces. Additionally, new approaches to data Similar to Phase 1 this paper does not focusacquisition using 12 bit phase data and floating on reasons to measure the tilt or angle of apoint phase calculations were proposed to die or offset surfaces. The focus of the paperfurther enable measurement of semi-reflective is one of new methodology along with a casePage 30 Electronics Beyond Content | NOVEMBER 2017 ISSUE

REL61 SOLDERING PERFORMANCE COMPARISONM8 REL61 LOW/NO-SILVER ALLOY

feature continued...Workflow to measure die tilt angle includes: As discussed earlier, extensive details on the fringe pattern. The phase calculation can be 1) Confirm if the optics of the die surface flip chip sample are not provided for propriety simplified to: reasons. The chips come in a 4x11 layout allows shadow moiré measurement, JEDEC tray. The samples themselves are already 2) where I values are grayscale intensity done by taking a physical shadow moiré production quality devices that likely received values. measurement and confirming phase outgoing quality checks, thus consistent and amplitude threshold max/min. well behaved data is expected. The focus of To this point, none of these calculations are 2) Identify multiple sample locations in the the case study is more to validate the concept limited by step heights. Thus, even across shadow moiré field of view. This step and throughput of the solution. Gauge results sudden steps heights, the phase term, , is only needs to be done once per sample from the 60 samples are collected considering still valid. It is this concept that is critical to type and layout. An example is given of the following variables: the forthcoming approach to discontinuous a JEDEC tray of samples in Fig 2. 1) Height of the die from the substrate using step heights, given an initial height estimate. 3) Identify the Die and Reference surfaces in The final equation converting phase data to Z the software GUI. An example is shown a newly proposed technique to predict this height information is where step heights pose a in Fig 3. These locations are reused for height given an initial estimate problem. The equation for height is as follows: each surface, so again this step is done 2) Die tilt angle with and without compensation only once per sample type. for die warpage 3) where N represents “Fringe Order”, an 4) Repeat the process of identifying reference 3) Throughput time per batch/JEDEC tray integer. surfaces and die surfaces if multiple die V. Using Shadow Moiré to Measure locations exist per sample. Die tilt angle Discontinuous Step Heights, Given Because phase occurs in a periodic manner, can be shown from die to die or substrate an Initial Height Estimate in order to translate phase data to Z height a to multiple dice. As discussed in section II, shadow moiré is counter integer must be tracked whenever a 5) Measure multiple groups or lots of traditionally not used to measure surfaces new phase begins. Fig 5 and Fig 6 visualize samples as desired. Measurement time with sudden changes in height. To understand this concept. is 2 seconds per group/lot, regardless of this limitation and ways to circumvent this sample quantity, plus unload and load time. limitation a closer look at the shadow moiré 6) Use files created in steps 2) to 4) to batch phase stepping algorithm is required. The first process all results together. step for shadow moiré measurements is to determine the height associated with a single fringe period, called Fringe Value. Considering again Fig 1, a counter moves across 6 total fringe periods. The theoretical calculation for Fringe Value is:Fig 2. Identifying sample locations 1) where W = Fringe Value (phase image) P = pitch of the grating lines α = angle of illumination β = angle of observation Fig 5. Phase image with Fringe Orders Fig 3. Software interface example, for Fig 4. Basic shadow moiré setup Fig 6. Phase values from red line in Fig 5 two planes with and without Fringe Order included In practice, the Fringe Value is calibrated byDie tilt angle can be calculated from the data comparison with a known step height calibration In order to determine a correct Fringe Order,sets within the batch processing interface. block, to establish a more accurate Fringe Value. N, a steady change in height is required. TheIV. Flip Chip Case Study Test Plan With a known height per fringe the “phase” height between the center and corner of Fig 560 samples are measured in two single shadow of each single pixel can be determined by cannot be determined without the informationmoiré measurements. The samples are extracting the grayscale intensity value from in between the two areas, showing the quantitymeasured inside of JEDEC trays, as received. each image, called intensity images, taken of fringe transitions. Thus the only problem is during the phase stepping process. A four to determine a correct value for N, which must step phase stepping is used in this case. be an integer. The sample and grating are moved apart the Given this information a new strategy is distance of the Fringe Value / 4 between each proposed to use an approximate height value image, representing a 90° shift in the periodicPage 32 Electronics Beyond Content | NOVEMBER 2017 ISSUE

feature continued...input from the user and then use the available Fig 9. Incorrect shadow moiré processing of phase imagephase portion of the shadow moiré equation From this study the estimated step height for theto determine a more accurate Z height. The die was 470 microns. Without the step heightsame sample used in the upcoming case study prediction the shadow moiré unwrapping acrossof die tilt is used to validate this approach. To the sudden height change is likely to producelook more closely at the numbers involved an incorrect result. However, the error in thiswith the prediction of height and measurement result is always a discrete error being the Fringeaccuracy, the initial height prediction must be Value multiplied by an integer. As an example,within the Fringe Value / 2, and the accuracy the flip chip sample is analyzed as measured byfor the shadow moiré measurement is Fringe standard shadow moiré algorithms, shown in FigValue / 100. For this case a 100 line per inch 9. In this case the die surface is interpreted as(LPI) grating is used so actual values translate 2 full fringe values, 508 microns (2*254 microns/to a required prediction accuracy of 127 microns fringe) lower than the actual correct data setand a final Z height accuracy of 2.5 microns. and is incorrect.Using Digital Fringe Projection (DFP) the step Visualized in a different way Fig 10 shows theheight of the sample studied is first determined actual die height, the shadow moiré interpretedto be used as our prediction. The DFP technique die height and other possible values created byis capable of measuring surface step heights, changing fringe orders, N.but has worse accuracy, smaller field of view VI. Flip Chip Die Height Case Study(allowing lower throughput), and is more Resultssensitive to less optimal (unpainted) surfaces.Here the technique is accurate to 5 microns andeasily effective in determining an initial heightestimate. A 3D surface rendering of one suchsample measure with DFP is shown in Fig 7. InFig 8, an average step height between substrateand die areas is calculated. Fig 7. Flip chip with exposed die measured with DFP The results from the case study concerning predictive die height are shown in Table 1. Note that die tilt angle calculations are in no way dependent on a prediction or measurement of the absolute die height, thus the value of thisFig 8. Determine flip chip step height Fig 10. Coordinate plot of possible step heightsPage 34 Electronics Beyond Content | NOVEMBER 2017 ISSUE

feature continued... Samples measured 60 samples has been applied, leaving only case study in question had 44 samples per Die height prediction 470 microns relative tilt between the die and tray, thus a throughput of 7920 samples/hour.Minimum Die height found 439.1 microns substrate. Throughput time could be further improved byMaximum Die height found 481.8 microns The concept of comparison automated handling. The throughput of 7920 between the two methods is samples/hour does not include any sorting of covered in more detail in phase good and bad samples, which could also be 1 of the study. [1] done downstream.Average Die height found 460.3 microns Results for the case study IX. Conclusions showing die tilt angle are shown in Table 2. Shadow moiré technology has extendedSt. Dev. Die height found 12.0 microns usability and measurement application value As expected, die tilt angles are outside of its most common use cases. The very low for this case study. measurement methodologies shown here Table 1. Predictive step height results For the given data set, minimal were developed purely through software andsection stands alone from value added by die difference is seen between the process improvements, thus extending useful two different approaches to applications without adding costly hardware.tilt angle calculations. angle calculation. Highly specular surfaces, such as die surfaces,Variation in die height is hypothesized to be more VIII. Shadow Moiré Room Temperature remain challenging for optical metrologies relyinga result of overall package warpage difference Throughput on diffuse light reflectance, such as shadowbetween samples. The consistency and range moiré and digital fringe projection; though software development has narrowed the gapof the results suggests that both the die height of sample surfaces that cannot be measuredprediction and die height measurements are with shadow moiré.within expected tolerance, as die height nevervaried outside of 31 microns from the predictnominal, thus well inside the Fringe Value / 2 Shadow moiré can be used to measure sudden step heights, given an accurate initial estimate(127 micron) requirement. In practice a tighter within 127 microns (in the case used in this study)threshold than Fringe Value / 2 can be used toavoid inaccurate calculation of fringe order. In of the actual height. Using shadow moiré to predict step heights should be used with caution,this case using Fringe Value / 4 as a tolerance as an incorrect input estimate greater than thethreshold for an acceptable gauge result answeris a suggested improvement to aid the reliability allowable tolerance will lead to incorrect output data. When used correctly the resolution of theof this approach. Tightening this allowable range measured step height is increase by 50X fromwould generate a failed calculation instead offalse information if the estimate and measured Fig 12. Die surface with tilt only the initial estimate. A case study of 60 samples is used to validate the approach.results were between 64 to 127 microns different,in the case of the 100 LPI grating. Die tilt angle has a fully established workflow in Timing for measurement of die height and software, offering some advantages over someVII. Flip Chip Die Tilt Angle Case Study die tilt angle were also evaluated during this comparablee techniques in terms of throughput.Results case study. A primary reason to use shadow Absolute measurement accuracy may likely be moiré to measure these gauges is purely for lower than point based measurement techniquesFor the purpose of comparing shadow moiré throughput. Because shadow moiré is a full field in some cases, but angle calculation can bewith point to point based technologies used to technology, once the test plan is established taken on a plane fit of the die surface insteadmeasure die angle the die tilt angle is processed for a single sample type and layout, which is of raw data of the die height, which factors inin one of two ways. The first is to process the also a quick process, running high volumes of warpage. The case study of 60 samples resulteddie corners as measured, as would be done samples scales very well. This throughput is in very low die tilt angle numbers.in a point to point based system. However, complimented by software to qualify pass/failone could argue that with full field data a more limitations for good or bad samples based on Throughput for quality assurance to measurerealistic value for die tilt angle can be generated gauge information. Therefore, for high volume, both die height and die tilt using shadow moirébetween the die and substrate by fitting both processing time is essentially negligible and the technology is high, at 7920 samples/hour.data sets to a plane instead of single points. bottleneck becomes equipment time. Throughput is unchanged whether measuringTo further this point the die surface is shown one or both gauges in this example. Samplein Fig 11 including both tilt and warpage of the Measurement time for a batch or tray of samples handling automation could further improvedie surface. with current solutions is mainly taken up by load measurement throughput. and unload time, as the actual measurement is only 2 seconds. Additionally, a fixture or jig It is worth noting that the concepts shown for should be used to ensure repeatable placement height and angle between die and package can of the sample for each load step. With a manual also be applied on numerous surfaces offset loading solution the samples used in this case from one another, such as a package on a PCB. study had an approximate total cycle time of 20 seconds, taking care with Acknowledgments the samples and moving DTA including DTA die fit The author would like to somewhat carefully. The die warpage to plane thank Greg Petriccione and Samples measured 60 samples 60 samples Kirill Shuykin of Akrometrix for software development Minimum DTA 0.006 0.003 supporting the covered concepts, and Ryan Curry ofFig 11. Die surface showing both tilt Maximum DTA 0.096 0.075 Akrometrix for applications and warpage Average DTA 0.040 0.040 support. www.akrometrix.comFor the purpose of comparison die tilt angle is St. Dev. DTA 0.019 0.018calculated based on both the warped die anda plane fit die. The same data set from Fig 11 Table 2. Die tilt angle (DTA) resultsis shown in Fig 12 after a 1st order plane fitPage 36 Electronics Beyond Content | NOVEMBER 2017 ISSUE

SPI Stall 320 in Hall A2 Messe MünchenTR7007QI November 14-17, 2017High Precision Stop-and-Go 3D SPI AOI TR7500QE Ultimate Inline 2D+3D AOI Solution AXI SPI 3D ICT AOITR7600F3D/TR7600LL SIII 3D C TR5001D/Q SII INLINE 3DUltra-high Resolution 3D CT AXI T Next Generation Inline Multi-Core ICT YMS 4.0 T AXI IC YMS 4.0 TRI’s Advanced Yield Management System for the Smart FactoryTest Research, Inc. (TRI), the leading test and inspection systems provider for theelectronics manufacturing industry, will showcase in productronica 2017 a powerfuland cost-effective product lineup that encompasses a full range of solutions for PCBAinspection and testing. Test Research, Inc. (TRI) sincerely invites you to visit Stall 320in Hall A2 on November 14-17 at Messe München to view on-site demonstrations ofthe above systems. TRI's German distributor Multi-Components GmbH will also jointhe trade fair in Hall A2 at Stall 540. We look forward to your visit!O'Brien Strasse 14 91126 Schwabach Germany T (9122) 631 2127 [email protected] www.tri.com.tw

TECHNOLOGY TODAY FEATUREINSIGHT INTO THE FUTURE – GKG GLOBALDISTRIBUTORS CONFERENCESUBMITTED By JOYCE LIM, GKG ASIA PTE LTDOn 28th of August, GKG Precision Machine Co., Ltd, conducted its with minimal hiccups. It helps greatly in attainingfirst ever in-house event, GKG Insight 2017. 50 distributors from more efficiency in the entire line of production. Today,than 30 countries, gathered to witness GKG’s growth towards being a after witnessing the R&D and manufacturingprominent brand with international standards. capabilities of GKG, we believe it will further enhance our mutual blueprint.” When askedDue to Typhoon Hato, numerous flights arriving seize the golden opportunity to hold this event.” about area for improvement, Mr. Greck hopesShenzhen Intl Airport were delayed or even Mr. Glenn Qiu, Chairman of GKG Precision that GKG can develop a machine user interfacesuspended. However, all 50 distributors arrived Machine Co., Ltd, articulated: “All the while, software that is more appealing to the westernat the designated time and the conference GKG focuses greatly on R&D with constant market with multiple languages such as Germancommenced at 9am sharp. innovation, fulfilling the requirement of our and Spanish.Juki Automation Systems Corporation embrace global customers. We strive towards mutual Mr. Grant Langley, General Manager of Techmetthe presence of GKG and embarked on the improvement and development.” (South Africa), commented: “Our company haveglobal promotion of the brand. This year, a During the conference, GKG officially launched been distributing other products but GKG’sworld-renowned EMS factory had purchased six of its newly developed products, including five products displayed the highest consistencymore than 300 sets of GKG SMT Printers. An SMT Printers and one Multi-function high speed and stability. We hope that GKG maintain theincreasing amount of international eminent dispenser. After an afternoon of observation and spirit with continuous improvement.”electronics manufacturing companies choose evaluation, distributors expressed great interest Mr. Mike Nelson, President of Etek Europe,to work with GKG, further affirming that GKG about the products and further discussed about remarked: “GKG is the Number 1 SMT Printerproduct quality have attained international the future roadmap of GKG. Manufacturer. In addition, it’s integrated modelstandards. With reference to GKG’s market consisting of R&D, production, sales and service,data, more than 8,500 machines had been sold At 4.30 in the afternoon, GKG greatly complement the marketing efforts into date, since GKG’s establishment. With this, sang the event song, “Together Europe. The topics that GKG elaborated todayGKG successfully secured the number 1 spot We Are”, with the international highly matches my requirement.”domestically, with the overseas market showing distributors. The song is also a According to the feedback, this is the first time ina consistent increase. self-composed song by GKG Asia the industry, that an event of such a large scaleBagged with many years of overseas marketing Pte Ltd’s Managing Director, Mr. was held. With creative and careful planningexperience, GKG Asia Pte Ltd’s Managing K.S Toon. by the organizing committee over the past 5Director, Mr. K.S Toon, noticed that there are months, GKG Insight 2017 were reckoned as aa great number of global consumers who are Mr. Sebastian Greck, Team Leader of Product unique “Open house” event specially tailored tobeginning to be highly captivated by GKG. He Management from Juki Automation Systems their global distributors to lay a strong foundationsaid: “We have shifted to this new industrial GmbH said: “We have been working with GKG towards the future.park three years ago and after these years of since 2012. GKG products exhibit high stability www.gkgasia.comoperation, we feel that we are well-equippedwith the capabilities to showcase to the worldwhat we have got. Hence, we’ve decided toPage 38 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Industry News Keep up to date with what’s newWith each issue we’ll keep you up-to-date with the latest industry news from around the globe.Digpro recruits a new Sales Network Lifecycle Management and also the endorsed by the ISO 14001 standard for theDirector - to focus on the market leader in Scandinavia. Digpro provides highly efficient Environmental Management Systeminternational power industry solutions for electricity, telecommunications (FTTx), in place at the company. Many of Electrolube’s gas, district heating, water and central and local products meet strict Underwriters LaboratoryDigpro continues to grow and employ new skills. government - in fact any organization that builds standards for flame retardancy and manyStefan Multing has been recruited as the new and maintains various types of networks. Digpro’s products meet European and American militarySales Director for Power Utilities at Digpro, and products enable users to streamline, save time and specifications.will be focusing on developing international sales money, while improving the quality of its service.in the power industry. Stefan Multing comes from Ron Jakeman, Managing Director of HKa similar role within ABB. www.digpro.com Wentworth Group (Electrolube’s parent company) commented, “We are delightedD​ igpro is experiencing rapid growth in international Electrolube is Awarded to be awarded the IATF 16949 standard,markets. To meet the increased demand for Automotive Standard IATF 16949 which is fitting recognition of our strengthsDigpro´s solutions, Stefan Multing has been and capabilities to meet the demandingappointed as the new Sales Director at Digpro to Demonstrating its continuing commitment to environments and requirements of thefocus on developing and expanding international achieving excellence in manufacturing and service automotive industry manufacturing sector.sales within the power industry. provision, Electrolube has been awarded the Electrolube has experienced expansive growth International Automotive Task Force’s new global with the automotive industry worldwide andStefan Multing comes from a similar role at ABB quality management standard, IATF 16949. The many of our product groups lend themselveswhere he worked as a Regional Sales Manager for global automotive sector presents huge growth effectively to the vast array of challengingthe past 6.5 years. In the past Stefan has worked potential and demand for electronic protection automotive applications. Our compliance withfor both small and major software companies products, and Electrolube has been particularly the IATF’s global quality management standardand holds a degree from Stockholm University in proactive in its development of a broad portfolio is an important step for us and it joins anEconomics and Information Technology. of electro-chemical products for use in harsh extensive host of standards that our products environments. and services currently meet both at home and“It’s very fun and exciting to get to be a abroad.”part of Digpro. The company has a strong The Electrolube range includes Conformalproduct offering and a world-class technology Coatings, Encapsulation Resins, Cleaning and www.electrolube.com.platform. It enables for high productivity in preparation chemicals, Thermal Managementdevelopment, but is also important to ensure materials and Contact Lubricants that satisfy every Farnell element14 adds ‘Flickthe high performance and accessibility that requirement for the protection of vehicle electronics HAT’ plug-and-play 3D trackingour customers put on their business critical and associated controls, from interior and exterior and gesture-control forapplications. As I see it, the potential in the lighting to challenging under-hood applications. Raspberry Pi and I2C-enabledinternational power and telecom industry is very devices to its range ofhigh. But it’s important that we work smartly The automotive sector is particularly strict in accessoriesand focused, on our own and in collaboration its selection and management of supply chainwith our strategic partners”, said Stefan Multing, partners, who must demonstrate not just excellence Farnell element14 has added the latest 3D trackingSales Director of Power Utilities at Digpro. in terms of product quality and performance, but and gesture-control Hardware on Top (HAT) to its also the quality of their staff, their manufacturing range of Raspberry P i™ accessories.“We are facing an exciting future where the processes and manufacturing environment.company is growing and customers are also The IATF 16949 standard (which replaces ISO/ The Flick HAT allows engineers to expand theincreasing on the global market. In order to TS 16949) establishes the requirements for control options for Raspberry Pi and I2C-enabledmeet future challenges and to continue our a Quality Management System covering the projects by enabling users to control devices withinternationalization journey, it is important to get design, development, manufacture, installation a swipe, tap or flick of the wrist. By supporting 3Da chance to work with the right people. Stefan’s and servicing of automotive products, and the gesture detection at distances of up to 10cm, thesolid experience and knowledge is therefor a very achievement of best practice in all these activities. Flick HAT doubles the range of alternative devicesimportant part of our continued expansion”, said to provide a more flexible user experience.Bo Lundgren, Group CEO of Digpro. Electrolube’s Beijing subsidiary was also awarded the IATF 16949 standard earlier this year, providing The use of near-field technology means that FlickDigpro is with its 30 years in the industry as a further evidence of this leading electro-chemicals HAT can be used to control a PC, TV, musicmajor innovator in the field of Geographic IT and manufacturer’s global vision and commitment to system or other device even when the project is excellence in every aspect of its business. concealed behind non-conductive materials such as wood or acrylic. The Flick HAT also supports Electrolube’s products and manufacturing communication over I2C. Implementation is processes are compliant with a wide range of simplified with fast, solder-free, plug-and-play internationally recognised standards, to identify installation whilst software libraries allow designers the properties and performance of Electrolube to explore the full functionality provided by 3D products throughout all areas of the electronics tracking and gesture sensing. industry. The company also won the Queens’ Award for Enterprise last year and has beenPage 40 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Steve Carr, Global Head of Marketing for Premier The Bergara-based company boasts a great Optimal Electronics and ETEKFarnell said: “This addition to our product range deal of experience in the production of varnishing Europe Partner to Providereinforces Farnell element14’s strengths in machines for the electronics industry. These Industry 4.0 Solutions to thehelping developers of IoT devices provide greater machines automate the entire process and can be Electronics Assembly Industryfunctionality than ever before. This includes tailored to meet the requirements of each brand.enabling devices with control options that are Optimal Electronics Corporation, a global providerusually only associated with high-end consumer New Business Relationship of smart factory software solutions for theproducts.” electronics assembly industry, today announced Flex LTD is one of the largest companies in its that it has signed a distribution agreement withThe range of Flick HAT variants provides sector, globally speaking. It provides design, ETEK Europe. Under the agreement, ETEK Europecompatibility across the spectrum of Raspberry manufacture, distribution and warranty service is the company’s exclusive distributor throughoutPi boards: Flick HAT offers compatibility with Pi A+, solutions for the electronics industry. It deals with the European market.B+, 2B and 3B; whilst Flick Large is compatible companies operating in the Aerospace, Industrial,with Raspberry Pi, Arduino, BeagleBone® and Automobile, Medical and Textile industry, operating ETEK Europe, established in 2007, has grownGenuino as well as any I2C-enabled device. The in 40 different countries. to become a leading supplier of equipment toRaspberry Pi Zero is supported by the Flick Zero. European aerospace, defense, medical andwww.uk.farnell.com Lazpiur, a family-run company based in Bergara electronic manufacturing industries. Operating and founded 103 years ago, manufactures threeLazpiur wins first order from the types of machinery: Electronic Machines; Fastener from its new 14,000 ft2 Technology Center, ETEK’smultinational company Inspection Machines; and Tailor-made Machines. team of factory-trained and experienced serviceFlextronics for BMW In addition, the company also produces precision engineers are able to provide world-class service forging tooling. The company operates in 25 that focuses on quick response times and puttingBergara, Gipuzkoa, 4th October 2017 countries. customers first.The multinational company Flex LTD (formerFlextronics) has chosen Lazpiur to develop their www.lazpiur.com Ranko Vujosevic, Founder and CEO at Optimalnewest project. Both companies have entered a Electronics commented, “The goal of ournew stage of business relations which will provide Libra Industries Hires Senior partnership with ETEK Europe is to providethe American company with high technology PCB Designer smart Industry 4.0 hardware and softwaremachinery at the same time that the Bergara- solutions to our customers. We were lookingbased company will gain market share in the Libra Industries is pleased to announce that it has for an experienced and hardworking partnerelectronics sector. hired Alan Vannasy as a Senior PCB Designer. that provides great support, and we found all ofLazpiur has supplied Flex with a machine to varnish Vannasy is an electronics packaging designer that in ETEK Europe. We are very excited aboutelectronic circuits designed for installation on with more than years of experience in the designBMW vehicles. This state-of-the-art machine has and development of new mechanical designs and Ranko Vujosevic and Mike Nelsonbeen shipped to the Flex Mexican headquarters printed circuit board designs, from initial conceptin Guadalajara. This varnishing process is new for to production. this opportunity.”Flex, and the company has counted on Lazpiur’s Optimal Electronics Corporation is a globalexperience for this process. Steve Schwaebler, Libra Industries’ VP of provider of innovative smart factory software Operations, stated: “We are excited about Alan solutions for electronics manufacturing since 1998. joining our design team. His wealth of experience The Manufacturing Optimization and Execution and industry knowledge will make him a key Software (Optel™) applies Artificial Intelligence and addition to the Libra Industries family. I’m confident covers all phases of electronics manufacturing, that Alan will play a vital role in providing and from production scheduling, machine optimization, implementing high-quality customer service and materials management and database driven solutions to our clients.” paperless work instructions through component, process and quality traceability. Vannasy has held key roles at leading companies, including team leader – senior staff engineer and lead design engineer – physical designer. He is experienced at concept definition, design, analysis, prototype, performance testing, agency approvals, customer acceptance and transfer to production manufacturing. Vannasy is an IPC Certified Interconnect Designer (CID) and holds a B.S. in Electrical Electronics Technology from Texas Tech University in Lubbock, Texas www.libraind.com www.optelco.com www.etek-europe.com

TECHNOLOGY TODAY FEATURECT TECHNOLOGY ADVANCES IMAGING MICROELECTRONICSTO ASSEMBLED PRODUCTSBy Keith Bryant, Global Director of Electronic Sales, Yxlon InternationalHamburg, GermanyWithin electronics manufacturing and failure analysis inspection, 2D The figure above shows a section through someinspection is the primary method of X-ray inspection and, traditionally, BGA balls. Where the cross section is taken,systems were only offering this. the 3D reconstructed image is accurate but the pointed area of the balls is inaccurate and resultsCT or 3D then became an option and quality The area of interest is set within the X-ray cone from the lack of gathered data in this area.varied dramatically depending on many factors beam and the sample or the detector is rotated. CROSSOVER SYSTEMSincluding quality of image, stability of X-ray tube, Backgroundreconstruction software, computing power, etc. Figure 2. ICT manipulation The lines between NDT and electronics X-rayIt took a long time to make a 3D image, and A larger number of images are taken, for instance inspection have become blurred as smallergetting detailed images could take many hours. one every degree, and these are then processed features need to be seen in NDT and assembledThis made it something that had very little use to make several slices. This allows the operator to product CT is being requested by more and morein the real world of manufacturing. drill down through the number of slices to check electronics manufacturing companies. interfaces and other key areas within the images. This has led to the development of more flexibleHowever, due to the design of the systems and However, as the captured images are taken at platforms that can cope with sub-micron demandsthe technology used, the biggest issue with an angle and not by rotating the sample 360° and large field of view applications. Certain keyCT was that that sample size was roughly the within the beam some data is missing. This features are required to give a system the abilitydimension of a business card. This was because means that when the 3D reconstruction is done to perform well in both arenas.of the simple fact that to get good magnificationthe sample had to be close to the X-ray tube Figure 5. Crossover System..and to build the CT image the sample had tobe rotated within the beam of the X-ray tube. A very stable base is needed for the key components (tube, manipulator and detector), and so granite typically is used for this. It also requires very accurate motion systems, with encoder modules made by top-quality manufacturers. Rotation tables are very high precision with high-end air bearings, resulting in accurate, repeatable results. Figure 1. Conventional CT X-ray layout. Figure 3. ICT slice showing QFN interface. Figure 6. Air bearing rotation table it is not accurate in some areas because the dataCone beam technology is standard in the is incomplete. To overcome this, some systems The higher-powered X-ray tubes also tend tomachines used for electronics inspection. The guestimate what should be there, making the be water cooled with diamond targets to givetube is at the bottom of the system, with the image look more real but may not be accurate. stable performance for demanding applicationssample held by some form of manipulator and and over longer scanning times.a collector at the top of the system, or the other Figure 4. BGA balls showing lack of data.way around in some systems. However, this can In order to work at the nano and sub-micron levelcause issues with the sample colliding with the and to image larger demanding applications, it istube. So, in this type of system CT is normally typical for these systems to have two tube types.a failure analysis technique, unless working at This can add to the time needed, however, somethe component level. systems can change tubes at the touch of a button. Even keeping the same focus region whenInclined or partial CT the tubes are changed is a significant advantage.Partial CT is a quite recent technology, and themain benefit is that it works by focussing on anarea of interest on an assembly or product, theonly size limit is the inspection area of the system.Page 42 Electronics Beyond Content | NOVEMBER 2017 ISSUE

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feature continued...These systems also tend to be larger than thenormal offline ones generally seen in our industry.The larger and heavier sample sizes and the largerflat panel detectors partly are due to the horizontal,rather than vertical, configuration. Figure 7. Image showing two X-ray Figure 10. Image showing virtual rotation Figure 13. System remote monitor tubes inside. in action basically they were microscope-based and notNEW TECHNOLOGIES Figure 11a. full 3D image of bracket measurement systems. Crossover systems have much more accurate components and activeHelical scanning vibration damping, making them metrology-based.To increase the field of view but maintain high The better machines have calibration valuesmagnification, helical scanning is used, as well related to the PTB-certified measurement sphereas very accurate manipulation and very clever gauge in a controlled environment at 20°C ±0.5°.software is needed to control the technology. The Some companies offer guaranteed PTB valuestube and the detector rise together, allowing the for a delivered system that can be ordered asfield of view to move up the sample, producing optional feature.very detailed large images. CT IMAGES FROM HIGH-END SYSTEMS Below are some images demonstrating the capability of Crossover systems. From sub-micron to full assemblies, the images show features that are challenging, such as dendrites a few microns in diameter and those that are hard to see even with high-end 2D systems. Figure 8. Image showing helical Figure 11b. 3D image of mounting hole Figure 14. Actual to nominal comparison scanning layout made by virtual rotation. measurement of componentThe other alternative is to use stitching to join that are offset or held at an angle. The moreseveral smaller images together and produce sophisticated systems use a camera and specificone large image but the accuracy is poor by software to check the sample position duringcomparison. rotation. This allows the operator to set the sample close to the tube, magnifying the image withoutThis allows very detailed images of larger objects the potential for damage.to be made as the smart phone below illustrates. Figure 9. Smart phone imaged in a Figure 12. Camera action for collision Figure 15. dendrites < 5 μm single shot prevention Figure 16. copper pillarsVirtual Rotation Access Remote Monitoring and PushThis is a software-driven technology that allows Messagesoperators to select a field of view not in the centreof the rotation table. This software innovation allows operators to manage one or more systems remotely.It is ideal for hard-to-hold samples or to make Continuous communication of inspection progressseveral 3D images without repositioning the and health data gives operators complete control.sample multiple times to make the optimum image. It displays the system health monitor, real-time information and alerts. The software works on allAnti-collision systems Windows tablets and PCs, and it allows remoteThe potential for collision and damage increases monitoring by sending push messages or callingwhen working with large samples or with those the user for direct system interaction. METROLOGY Traditional X-ray systems have struggled with measurement accuracy and repeatability becausePage 44 Electronics Beyond Content | NOVEMBER 2017 ISSUE

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TECHNOLOGY TODAY FEATUREInterview with Abby TsoiBy SMT TODAY EDITORAnda, established in 1999 with headquarters located at DongguanChina, is a world leader in the manufacturing of Assembly, Plasmatreatment, Fluid Dispensing, Selective Conformal Coating, AssemblyMachines, UV Curing Ovens, IR Curing Ovens, Process Lines, LinearMotors and Complete Automation Solutions for the EMS industry. Andahas more than 1,000 employees worldwide. However, the companyrecently decided to expand its customer base into North America. Oureditors met with Abby Tsoi, the CEO of Anda Overseas Operations, tofind out why the company is expanding into these markets.Q. Congratulations on the expansion of marketplace is a major step into the international motors to meet customers’ requirements and forDongguan Anda Automatic Equipment Co., market for Anda. I have the confidence needed our own production of equipment.Ltd. Why is the company expanding into to accept this challenge, and lead Anda intoAmerica, and why now? becoming an international company with high- Q. Where do you see the company in five end equipment and solutions to worldwide years from now? In 10 years from now? Why?A. Our business has been growing tremendously customers. Additionally, my internationalin the American marketplace so, in order to network and experience with professionals and In five years from now, I see Anda becomingprovide the best possible customer satisfaction, technologies make me the most qualified person a public company, and a world leader ofwe set up a new office in Fremont, CA. The facility to steer a very technical company into such an dispensing/conformal coating equipment asfeatures a demonstration center as well as a spare important expansion. well as automation solutions. In 10 years, Andaparts center for providing efficient support for will be an industry leader known for mergingcustomers. Additionally, an application laboratory “I have 28 years of experience semiconductor and SMT technologies inand R&D center provide a strong backbone and running an international component assembly, and providing innovativesolution to customers’ technical issues. equipment business, and I hold new designs for automatic equipment. the title of SMTA China president.Q. How will the expansion into this region As the CEO of Anda Technologies “my international network andhelp your customers? What advantages USA, Inc., I run the overseas experience with professionalswill it provide that the competition cannot? operations of Anda.” and technologies make me the most qualified person to steerA. Our new California office, which offers full Q. According to the news, Dongguan a very technical company intoservice in both sales and applications, will provide Anda Automatic Equipment has three new such an important expansion.”customers throughout North America with quick- products: a dispenser, a coating machineturn, real-time responses. With this expansion, and a plasma cleaner. Can you briefly tell Q. What is the most important thing thatthe company is able to deliver a faster tailor-made us about the machines and what makes you would like our readers to know aboutdesign to whatever the customer requires for them unique? Dongguan Anda Automatic Equipment?their manufacturing while continuing to providehigh-tech, low-cost solutions to the industry. With the trend of electronic products becoming Anda is your partner for providing a total solution more miniature and high-density component in the manufacturing industry with our high-“Our business has been growing population, our major products are higher end automation equipment technology andtremendously in the American precision and provide the reliability needed to experience. We value our customers worldwidemarketplace so, in order to fit the requirements of the product trend. Instead and look forward to working one-on-one withprovide the best possible of buying from vendors, we are now making the our North American customer base.customer satisfaction, we set up core parts of our equipment in-house, deliveringa new office in Fremont, CA” faster and better performance of products in a www.anda-automation.com shorter time.Q. As the CEO, what will your mainresponsibilities be? What experience do you Q. Are there any new products or technologieshave that makes you the best person to lead coming from Dongguan Anda Automaticthe company into this important expansion? Equipment that we should watch for?I have 28 years of experience running an We make new products every week now, andinternational equipment business, and I hold we focus on customizing production equipmentthe title of SMTA China president. As the CEO to customers’ specifications. The most recentof Anda Technologies USA, Inc., I run the new product is the Dual Head Plasma Cleaningoverseas operations of Anda. The America Machine. We begin the process by making linearPage 46 Electronics Beyond Content | NOVEMBER 2017 ISSUE

TECHNOLOGY TODAY FEATURENordson YESTECH Helps Trenton Systems EnsureConsistent Quality and Best Practices for Its US-Made Technologiesby Michael Bowling, President, trenton systems inc.Headquartered outside Atlanta, GA, Trenton Systems Inc. is a global leader Nordson YESTECH’s FX-940 ULTRA 3Din the design and manufacture of board-level products and integrated AOI system gives Trenton Systemscomputer systems to address the critical needs of industries such asgovernment and defense, test and measurement, industrial automation, the assurance that its product is beingGPU computing, medical, video display walls, communications, video manufactured correctly, every time.processing and energy. The company has designed and manufacturedrugged, military and modular rackmount computers, and industrial of assurance that the product is being sent outservers since 1989. The servers use Trenton Systems’s U.S.-made properly manufactured, every time.single-board computers, backplanes and embedded motherboardsfor critical embedded computing applications. Trenton Systems offers customers numerous advantages, including customer-drivenThe company understands that when it comes to was chosen for cost, performance and because computing solutions that satisfy most demandingrugged, modular or military computers, “one size” it is a US manufacturer. requirements. Additionally, the company designs,does not fit all. As a result, Trenton Systems’s manufactures and supports board-level productengineering design and computer manufacturing Headquartered in Carlsbad, CA, Nordson in the United States. Further benefits includeprocess can handle a variety of customer design YESTECH is a leading provider of automated total BIOS control that allows modificationsrequirements for needs-based industrial, long- optical inspection (AOI) systems with integrated that support complex integrated systems;life computers. Additionally, Trenton Systems yield enhancement solutions for the printed circuit backplane designs that allow unique ISA, PCI,is an Affiliate member of the Intel® Internet of board assembly and advanced semiconductor- PCI Express 1.0 and 2.0 configurations; five-Things Solutions Alliance, a global ecosystem packaging industries. year factory warranty on all SBCs, backplanesof member companies that provides scalable & embedded motherboards; rugged enclosuresand interoperable solutions. Trenton Systems purchased two FX-940 ULTRA built to withstand shock and vibration in harsh 3D AOI systems for its Utica, NY facility in environments; board-level products utilize long-Edward Wheeler, Director of Manufacturing December 2016, and installed them when they life components for 7+ year product availability;Engineering at Trenton Systems Inc., said, “Our arrived shortly thereafter. The 940 3D was about and manufacturing and computer integrationdesign, engineering and manufacturing facilities to be released and Trenton Systems wanted to be facilities are ISO 9001:2008 Certified. YESTECH’sare still based in the United States, allowing on the front of the curve with the new machines 3D AOI system helps them continue to provideus to maintain the highest quality standards, rather on the end of the curve with the existing best-in-class solutions to their customers.which continues to be the hallmark of Trenton’s machine that it currently was using. Wheelerreputation. We remain focused on meeting the said that the new systems are running at full Wheeler added, “The service we’ve received fromdemands of any computing environment in which speed, and have improved because YESTECH Nordson YESTECH has been exceptional. Wedata resilience, dependability and application had been continually developing the software knew going in that there would be some growingintegrity are critical.” To continue strengthening as Trenton Systems was going into production. pains with the new system, and their support –its high-quality reputation, Trenton Systems The machines are running faster with the 3D both remote and on-site – has surpassed ourpartners only with companies that share its view capability than anticipated. With its FX-940 expectations.” He added that he constantlyon excellence and best practices. ULTRA 3D AOI systems, Trenton Systems is able evaluates other equipment and will go with a to provide its customers with cutting-edge 3D better fit if he finds it, but it needs to be an overall Trenton Systems has been designing, technology for the inspection of solder defects, fit, not just price or a marginally better performer manufacturing and delivering quality, US- lead defects/lifted leads, component presence on paper. “YESTECH has always had a greatmade products since 1989, and understands and co-planarity of chips, BGAs and other technology:cost ratio, and when you combine height-sensitive devices. that with the service and personal aspects of that innovation and flexibility are key to the relationship, it’s not surprising that we have meeting customer requirements. The FX-940 ULTRA provides high-powered continued to do business with them.” inspection with an unmatched false call rate.“At Trenton Systems, we build a wide range of “As an early adopter of the 940 3D systems “As far as I’m concerned,” Wheeler concluded,boards for our customers in terms of volume and coming from the FX platform, we were concerned “The 940 3D is by far the best bang for thecomplexity, from electronics for toys with relatively that the increased complexity of 3D inspection buck when it comes to automated inspectionfew placements, to aerospace applications was going to slow down the process and were equipment. People make a company, and we arewith thousands of placements, and everything devising plans to use it only where needed,” said thrilled to have the relationship with YESTECHin between. We needed a way to ensure that Wheeler. “We were pleasantly surprised that not that we have. We don’t necessarily do things incomponent and solder joint inspection was only does the 3D run far faster than anticipated, the traditional way, so with some of the customalways being done in a consistent way, and the coverage is dramatically improved compared changes we asked for in the software, I can’tthat’s where the Nordson YESTECH 940 3D AOI to the 2D system we were used to, and has imagine they would have been possible if we’dmachines come in,” added Wheeler. YESTECH expanded the 3D inspection far beyond our been dealing with an overseas supplier.” initial expectations.” www.nordson.com/en/divisions/yestech Wheeler added, “Working with YESTECH to customize the software and data collection to fit www.trentonsystems.com our needs was easy and efficient, making us glad we were dealing with a US-based company. We build a lot of products that the customer wants shipped out without going through a functional test, and the 940 3D lets us achieve a high levelPage 48 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Visit us at Productronica Hall A2 – Stand Number 445 Your X-ray Inspection Solution The New QuadraTM SeriesTurn Images Into SolutionsQuadra creates unbeatable images, making it easy to see eventhe tiniest detail and find defects quickly. The in-house designedhigh performance X-ray tube and detector allows featurerecognition down to 100nm and magnification up to 68,000times.Simplicity As StandardX-ray inspection should be as easy and intuitive to use as possible.Quadra enables operators and occasional users to get incredible X-rayimages quickly, easily and with minimal training.Maintenance FreeIncrease your return on investment, reduce your downtime and costs.Quadra is the only maintenance free inspection system. Regularpreventative maintenance visits are no longer required to guaranteeoptimum X-ray performance.The New Quadra Series from Nordson DAGE.Learn more: www.nordsondage.com/quadra

TECHNOLOGY TODAY FEATUREThe Influence of Clean Air on the Value-AddedChain in Electronics ProductionBy Stefan Meissner, Head of Corporate Communication with ULT AGHow to protect values in electronics manufacturing by the utilisationof technology for air purificationThe value-added chain – what is In particular, indirect activities and quality Image 1: the threefold damagingthis actually? assurance generate a greater part of the costs effect of laser fume on humans, in product manufacturing. This article principally“The idea of the value chain is focusses on the indirect activities. machines and productsbased on the process view oforganizations, the idea of seeing Indirect activities and their influences Airborne contaminants and their impactsa manufacturing (or service)organization as a system, The indirect activities within a value-added chain To put it shortly, all airborne pollutants havemade up of subsystems each comprises of three subdivisions: negative effects on employee health but alsowith inputs, transformation on production plants and products.processes and outputs”. • Maintenance – this includes production resources and rooms as well as the entirety In principle, airborne pollutants are classifiedThe definition of a value-added chain by Michael of all systems and plants due to particle sizes. This classification primarilyE. Porter is one of many that can be found in focusses on the influence of emissions on thereference books, works and on websites. In • Product quality – this includes precision of human body. In addition to the possibilities ofprinciple, it involves a sequence of activities, manufacture, accuracy, functionality and brain damages, neurotoxic effects or airwayexecuted by a manufacturing company to cleanliness injuries, they are differentiated in terms of beingdevelop, produce, sell, ship and maintain inhaling (E fraction) or alveolar (A fraction).products or services. • Occupational safety – this includes work clothing, ESD protection, injury potential and The capture of contaminants is regulated byThree main parameters essentially influence a clean air law in various countries. These regulationsvalue-added chain: determine categories of danger for specific All three issues have one common factor: hazardous substances, e.g. in terms of fire and• Direct activities − research, development, they depend on clean air in the production explosion risks, or in types of health damaging production, shipment etc. rooms. How is this the case? effects (cancerogenic, mutagenic or toxic for reproduction).• Indirect activities − maintenance, operation, In modern electronics production, there is a occupational safety, environment etc. multitude of different processes: from connection and separation technologies, surface processing• Quality assurance − monitoring, test/ such as marking, drilling, sintering and milling, the inspection; quality management etc. utilisation of fluxes, up to production processes such as 3D printing or rapid prototyping by means of laser, soldering, welding and gluing – all these processes generate harmful substances that might have extreme health impacts.Page 50 Electronics Beyond Content | NOVEMBER 2017 ISSUE

SQ3000 DD Ad - SMT Today v1.pdf 1 10/9/17 10:44 AMJust as accurate. Twice as fast.Increase productivity with high-volume throughput, while relyingon unprecedented speed, accuracy and ease-of-use. High Resolution Sensor and NewUltra-High Resolution Sensor options. Powered by MRS TechnologyWhere exibility, speed and accuracy meet, you’ll nd the new SQ3000-DD.The unique design of the new SQ3000-DD 3D AOI maximizes exibility providing the ability to inspect high volumeassemblies, the convenience of inspecting di erent assemblies and board sizes simultaneously on di erent lanes, oreven switching from dual lane to single lane mode to inspect very large boards. Adding to the exibility, choose two ofthe same or two di erent advanced Multi-Re ection Suppression (MRS) Sensors for various applications, both of whichmeticulously identify and reject multiple re ections caused by shiny components and re ective solder joints – bothdelivering unparalleled microscopic image quality at production speed, maximizing throughput.Learn more athttp://bit.ly/2w8wCNz www.cyberoptics.com Copyright © 2017. CyberOptics Corporation, Inc. All rights reserved.

feature continued...Airborne contaminants may additionally have Image 3: selection of capturing elementsnegative impact on production systems andproducts. Depending on technology (laser, Due to pollution amount and type as well as Basically, the appropriate capturing elementsoldering, welding, etc.), they consist of various airflow principles, they are available in various can deliver a substantial contribution to theinorganic and organic substances, which versions – up to complete housing solutions. quality of the extraction and filtration device.might have partly dramatic effects based on The degree of capture rate forms the basis forchemical reactions. subsequent high-grade filtration, finally providing high overall efficiency and low residue in theSoldering fume, for instance, mainly consists of returned clean air.fluxes, soldering material and detergent residues,which often join up to adhesive aerosols. They The value-added chain and its dependencealso compromise machinery and products – and on clean airfinally product quality − as they create firmlyattached dirt layers. Analysis of possible impacts of airborne pollutants on indirect activities within the value-Contamination of electronic assemblies with added chain shows that all three subdivisionstacky dusts may lead to conductor track are concerned.corrosion, which can lead to partly or completefunctional failure. Product quality suffers from the • Production resources and rooms must notimpact of hazardous emissions in the long term. be pollutedExtraction and filtration technology and • Product quality and cleanliness must beits support guaranteed under all circumstances – restricted functionality is intolerableThe early removal of airborne pollutants preventstheir impact. Extraction and filtration systems • Employee protection is of highest importanceprovide an effective solution. The variety of – regulatory bodies determine the demandssystems on the market is high. to be achievedExtraction and filtration units are determined by Extraction and filtration in electronics productiontype, composition and amount of pollutants; goes far beyond the vacuum cleaner principle. Itsystem utilisation in automated, semi- is not just a case of dirt removal but to eliminateautomated and manual production as well as hazardous substances in the air that may havemobility or flexibility. negative impacts on humans, machines and products – consequently on the entire value- Image 2: mobile extraction and filtration added chain. system for larger amounts of soldering www.ult.de fume, the LRA 1200 from ULTModern extraction and filtration systems cleanprocess air to such a high degree that thepurified air can be moved back to the workingarea. This is based upon innovative filtrationconcepts, which can additionally be configuredto special requirements.The capturing of airborne pollutants is anotherdecisive aspect in air purification. Closestproximity to the source of pollution is of criticalimportance – the closer, the better. Not onlyto capture the majority of all particles but tominimise economic efforts.A general rule says that twice Image 4: soldering fume extraction atthe distance between emission manual workplace – utilisation of a suctionsource and capturing elementrequires four times the exhaust pipe mounted on an extraction armperformance in the extractionand filter system. Capturingelements are nozzles mountedon extraction arms. Theyguarantee the ideal capturingof airborne contaminants.Page 52 Electronics Beyond Content | NOVEMBER 2017 ISSUE

See us at We already made ComponentProductronica, Counting Easier, now weHall A3, Stand made it Faster! 102-5 (USA Pavilion) Summit II XQuik II Auto Load withThe latest in high performance rework XQuik with AccuCount Technology combines VJsystems, combining the latest rework Electronix’ X-ray imaging with AccuAssembly’stechnologies and ergonomics with the image processing and inventory management tothroughput, accuracy and reliability of provide a highly accurate count of componentsthe renowned Summit product family. stored in tape-and-reel and waffle packs. • Reduced Footprint • MES data integration • Improved Lighting and Optics • 7” through 15” reels • Digital Gas Flow Control • Integrated barcode printing • Enhanced Side-View Camera • >99.7% part count accuracy • Improved Lighting and Optics • Substantially speed up part counting process • Digital Gas Flow Control • May also be used for electronics inspection • Enhanced Side-View Camera • Automated Reel Handling • Larger Board Capacity • Automatically “counts” components as • Enhanced SierraMate software • Easily Customized Operation Sequences small as 01005 • Designed for Years of Continuous Use • No programming required, One button operation • No need to remove reel from antistatic moisture barrier bag for countingBohemia, NY Suzhou, China Paris, France Budapest, Hungary Bengaluru, India VJ Electronix 19 Alpha Rd. Chelmsford, MA 01824-4124 www.vjelectronix.com Email: [email protected] Tel: +1 631 589 8800

TECHNOLOGY TODAY FEATUREGrand Opening of Comet Group’s Lab Onein San Jose, Californiaby SMT TODAY EDITORAbout 130 customers, partners, media (including SMT Today), employees shorter and shorter,” said Paul Smith, Generaland invited guests from the Bay Area and beyond came together on Manager for Lab One. “Lab One provides fastthe 4th October 2017, in a ribbon-cutting ceremony to celebrate the and easy access to our technologists and to ourofficial opening of COMET Group’s Lab One. The working Lab and solutions, RF power, x-ray and ebeam.” testing environment is now available to many leading Silicon Valleybusinesses – acting as a key resource for a variety of testing and Also Shannon Hart, SVP of Global Operations forinspection services, as well as for opportunities to collaborate with Mattson Technology Inc. expressed excitementComet Group’s industry experts, who will be now be available for for the commitment to the region and Cometconsultation, brainstorming and problem solving. Group’s expansion by saying,“The Model of this type of facility covers many to the region by stating, “This type of offering “It will be great to havetypes of applications, said Frank Hochstenbach, is essential here in Silicon Valley and we are so close collaboration betweenVP New Business Development for VDL Enabling grateful that you have chosen San Jose as the engineering and developmentTechnologies Group. “This allows for larger location to open this Lab.” teams to help speed up thecorporations as well as start-ups to take product development process.”advantage of these novel technologies.” Ajit Manocha, President & CEO of Semi, Craig Arcuri, a Senior Manufacturing Executive and Bill Victor Sloan, President of Victor Aviation summedWith pioneering solutions for a wide range of Bader, President & CEO, iNEMI participated in a up the core of Lab One right to the point byindustries, Comet Group will support its clients roundtable discussion led by Trevor Galbraith, saying “What I’m most excited about is the factby bringing greater safety and security, mobility, Editor-in-Chief, Global SMT & Packaging, where that Lab One is an open-door organization thatsustainability and efficiency to numerous areas they discussed the future of x-ray testing, plasma will help companies of all sizes, including mine,”of life. applications, additional industries for ebeam as said Victor Sloan, President of Victor Aviation. well as how companies can best utilise Lab One.San Jose Mayor, Sam Liccardo, was on hand For more information about the Comet Groupfor the official ribbon cutting ceremony and  “Speed and agility are more important than ever Lab ONE facility and it’s offerings, please visitexpressed appreciation for this commitment given that companies’ innovation cycles get www.comet-group.com/home.Page 54 Electronics Beyond Content | NOVEMBER 2017 ISSUE

Technology with Passion Let’s find out together how we can shape the future. Your future.Lab ONE Innovate. Implement. Accelerate.RF Power Technology X-ray and CT Technology ebeam TechnologyImprove performance, reliability, Maximum spatial detail recognition More productive and sustainable withrepeatability, throughput and yield of and high-yield inspection. blue technology.your RF system. ebeam is good for the environmentOur products enable semiconductor Even the smallest defects may have and leads to more productivity.manufacturers to produce more a big impact on the functionality and By mastering the small electron,complex devices in less time at safety of objects. Our inspection we create big changes: refined andhigher yield. systems detect and visualize things new materials, cleaner processes, 200 times finer than a human hair, greater resource efficiency. gaining precise CT insights. comet-group.com/lab-one

NEW PRODUCTSexciting new industry innovationsKeeping you informed of the latest developments in technology andinnovation within our global electronics industryALPHA® SnBiAg Low Temperature Solid strength. The new knurled hex keys from PB low-voiding solder pastes, visit www.indium.com/Solder Wire Enables Long-Term Reliability Swiss Tools is available in sizes 1.5mm –10mm avoidthevoid or see Indium Corporation in hall A4& Reduced Material Costs as individual hex key l-wrenches or as a set in a at booth 214.Somerset, NJ – October 5th, 2017 – Alpha handy plastic holder.Assembly Solutions, the world leader in the www.indium.comproduction of electronic soldering and bonding All PB Swiss Tools Knurled hex keys are made frommaterials, has introduced a low-temperature the company’s signature spring steel alloy with KIC releases new smart technology for real-solid solder wire that demonstrates long-term precision heat treatment. This alloy is known for its time insight into reflow and wave solderreliability while enabling the use of less expensive high hardness, long durability, perfect dimensional processesPCB materials. accuracy, and exceptional elasticity and tenacity. KIC is pleased to announce the release of its Additionally, the PB Swiss Tools’ Knurled hex key new Vantage network software system. The newALPHA® Sn42 Bi57.6 Ag0.4 is a lead-free solid series provides absolute precision and the highest software provides a real-time dash-board forsolder wire primarily used for rework operations regularity with tolerances smaller than a human thermal processes, accessible anywhere, fromand touch up soldering of low temperature hair. PB Swiss Tools’ hex keys are chrome-plated any authorized PC or mobile device. The processbased electronic assemblies. Compatible with for protection against corrosion. data is automatically stored in a central locationall commonly used lead-free surface finishes, where the engineer can quickly retrieve and sharethis low temperature solution is ideal for soldering Each hex key is labeled with the serial number all relevant data.sensitive components or connectors. It is available for additional security and to enable tracing thein various wire diameters (min: 0.6mm) and is more production back to the raw material. PB hex The Vantage delivers value to users, not throughversatile than SnBiAg alloy solid solder sticks. keys also feature a perfect-shaped ball-point massive amounts of raw data, but through end, allowing any user to turn the screws with convenient access to only relevant and/or“The ability to use low temp compatible components an angle of up to 30°. PB Swiss Tools is the only actionable data. For example, with a few mouseand low Tg PCBs leads to a reduction of waste manufacturer to offer such a large angle for ball- clicks, the user can access traceability data forand scrap that can lead to a significant savings in point hex keys, making them the most versatile every assembled PCB within a certain time frame,material costs, said Bernice Chung, Global Product for the user and very unique. oven, shift, client name, or all of the above.Manager for Solid Solder Wire at Alpha AssemblySolutions, a part of the MacDermid Performance With more than 130 years of experience, PB Swiss KIC’s President Bjorn Dahle states:Solutions Group of Businesses. “The SnBiAg alloy Tools is a global leader of hand tools manufacturedallows us to reduce exposure to thermal excursion for use in the industrial marketplace, even for the “The smart factory is aboutduring assembly, thereby eliminating the need for most hazardous jobs. All PB Swiss Tools are 100 using data to run the factorya wave soldering process which both increases percent Swiss-made and come with an unlimited more effectively. A few yearslong-term reliability and reduces energy costs.” lifetime guarantee. Work with the best! ago people were asking us to provide them with real-timeThis new soldering material from Alpha eliminates For more information or to order online, please data accessible from anywhere.the need for additional reliability testing of solder Now they are saying: ‘Help, I amjoints reworked with an alternative alloy. visit www.pbtools.us. drowning in information!’ The www.cotinc.com key is using data analytics toFor more information on ALPHA® SnBiAg Low deliver insight and actionableTemperature Solid Solder Wire or any other product Indium Corporation to Feature Stable, Low- data. A second benefit is theor process technology, visit the website Voiding Indium8.9HF Solder Paste Series at management of instructions Productronica 2017 and task verification. Thewww. alphaassembly.com responsible engineer has Indium Corporation will feature its void-reducing literally thousands of balls inCOT announces new Knurled Hex Keys from Indium8.9HF Solder Paste Series to help customers the air at any time while hopingPB Swiss Tools Avoid the Void® at Productronica, November 14- that all of the instructionsGAINESVILLE, GA ― October 2017 ― Count 17, in Munich, Germany. were understood and executedOn Tools, Inc. (COT), a leading provider of precision correctly. Vantage organizescomponents and SMT spare parts, is pleased to The Indium8.9HF Series delivers no-clean, halogen- and shares both the dataannounce that PB Swiss Tools free solder paste solutions designed to produce management and task execution low-voiding–plus improved stability–during the for every reflow oven and wavenow offers knurled hex keys as a standard option printing process. Under optimal process conditions, solder machine in the factory.”in their product catalog. The knurling at the shaft this series:increases the non-slip property in wet or oily Move toward the future of line connectivity, flexibleenvironments, thereby increasing the safety. The • Demonstrates consistent printing performance production, process transparency, machineround shaft, manufactured from PB Tools’ unique for up to 12 months when refrigerated learning and real-time insight. For more informationsteel alloy guarantees higher reverse fatigue about KIC • Maintains excellent printing and reflow performance after remaining at room www.kicthermal.com. temperature for one month • Delivers excellent response-to-pause even after being left on the stencil for 60 hours The Indium8.9HF Solder Paste Series boasts a unique oxidation barrier technology that makes these pastes perfectly suited for a variety of applications, especially automotive assembly. For more information about Indium Corporation’sPage 56 Electronics Beyond Content | NOVEMBER 2017 ISSUE

TECHNOLOGY TODAY FEATUREAdditive Manufacturing Brings New Opportunities toElectronics Design and ProductionBy Simon Fried, Chief Business Officer, Nano DimensionIt may sound too good to be true, but technology exists today that can The speed of the DragonFly 2020 3D Printershorten time-to-market, open the door to new innovations in electronics makes it possible for PHYTEC designers todesign and production, reduce costs, and enable electronics designers create PCB prototypes 10-15 times fasterto take full control of their development process. This isn’t just an than ordering the traditional way. This enablesengineer’s fantasy; advances in 3D printers and nano particle inks are PHYTEC to perform functional testing and quicklybringing additive manufacturing to the world of printed electronics, finalize the concept design in the early stages ofbreaking existing technology barriers for multi-material 3D printing development, to meet customers’ needs. Errorsof electronics. can be immediately detected and eliminated. The result is either increased quality of design and/orOne system making this technological leap In-house prototyping opens a new world for faster designs and shorter design cycles, frompossible is Nano Dimension’s DragonFly 2020 Pro design engineers, who can now streamline months or weeks to days.3D Printer, the world’s first professional 3D printer and control the entire process. As an example,for the production of multilayer Printed Circuit current workflows generally lead to infrequent Product development in industrial applicationsBoards (PCBs) and 3D circuitry. The enterprise and relatively large prototype batches. With the has become very agile, and time-to-market is a3D printer drastically transforms the circuit DragonFly, they can print and test 10 different key to success for PHYTEC’s customers sincedevelopment process and enables fast, secure designs over a week as opposed to getting a new types of appliances and products areand effective agile electronics development in batch of one design, as is the case today. There continuously invented all over the world. Theways previously not possible. are other benefits as well: DragonFly 2020 is a key technology for PHYTEC for iterative technology design, enabling agileLeveraging additive manufacturing gives • Rapid innovation provides design teams hardware methodologies and generating time-designers options for replacing existing subtractive the freedom to experiment and iterate savings and a competitive edge.manufacturing of prototypes of their PCBs, which on-the-fly.is an expensive, time-consuming, polluting, multi- “Onsite 3D printing of PCBs can easily savestage, labor- and material-intensive process. The • Print complex geometries with structural multiple days in waiting for PCBs. This allowsDragonFly offers advanced capabilities that can and functional characteristics to save you to get early access to functional prototypes.optimize development workflows because of space, weight and cost. You can do your design validation much earlier,its ability to quickly and easily produce proofs so the most important development of having aof concept, design validations and prototypes • Enable greater flexibility and customization DragonFly 2020 3D Printer is a dramatic reductionin-house. in PCB design – and, ultimately, the in product development cycle time,” said Bodo potential for small-scale production. Huber, Chief Technology Officer, PHYTEC.By using this technology, companies caneliminate the often weeks-long wait for a custom The DragonFly 2020 Pro combines three tightly Future use cases for the DragonFly 2020 Proprofessional multilayer PCB prototype to be integrated technologies: 3D printer hardware, are nearly endless. Component-embeddingfabricated off-site. The revolutionary printer can software that converts standard Gerber board technology may allow for the development of3D-print an entire multilayer board overnight, design files to 3D-printable files, and nanoparticle- new kinds of PCBs that disperse componentsallowing users to test and iterate on-the-fly for based conductive and dielectric inks. through a printed object, playing a structural role.increased innovation. This process can radically We’ll be able to design an electronic productreduce development risks and shorten time- PHYTEC Improves Speed & Quality with the and then 3D-print the PCB accordingly to matchto-market. DragonFly 2020 the design, which will completely change how electronic products are developed.The DragonFly Pro is capable of delivering Germany-based PHYTEC offers cutting edgehigh-resolution 3D printed electronics while solutions for the industrial embedded market, Nano Dimension will be displaying itsoffering improvements in development speed, mainly Board Support Packages for System on DragonFly 2020 Pro 3D Printer for the firstprocess and endless flexibility for superior Modules (SOM). To keep up with strong demand time at productronica in Hall B2, Booth 201.product development. It is a one-stop solution for prototypes from customers, PHYTEC soughtfor 3D-printed electronics that allows a variety a solution to reduce the development cycle time www.nano-di.com/of benefits for users: and improve quality. The company turned to Nano Dimension because of the accuracy and• Print high resolution trace and space with precision of its unique 3D printed electronics the precise inkjet deposition system, highly technology, seeing it as an opportunity to increase conductive silver nano particle ink and its rapid prototyping capacity for professional dielectric inks. state-of-the-art electronics.• Construct the full range of multilayer printed circuit board (PCB) features, including interconnections such as buried vias and plated through holes.• Keep sensitive and proprietary design information in-house while testing.• Enjoy the quick production of PCB prototypes, antennas, experimental electronic circuits and more, allowing for faster revisions and more creative board designs.• Reduce waste.Page 58 Electronics Beyond Content | NOVEMBER 2017 ISSUE

See us at November 14-17 - Hall A2MBUoNoICtHh #461The search is nearly over.Find out more at Productronica. europlacer.com

TECHNOLOGY TODAY FEATUREVirtual Industries Proves that GoodThings Do Come in Small Packagesby SMT TODAY EDITORFounded in 1987, Virtual Industries Inc. is headquartered in Colorado lives. Pacemakers, hearing aids, and hearingSprings, CO by Owners Tom Mealey and Daren Palmer. For 30 years, implants are becoming smaller yet provideVirtual Industries has been a leading supplier of manual vacuum improved quality of life for many across the globe.”handling solutions to the world’s high-technology firms. The company’spatented ESD-safe products are used by Class I clean room personnel, Mealey added that for many of the componentselectronic assemblers, semiconductor manufacturers, universities and inside of these gadgets, there is automatedscientists on a global basis. Mealey and Palmer’s success has come equipment that can place parts as small as afrom developing innovative manual vacuum handling tools and pick- 01005 resistor with incredible accuracy andup tips based on customer requests and customer feedback. These speed. However, there are parts that musttools provide customer-specific solutions that make assembly and be hand assembled either because of theirprocessing operations more productive and ergonomic. odd shape or sensitive surface. While many parts can be manipulated easily with an old-Virtual Industries began selling its products level via a 10-segment bar graph display. The fashioned mechanical tweezer, the downsidein the United States in 1988, and established ADJUST-A-VAC ESD Safe Kit with ESD-safe is that mechanical tweezers have high costinternational operations in 1989. The company Delrin Small Parts Tip and ESD-safe rubber associated with them. For example, if anhas agents and distributors in more than 60 Vacuum Tips (AV-6000-SP8-BD-220) manually assembly person drops the tool, the delicate tipcountries and serves customers in nearly 200 handles thin/delicate substrates, wafers, MEMS profile is easily damaged and the costly tweezercountries. More than a third of Virtual Industries’ devices and other very fragile components. This must be scrapped.sales come from outside the United States. vacuum-tweezer allows the operator to adjust the vacuum level from just below atmospheric Palmer added, “Many of our tools that are Virtual Industries Inc Owners Daren pressure to up to 10” of mercury depending available today can be used for assembly of Palmer(L) and Tom Mealey (R). 2017 on the fragility of the part being handled. Both a wide variety of miniature or odd-sized parts marks Virtual Industries’ 30th year in products feature an integrated 10 segment without the need for tip customization. The bar-graph-display that visibly shows the vacuum Vacuum-Tweezer tool is well-suited for many business level present during handling operations, and of these applications. Everybody knows what the vacuum ports on each integrate a user- a tweezer is and that a vacuum picks stuff up.” replaceable inlet filter that protects operation of Unlike a mechanical tweezer that has two gripping the tool from dust particles. Both systems are surfaces, the vacuum tweezer has a handle with available in various sets depending on individual a control button and only a single conical point handling applications, and in either 110 or 220 at the tip. The tip has an orifice opening that is V operation. connected to a vacuum source. The vacuum source creates a constant flow of low pressureThe company’s product line features hand TWEEZER-VAC® Elite (TV-1500-ELITE) that is used to grip anything that comes intotools that replace mechanical tweezers or other is on the left and ADJUST-A-VAC® ESD contact with the tip.gripping means for many applications. Many ofthese tools are portable and eliminate the need for Safe Kit is on the right. There are several advantages to using a toolvacuum hoses or power cords. This makes these that has only a single gripping tip. First, theretools ideally suited for ergonomic manipulation All of the company’s tools and technologies is no mechanical squeezing of the gripped partof parts during assembly, inspection, rework and are designed to solve the smallest of handling that could cause breakage or other mechanicalservice operations. In addition to hand tools, challenges. “Handling of miniature parts is damage to a fragile item. Secondly, once a partVirtual Industries offers a broad line of accessories becoming more challenging for manufacturers is gripped by the vacuum at the tip, it stays onincluding miniature rubber vacuum cups, wafer as everything we use in our daily lives becomes the tip and is released only when placed and thehandling tips and precision machined tips for either smaller itself or more complex functions are release control button on the vacuum tweezercritical handling operations. added,” said Mealey. For example, companies handle is pressed. Mealey said, “Everyone who are developing high-tech glasses that can record has used mechanical tweezers to pick-and-placeFor customers who do not require portability, every waking moment. Cell phones continue to small parts is familiar with the “zing effect”: youthere is a selection of bench top systems that include more gadgets that integrate into our daily pick a part, it slides off one of the tweezer tips andare powered by line voltage, compressed air, or it zings across the room, never to be seen again.”in-house vacuum sources. These tools use a Small parts can be very expensive so lost partsvacuum pen that is tethered with a small diameter can add significantly to the assembly processvacuum or air pressure line. Parts ranging in cost. Finally, with a vacuum tweezer, users cansize from 0.100 microns (0.004”) to 300 mm grip a part from the side, from the top or from(12 inches) can be handled easily. any other protruding feature; two opposing flat surfaces are not required to grip the part.Recently, the company introduced two newproducts: the TWEEZER-VAC® Elite (TV-1500- All of Virtual Industries’ products are benchELITE) and ADJUST-A-VAC® ESD Safe Kit. top or smaller, but that doesn’t mean that theyEach was developed in response to customer don’t provide large benefits. They are versatile,concerns: The TWEEZER-VAC Elite firmly grasps reliable and cost-effective. They are easy-to-usecritical components and shows the vacuum and help solve customers’ handling challenges. Implementation of vacuum tweezers for assembly of electrical or mechanical parts is limited only by the imagination of the engineer. www.virtual-ii.comPage 60 Electronics Beyond Content | NOVEMBER 2017 ISSUE

LED Big Board SolutionProduction class assembly equipment for 24”, 28”, 48”, 59” PCB form factors includes high performance printing, precision component mounting, repeatable reflow, and reliable board handling with expert training, service and support. smt.hanwhatechwin.com

red carpetout & about in the industryIn this feature we follow our industry movers and shakersthroughout the world. Time to take a bow... CalcuQuote and Tech Edventures Team Up for Europlacer 30-Year-Milestone Staff Join VIPs After-School Engineering Camp on Factory Opening Social Outing. Dallas, TX - As part of a commitment to the greater More than a dozen employees at Europlacer’s Dallas/Fort Worth community, CalcuQuote is global manufacturing hub in Rocheserviere, sponsoring an after-school program, operated France, celebrated long service of 20 or 30 years by Dallas-based STEM education company Tech with the company on a prestigious champagne Edventures, at Weatherford Elementary School river cruise in the nearby city of Nantes. They were in Plano, Texas. The program will introduce accompanied by VIP customers and international students to principles of engineering and computer Europlacer personnel in town to attend the opening programming. Weatherford Elementary is a Title I of the company’s new premises expansion. school with more than forty percent of the school’s enrollment being composed of students from low- Timed to coincide with the official opening of income families. the company’s factory extension and smart new customer area, the river cruise invitation TechEdventures Founder and CEO Dr. Allen Selis list included Europlacer staff members with said of the partnership between the companies, a staggering combined total of service at the “We are excited to have received a sponsorship for Rocheserviere plant well in excess of 630 years. the Weatherford Elementary after-school program from our friends at CalcuQuote. Both businesses Guests on the evening cruise along the Erdre River are devoted to science and technology, and from Nantes enjoyed the comfort and splendour these funds will go a long ways toward helping of glass-sided river boats equipped with arrays of underprivileged children learn about science and intense floodlighting along each flank, designed technology.” to illuminate the many impressive chateaux that line the river. Exquisite food and fine champagne “Our team is thrilled to be able to provide these served on board were accompanied by the relaxing students with the opportunity to learn in an sounds of a jazz trio. engaging way about technology, robotics and programming,” said Chintan Sutaria, President Europlacer boasts a remarkable track record of CalcuQuote. “I got to see Dr. Selis teaching of staff retention, probably unmatched in the summer camps when we were working out of NoD electronics manufacturing sector, with 16% of its coworking in Dallas, and it’s exciting that we are workforce serving over 20 years with the company able to reconnect to make a positive impact on the and 8% more than 30 years. local community with our businesses.” www.europlacer.com www.calcuquote.comPage 62 Electronics Beyond Content | NOVEMBER 2017 ISSUE

send your event pictures to [email protected] or tweet us at #smtredLibra Industries Promotes Manufacturing Careers atThink Manufacturing Career ExpoLibra Industries, a privately held electronicsmanufacturing services (EMS) provider, will participatein the fifth annual “Think Manufacturing Career Expo” onThursday, Oct. 5, 2017 from 10 a.m.-1 p.m. at WickliffeHigh School in Lake County, OH. For the fifth year, theLake County Chambers and the AWT are partnering tohost the annual expo.Approximately 500 students from Lake County highschools will attend the expo to explore the opportunitiesthat manufacturers like Libra Industries have to offer.Libra Industries is a privately held electronics contractmanufacturing company that has been in business formore than 35 years. The company provides customizedmanufacturing solutions that make our customers morecompetitive and improve their profitability.The Think Manufacturing Student Expo will give teachers,guidance counselors, principals, students and parentsthe opportunity to learn more about the various high-techcareers, other rewarding career opportunities, the verycompetitive pay and other benefits that manufacturingoffers. For more information about the event, visit http://thinkmfgexpo.com.For more information about Libra Industries, visit www.libraind.com.

TECHNOLOGY TODAY FEATURESMT Today Out and About at SMTA InternationalBy SMT TODAY EDITORThe SMT Today Team have recently returned from the 2017 SMTA Factory: CIM and IoT and Enabling IntelligentInternational Conference and Exhibition, held in the Donald E. Supply Chain to ensure we are fully informed ofStephens Convention Centre in Chicago, IL., where a record number the latest developments in the industry.of international attendees from 22 countries were registered this year,and over 170 exhibiting companies filled the exhibit hall bringing more It was a fantastic opportunity for the SMT Todayequipment and new products than past years. team to catch up with everyone and introduce our new dedicated Industry 4.0 platform, i4.0SMT Today invited guests to attend a rare Scottish The Technical Innovations Symposium keynote Today. This definitely gained a lot of interest andwhisky and gin tasting experience at our booth presentation by iNEMI’s Bill Bader on the momentum at the show, and demand called forthis time, which went down a treat with most 2017 Roadmap Highlights was well-received us to pull forward a preview issue of this newafter a hard day on the show floor. We also had by attendees. On Tuesday morning a crowd magazine to launch at productronica. So lookour daily prize draw and some of the winners filled the Opening Keynote Session until it was out for this coming soon online, or pick up yourphotographs are published here. standing-room-only to hear Microsoft’s GM hard copy at the show. of HoloLens Hardware Design, Rune Jensen,The technical conference continued the tradition share his experiences developing the company’s SMTA International 2018 will be held October 14of being the strongest in the electronics assembly premier mixed reality device.  - 18, 2018 at the Donald Stephens Conventionindustry. The Women’s Leadership Program Center in Rosemont, IL.brought together presenters from IBM, Intel, Nike, One of our representatives, Andrew Carpenter,FLITE, WNIE, and Women in Manufacturing on was also invited to attend the MFX1 Session www.smttoday.comMonday afternoon.   on Factory Automation, Industry 4.0, SMART www.i40today.comPage 64 Electronics Beyond Content | NOVEMBER 2017 ISSUE

TECHNOLOGY TODAY FEATUREan interview with Randy Ferrell, Senior ProcessEngineerbY DAVINA MCDONNELL, SALINE LECTRONICS & BJORN DAHLE, KICWe sat down with Senior Process Engineer, Randy Ferrell, of Saline A. Producing consistent acceptable qualityLectronics to help get a better understanding of what it’s like to - Good training for the team members, utilizingmanage and drive a mid-sized electronics manufacturing company capable equipment, most significantly, inspectionin the US. Ferrell relies on a data driven process in his daily decision equipment, and clear direction for processmaking, and emphasizes the importance of good communication to improvements. It’s also important to emphasizeeffectively manage a large and diverse team. He’s enthusiastic about a culture of quality and enforcing that to everythe exponential benefits of a true smart factory, and believes the data job on the floor.gained from these intelligent systems will help improve his day to day. A. Managing a large number of people, jobs,Q. What are your responsibilities at delivery. We are getting more clients that do not ovens, shifts, clients -Lectronics? accept re-work. If those clients’ products are not made perfect the first time we need to scrap Communication!A. I manage the SMT department along with our the PCBA.Process Engineering team at Saline Lectronics, www.lectronics.netan EMS provider in Southeastern Michigan that Our clients are starting to require more informationspecializes in manufacturing innovative electronic on traceability data. We are developing automated www.kicthermal.comassemblies with lean methodology and advanced and flexible reporting mechanisms to give ourtechnology. clients access to the targeted relevant data without them getting overwhelmed by the information. OnQ. What are your biggest challenges? our end we are using process monitoring and MES related software to help us provide such reportingA. My biggest problem is not having real-time both clearly and cost effectively.information for efficiency and defects, so we canfix the problem before spiraling out of control. I Q. How do you troubleshoot productionalso find it challenging to juggle hundreds of balls defect issues?in the air simultaneously with numerous machines,processes, personnel, production jobs, clients etc. A. It is difficult to immediately determine the rootCommunication and verification are essential to cause of a defect. We use a 1-3-5-10 escalationgetting the job done right. rule. For example, the technician will attempt to address a single defect issue. Action taken isQ. How do you know whether you are doing reported. In a series of 3 defects, the productiona good job? line is stopped and the process engineer is notified while the technician continues to troubleshootA. I measure success by my ability to solve a the issue. Downtime is incredibly expensive, soproblem by actually fixing the root cause so I finding and correcting the root cause quickly isdon’t see it again. I really enjoy that aspect of critical. We find that access to real-time processmy job and love that I can lend to our continuous data improves our visibility and helps us to solveimprovements at Lectronics. the issue faster. One of the systems we use with a real-time dashboard for all reflow ovens fromQ. How do you know that your team is doing KIC notifies us instantly of an issue.a good job? We can then use the networkedA. I have metrics that the team uses to software to drill down tocommunicate their projects, and I get regular a specific product and ovenupdates through one-on-one interactions that condition to find out what isare interspersed with weekly team meetings. I going on. Fortunately, we haveprovide feedback to keep them on task and also very few defect issues on our 6to align their priorities. I know that they are doing lines, and hence less downtimea good job by keeping my finger on the pulse. and re-work.Q. Have you noticed any recent technical Q. What are the most importantand/or client based trends or changes? components in:A. Yes, the technology and clients are both driving A. Keeping production costs low - Ideally atowards the future smart factory. Internally, we one-piece flow is what everyone wants and striveshave Lectronics 4.0. There are many items that for and it is accomplished by automation. This isgo into developing a smart factory and it starts in especially important in the interface between thethe quoting phase and ends when the customer various production functionalities such as SMT,receives the best product possible in the time that final assembly, testing, etc.was agreed upon. Ultimately, the output we wantfrom our smart factory is to lower production cost,receive consistent quality, and improve on-timePage 66 Electronics Beyond Content | NOVEMBER 2017 ISSUE

The future of electronic manufacturing

“SMT Hautes Technologies has earned a solid reputation for the assembly of high quality, complex printedcircuit boards with short manufacturing lead times. As a High Volume PCBA supplier, SMT HautesTechnologies set out to purchase a robust, post reflow 3D AOI solution with the industry’s lowest false callrate. After extensive research, we determined that no other AOI vendor could match the performance andspeed of MIRTEC’s MV-7 OMNI 3D AOI machine. The MV-7 OMNI has proven to be the perfect fit for ourSMT inspection needs.” - Stéphane Deschênes - PDG/CEO – SMT Hautes Technologies OMNI-VISION® 3D Inspection Technology 15 Mega Pixel CoaXPress Camera Technology 10 um Telecentric Compound Lens Design 10 Mega Pixel SIDE-VIEWER® Camera System Eight Phase Color Lighting System Full 3D Co-Planarity and Solder Fillet Inspection Capability www.mirtec.comPage 68 Electronics Beyond Content | NOVEMBER 2017 ISSUE