The Choice of Publication for the Electronics Industry

HOW CLEAN IS CLEAN ENOUGH TO ACHIEVE RELIABLE ELECTRONIC HARDWARE?

REFLOW IN tODAY’S HIGH-MIX/ HIGH-VOLUME PRODUCTION ENVIRONMENT

red carpet

Who’s doing what, where?

inside

SMTAI

2015

27th Sept – 1st Oct 2015

meet the CEos Page 8

Jonny Nichols, SAMSUNG C&T Automation (cover)

Michael Schwager of Aqua Klean Systems Subodh Kulkarni of CyberOptics Corporation Mitch Schoch of Bentek

Kevin Laphen of Practical Components

Mark Brawley of Speedprint Technology

| OCTOBER 2015 ISSUE smttoday.com

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Where Leaders Solve Tomorrow’s Challenges Today

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welcome

to smt today

Welcome to the latest edition of SMT Today – a high quality publication created for the global electronics industry which provides the best content and largest distribution through the latest technology channels.

We’ve brought the publication of this issue forward to coincide with the SMTA International Exhibition in Chicago, a platform on which the industry’s leading companies will show the latest trends and developments, as well as up-to-date solutions.

For the rst time, SMT Today are proud to have introduced ‘People Awards’ which recognise and celebrate outstanding personal achievements and innovation within the industry. Online votes against the nominations have now been completed and the winners in the ve categories will be announced at SMTAi on the 29th September.

This edition of SMT Today also includes technical articles, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts. In particular, we’ve included an article co-written by Dr Mike Bixenman of Kyzen entitled ‘How Clean is Clean Enough to Achieve Reliable Electronic Hardware?’, an interview with Jonny Nichols, SAMSUNG C&T’s National Sales Manager and make recognition of the fact that Nihon Superior are celebrating 50 years within the electronics business.

During 2015, we’ve attended a number of trade exhibitions, and, as a team, were delighted to meet up with many of our readers and contributors where we shared what additional services SMT Today can o er in the form of delivering responsive websites, successful marketing campaigns and e ective video productions.

The next issue of SMT Today will be published in November and will focus on productronica in Munich, so if you’d like to advertise with us or have any articles that you’d like included, please don’t hesitate to contact me at [email protected].

In the meantime, we would like to extend an open invitation to exhibitors and visitors to our booth #446 at SMTAi and will look forward to seeing you in Chicago!

Kind regards

Lin Ramsay, Editor

Email: [email protected] Skype: lin-smttoday Call: +44 1292 834009

Page 3

inside this issue...

Shows/Events

Exhibition Focus Review

6 SMTAi Chicago

Director Spotlight

Interview with industry experts

10 Jonny Nichols, SAMSUNG C&T Automation

Technology Today

Industry experts share their knowledge

14 Profab Electronics Inc. Relies on SAMSUNG C&T Automation to Achieve the Highest Standard of Quality and Service

16 How Clean Is Clean Enough to Achieve Reliable Electronic Hardware?

22 Development of High Wettability Flux Cored Wire Solder

24 An Interview With John Dignan, Owner and Managing Director of Dynamic EMS

26 Conformal Coating in the 21st Century

33 Interview with Raymond LaFleur, General Manager Overseas Sales and Marketing, DEN-ON Instruments Co. Ltd.

36 KIMCHUK INC. Continues Juki Partnership to Strengthen Its Quality and Customer Focus

39 Interview with Je Lancaster, Engineer at Count On Tools, Inc.

42 NEPCON, South China 2015

44 SEMICON WEST, San Francisco 2015

46 Re ow in Today’s High-Mix/High-Volume Production Environment

50 Interview with Jared Sandman, CEO of Fancort Industries

52 Interview with Simon Norman, Director at EVS International Sales Ltd.

34 New Products Exciting new industry innovations

54 Industry News

What’s happening in the world of electronics

60 Red Carpet

Photo gallery of industry personalities and events

Articles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every e ort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers for loss arising from articles/information contained and published.All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

6

10

16

6

SMTAI, Chicago

8

Meet the CEOs

10

Director Spotlight

54

Industry News

42

NEPCON, South China 2015

magazine contacts...

Editor

Design Website

Lin Ramsay [email protected] +44(0)1292 834009 skype: lin-smttoday

BBD Creative bbdcreative.com +44(0)1292 280022

smttoday.com

Advertising Enquiries

To enquire about available advertising opportunities, please contact:

advertising @smttoday.com

NEXT EDITION

November’s edition will focus on productronica 2015 in Munich, Germany

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SMTA

International

2015

Donald Stephens Convention Center, Chicago, USA

Conference: 27th Sept – 1st Oct 2015 Exhibition: 29th – 30th Sept 2015

Attendees and exhibitors at this year’s event can expect a focused event with the strongest technical conference for which SMTA International has come to be known. SMTAI has been recognized as a truly di erent type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.

Learn more about the latest equipment and technology from the160 companies who will be exhibiting. In addition, the technical conferences will provide you with the latest research results and this year there are new session tracks including Flux, Solder, Adhesive (FSA) and Inspection Technologies (INS). There are 16 new tutorials including “LED, BGA and QFN Assembly and Inspection” which are free for members.

To get the most from the show and to stay updated on the latest trends and developments, we have gathered a sampling of the customers, products and systems that will be available at the exhibition:

Page 6 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

DEN-ON INSTRUMENTS

booth #707 PRODUCT To debut the 7th Model Series RD-500V Rework Station on Seika Machinery’s booth

Kyzen

booth #117

PRODUCT Will showcase its AQUANOX A4708 ph Neutral Electronic Assembly Cleaning Chemistry and celebrate 25 years of providing cleaning chemistries

MIRTEC

booth #407

PRODUCT Will showcase the latest advancement in their award- winning 3D AOI and SPI systems

Indium Corporation

booth #430 PRODUCT To share their knowledge and expertise on a number of technical papers and will also serve as chairs on four technical seminars

Juki Automation Systems

booth #718

PRODUCT To demonstrate updated exible solutions designed for both high-volume and high-mix environments

Viscom Inc.

booth #506 PRODUCT Will present the company’s new 3DAOI and CCI systems

Essemtec

booth #335

PRODUCT Will demonstrate the Paraquda G2 multifunctional center and Cubus storage system

Europlacer

booth #637 PRODUCT Will exhibit the iineo II SMT pick-and-place platform

BTU

booth #734

PRODUCT Will demonstrate the newly enhanced ENERGY PILOT software, designed to reduce and monitor the re ow over operating costs

Be Part of the Solution... Where Leaders Solve Tomorrow’s Challenges Today

meet the CEOs

the people who make it happen

Our industry is driven by a global network of CEOs with the energy and vision that brings new technology and innovation down the line. Every edition, we will introduce you to the faces behind the companies.

Aqua Klean Systems

Michael Schwager

Led by CEO Michael Schwager, Aqua Klean Systems has been an innovative leader in electronics manufacturing equipment since 1996. The company began with the design and manufacturing of zero-discharge water recycling systems. Shortly thereafter, Aqua Klean Systems began refurbishing, servicing and distributing used inline cleaners from all manufacturers. Over the last 19 years, Schwager and his team have consistently expanded as an international company serving customers throughout the world. Aqua Klean Systems has built up exceptional relationships with its customers by providing innovative products and outstanding customer service.

CyberOptics Corporation

Subodh Kulkarni

Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. The company’s products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. Through internal development and acquisitions, CyberOptics’s President and CEO Dr. Subodh Kulkarni is strategically repositioning the company to become a global leader in high-precision 3D sensors. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through facilities in North America, Asia and Europe.

Bentek

Mitch Schoch

Founded in 1985 and led by President and CEO Mitch Schoch, Bentek is a leader in manufacturing and engineering solutions for complex electro-mechanical and power distribution systems for the semiconductor and solar industries. Schoch and his team applied these extensive capabilities and knowledge into a comprehensive family of standard and con gure-to-order (CTO) solar combiner products. These solar combiners provide quality, ease of installation and safety to the solar industry.

Practical Components

Kevin Laphen

Practical Components is an international distributor of mechanical IC samples or “dummy” components, and also distributes SMD production tools and equipment. The company is led by President Kevin Laphen and is the exclusive distributor of mechanical samples for Amkor Technology. The company also distributes components from most other leading SMD manufacturers. Practical has a worldwide distribution network and in-stock availability of most popular package types.

Speedprint Technology

Mark Brawley

Speedprint became a division of Parable Trust Ltd., which acquired all assets of the Blakell Europlacer Group in 2013. In keeping with the ethos of the Blakell Group’s desire to o er exible and innovative solutions to the market, Mark Brawley, Vice President of Speedprint Technology, Americas’, and the Speedprint team are committed to delivering outstanding value and service with a ordable leading-edge stencil printing technology. The realization of this ambition is clearly illustrated by the company’s award-winning agship avi range of fully automatic inline printers. With more than 30 years’ experience in the design and manufacture of screen printers, Speedprint operates from a hi-tech facility based in Poole, United Kingdom.

Page 8 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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director

spotlight

an interview with

Jonny Nichols, National

Sales Manager, SAMSUNG

C&T Automation

by SMT today editor

SAMSUNG has developed advanced technology for electronic and mechanical design, process, and production with high speed and accuracy, leveraging the technical expertise of semiconductor equipment and industrial automation systems. Based on these technologies, they provide high speed and high precision SMT machines to customers to reach their company production goal.

In addition, SAMSUNG provides synergized SMT assembly solutions combined with world-class service and support throughout North America. Solutions include state of the art printing, placement, re ow and board handling technologies to achieve high quality and price-performance without compromising exibility and growth path on demand.

All systems include installation, training, warranty, 24/7 technical phone support, next business day onsite support, next business day shipment of emergency spare parts and free MMI software upgrades for life on selected gear. In order to support customers in the region properly, SAMSUNG o cially established SAMSUNG C&T Automation, Inc. in the USA in 2012.

modular or scalable format for real-time monitoring, feedback and correction of select equipment in the assembly line. SAMSUNG o ers industry-leading intelligent placement systems and line monitoring solutions capable of prediction and prevention (PnP), which ensures that respective processes are in control and quality product is being built.

‘‘ continuing

In my opinion,

education is the keystone process that characterizes a company’s ” ‘competitive’ edge

Q. What technology trends are you seeing emerge in the electronics industry?

A. The demand for SMART technology is on the rise. Not simply intelligent feeder systems for setup veri cation but solutions that utilize this information and more in a

monitoring

‘‘

SMART technology

The demand for

Q. SAMSUNG C&T Automation recently partnered with ACI Technologies and has agreed to demo a SAMSUNG machine in their showroom. What do you hope to accomplish by doing this?

A. A partnership with the American Competitiveness Institute (ACI) will reinforce brand awareness and market recognition by exposing SAMSUNG placement technology to progressive companies and individuals taking advantage of ACI’s services that include IPC training/certi cation programs, open-house tours and continuing education related to electronics manufacturing.

In my opinion, continuing education is the keystone process that characterizes a company’s “competitive” edge.

Q. How does SAMSUNG C&T Automation stand apart from their competitors?

A. SAMSUNG is a maker and user of factory automation technology with more than 24,000 electronic assembly systems produced since 1989. These systems are used for prototyping, new product introduction and volume production of electronics for a variety of markets including military, aerospace, medical, industrial, commercial and consumer.

SAMSUNG’s ying vision alignment systems, combined with auto-teach capability, provide high-quality control and repeatability while SMART auto-loading feeder technology minimizes setup and changeover times for e ciency and productivity — these are some of the many features that di erentiate SAMSUNG.

is on the rise. Not simply intelligent feeder systems for setup verification but solutions that utilize this information and more in a modular

or scalable format for real-time

”

Q. How do you think LEDs will play a role in future technology development and advancement and how will that a ect SAMSUNG?

A. Automation systems for processing LED applications will continue to grow and in uence electronics assembly systems. Demand for specialized equipment is on the rise for systems such as SAMSUNG’s SLM platform, which is capable of picking multiple LEDs simultaneously from the same feeder for integrated rank management bene ts.

Continued...

Page 10 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Family Values

for art Business.

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Traditional SMT mounters such as SAMSUNG’s SM series equipment are being in uenced as well. SAMSUNG SM series can be optionally con gured to handle extra large boards up to approximately 60” in length while using advanced feeder and nozzle technologies to optimize quality, process control, repeatability and performance.

LEDs will certainly play a major role in new technology development, continuous improvement and machine form factors going forward.

regions. What other changes do you see in the near future?

A. Well, to state the obvious: change is inevitable and good people are hard to nd. SAMSUNG is fortunate to have some of the most talented and committed personnel in the industry.

Yes, SAMSUNG is hiring, expanding and growing operations as needed to support our existing customers and the increasing demand for SAMSUNG automation solutions.

The challenge is staying ahead of the demand curve and changing accordingly with the right people in the right places at the right time. That said, more people and SAMSUNG locations are coming soon.

‘‘I happen to appreciate the core values of SAMSUNG’s philosophy — people, excellence, change, integrity and co-

rosperity. p”

Q. In June of 2015, a company called the Reputation Institute released a report that showed SAMSUNG is the world’s most reputable company, beating companies like Apple, Microsoft, and Google for the #1 spot.

How does working for a company with such strong name recognition and high brand awareness change the way you approach your job?

A. I happen to appreciate the core values of SAMSUNG’s philosophy — people, excellence, change, integrity and co- prosperity. Keeping these values in mind allows me to focus on what is really important both interpersonally and professionally so the impressions I make are consistent with the image and reputation of SAMSUNG.

Q. SAMSUNG has a reputation of strong customer relations and a high level of customer service.

To what do you attribute these qualities and is it difficult to maintain as the company continues to grow?

A. SAMSUNG is one of many rising stars in the electronic assembly marketplace. Like all stars on the move, brightness and intensity changes occur naturally depending on the viewer’s perspective. Frankly speaking, this is normal and the very nature of SAMSUNG.

It is this “movement” or momentum that progressively drives investment, timely expansion of operations, competitive product development and strategic initiatives scaled for all tiers of business.

Certainly there will be challenges along the way which SAMSUNG will meet head-on, working harder AND smarter to ensure long- term success.

‘‘

specialized equipment

is on the rise for systems such as SAMSUNG’s SLM platform, which is capable of picking multiple LEDs simultaneously from the same feeder

for integrated

Demand for

rank man”

agement benefits.

Q. Recently SAMSUNG has made some widely publicized new hires and appointed new representatives in several

Family Values for SMart Business

Page 12 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Profab Electronics Inc. Relies on SAMSUNG C&T Automation to Achieve the Highest Standard of Quality and Service

By smt today editor

Profab Electronics, Inc. operates with the philosophy that electronics play a central role in making the world a better place. Since its founding in 1992, Profab has cemented its position as an industry leader in contract manufacturing with its commitment to this idea through constant growth, adaptation and delivery of the highest-quality products.

order to maintain e ciency, speed and capability, Profab utilizes SAMSUNG placement systems and currently has six SAMSUNG machines including SM-421 Flexible Mounters and SM- 481 High-Speed Chip Shooters.

“Selecting and owning the best equipment in each category has been instrumental in our growth,” commented David Berent, Sales Manager at Profab. “We recently moved to a 60,000 sq. ft. facility, which gives us even more room for expansion. When I speak with a current customer or a potential customer I do not have to concern myself with whether we can handle the technology. It gives me freedom to know I won’t be faced with having to let a customer down.”

“SAMSUNG’s future depends on each and every customer’s experience,” commented Jonny Nichols, National Sales Manager at SAMSUNG. “We’re just as honored today as we were originally to have been selected by Profab to be the company’s preferred surface mount technology provider.

Like Profab, our business has grown signi cantly over the years thanks to customer con dence and investment in not only SAMSUNG technology, but the people and e orts behind the solutions that ensure long-term quality, reliability and performance. Congratulations to the Profab team on its new facility and purchase of additional SAMSUNG equipment!”

Easily one of the fastest growing electronics manufacturing service providers out of the South Eastern United States, Profab has expanded from one line in 2009 to three lines today. Profab supports prototype through medium/high-volume production and is an enterprising company known for its innovative processes and systems, in addition to consistently setting ambitious quality standards. Combining exibility, unparalleled experience and a dedication to quality, Profab offers full or partial turnkey prototype and production assembly of electronic assemblies.

very seriously — it is one of the main motivators to continually improve ourselves and Profab’s capabilities.”

Figure 2: Twenty years ago Profab was SAMSUNG’s rst customer in the United States. The partnership continues to this day proving that quality and support withstand the test of time.

Figure 3: Profab currently uses six of SAMSUNG’s placement systems, including exible mounters and high-speed chip shooters.

Figure 1: Profab recently expanded into a 60,000 sq. ft. facility in Florida. The company counts on strong partners like SAMSUNG to provide the best equipment in each of the categories that the company o ers. This has been instrumental in Profab’s growth.

“We enjoy the process of tackling the challenges our partners and clients present to us. We love what we do here; we provide solutions to some of the most intriguing challenges and get to participate in implementing them,” commented Ryan Levy, Director of Operations at Profab. “There is a feeling that we aren’t just in one eld (electronics manufacturing), we are given the opportunity to be at the forefront of developing and driving adoption of incredible new technologies. That’s something we take

This unique mentality is re ected in every part of the process that Profab o ers. As a ‘full-service partner,’ Profab o ers support to its customers from before the rst prototype through to full- scale production. There is total exibility in its approach to each project and a permanent attitude that anything is possible. “When we expand, whether it’s the physical space of our factory or the acquisition of new equipment, our intention is always to ensure that we will never have to decide that something is too hard or too much to do,” added Levy. “We prefer that there is never a question about our ability to give our customers what they want.”

SAMSUNG has been an ever-present partner in this endeavor. Profab was SAMSUNG’s rst customer in the United States and, 20 years later, continues to enjoy the terri c support and high-quality equipment SAMSUNG provides. “The ease of use, maintenance and speed allow us to promise a customer a product on time and produce it knowing our machines won’t fail. We always buy new machines from SAMSUNG knowing that they will take care of them and keep them running like day one many years from the purchase date,” said Levy.

SAMSUNG continues to prove to be a critical part of Profab’s ambitious aforementioned mission. In

Page 14 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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How Clean Is Clean Enough to Achieve Reliable Electronic Hardware?

By Mike Bixenman, DBA, and David Lober, KYZEN

Mark McMeen and Jason Tynes, STI Electronics, Inc.

The golden age of the Internet, digitization and social networking is in full swing. These technologies enable the Information Age from which every company and entrepreneur can cut costs, innovate new o erings and reach billions of new customers. Embedding information and telecommunication technologies in the form of sensors will increase productivity throughout the entire economy1.

problems due to intermittent connections, corrosion, electrical shorts and arching. These e ects can negatively impact device functionality and end user requirements. A wide range of contamination sources can be found in many places, including fabrication residues on components, post-soldering ux residues, processing equipment, cleaning machine e ectiveness, rework, etc., and requires a exible evaluation approach.

Bottom Terminated Components

Typical parts soldered onto the PCB have ux residues trapped between the component body and board (Figure 2). Cleanliness at the interface is critical to reliability and the least understood.3 Ionics in ux residue can exacerbate contamination levels under the component and/or creation of high resistance shorts across pads.

Figure 2: Residue under Bottom Termination

Generally clean does not mean the product is clean where it matters most. Location of residue matters. Residue pooled under the component may still be active and ionic in nature. Pockets of contamination are in uenced by ux type, placement, wash characteristics, solder paste volume, PCB cleanliness and component contamination. These factors create a “multi-variable” issue that is challenging to understand.

Experimental Design

This designed experiment seeks to quantify the in uence of surface insulation resistance (SIR) on a speci c set of ionic species and no-clean ux residues under bottom terminations. The intent is to explore SIR as it relates to species type, species concentration and conductor spacing. The output of this testing will be quanti able relationships between:

1. Ionic Concentration vs. SIR 2. SIR vs. Conductor Spacing

These outputs will be used to further develop this method with the goal of improving industry guidelines for maximum

Information technology drives processing speed, memory storage and, ultimately, new capacity. Technology is constantly improving digital product innovations that are increasingly faster, more e cient, more useful, a ordable and more powerful2. Speed is enabled from denser circuit designs, tighter pitch and shorter line spacing. The risk of residue present on the surface and under bottom terminations can impact chip performance at these shrinking dimensions.

Figure 1: Example of Residue under BTCs

Reliable hardware is more challenging to reproduce due to component size, residues trapped under bottom terminations, shorter distance between conductors, higher pinout devices in a smaller footprint, increased electrical eld and environmental factors3. There is no one universal test method for quantifying reliability risks. The amount and nature of the data generated depends on the product being produced, the consequences of failure and the end-use environment. A three-phase approach is commonly used to specify the manufacturing process requirements4.

Phase 1: Screening experiments with inexpensive test vehicles

Phase 2: Validation experiments with more representative test vehicles

Phase 3: Veri cation runs on manufactured assemblies

The purpose of this article is to develop an improved test method to measure the resistance on non-cleaned and cleaned test boards using low residue solder pastes under a series of bottom termination components. Testing the location, ux type, quantity and mobility may provide an improved risk assessment of reliability expectations.

‘‘

universal test method

There is no one

for quantifying reliability risks.

The amount and nature of the data generated depends on the product being produced, the consequences of failure and the end-

se environment. u”

The problem is that current chemical and electrical test methods limit the e ectiveness for testing residues entrapped under component terminations. Residues under the bottom termination have the highest potential for leakage and are the least understood. Site-speci c testing of the residue under the component termination has the potential to detect resistance drops. Gaining a better understanding of no-clean residues that do not outgas during re ow will help reliability engineers understand cleanliness at the interface.

Why Does Device Cleanliness Mat ter?

Insu ciently cleaned electronics can cause

Continued...

Page 16 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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technologies for your specific needs? When science and care converge, exceptional cleaning results.

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ionic concentration levels for given board densities/conductor spacings. It will also be used to produce minimally acceptable SIR (cleanliness) levels.

The test board has sensors placed under the bottom termination. The sensor traces provide real time SIR data within the residue. Locally exposed traces route to the boards edge for electrical access to volume between component and board.

There is a wide range of proprietary chemical makeups when it comes to uxes. Regardless of ux type, the warrantying agent of the nal product must have a clear understanding of the risks involved in producing and selling its products. Included in these risks are the detrimental e ects of contamination sources. The clear warning sign of that risk manifests itself through the presence of ionic components near solder terminations. These compounds have the capability of migrating under a voltage bias, which produces a current. An even more dramatic result of the presence of ionic compounds is the creation of dendrites.

‘‘any fluxes are designed to leave trace levels of inactive residues, rendering them ” relatively harmless

Dendrites serve as semi-permanent conductive paths between previously unconnected PCB pads. They are constructed out of ionic compounds that were permitted to remain on a PCB and, under voltage bias, create a fully continuous chain of electrically conductive molecules between terminals. The result is current leakage and irregular performance in the nal product.

Hypothesis 1: Some ionic constituents within solder ux residues are more detrimental than others.

Species Identification

The most commonly-present ionic constituents within solder ux residues have been narrowed down to a handful of ionic compounds. Some compounds are more detrimental than others; however, the impact of each can be quanti ed. The table overleaf shows a list of compounds, broken into groups of ionics (anion and cation) and weak organic acids.

Hydration/Carrier System

Regardless of the compound, a uid carrier system must be present in order to allow the ionic compound(s) to mobilize. The most viable carrier system is water. Water, without contaminants and in a normal air environment, tends toward a resistance on the order of 1-5 MΩ. The presence of su cient moisture allows for the ionic species to mobilize in unique ways that provide repeatable resistance values that are often greater than 10 MΩ. Overhydrated compounds tend toward a resistance equivalent to water, masking the e ects of the contaminant. A consistent hydration method is necessary to provide repeatable hydration levels to the ionics present on the PCB.

Hypothesis 2: Reduced spacing between test locations correlates to lower SIR values.

Figure 3: Sensors placed under Bottom Termination

Background to the Problem

In electronics manufacturing, solder paste is deposited onto PCBs and used to produce solder connections between discrete devices and the PCB. The assembly is heated above the melting point of the solder and allowed to cool. This process causes the ux to volatilize and ultimately vaporize. During volatilization, the ux removes oxides and permits the solder to chemically bond with the PCB and component. Ideally, the ux then vaporizes and is removed by dissipating into the surrounding atmosphere, leaving only solder behind.

‘‘Generally clean does not mean the product is clean where i”t matters most.

Practically, however, there is commonly a residual component of ux remaining – ux that never fully vaporized or was prevented from dissipating. This ux residue, depending on its chemical constituents, can have varied impacts on the nal assembly. Many uxes are designed to leave trace levels of inactive residues, rendering them relatively harmless. Conversely, ux is designed to attack metals, which makes leaving volatile/ active uxes on a PCB problematic.

Figure 4: Active Residues lead to Leakage Currents

Page 18 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Anions

Cations

Weak Organic Acids

Bromide

Ammonium

Acetate

Chloride

Calcium

Adipio Acid

Fluoride

Lithium

Formate

Nitrate

Magnesium

Maleic Acid

Nitrite

Potassium

MSA

Phosphate

Sodium

Succinic Acid

Sulfate

Table 1: Ionic Constituents of Concern on PCBs

Conductor Spacing

It is theorized that increasing the spacing between test locations will demonstrate a corresponding increase in SIR resistance values. The coupon used to conduct this testing incorporates parallel, exposed sensor traces. These traces are .005” (.127 mm) wide and are separated by .005”. Therefore, the testing adjacent sensor traces (7 to 8, 8 to 9, etc.) provides insight

It is expected that the SIR for .005” will be substantially lower than that of .075” simply because there is a larger gap. The ability to vary conductor spacing will allow for the sensitivity of cleanliness levels to be associated with the density of the components on a board. A more densely populated board or one with ne pitch BGAs, for example, would have a more stringent SIR requirement than a board that

voltage be of an equivalent value. At 5.5V, a 1 MΩ resistor draws 5.5 μA of current – easily measured by standard equipment.

‘‘Regardless of the compound, a fluid carrier systemmustbepresentin order to allow the ionic compound(s) to mobilize”

1 ft./min

5 ft./min

8 ft./min

Data Findings

Flux Testing Results

Three solder pastes supplied by a common ux manufacturer were selected to have low,

Continued...

into the SIR over a .005” (.381 mm) gap. Skipping a trace (7 to 9, 8 to 10) provides insight into the SIR over a .015” gap (.005” space + .005” trace + .005” space).

‘‘The most commonly- present ionic constituents within solder flux residues have been narrowed

down to a handfu”

ionic compounds.

With a total of 13 conductors, the e ects of conductor spacing can be evaluated for .005”, .015”, .025” ... .115” spaces.

uses only through-hole technology parts. The increase in conductor spacing could realize a decrease in SIR stringency. For this study, 5 and 15 mil spacing located at the center of the array was measured.

Noise Effects on High Impedance Measurements

High impedance meters measure resistance levels greater than that of polyimide or FR-4 materials. For this testing, a representative voltage is applied across the test traces, and the current is measured. The equipment performs a quotient between the supplied voltage and measured current to determine the equivalent impedance. Representative voltages in a digital circuit tend to be 2.5 – 5.5V, and thus justi es that the supplied

Figure 5: SIR Sensors under BTCs

l of

Figure 6: Residue remaining under BTC as a function of cleaning time

medium and high activity ux compositions. These designations were provided by the ux manufacturer based from their knowledge of the ux formulation. Three boards of each ux were cleaned using an aqueous cleaning agent in an in-line washer at 15% cleaner concentration at 150°F. The cleaning agent selected was known from experience to be capable of removing all of the ux from underneath these components. The belt speed of the in-line was varied to give di erent levels of cleaning. The belt speeds selected were 1 ft./min which provided complete cleaning of the ux residues, 5 ft./min which provided partial ux removal and 8 ft./min which provided virtually no cleaning. Following the aqueous cleaning process, the resistance between 4 sets of adjacent traces and 4 sets of alternating traces was measured. The measurements were carried out using ambient o ce environmental conditions (20-25°C and approximately 30% RH). Due to capacitive e ects a stepped DC voltage waveform was applied. The +3.3 V DC bias was applied for 15 seconds prior to a current measurement. The voltage was then switched to -3.3 V for 15 seconds before another current measurement was made. This was then repeated a second time yielding a total of 4 resistance measurements per sensor trace pair. The resistances for each sensor distance were average for each board. The data ndings are presented in the gures below. Zero on the chart represents boards that tested the resistance of the solder paste residue before cleaning.

Species Results

For the species testing, one drop of the ionic species at the desired concentration was placed on the sensor traces. The board was then placed in a 110°C oven for 30 minutes and then allowed to cool in a desiccator for 1 hour. The results of the species testing are presented in the gures below.

Conclusion

There is a set of IPC speci cations that drive industry compliance. The problem is that these tests do not provide the resolution needed to measure highly dense devices using BTCs. This creates a totally new environment that calls for improved test methods and speci cations to quantify the issues and problems associated with residues under BTCs. The research is driving toward a better model for making accurate risk assessments.

OEMs currently count on CMs for qualifying and validating process conditions. The

problem is that the CM warranty does not meet OEM warranty expectations. How does the OEM obtain the data needed to satisfy the CM warranty and consumer expectations? If these expectations can be integrated, the OEM now has the knowledge to make accurate assessments of their product toward consumer expectations. Quality and reliability engineers need to capture the right variables that allow them to meet their quality objectives. When people have horizons of 10-25 years, there is a gap in knowing whether or not you are clean enough. The problem is that the stakeholder is the OEM, not the CM who is making the decision on materials and process parameters.

To achieve this level of granularity, the testing methods in work have the potential to provide better resolution for answering these questions. Is the research method perfected today? No, but that is why you learn from the data ndings, con rm your assumptions and design follow on research to move from a hypothetical position to theory. The whole goal is to con rm our theorems in an e ort to improve standards.

The ux study con rmed the old saying “if you are going to do a job, do it right or not at all.” While there was substantial variation in the data, this preliminary study shows that the electrical resistance underneath components can be measured using voltages that are representative of modern circuits and environmental conditions. This is not extreme.

The species testing provides needed insight into quantifying ionic levels for each ion that can lead to a drop in resistance. Follow on study is needed to gain a clearer understanding of the method for isolating speci c ions. By doing so, an accurate assessment of levels can be correlated to electric eld.

**Originally presented by KYZEN at SMTA ICSR.

Figure 7: Low Activity Boards Cleaned and Measured

Figure 9: High Activity Boards Cleaned and Measured

Figure 10: NaCl Species Data Findings at PPM Levels

Figure 11: Benzoic Acid Species Data Findings at PPM Levels

Figure 8: Medium Activity Boards Cleaned and Measured

References

1. Bryzek J. (Nov. 2014). Living Connected Through a Trillion Sensors. SMTA International Conference on Soldering and Reliability. San Jose, CA.

2. Ismail, S, Malone, M.S., & Yuri, V.G. (2014, Dec). Exponential Organizations: Why new organizations are ten times better, faster and cheaper than others. Singularity University.

3. McMeen, M. (2014, Nov). Complex Electronic Assembly Cleanliness Requirements. IPC/ SMTA High Performance Cleaning Conference, Schaumberg, IL.

4. IPC-CH-65B. (2011, July). Guidelines for Cleaning of Printed Boards and Assemblies. IPC Association for Connecting Electronics Hardware.

Page 20 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Development of High Wettability Flux Cored Wire Solder

by KOKI Company Limited, Adachi-ku, Tokyo, Japan

Abstract

New ux cored wire solder with new activators has been developed to attain high wettability performance. This new wire solder is equipped with faster and longer wettability performance which makes it ideal for automated soldering process. In addition to its general performance, this new wire solder achieves high ux activation with optimal surface insulation resistance and low corrosion property, as con rmed by both JIP (Japanese Industrial Standards) and the IPC (Association Connecting Electronics Industries).

Figure 1: Wettability vs. continuity of activators

Electrical and electronic products today have multiple functions and are composed of various different electric components. Consumer electrical products may swiftly become popular on the market if they are reasonably priced. Makers try to produce a product which is reasonably priced to attract consumers yet pro table through engaging in cost reduction on parts procurement and process e ciency improvement. Smart phones are the best example of such products. Making an e cient process is important from the standpoint of not only cost reduction but also energy saving.

Surface Mount Technology (SMT) is the major technology applied to today’s electronic device manufacturing and solder paste is the mainstream of soldering material. However, insertion mount components, such as connector modules or large electrolytic capacitor, use ow soldering or manual soldering by soldering iron. Therefore, ux and wire solders are as important materials for the soldering as solder pastes.

Slide soldering is one of the soldering techniques useful to solder connectors to obtain high joint strength at a narrow location by selecting appropriate wire diameter and iron tip size. Slide soldering by automation enables a large number of connector pins to be soldered in a single stretch; therefore, widely used at many manufacturing factories.

To achieve both speed and quality using slide soldering, pins or leads must wet quickly and the solder must wrap around them very quickly.

This article introduces Koki’s wire solder series 72M which is specially designed for fast solder wrapping to help shorten the production tact time.

1. Flux Engineered to best accommodate automated slide soldering

Automated slide soldering process comprises of (1) heating components, (2) feeding wire solder, and (3) forming solder joints simultaneously by using a gate-shaped soldering tip which is slid along the component leads and wire solder which is fed in the direction of the soldering tip.

The ux should wet the leads or pins as quickly as possible in order to perform aforementioned (1) through (3) and to get an acceptable solder joint at a very high slide speed. Whereas, the automated shot soldering, which is similar to the manual soldering; where one spot is soldered at a time, the time required to wet the component lead is not so critical.

To achieve (3) Forming solder joint quickly, molten solder needs to wet into the Through- Hole (TH) fast and oxidation of the solder surface must be prevented to maintain surface tension. In addition, ux must retain its ability to remove the oxidized lm ( ux activation) as the wire solder is continuously fed to the iron tip.

Flux constituents include natural or modi ed resin and activator to remove oxidized lm, such as organic acid or halides. In order to develop a fast and continuously active ux, an extensive study was conducted on the new activator.

Figure 1 summarizes this study. Prototype ux was produced by adding di erent activation agents one by one into the base ux. X-axis indicates continuity and Y-axis shows wettability. Low wettability leads to bridging.

Activator A looked to be performing well on wettability at rst, but was poor on continuity as wettability rapidly degraded as the slide soldering was repeated. Activator B maintained activation after repeated slide soldering; however, it was not fast acting, as it showed poor wettability in the beginning. Activator C performed good wettability in the beginning and good wettability was maintained.

Therefore, Activator C with good wettability and continuity was sent to the next development stage.

2. Evaluations by Actual Slide Soldering Set-up

To evaluate the performance of ux with the new activator, prototype wire solder was tested for bridging occurrence and solder lling at various temperatures and slide speeds. When the slide speed is too fast, solder fails to form round llet around pins and leads to a bridging defect. On the other hand, if the tip

temperature is too low, solder’s uidity is found to be lower and causes bridging or insu cient through-hole ll. Therefore, the toughest process parameter for the automated slide soldering is going to be low iron tip temperature and fast tip sliding speed.

This performance test was conducted using a Ni/Au plated leaded component inserted into through-hole (diameter: 1.0mm) on an OSP test board (made of FR-4, thickness is 1.6mm). Wire solder diameter used was 0.5mm. Three di erent iron tip temperatures were used: at 330, 350 and 380˚C. Slide speed was 6mm/ sec. and 13mm/sec. Figure 2 and 3 show the performance test result.

The new ux (72M) was capable of reducing

bridges signi cantly, even at a toughest process parameter: higher slide speed and lower tip temperature. In addition, less solder pads exposed on the component side is indication of the su cient through-hole ll.

Figure 2: Number of bridges (Top: Slide Speed at 6mm/sec., Bottom: Slide Speed at13mm/sec.)

Page 22 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Figure 6: Insulation Resistance Test Results and Magni ed Image at Comb Shape

Figure 3: Through-hole Fill Level Soldered at 13mm/Sec.

In summary, 72M is a ux suitable for slide soldering at fast speed. It can also be stated that 72M is ideal for soldering components which are sensitive to the heat as it signi cantly reduced bridging defects even at a considerably lower tip temperature.

Figure 4 shows the ux residue of 72M and conventional product. 72M shows less residue cracks and it is lighter in color. These properties are owed to a reduced additive amount by selecting di erent ingredients than conventional ux and activation agents with stronger activation. Lighter residue color allows making judgment easier in the visual test for quality inspection. 72M ux’s processability improvement is not just for wettability and ease of inspection. User experience is improved by reducing the smell of ux fume.

3. Reliability

Reliability is one of the most important aspects of the ux. Critical ux reliability tests are considered to be electrical insulation (SIR) and copper corrosion of the ux residue. A ux with more aggressive activating agents improves wettability

Figure 5 shows change in insulation resistance and actual image of comb shape. Stress test condition was 85˚C/ 85%RH and stress voltage was DC50V. 72M ux residue maintained above 1010Ω for over 1000 hours. In addition, no evidence of electromigration was observed.

Same results were obtained by the reliability tests conducted in accordance with IPC TM- 650 2.6.3.7 (see Figure 6).

As for the copper corrosion, 72M residue was determined to be no corrosion per JIS and IPC method (see Figure 7).

4. Available Alloys

Wire solders with 72M core are available in Sn3.0Ag0.5Cu(SAC305), low-Ag iron tip erosion resistant S01X7Ca(Sn0.1Ag0.7Cu0.03Co+α) and S03X7Ca(Sn0.3Ag0.7Ci0.03Co+α), hybrid strengthening low-Ag alloy (S1XBIG(Sn1.1Ag0.7Cu1.8Bi+Ni) and high durability alloy SB6N(Sn3.5Ag0.5Bi6.0In) to meet variety of needs while maintaining high wettability and processability.

Figure 7: Copper Plate Corrosion Test Result (JIS and IPC)

- EM Test Result (Original Method, JIS Test Board)

iron tip. New iron tips is composed of Cu core for high thermal conductivity, Fe plating layer to prevent it from reacting with solder, and thin Sn plating layer. Top Fe plating layer is exposed to high temperature, resulting in cycling oxidation and reduction. This consumes Top Fe layer rapidly, resulting in Cu core exposure. Copper core easily reacts with solder alloy forming voids and deteriorating thermal conductivity. At this stage, iron tips need to be replaced.

For conventional eutectic Sn40Pb, iron tip erosion was a less serious issue as Pb in the solder could form Pb-Fe compound around the interface and resist Fe in the Sn-Fe compound to disperse into the solder. On the other hand, popular Pb free solders, such as SAC305, Fe in the iron tip continuously disperse into the solder and erodes iron tip fast.

S01X7Ca and S03X7Ca has Co as an additive which replaces Sn-Fe compound and forms 3 barrier layers (Fe plating>SnFe>SnCoFe>SnCo) to prevent Fe dispersion and iron tip erosion.

6. Summary

• Signi cantly improved wettability by new

• Significantly improved automation processability and preferable ux residue color

• High Reliability (Insulation Resistance, Copper Corrosion)

• Available in variety of solder alloys

Figure 5: Insulation Resistance Test Result and Magni ed Image at Comb Shape

ux formula

Figure 4: Fillet shape and Residue Appearance (Slide Speed: 13mm/s, Iron Tip Temp.:380˚C)

but increases concerns on lower insulation resistance performance and corrosion of the copper pad. JIS (JIS Z 3197) de nes insulation resistance to be conducted on a test piece which is produced by solving ux into IPA, apply on the JIS comb-shape board then dip soldered. To test 72M’s reliability, test boards were soldered using 72M cored wire solder to obtain a more practical result.

- SIR Test Result (IPC TM-650 2.6.3.7)

5. Iron-tip Erosion Resistance Low Ag iron tip erosion resistant solder alloys, S01X7Ca (Sn0.1Ag0.7Cu0.03Co+α) and S03X7Ca (Sn0.3Ag0.7Ci0.03Co+α) eliminates one of the serious drawback of soldering with

AN INTERVIEW WITH John

Dignan, Owner and Managing

Director of Dynamic EMS

by Gayle Paterson, Columnist and Scoop Communications’ Account Director

John Dignan recently become the Owner and MD of Dynamic EMS, ten years after he started with the company as their Sales Director, having already spent many years in the industry.

Based in Dunfermline, Scotland, Dynamic EMS now employs close to 100 sta and has grown rapidly under John’s leadership, I asked John to share some of the secrets of his success.

9.00 am to review the previous day’s outputs, misses and opportunities. Typical days end around 6.00 pm, but I am generally available until 9.00 pm.

I think the biggest challenges the company faces is ensuring that we continue to develop mutually bene cial business relationships with new customers as well as growing the company organically. Our customer retention is very positive as we have adopted a “Service Model” that enables the company to be very responsive to the increasing demand of the EMS industry. In our industry, margins are very thin and this is always a challenge.

Q: What can you tell me about the future, new partnerships, products or plans for continued growth and investment?

A: Dynamic EMS are always continuing to build its ‘business eco system’ with a variety of organisations that will ultimately result in some form of customer engagement in the near to mid-term. As the company grows we will be strategic also in our investments and look for return on investment.

Dynamic EMS has developed a sales strategy that is very much sector based and diversi ed in ‘niche’ technologies which looks to attract likeminded individuals who value our service o ering. I think that the growth has come by deploying this strategy and by choosing the right customers to engage with. We have also engaged and enjoyed success with a number of signi cant industrial sector based customers.

I see Dynamic EMS continuing to grow its UK indigenous business with the potential to grow on an international basis as we look to attract more European based customers.

It’s very important to understand the need of the customer and, indeed, the needs of our customers’ customer. Having been with Dynamic EMS for ten years the majority of our customer base were captured in my role as Sales Director so I have developed good personal relationships at a CEO level which de nitely helps.

Q. Your success is a wonderful achievement and highlights a real personal and professional commitmenttoDynamicEMS. Isthisamodel you plan to take forward into the company, where anyone can reach the top?

A. I think the company operates a very paternalistic, open culture towards its employees who have served the company well over many years. With an average service of 18 years our employees are truly an inspiration for me in the way they approach their ‘day to day’ work and their loyalty to ensure that Dynamic EMS achieves its aspirations.

I think it’s important to hold the door of opportunity open for every person –so anyone with commitment can indeed ‘reach the top’ however that is de ned.

Q. What culture and leadership style would you say you bring to the organisation and how has it been received and adopted?

A. I‘d suggest that I’m consultative in my leadership style placing accountabilities for the day to day running of the business with the management team, but still very hands on. The management team are given clear direction and are results driven, with a focus on providing demonstrable evidence in the decision making process. I would hope that this style would attribute to the performance of the company that has grown in revenue terms 26% in 2014 and is in a good position to grow in 2015.

The overall direction of the company and its performance is disseminated to all employees in our ‘speech to the nation’ on a monthly basis. The senior leadership team (including directors) have ‘shared objectives’ that are measureable, presented on a monthly basis and form the basis of our KPI (Key Performance Indicators) dashboard.

As an Individual I have ‘external mentors’ (former colleagues etc.) who advise on strategy as well as evolving the strategy with other board members. The Dynamic EMS board meets daily

to discuss performance. Strategy and overall alignment of ‘shared objectives.’

I believe Dynamic EMS Ltd is very fair with employees and, as I said, our sta turnover is less than 1%. We have employees here who have served the company through its evolution for more than 35 years. We o er our employees good bene ts and this is re ected in our retention levels.

‘‘

team are given clear

The management

direction and are results driven, with

a focus on providing demonstrable evidence in the decision making process.”

Q. You’ve gone from Business Development to Owner and MD, what does a typical day look like now and how does your new position challenge you?

A. Typical days for me have always started early, around 5.30 am, where I am usually reviewing emails and planning calls etc. over a cup of tea. Our rst ‘meet of the day’ is usually around 8.00 am followed by our ‘morning prayers’ session where the directors meet at

Biography:

John Dignan has been part of the EMS industry for 30 years and has held senior operational and sales roles within Solectron, FCI Areva, Northrop Grumman and Plexus Corporation.

He joined Dynamic EMS in 2005 as Sales Director and became Managing Director in 2011.

In 2014 John acquired Dynamic EMS Ltd.

John studied electrical and electronics engineering and then in later years completed an MBA at Edinburgh University and is also a Fellow of ISMM (Institute of Sales and Marketing Management).

Page 24 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Conformal Coating in the 21st Century By Brad Banfill, Equipment Program Manager, Specialty

Coating Systems

State of Conformal Coating Equipment

Conformal coating is a term that covers many applications. The technology ranges from spray coating to speci c dispensing for the application of material dots, lines, lls, even glob tops and potting. Because of the variety of industries that need this technology and multitude of complex and diverse applications, true automation is often more of a manufacturer’s dream than a reality.

Every industry bene ts from conformal coating protection of their substrates, electronics and other delicate components. The applications are extremely diverse and what ts the needs of one manufacturer does not t all. That is also true of the materials that need to be applied – one coating does not t every application. Over the years, automation in material application has grown, but manufacturers are often still using multiple systems speci c to one or more coating materials and/or processes. In fact, even with today’s drive for fully automated facilities, some manufacturers continue to apply materials via manual or semi-manual methods, including brush coating, dip coating and/or spray gun/booth processes.

The latest in conformal coating and dispensing systems changes much of this by bringing more complete automation to the manufacturing oor - single systems that provide exible, con gurable solutions for multiple materials and applications processes.

Selecting a Coating

Conformal coating is most often necessary to protect delicate electronics and other devices from contamination and ultimate failure. While the shrinking size of today’s advanced assemblies adds to the complexity of choosing a material and a coating process, it is not just physically small assemblies that require protection. Large devices and components used in automotive and aerospace applications, wind turbines and large LED lighting arrays also need to stand up to harsh environments for years at a time as maintenance, warranty and replacement costs are high for manufacturers. Whether large or small, long or short product life, there are many formulations of conformal coating chemistries to consider.

Traditional coating materials include acrylics (AR), epoxies (ER), parylenes (XY), silicones (SR) and urethanes (UR), but the list of available materials and dual/hybrid technologies is quite lengthy. The speci c properties of a coating – application methods, curing requirements, the bene ts they o er end applications, etc. – must be reviewed by product designers and manufacturers

on a per project basis to achieve desired results. Yet while choosing the right coating material can be challenging, today’s easily programmable, multi-functional, multi-valve coating systems allow for the application of virtually any material a manufacturer needs to apply – by a host of application processes.

‘‘Whether large or small, long or short product life, there are many formulations of conformal coating chemistries to consider”

The Automation Answer

While automation of basic material dispensing systems for PCBs began over four decades ago, traditional dispensing and conformal coating applications were not coupled together until recent years. Most dispensing systems have been designed for high speed, large volume solder/epoxy dot or line applications and often cannot be used in applications that require more exibility, e.g. applying multiple types of materials on the same substrate and/or using spray and certain dispensing techniques within the same process, etc. Modern automation technologies have brought more exibility and precision to the conformal coating industry. The latest systems are easily programmable and provide exible con gurations, with user- selected dispensing and spray valves that move along a direct-drive, three-axis system. Some systems available also o er truly programmable fourth and fth axes, which can be added for tilt and rotation capabilities.

Today, manufacturers can nd con gurable conformal coating systems with multiple application heads that can handle a wide range of applications, including dispensing of one or two part coatings, applying lines and dots of any size, quickly jetting materials into any pattern, precisely and controllably spraying for maximum coverage and applying coatings around a radius (360° rotation). The same system that handles two-part metering may switch to handle multiple coating materials and may even be used for solder paste dispensing for electronic applications.

Where manual coating methods (e.g. dip, brush, and manual spray) typically require

Figure 1: Modern spray coating and dispense systems, like the SCS Precisioncoat, o er unmatched automation, exibility and accuracy for manufacturers.

Figure 2: Selective spray coating valves enable coatings to be applied e ciently with a high level of accuracy, limiting or completely eliminating the need for pre-coat masking.

Continued...

Page 26 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

SPECIALTY CDATINL3 SYSTEMS”

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feature continued...

some form of masking on assemblies to keep coating o of critical components, today’s automated, programmable systems help to make masking a thing of the past. Through simple programming and precise application techniques, keeping sensitive areas coating- free is done easily and accurately as terrain- following coating heads move along three to ve axes, with angular de ection of up to 45° to reach all surfaces on a board. Fiducial recognition, laser height sensing and needle calibration are just a sample of the available options that help ensure boards are coated accurately. In addition, atomized spray heads o er programmable spray patterns and continuous on/o operation for highly accurate, fast coverage, while a needle dispenser applies coating into deep recesses and around tall components.

The latest in advanced conformal coating and dispensing systems o er proprietary Windows®-based software, which enables device and system integration features. Advanced software allows for the transfer of processes between machines and locations, and the ability to upload CAD drawings further simpli es the programming process. Additionally, for companies that operate out of multiple regions, computer-integrated systems can be set to cross language

barriers. Finally, system software can monitor peripheral needs (e.g. material supply) with low level alarms and automated shutdown, reducing the time required by operators for system monitoring. Fully programmable software, in conjunction with a exible, con gurable system, provides the exibility and accuracy that manufacturers can rely on in their daily production.

‘‘Fiducial recognition, laser height sensing and needle calibration are just a sample of the available options that help ensure boards are ”coated accurately

Along with the ease of both o ine and inline programming, most modern systems o er bar code readers, which detect a unique code on the device to be processed. Upon identifying the board, the system software selects the proper coating and/or dispensing program, including coating parameters (e.g.

conveyor width, speed of coating, height, exact coating to be used, the dispensing paths and which spray/dispense heads to use) to e ciently and e ectively process parts. These features, and more, enable less operator intervention, saving labor and time while increasing e ciency and accuracy.

Understanding the Options

As manufacturers understand the various conformal coating material options and their inherent application and curing processes, selecting a exible, fully automated system can greatly maximize e ciency and accuracy on the production oor and, ultimately, increase the reliability of the end products.

Because of the wide range of features available in today’s automated conformal coating and material dispensing systems, and the ability for some equipment providers to specially design and/or customize units for speci c manufacturer needs and requirements, customers should discuss their speci c application and even arrange customized demonstrations before making a nal system purchase.

By understanding exactly what you need and what the latest equipment can do to help you run a more streamlined operation, manufacturing processes will only improve in the long run.

bban [email protected] www.scscoatings.com

Figure 3: Manufacturers often bene t from easily con gurable valves to allow quick and easy transitions from a selection of spray and dispense valves, including atomized spray valves, jetting technology, dispense valves, spot UV wands, etc.

Figure 4: Fully programmable 3-5 axes coating systems allow manufacturers to apply their materials with great precision, including 45° tilt and 360° rotation capabilities.

Page 28 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Page 32 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Interview with Raymond LaFleur, General Manager Overseas Sales and Marketing, DEN-ON INSTRUMENTS CO. LTD.

by smt today editor

Established in 1963, DEN-ON INSTRUMENTS CO. LTD. researches, develops, designs and manufactures tools for the electronics industry. The company o ers a complete range of rework equipment as well as soldering/desoldering tools and preheaters.

DEN-ON INSTRUMENTS has a liations with the Japan Printed Circuit Association (JPCA) and the IPC — Association Connecting Electronics Industries in the United States. DEN-ON INSTRUMENTS features a variety of advanced rework systems, soldering/desoldering tools and preheaters designed to advance customers to the top of their industry.

A. We have built our company on customer support and we strongly feel that without it we are just another product being sold on the market with a short lifespan. No company today can survive without recognizing that customer service is essential before and after the sale, which is key to staying successful. We feel that long-term support – even after warranty – also plays a key role in being a success. Ultimately, sales and growth come through interaction with customers and service does that best. Solve a customer’s problem and they will continue to come to you for solutions.

Q: Where do you see the company in 10 years? Do you think it will have evolved/ changed to t the needs of the industry? Can you explain what you think those needs could be?

A: We see DEN-ON with a continued presence in the marketplace with its proven quality products. We also see extending our reach into more markets, especially the Western hemisphere, in order to provide the most e cient, cost-e ective solutions for the needs of customers and to always be prepared for next- generation technologies. DEN-ON recognizes that we cannot become complacent and think that we can survive with the status quo.

Any company that wants to do more than survive must evolve, stay progressive and innovative on a constant basis. We know in the future that competition will continue to be erce and that DEN-ON must continue to build a reliable, quality product that is within a price range that can compete, without lowering our longstanding quality standards.

The industry is always looking for a practical solution to reduce their cost of manufacturing, looking for quicker ways to assembly and seemingly moving towards more automation that is reliable and a ordable.

Q. Do you plan to introduce any new technologies in the coming months? If so, can you brie y explain them?

A. Our products are evolving every day. We are always striving to be better and re ne our machines to make them more e cient and responsive to customer needs. This will continue to be the case as new and improved technologies continue to proliferate in the form of cost-e ective solutions from DEN-ON.

We are developing some new products based on market needs that will be introduced soon and they will focus on miniaturization and fully automating the rework process.

We recently spoke with Raymond LaFleur, DEN-ON’s General Manager Overseas Sales and Marketing, to nd out more about the company and its goals for the future.

Q. What makes DEN-ON stand out from its competition? What makes it special?

A. DEN-ON is a longstanding soldering and desoldering tool company that has been in the industry for more than 50 years. We have comfortably survived every uctuation in the world economy for a number of reasons – the provision of the best solutions to our customers’ needs by supplying them with high-quality, reliable products and sustained, solid support.

We feel that the best formula for any company to stand out among its competition are the basics. Such basics include the ability to provide not just equipment, but the best solutions to meet their needs at a price that is within their budget, together with reliable support. Our products are also continually progressive with technology and it is our driving force to stay many steps ahead of the newest technology before it is fully introduced to the market. Our rework stations, speci cally our newest model the RD500V series, along with our applications support in the eld have an excellent track record of being a solid performer 24/7 with a proven uptime of more than 99 percent during operation.

Additionally, DEN-ON produces equipment not just for the high-end electronics market with our semi-automated repair equipment, but also the low-end market with our line of hand tools that have been around for more than 50 years.

Q. What goals do you hope to accomplish by the end of 2015?

A. Our goals are many but the main one is to continue making the high-quality tools that we have been manufacturing for more

than 50 years for the market and to continue providing outstanding customer solutions. One of our other important goals is to send out a message - we want to make the DEN-ON name recognized globally for our high-quality, reliable products. Although we have been in the business for many years and have sold equipment in every country that manufactures electronics, there are some parts of the world in which the DEN-ON brand name is not well known. Speci cally in the Western Hemisphere, we would like to increase our recognition of the DEN-ON products as being top quality, covering the full spectrum of the PCB repair market that incorporates very large complex PCBs down to the smallest PCBs. Finally, our continued goal is to maintain our company’s reputation of providing the best support for our products, which has made us who we are today.

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for the high-end electronics market with our semi- automated repair equipment, but also the low-end market with our line of hand tools that have been

around f” 50 years.

or more than

Q. What is your customer service like? How big of a role do you think customer service plays in the overall success of your company?

new products

exciting new industry innovation

Keeping you informed of the latest developments in technology and innovation within our global electronics industry.

ScienscopeLaunchesX-Scope8000 AXI

AXI systems from Scienscope are fully automatic X-ray inspection machines using new advanced servo axis motion technology in order to rotate the target, and move the at paneldetectorstoanobliqueangle.Usingthis newinnovativedesignallowsthemachineto move to these positions quickly and precisely, which is important when using inline X-ray for 100% inspection. Our new innovative design enables us to o er this very advanced X-ray system at a very economical price that is a fraction of similar machines in this category.

The new AXI machines from Scienscope will maintain our usual best in class price to performance ratio, and will also include top- notch features such as fully automated s/w tools. Standard features include: The latest technology sealed tube wide angel X-ray source, ultra-High resolution digital at panel detectors, automatic void detection/calculation/reporting, automatic ball area measurement, automatic o set measurement, automatic missing ball and solder paste detection, and can accommodate board sizes up to 650mm x 600mm (25.5 x 23.6”).

Operation could not be any easier. There are numerous built in automated tools that, once set up, do not need to be touched or modi ed. In addition to the most important automated tools there are many manual tools for easy manipulation. There is also not a lot of maintenance on Scienscope X-ray machines. Scienscope uses the latest technology closed tube X-ray sources that have micro-focus ability giving a crystal clear image and require no maintenance other than a simple calibration. Typical life expectancy of the tube is more than 10,000 hours.

www.scienscope.com

BTU PYRAMAXTM Re ow Ovens Meet Fuji Dual Lane Requirements

BTU International, Inc., a leading supplier of advanced thermal processing equipment

for the electronics manufacturing markets, has successfully launched its Fuji compliant dual lane conveyor solution on the PYRAMAXTM family of re ow ovens used for printed circuit boards.

This dual lane solution is fully compliant with Fuji Machine Mfg. Co., Ltd.’s automated surface mount placement lines providing up to two lanes of travel to a maximum width of 320.5 mm per lane. A lane to lane minimum distance of 46 mm can be achieved. The conveyor is also capable of operating in a single lane mode with a maximum width of 552.1 mm. This tight integration with up and downstream equipment eliminates the need for additional handling equipment and interfaces reducing capital expense and overall line footprint.

www.btu.com

ODELI Directors

Electrolube Resin Proves A Hit With French Lighting Specialist Odeli

The French LED luminaire and custom lighting manufacturer, Odeli, found an ideal production partner in Electrolube, whose UR5635 hazy polyurethane resin proved the best solution for protecting LED lighting products destined for the European Games Stadium at Baku, Azerbaijan.

Having given Electrolube full specifications and an explanation of its requirements with regard to a suitable encapsulant for the LED based systems, Odeli was invited to test Electrolube’s UR5635 hazy polyurethane resin. Samples were duly delivered for testing, based on the real conditions in which the lighting was destined to operate. UR5635 was subsequently approved for the application and the appropriate processes installed - all within one month of the first meeting between the two companies.

www.electrolube.com

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Engineered Materials Systems (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, introduceditsnewEMS561-403Low-Cost Snap Cure Conductive Adhesive for stringing applications in crystalline silicon and thin- lm solar modules. EMS 561-403 is designed to electrically interconnect solar cells using ribbons.

The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure.

The 561-403 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for photovoltaic applications.

www.emsadhesives.com

Valtronic SA Continues Innovating Precision Machining with Partner Bumotec

Valtronic SA, manufacturer of miniaturized electronic products for trusted medical device partners, announces that it is continuing its focus on innovation at its precision machining site in Switzerland by expanding its partnership with Bumotec through the use of the S-191

Page 34 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Linear. Valtronic uses Bumotec equipment to continue improving its innovative technologies.

Bumotec’s S-191 Linear machine is designed to turn, mill and grind individual parts or parts from bar in a single setting. The machine’s turnmill center is suitable for complete machining of very complex six-sided parts. Linear motors ensure maximum precision and reliable repeatability in the machining of parts. Due to the combination of the rapid linear drive with a high-resolution Renishaw measurement system and a stabilized cooling circuit for all heat-generating elements, the S191 Linear achieves excellent productivity. A unique feature is the high-speed spindle (30,000 rpm), on which it is also possible to turn and mill ceramic.

www.valtronic.com

Koki Releases Improved ICT Compatibility Halogen Free Solder Paste

Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new ICT Compatible Halogen Free Solder Paste, S3X58-M650-7.

Though In-Circuit Testing is a popular way of testing if assembly is correctly fabricated. The testing probe needs to be cleaned frequently in order to keep the probe o from ux residue particles which could cause measurement errors.

S3X58-M650-7 has a lower contact resistance and leaves very less residue on the probes as compared to the conventional product, thus improving the rst pass yield at the ICT.

To follow the transition to halogen free products, solder paste without halogen activator was facing the challenge of maintaining equivalent activation continuity and heat resistance as activator with halogen. New S3X58-M555 maintains activation by suppressing activator reaction at the room temperature, and performs remarkable meltability during re ow process. In addition, after a harsh dewing cycle test required by automotive parts suppliers, S3X58-M555’s ux residue maintained Surface Insulation Resistance and inhibited Migration, thus achieving high reliability compatible to automotive application.

www.ko-ki.co.jp/en

World class racing yachts have PCBs from Newbury Electronics at the heart of their performance monitoring systems.

Sailors in high performance racing yachts are the latest to bene t from advancements in electronics which allow them to monitor every aspect of their vessel’s performance and the prevailing conditions. Many will have tted their yacht with a Bravo Systems solution which has at its heart PCBs from Newbury Electronics.

The processor is formed from an ATOM single board computer and a PCB from Newbury Electronics, with all the power supply protection, indicators LEDs and connectors. The acquisition node is formed by two PCBs, again built by Newbury Electronics, which incorporates a microcontroller, CAN drivers, 8 ADC channels, 2 Serial ports (RS232 – 485) and 6 x digital I/O.

www.newburyelectronics.co.uk

Seika Machinery Now Carries the MALCOM RDT-250C Re ow Simulator

Seika Machinery Inc., a leading provider of advanced machinery, materials and engineering services, now carries the MALCOM RDT-250C Re ow Simulator. The system can reproduce the temperature pro le of a re ow oven while allowing operators to observe the melting state of solder paste and record the process.

The local matrix control system of the upper heater enables re ow soldering of the PCB in which the thermal capacity is balanced with the best heating temperature. Low power consumption provides excellent cost/performance bene ts. Additionally, the RDT-250C can accommodate full size PCB boards for testing (250 x 330mm).

Each heating stage sets the temperature as well as the time. This makes it possible to change the time that keeps the re ow peak temperature free. The operator can observe the state of soldering through wide glass windows from the rear of the unit. An optional video camera capture system can be purchased to record the re ow process with pro les.

The system reproduces nearly the same conditions as an actual re ow oven by using the hot air of the upper-heater and the extreme infrared radiation of the lower heater together.

The MALCOM RDT-250C can heat in N2 atmospheres and control the N2 concentration with the O2 Oxygen Analyzer, OAS-1, and N2 ow adjustable function (OAS-1 is optional). For more information, contact Michelle Ogihara at [email protected].

www.seikausa.com

Juki Intelligent Storage Solutions Are Now Compatible with All Brands of Placement Machines

Juki Automation Systems (JAS), Inc., a world- leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce that all Juki Intelligent Storage Solutions are now compatible with all brands of placement machines. This is accomplished using bundled software from Cogiscan, the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry.

The release from the Juki storage towers of all the necessary reels of components to satisfy a work order is performed by a single click. The number of reels retrieved from the tower for a work order corresponds to the number of feeder locations for the component part number on the machine and allows for priority selection of components based on user de ned rules that include FIFO, partial reels rst and reels with enough quantity. Likewise, the ability to include an attrition factor when creating kits to account for loss of components during production is possible.

Juki Intelligent Storage Solutions’ customers can now bene t from knowledge of where components are (towers, storage racks, production line) at all times. This includes the ability to create kits of components from pick lists generated by the ERP system and combine several pick lists together for a combined kit for cluster setups.

The bene ts of using the Juki Intelligent Storage Solutions are many. Costs are reduced due to lower manpower required in the stock room and a signi cant footprint reduction compared to traditional warehousing methods. Preparation time is reduced by the simple integration with ERP or assembly systems and the automatic collection of components. The units also provide ESD and humidity control protection, replacing the need for separate dry storage.

www.jukiamericas.com

KIMCHUK INC. Continues Juki Partnership to Strengthen Its Quality and Customer Focus By smt today editor

In business for more than 50 years, KIMCHUK INC. is a fast- paced, technologically advanced, high-product mix electronics rm specializing in electronic and electromechanical contract manufacturing services and engineering design.

Figure 1: Danbury, CT-based KIMCHUK INC began as a machine shop 51 years ago but sold all other divisions to focus on electronics in 2004.

Committed to excellence, the company believes that its success depends on customer satisfaction, which is achieved by safely producing reliable products, delivered on time, at competitive prices.

“Quality is a vital element in accomplishing this goal through employee involvement and continuous improvement at all levels of the organization,” said Steve Sconzo, Director of Manufacturing, at KIMCHUK INC.

KIMCHUK INC. began its successful entry into the industry in 1964 as a machine shop which was formed by William Kimbell and Nicholas Sachuk which created the name KimchuK, Inc. In 1971 James Marquis joined the corporation for the purposes of expanding KimchuK into the areas of product design development and contract manufacturing. Mr. Marquis established an electronic division in the Danbury, Connecticut area while William Kimbell continued to manage the mechanical division in Stamford.

In 1975 KimchuK Electronic Division purchased its rst building in Brook eld, Connecticut. Additionally, William Kimbell decided to allow the precision machine shop to go into attrition while he expanded

its facilities into the precision sheet metal area. The precision sheet metal better suited the types of business that the electronic division was initiating. The growth rate of the company was quite signi cant during the latter years of the 1970s.

The division continued growing signi cantly and through the 1980s and 1990s the company continuously expanded and moved into larger facilities. The mechanical fabrication division also grew and was relocated into a larger facility. In the 1990s, the electronic division invested heavily into surface mount technology and automatic testing. In addition, it introduced a formal continuous improvement process in which a full-time programming group was employed to improve the efficiencies of the manufacturing processes. In 2004, KIMCHUK INC sold the mechanical fabrication division and continued the expansion of the electronic division.

Today, the Danbury, CT-based company continues to maintain a high-quality, customer-driven organization that o ers a full range of services from engineering design and packaging to state-of-the-art manufacturing, testing and supply chain

services to customers in the hi-rel industries of military/aerospace, medical, safety and security, energy, commercial and telecom.

To remain competitive in these arenas, KIMCHUK INC must partner with companies much like itself: those who value quality, innovation, technological advancements and customers.

It is these qualities that brought KIMCHUK INC and Juki Automation Systems together in 2008, with the rst purchase of a KE-2080E mounter system. The sale was facilitated through Dave Wilson of Competitive Edge Solutions (CES), one of Juki’s manufacturers’ representatives.

‘‘Today, the Danbury, CT-based company continues to maintain a high-quality, customer-driven organization that offers a full range of services from

engineering de”

and packaging

Recently, KIMCHUK INC purchased three more systems – two KE-2080E flexible component mounters and a FX-3 high speed chip shooter – all through CES because Sconzo and his team remain impressed with Wilson’s knowledge and level of customer interaction. In addition to the above shared- qualities, KIMCHUK also found that, after

Figure 2: KIMCHUK INC’s Director of Manufacturing Steve Sconzo said that the purchase of Juki equipment has helped the company increase throughout and placement accuracy.

sign

Continued...

Page 36 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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vanced electronics company that manufactures circuit boards Juki. they have made us feel like we are the most lmponant

and Integrated assemblies to support its customers from customer they have. The thing l love about Jukl Is their Solid

NPl through end of life. Founded in 1980 and headquartered — Capable — Reliable equipment, combined with their world-

in Mooresvllle, NC, Git/ll works in a diverse set of market class tolks There are others that do it right on the equipment

sectors, including industrial, commercial, medical, energy, side, but no one is in the same league on the folks side,’

defense, telecommunications and emerging markets. GM! ‘ V

uses Jukr solder paste printers and SW placement systems Nlck Hams

in its NC and Costa Rica facilities‘ G M I M F G C‘23':;‘;‘€:fi;|/ig\[JCC)irCuitS Inc

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Call Juki today to learn more about our outstanding reliability. service and support

LOWEST COST www.\]as-smt.com

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Tel (+81)334801111 Te|.|+1)919460 0111 Tel t+41)326262929

Email‘ rnqsmt@\]ukr corp Email’ sales@\]as—smt com Email‘ rnlo—europe@ias—srnt com

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feature continued...

evaluating numerous other machines, Juki was the best overall choice with the most a ordable price point.

“The machines have all exceeded our expectations,” said Sconzo. “To date we have not had any parts we were unable to place.” He added that throughput, placement repeatability and reliability all rate very highly. Additionally, the low cost of ownership, part traceability, feeder set- up veri cation, increased inventory counts, offer a vast improvement in placement accuracy and repeatability combine to provide numerous bene ts. He also said that the company intends to purchase future systems from Juki.

KIMCHUK INC runs two production lines: one is a Juki line and the other is a mixed- vendor line. However, the company’s ultimate goal is line commonality (to have the same systems on both lines). As a result, each of the KE-2080E high-speed modular exible mounter systems were placed on a line.

The purpose of the company’s purchase was to enhance fine-pitch placement capability for components such as ball grid arrays (BGAs), quad at no leads (QFNs), etc. for each of the production lines. The next step was to complete the integration by replacing its outdated chip shooter equipment with Juki’s FX-3 high-speed chip shooter. Because Cogiscan’s track, trace and control software is integrated into Juki’s FX-3 system, KIMCHUCK is also able to take advantage of this excellent software. Finally, the company recently purchased a sophisticated 3D solder paste inspection system.

Sconzo said that both the KE-2080E and FX-3 have helped advance KIMCHUK INCs mission by increasing throughput, enabling the company to become more competitive in pricing as well as meeting its customers’ essential and critical needs for placement accuracy. O ine set-up veri cation has also drastically reduced line changeover times, enabling the company to achieve higher equipment utilization. Not only have they

helped KIMCHUK, but the Juki systems have bene tted customers as well because they now receive increased traceability and ease of meeting J-STD-001 and IPC-A-610 class 3 requirements.

KIMCHUK INC differs from competition in that its number one concern is to help their customers advance to the top of their markets. To do this, the company has honed its mission over the past 50 years. Based on past and current success, these ve main characteristics have withstood the test of time:

Services provided by KIMCHUK INC include complete product design services from concept to production, reverse engineering, 3D in-house printing, DFM & DFT, simple to complex printed circuit board (PCB) assembly, through-hole, surface mount, Heatsink to PCB bonding, RoHS/non- RoHS, turnkey/consignment, automated optical inspection (AOI), Box Build to Full system integration, cable/harness assembly, materials procurement, prototype quali cation, depot repair, full test capabilities with in-circuit test (ICT)/ ying probe, J-Tag, functional and burn-in, and order ful llment. Quality driven with certi cations including ISO9001:2008, AS9100C, ISO13485:2003, ITAR & FDA registered, IPC-A-610, IPC-A-620, J-STD-001 Class III including space addendum with certi ed assemblers and trainers.

Customer service is also an important aspect to KIMCHUK INCs relationship with Juki. Sconzo concluded, “Juki provides us with excellent customer service. Although rare, whenever an issue is encountered the customer service team is always very quick to respond. We are always back up and running quickly. We give Juki ve stars for service.”

To find out more about KIMCHUK INC, contact [email protected] or call at 1 Corporate Drive, Commerce Park, Danbury, CT 06810-4130; 203-790-7800; Web site: www.kimchuk.com. For more information about Competitive Edge Solutions LLC, contact Dave Wilson, Owner, at 54 Ash Street, Hopkinton, MA 01748; 508-497- 5024; E-mail: [email protected]; Web site: www.cesolutionsllc.com.

To learn more about Juki Automation Systems and its comprehensive range of industry solutions, contact Geron Ryden, Director of Marketing, at 507 Airport Blvd., Morrisville, NC 27560; 919-460-0111 x130; E-mail: [email protected]; Web site: www.jukiamericas.com.

• Investment minded: KIMCHUK INCs design and manufacturing equipment is already in place. Sta are in-house, trained and certified, which frees customers’ capital for R&D or high- priority items.

• Reduce material costs: Supply Chain Management combines customer requirements for volume component discounts through strategic supplier relationships.

• Shorten development cycles: KIMCHUK INCs in-house design services enhance communication between engineering, manufacturing and test requirements. Projects move uidly through design and production.

• Expertise: With more than 50+ years of experience in engineering design and contract manufacturing, the company has exposure to a wide variety of products and customer techniques that makes it exible as well as highly competitive.

• Guaranteed quality: Quality is built into each customer’s product, from design review to manufacturing and test to complete warranty programs.

Figure 3: KIMCHUK’s two production lines, which includes Juki systems KE-2080E mounter and FX-3 chip shooter.

Figure 4: Sconzo and his team next to Juki’s FX-3XL high-speed chip shooter. The Juki equipment has proved bene cial to KIMCHUK INC as well as its customers.

Page 38 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Interview with Jeff Lancaster, Engineer at Count On Tools, Inc.

by smt today editor

Solid-state lighting has the potential to revolutionize the lighting industry. Light-emitting diodes (LEDs) — traditionally used in signs, signals and displays — are rapidly evolving to provide light sources for general illumination. This technology holds promise for lower energy consumption and reduced maintenance. Continued growth in LED technology and solid-state lighting has provided the electronics manufacturing industry with viable solutions for today’s electronic devices.

As a result, companies in the surface mount technology (SMT) industry are expanding their manufacturing capabilities to meet this demand. The range of new and potential applications for LEDs in electronics is practically endless.

Q. What problems do the stickiness or tackiness of the LED substrate cause for manufacturers attempting to place these components on boards?

A. Problems can start at presentation of the LED in the feeder. Because of the sticky silicone-based substrate, the dome of the LED can stick to the cover tape, causing the LED to ip on its side or even stay with the cover tape if the feeder is not set up properly. If the LED does get picked but does not release from the nozzle at placement, the machine could possibly start sticking the LEDs to each other and to the nozzle itself or start faulting out the machine with high reject counts.

‘‘The die inside LEDs currently being made is staying close to the same size; however, the substrate is being cut closer to the

die to reduce the footprint. This is done in order to incr”ease LED population

Q: How has Count On Tools been able to overcome these LED component problems for customers?

A: We have invested a tremendous amount into materials and nozzle designs to get the results that our customers need. We have tried ideas from wood nozzle tips to custom formulations of Te on and all have had varying levels of success. Our go-to material is urethane even though it is very di cult to machine to the ne details that are required for the smaller LEDs.

In addition, tip geometry places a huge toll because what works great for one machine may not work at all for another. That is why we work with the customer to see which design will work best for their exact situation.

Continued...

Count On Tools has realized this trend and worked to quickly develop a line of nozzle designs that allows customers to accurately and consistently place LEDs with existing SMTpick-and-placeequipment.Byworking closely with LED component manufacturers such as CREE and Lumileds, Count On Tools guarantees secure picking of all fragile components and accurate placement on circuit boards.

SMT Today recently sat down with Je Lancaster, the Design Engineer behind the LED and custom nozzle program at Count On Tools, to discuss the growth of LED technology and how Count On Tools has overcome the issues that many contract manufacturers have faced with implementing this technology into their production capabilities.

Q. Recent growth in LED technology and solid-state lighting have provided the electronics manufacturing industry with viable solutions for their use in today’s electronic devices. Have you seen an increase in demand for nozzle and tooling for LED components?

A. Yes, we have seen considerable growth for custom LED nozzles and tooling as well as high-volume repeat orders for tooling lines up for production. We constantly receive requests to build nozzles for the newest LEDs, some even before they hit the LED manufacturers’ customers.

Q. We understand that the transition to high-power LED components, such as those o ered by Cree and Phillips Lumileds, are more di cult to handle in the pick-and-place operations. What makes these LED components more di cult to handle than regular components?

A. As with all technology, everything has to get smaller yet more powerful — this holds true for LEDs as well. The die inside LEDs currently being made is staying close to the same size; however, the substrate is being cut closer to the die to reduce the footprint. This is done in order to increase LED population. The problem with the reduced substrate is that it makes the LED so lightweight that the tacky silicone dome literally sticks to the nozzle. This is where we have to get creative about how we approach picking the LEDs.

‘‘we have seen considerable growth for custom LED nozzles and tooling as well as high- volume repeat orders

for tooling line” for production

s up

feature continued...

Q: We have also recently seen a transition to smaller LED packages. How has Count On Tools been able to adjust its nozzle designs to accommodate these components?

A: The smaller LED packages have been a big challenge but we have stepped up with innovative designs. For example, we can now break the LED away from the nozzle tip after the vacuum has been turned o by building in vacuum leaks around the pick surface. This helps to stop the buildup of pressure that makes the silicone stick to the nozzle.

Of course there are some things that the machine operator can do, such as minimize placement pressure and feeder, depending on their particular situations.

‘‘We have invested a tremendous amount into materials and nozzle designs to get

the results that”

customers need

Q: Count On Tools also works directly with LED component manufacturers on nozzle designs, speci cally for new LED products coming to market.

What does this mean to you to be able to stay at the forefront of this growing technology?

A: LED manufacturers come to us because they know they get quick turnaround and a lot of experience in the LED placement arena to get their customers up and running fast. We work closely with the manufacturers to get the best design that we can then apply to other machine types and customer situations.

It enables us to guarantee safe and reliable handling of the LED components for the pick-and-place operation.

Q: Is there any other information you can give customers regarding handling LED components in the pick-and-place operation, especially rst timers?

A: Do your research on the LEDs that you are placing. Most manufacturers have comprehensive documentation on their websites regarding information from machine setup to temperature and humidity levels, which play a signi cant role in how tacky the silicone can be. You can always call us and we will do our best to solve whatever issue you may run into.

Conclusion

Count On Tools’ LED nozzle technology was developed to provide a consistent and reliable platform for the placement of solid-state LED

lighting components in the SMT assembly process. The company’s technology is based on an exclusive urethane material coupled with its precision machining capabilities, which has allowed it to manufacture tooling that not only overcomes the tackiness of the LED substrate but also o ers better handling of the sensitive shapes and pro les of the many di erent LED designs.

our

‘‘

closely with the

manufacturers to get the best design that we can then apply to” other machine types

Count On Tools’ LED nozzles and tooling is available for all brands of SMT pick-and- place equipment. Additionally, Count On Tools can generally provide a nished nozzle within 1-2 weeks while saving customers up to 50 percent or more over OEM designs for custom nozzles. Volume discounts are available for orders of more than 50 nozzles. There are no design fees and Count On Tools provides free quotes based on the equipment and type of LED being placed.

We work

Count On Tools, Inc. SMT Assembly Tools & Nozzles

For more information, please visit Count On Tools’ website at www.cotinc.com

Page 40 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Electronics SOLUTIONS

_ 29th — 30th

Productlon I l September 2015

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South China 2015 Shenzhen Convention

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25th - 27th august

Over the past 30 years, NEPCON China has grown to become the largest electronics manufacturing event in Asia, by continuing to re ect the latest developments in China’s rapidly growing electronics manufacturing industry. Additionally, the brand has also been extended to include a regional edition in Shenzhen (NEPCON China South) each August.

This year’s event, which took place between the 26th and 28th April at the Shanghai World EXPO Exhibition and Convention Center drew nearly 22,000 visitors from

across China – a 5 percent increase from 2014. Most notably the number of senior buyers attending as a result of their Targeted Attendee Program (TAP) rose from 438 to 1,066, an increase of 143.4%.

The 2015 event also debuted the successful Electronics Manufacturing Automation (EMA) Pavilion, which showcased the most advanced industrial automation technologies.

Here’s a snapshot of just some of the exhibitors and their booths:

Page 42 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

MIRTEC BOOTH

ViTrox BOOTH

Hamed El Abd from WKK and Frank Bose from Essemtec

Erik Miller and Tom Forsythe from KYZEN and Abby Tsoi from Kasion

Jack Wong from GKG and Craig Arcuri from Rocket EMS

Craig Acuri from Rocket EMS and Senta Wong -- CEO of WKK

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Suppression (MRS) technoiogy to let you see like never before, An easy-to-use software

ailows human operators to engage effortiessly with the SQ3000 robust hardware to achieve

superhuman results, whrch is, metrology grade accuracy at production speed.

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semicon west

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Moscone Center, San Francisco, CA

13th - 16th july

SEMICON West is the annual tradeshow for the micro- and nano-electronics manufacturing industries. Since 1971 the show has been the standard-bearer for the technological revolution, spawning a worldwide group of tradeshows organized by SEMI.

SEMICON West 2015, which took place between the 13th and 16th July at the Moscone Center in San Francisco, CA, marked another successful show with a high number of exhibitors and attendees from across the globe. New technologies and innovative new products were introduced

on the oor, making it a not-to-miss event.

Segments covered included;

semiconductor, photovoltaics/solar, micro- electromechanical systems (MEMS), LEDs/ solid state lighting and printed/ exible electronics. This year’s show also marked its eighth year of partnering with Intersolar North America, and provided a complete experience for engineers and manufacturers whose expertise lies in both semiconductor and PV manufacturing.

Here’s a snapshot of just some of the exhibitors and their stands:

Page 44 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

Assembly Resource Leigh Jackson

Steve Kirby and Alan Siebenthall from Kirby and Demerest and Mike Schwager from Aquaklean in the middle

Amtech VP Brad Anderson

Nordson DAGE Alan King

CyberOptics Dr. Subodh Kulkarni

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Reflow in Today’s

High-Mix/High-Volume Production Environment

By Bjorn Dahle, President, KIC

The majority of today’s SMT market in the United States and Europe is high-mix/low- to medium-volume and parts of it are even considered extreme high-mix and/or extreme low-volume. In the US market there is talk of high-mix/higher volume while increasing e ciency. Many production lines now experience more downtime than production time. Production downtime is the result of numerous factors, but mainly it is caused by machine setup and changeover time.

for di erent components on the same PCB and it dramatically reduces oven setup time. However, it does require that a minimum of one pro le is run rst and therein lies the rub. Until recently I did not quite appreciate the di culty some factories have in acquiring a relevant PCB for pro ling, or to take the time to follow best manufacturing practices. EMS companies, for example, are frequently provided X number of boards and are supposed to provide X number of assemblies, not X minus a pro ling board or two.

Some oven setup tools are designed to help factories that cannot always use best manufacturing practices for their reflow processes. Various elements of Auto-Focus include:

Technology to reduce the need to profile

A very exciting technology that promises to greatly reduce setup time is oven setup software that utilizes a built-in database that does not require an initial pro le run even for a new PCB assembly. The technician simply inputs the length, width and weight of the PCB and the system recommends the best oven recipe in a few seconds — without running a pro le.

One critical machine that can contribute to much of the downtime or potential success of a production line is the re ow oven. The oven can be very time consuming to set up for a new PCB assembly and often it is the slowest machine in the line changeover. This can significantly – and negatively – affect pro t and delivery times. There have been many technologies developed for the mass production factories of China and other lower cost countries. Less attention has been focused on the unique needs and technical solutions of high-mix markets.

SMT assemblers strive to produce strong solder joints without damaging components or substrates during the soldering process. Solder paste, substrate and component manufacturers provide tolerances or process windows that need to be followed. The best manufacturing practice to manage the re ow process is to attach thermocouples (TCs) to every unique PCB part number and select an oven setup that positions the PCB pro le in spec. In-spec is determined by measuring a time vs. temperature pro le that conforms to the interface between multiple process windows:

Jose del Valle, industry expert and COO/Vice President of NuVal EMS, a high-mix contract electronics manufacturing company based in California, believes that it is not su cient to process most components within spec – they ALL have to be processed in accordance with the relevant process window. He said that this can prove di cult, however, since there may be hundreds or even thousands of components being soldered to the same substrate and the position on the substrate, along with the thermal mass, will in uence how they heat up and cool down. Additionally, the components may have process windows that di er from each other.

Many factories will assemble dozens and even hundreds of unique assemblies monthly. While some of them – like NuVal EMS – can and will run their thermal process the “correct” way, others cannot or will not for various reasons: no representative production PCB is available for pro ling; process window information for some components is lacking; limited time or resources available to pro le each unique PCB; oven changeover/downtime is deemed to be too long.

So what happens if a factory cannot use best manufacturing practices for the re ow process? There are technologies and methods available that can help them come close.

At the fundamental level, an electronics manufacturer is in the business of producing products at the quality requested, delivered at the agreed upon schedule, at a price the customer is willing to pay and at a cost that allows the manufacturer to be successful. Everything else is a means to an end. Pro ling, traceability, process control, inspection and more are not an end in themselves (unless a client speci cally requests them), rather they are tools to be used to improve quality, productivity and cost reduction in order to help the manufacturer become successful.

To help manufacturers become more successful, software that recommends the best oven setup for each assembly to produce an in-spec pro le is available today from several companies, such as KIC’s Navigator. The software can handle di erent process windows

• Solder paste speci cation (or other material like under ll).

• All relevant electronic components’ tolerances.

• Design challenges reducing the process window such as large mass heatsink BGAs next to small mass components like 0201s or smaller.

• Substrate data and tolerances:

a. Laminate Tg and Td, layer counts, copper weights, HDI or non-HDI, etc.

b. Surface protectant: OSPs are becoming more complex, requiring specific temperatures for assembly in order to survive multiple re ows and cleaning, while attempting to achieve optimal e ciency.

Figure 1: Auto-Focus Input Software Screen

Whether the technician decides to run a veri cation pro le afterwards (recommended) or not, this more scienti c method at least offers improvements over the common “guessing game” going on in factories every day — namely looking at a new PCB assembly and using the oven settings currently employed for the most similar PCB, while not even running a pro le afterwards.

Additional technologies o er near instant oven changeover. To explain how they

Continued...

Page 46 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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work, let us rst look at the challenge at hand. An average re ow oven has literally billions of alternative recipes because each zone temperature can be adjusted in small increments within a wide range. Additionally, the conveyor speed adds yet another variable to form a huge number of possible combinations. The oven setup software will perform an exhaustive search of all of them and for each unique oven recipe it will predict the pro le and its relationship to the relevant process window. (This prediction task takes only a few seconds after an initial pro le is run.)

Avoid oven changeover by identifying a common recipe for several different PCB assemblies

Prediction software can be used to identify a common recipe that can process groups of di erent PCBs. One method is to simply attach a large and a small PCB to the same pro ler. The software will search for a recipe that can process both PCBs in spec, therefore the other PCBs in between will be in spec. Depending on the oven capability, it may not be possible to use a single common recipe for all PCBs. Instead, the software can generate a select few recipes for groups of small, medium and large PCBs. As always, running a real veri cation pro le with TCs attached to the PCB is recommended, but frequently omitted.

Eliminate waiting time for oven to stabilize on new temperatures

Another application of prediction software is that it can identify a new oven recipe by only changing the conveyor speed and keeping the zone temperatures the same. Oven changeover from one recipe to another using

the same zone temperatures with a di erent conveyor speed is near instantaneous. On the other hand, a re ow oven may need up to 30-45 minutes to stabilize on a new recipe if the new temperatures di er greatly from the current. This is especially true when the oven changes from a hot to a cooler recipe. Some

SMT factories like Nu-Val EMS have long realized that a re ow oven will heat up much faster than it cools down and the production manager will schedule the day’s batch of production runs by starting with the coolest oven recipe and ending with the hottest. This approach requires more pre-production planning across the organization, but enables a higher-mix environment to become higher- volume by improving e ciency, added del Valle.

Automate profiling

Some companies, especially automotive and other high-reliability electronics, demand best manufacturing practices. The manufacturer will have no choice but to set up the oven correctly and run verification profiles. Discussions between manufacturer and clients take place constantly in regards to the frequency of pro ling. One camp states that re ow ovens are so stable that pro ling can be performed less frequently. The other camp argues that running veri cation pro les even as frequently as every shift means that production is running blind that whole shift. Common variations like changes in the exhaust system, thermal loading, pressure changes and human errors may a ect the thermal process significantly. Automatic and continuous pro ling that measures the pro le in real-time for each and every PCB being produced is becoming popular among many manufacturers because the technology provides traceability, eliminates the problem of running blind in between spot checks and eliminates the production downtime associated with periodic manual pro ling. The systems will further reduce downtime by monitoring the oven during the changeover phase and alert the technician the moment that the oven is ready for production. Another source of downtime can be the time it takes to troubleshoot a production run that has stopped due to a yield problem. Although typically less than 5-10 percent of defects are attributed to the re ow process, many factories will run a pro le to troubleshoot the yield issue. This is due to the lack of process information in this historically “black box” re ow oven. Automatic pro ling will inform the engineer immediately whether the problem is in the reflow process or not, reducing troubleshooting time. If the problem is in the thermal process, the system provides information to identify the problems in the oven.

Conclusion

It is not uncommon for production lines at SMT factories to spend more time on setup and line changeover than actually running production. Additionally, following best manufacturing practices for the re ow process may not be possible or acceptable

at these factories. Today, process engineers and managers are doing their best with what they have. They can use techniques like scheduling the production batches to run cooler oven recipes in the morning and progress towards hotter recipes at the end of the day.

To signi cantly improve pro tability, however, high-mix/low-volume manufacturers are taking advantage of new technologies such as prediction software. Oven setup and process optimization software may improve both productivity and quality by allowing for a more scienti c and accurate approach to re owing the assemblies under such di cult circumstances.

NuVal EMS achieves high yields and low costs by ensuring that every product it makes is well designed, properly laid out, in concert with the client and thoroughly tested before going into production. Customer service and personalized solutions are extremely important to NuVal EMS, so the company focuses on providing customers with the highest possible levels of quality and productivity.

“There are hundreds of contract manufacturers to choose from, but there are very few that do what we do: focus exclusively on the customer,” said del Valle. “At NuVal EMS, we don’t want to just churn out products for clients we may never see again. Our focus

Figure 3: Jose del Valle, COO/Vice President, NuVal EMS Inc.

is on developing long-standing relationships with clients where we become an extension of the client’s engineering and operations team. We want to take on customers’ most di cult challenges and turn their product sketches into trailblazing innovations.”

Figure 2: Auto-Focus Output Software Screen

Page 48 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Interview with

Jared Sandman,

CEO of Fancort Industries by smt today editor

Over the past four decades, West Caldwell, NJ-based Fancort Industries has become a leader in electronic production solutions. As an early innovator in aerospace lead forming equipment, Fancort builds equipment that is critical to satellites including the international space station and the Jupiter Space probe – all still ying today and highly regarded by NASA, its contractors and major semiconductor suppliers.

A: Robotic soldering equipment ts naturally into our growing area of expertise in electronics production equipment. About three years ago, after working with several vendors, we found ourselves gravitating to the Japan Unix equipment because it has many features that di erentiate it for speed, reliability and cost. Since then we have partnered with Japan Unix to cover

the North American market.

It was this expertise in electronic component processes that allowed Fancort to steadily expand into the areas of lead forming services, PCB depaneling, pneumatic and servo presses, hot bar soldering and, most recently, robotic soldering.

A manufacturer and integrator of production solutions for electronics manufacturers, Fancort has a strong competency in both precision tool design and automation.

Our editorial team recently spoke with new CEO, Jared Sandman, to nd out what new plans he has for the thriving company.

Q. Jared, congratulations on your recent appointment as CEO of Fancort Industries. Can you give our readers a brief description of your professional background? Why are you the most quali ed to lead the company to 40+ more years of success and innovation?

A. Good question. I started out working for Texas Instruments as mechanical design engineer in the sensors and controls business. I was fortunate enough to start out in a new product development group where I worked with highly talented people developing and eventually managing product lines. After leaving TI, I worked at and eventuallyownedseveraltechnicalsales companies prior to my eventual appointment at Fancort Industries.

Q. What are your initial thoughts about the company? What are the strengths you noticed immediately?

A. What excites me most about Fancort Industries, and technical sales in general, is the process of developing unique solutions to your customers’ problems. When we as sales professionals are able to provide advice and expertise that makes life easier for our customers, it is a virtuous process.

Fancort is a classic example of good people doing what they love and helping customers achieve their goals.

Q. Are there any improvements you hope to make?

A. Fancort has a very strong base of expertise from which many things are possible. My focus will be to continue to serve our established customers and product lines rst. Then, with intense focus on our customers’ needs, we will continue the Fancort way of innovation and new product development.

‘‘What excites me most about Fancort Industries, and technical sales

in general, is the process of developing unique solutions

to your cu”stomers’ problems.

Q: Can you please give us a quick rundown of the Fancort product portfolio?

A: Basically, we started the business making lead forming equipment in 1972, developed a line of pneumatic presses to complement the lead forming equipment, then moved further into PCB production solutions with our depaneling, hot bar soldering, press t machinery, robotic screw fastening and, most recently, robotic soldering.

Q: How does the Japan UNIX robotic soldering equipment t into Fancort’s product line?

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very strong base of

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expertise from which many things are possible. My focus will be to continue to serve our established customers and ” product lines first.

Q: How important is it in today’s environment to be a global player? What are you doing to have more of a worldwide presence? What advantages does this bring customers?

A: I think it is crucial to think and act globally. Fancort has been doing this for decades and I think it is a key reason we have lasted through the years. The world is getting smaller and we nd ourselves reaching across the globe on a daily – and almost hourly – basis. Although we have our main production in New Jersey, we have customers that include companies and governments in numerous countries including China,India,Russia,Mexico,Canada,the Middle East and many more.

Q: What do you most want the industry to understand about Fancort Industries?

A: We are a company of high-quality solutions. We spend the time and e ort to develop long-term value in our people and customers.

Page 50 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Interview with Simon Norman, Director at EVS International Sales Ltd by smt today editor

EVSInternationalSalesLimitedisbasedintheUnitedKingdomonthe Isle of Wight, o the south coast of the English mainland.

EVS has become the leading company in the solder recovery market and today holds close to 20 international awards for its equipment.

Q: Do you believe this amount will increase in the next year?

A: Yes, we are just about to launch a new product aimed at the selective solder market, which is growing signi cantly in Mexico. Our new technology will result in numerous cost

and process bene ts for our customers.

‘‘We have enjoyed good sales in many areas of Mexico such as Guadalajara, Juarez, Tijuana,

Our editor recently caught up with Director, Simon Norman, at EVS International Sales Limited to nd out more about the company’s presence in Mexico as well as how it plans to continue strengthening its success in this region.

Q. What are the main bene ts of solder dross recovery equipment?

A. They are so many but the most important are reduction in carbon footprint, return on investment (ROI), ISO 14001 environmental management, improved process and productivity, reduced wave maintenance and reduced shorts and rework. All of our customers are keen to save money while simultaneously improving their processes.

Q. How does your machine positively impact the environment?

A. As part of its process, EVS utilises the energy already used in heating up the solder pot to process the waste dross. With our process, we can extract 65-75 %+ pure solder from this waste on-site at the point of use. This process is very environmentally e cient and produces a FAST ROI, saving storage, admin and the shipping of heavy solder laden dross o site.

ISO 14001 says ‘Reduce, Recycle and Reuse’ and so do we!! We have a full range from small to large capacity machines to do this.

Q. What made EVS decide to have a presence in Mexico? How long have you been involved in this region?

A. We identi ed countries where the majority of electronics manufacturing plants were located and either partnered with distributors or directly began visiting them one by one to demonstrate our products. Mexico was a country that we felt was very important and had massive potential. We have been selling EVS machines in Mexico for 15 years.

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Q: Is EVS selling directly into this territory or does the company rely on distributor relationships?

A: We sell our products through Interlatin, who are experts in our eld. They employ local sales and service engineers who sell and service EVS machines throughout the Mexican territory.

Q: What percentage of your business currently comes from Mexico?

A: Currently, the Mexican market is very buoyant for us and is one of our top three territories. We have enjoyed good sales in many areas of Mexico such as Guadalajara, Juarez, Tijuana, Reynosa and Chihuahua.

Q: How about the next ve years?

A: We see steady growth as more producers look to save money and EVS is instrumental in this. With a growing range of product, we are driving up the e ciency and growing the percentage returns that customers can achieve — when they see our product work they are very impressed. We also have many developments in the pipeline over the coming years.

Q: What are the key ingredients that EVS needs to succeed in the Mexican market?

A: We need to continue visiting and growing our customer base, training our distributors, sales and technicians to provide our customers with better returns and continue improving our support service.

Q: What does the company hope to accomplish in Mexico before the end of 2015?

A: Everyone in our industry wants to save money and so our goal is to increase sales of the EVS range throughout the rest of the year and to spend time visiting new and potential customers who use wave solder or selective soldering to demonstrate the many bene ts of investing in an EVS Solder Recovery System and how much money it can save them.

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Page 52 The Choice of Publication for the Electronics Industry

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Industry News

Keep up to date with what’s new

With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

Steve Kirby of Kirby & Demarest

Aqua Klean Systems Signs Rep Agreement with Kirby & Demarest

Aqua Klean Systems, a leading provider of advanced PCB cleaning equipment, announces that it has signed a manufacturers’ representative agreement with Kirby & Demarest in the Paci c Northwestern United States. Kirby & Demarest offers vast process knowledge, attention to detail and sales follow-up.

Kirby & Demarest was founded in 1973 by Dave Demarest as Demarest Associates, and has been serving the Paci c Northwest microelectronic community ever since. As manufacturers’ representatives, the company provides high technology companies with an array of products used in the design, manufacture and test of circuit board assemblies, hybrid circuits and semiconductors.

www.kirbydemarest.com www.aquaklean.com

BAE Systems installs KISS-103IL selective soldering system in Indiana

ACEProductionTechnologies,Inc.,aleading supplier of selective soldering systems, is pleasedtoannouncethattheBAESystems’ Fort Wayne operations has invested in a KISS-103IL in-line selective soldering system.

The KISS-103IL selective soldering system has been installed at the BAE Systems facility located in Fort Wayne, Indiana and is the third selective soldering machine BAE Systems has ordered from ACE Production Technologies.

“The KISS-103IL is a fully-con gured SMEMA compatible selective soldering platform equipped with “Super Quick”

processing speeds and the unique dual solder nozzle systems enabling the use of multiple nozzle shapes within the same program,” said Alan Cable President of ACE Production Technologies. “The KISS-103IL comes standard with the ACE automated ducial location and correction system that offers seamless ducial recognition and true automated X-Y alignment and corrects any skew of the printed circuit board.”

Cable added, “Other innovative features include the new SWAK-OS machine operating software which is a revolutionary graphics- based programming and editing machine control system that features fast program loading and program recall with minimal operator intervention. A major bene t of the SWAK-OS is the integrated board scanning function that automatically captures and saves an image of a printed circuit board to the selective soldering program.”

www.ace-protech.com

Varitron’s new plant in Hudson, NH

Varitron Renews Corporate Agreement with Cogiscan

Cogiscan Inc., the leading track, trace and control solutions provider for the electronics manufacturing industry, is pleased to announce that the company has renewed its corporate agreement with Varitron. As part of this agreement, Varitron will expand the use of the Cogiscan traceability system to its new plant in Hudson, NH.

“We started working with Cogiscan in 2011,” commented Michel Farley, President of Varitron. “We originally focused on implementing a factory-wide traceability solution at our St-Hubert facility. This was a strategic investment to attract and secure new customer contracts that required this technology. As a direct result of this investment, we acquired two new customers that resulted in a 33 percent increase in revenues. Our traceability capability also played a major role in securing a third new customer. In addition, the types of customers that require traceability tend to be more stable and more pro table, which means that this investment

contributed both to the top and bottom line. This additional business eventually led us to acquire a new site in Hudson, NH and the rst investment that we are making at this new facility is the Cogiscan traceability system because we know that it will be the most important factor to bring in new business.”

www.varitron.ca www.cogiscan.com

Kurtz Ersa Offers Limited Time Special on Industrial Soldering Station

Kurtz Ersa North America, a leading supplier of electronics production equipment, announces a limited time* bundle offer on the i-CON 1 Industrial Soldering Station. Effective July 1, 2015, Ersa is offering three i-CON 1 stations for $650, representing a savings of $685.

The i-CON 1 is a professional industrial soldering station that uses the 150 W i-Tool. Its outstanding measure and control technology ensures quick heating and heat recovery times as well as the constant temperature of the soldering tip. Excellent soldering results can be achieved at very low tip temperatures.

The i-CON 1 features a large selection of tips from the 102 Series, as well as low operating costs through separately replaceable wear parts. The integrated standby and sleep functions help extend the tip life even further. The soldering station is operated via an illuminated text display and the i-Op control knob. All of the important soldering parameters, includingasecurepasswordprotection,can be easily con gured. The ESD-safe station is suitableforcontinuousoperationinindustrial environments as well as for THT and SMT soldering tasks with high energy demands.

www.ersa.com

Fancort Industries Appoints New Reps in Northeast

Fancort Industries, Inc., a global supplier of cost-effective solutions to electronics manufacturers, is proud to announce the appointment of two prestigious rep companies:

Page 54 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

REStronics Co. in New England and Cope Assembly Products in the Mid-Atlantic region, covering Virginia, Delaware, Maryland and West Virginia.

“We’re thrilled to bring two such notable rep groups on board. Our Rep network is key to our growth and these guys will help us make it happen,” commented Jared Sandman, President of Fancort Industries.

REStronics Co., Inc. was established as a manufacturers’ representative in 1980, by Ralph E. Savage with the intentions of servicing electronics OEMs and the local distribution which serves them. Their philosophy of working closely with engineering personnel, assisting in overcoming production problems, and helping to improve process ef ciencies has proven to be an excellent mission. Whether it is with product lines they represent or their

collective knowledge of the processes, their intent is to service our customers.

www.fancort.com

Science and Care Converge in KYZEN Sponsored SMTAI Women’s Networking Event

Women attending the SMTA International Conference and Exhibition in Rosemont, IL in September will get a rsthand look at what happens when science and care converge in a networking reception being held exclusively for them. As sponsor of the networking event, KYZEN, a leader in environmentally responsible precision cleaning technologies, recognizes the unique and important role that women play in the industry, and wants to provide them the opportunity to connect and interact while at

the conference held at the Donald Stephens Convention Center in Rosemont, IL.

“We are honored to support the SMTA and feel that this is an important opportunity for women in our industry to network and learn from each other,” said Sherry Stepp, KYZEN’s Global Electronics Segment Leader. “In years past this event has proven to be both inspirational and entertaining.”

As an industry leader KYZEN continually provides exceptional support of the SMTA and has sponsored a variety of SMTA events over the years. In addition to the Women’s Networking Event at SMTAi, KYZEN’s “Where Science and Care Converge” marketing theme will be evident throughout the Conference, as well as on the golf course.

www.KYZEN.com

Industry News

feature continued...

V810-S2EX from left to right: Eddy Ma, Xillin Zheng, Wu Zheng, Weishan Lai, Zeling Lee

MiTAC Becomes First V810 XXL&V810 S2EX AXI User of ViTrox Technologies in Mainland China

MiTAC Computer (ShunDe) Ltd., part of MiTAC-Synnex Group, announced that after the successful installation and operation of rst the ViTrox V810 XXL (AXI) in mainland China in 2014, its subsidiaries that focus on EMS services successfully installed their rst ViTrox V810 S2EX (AXI) in mainland China in January 2015.

MiTAC Computer (ShunDe) Ltd., a leading EMS company, provides high quality, ef cient, exible full-service provider (design + board phase & system phase manufacturing, testing and assembly) to companies including Oracle, Intel, Dell, IBM, HP, BOSE, Fujitsu, Toshiba, Inspur, Lenovo as well as other world-renowned manufacturers and the private brand TYAN. AXI is one of the core test areas, and good test equipment is not only part of production, but also has become a method to enhance customer trust and create more value for customers and factories.

Test Manager Eddy Ma and AXI team head Zeling Lee commented: “We rely on more than 12 years of experience with the last generation AXI: Agilent 5DX and through a series of assessments, we choose AXI from ViTrox Technologies Malaysia as our new AXI test equipment.”

www.msgroup.com.tw/index_cn.asp www.vitrox.com

Libra Industries Installs Its Fifth Juki Line

Libra Industries, a privately held electronics manufacturing services (EMS) provider, is

pleased to announce that it has purchased and completed the installation of its fth line from Juki Automation Systems (JAS), Inc. The new line consists of a GKG Precision Machine Paste Printer, KE-2070E, KE-2080E, TR6DER and Shenzhen JT Automation RS- 800II 8 zone oven.

The line has been installed at Libra Industries’ Plant Three in Lake County, Ohio, where the company offers state-of-the-art Electronic Manufacturing Services (EMS) as well as wire harness and cable assembly. The new line includes sales and service from JAS, Inc.

Libra Industries and JAS, Inc. have been working together for more than 25 years. Libra Industries selected JAS, Inc. once again because of the attentive, consistent customer service it has received over the years. “This new SMT line will signi cantly increase capacity in our Willoughby facility through improved component placement speed and accuracy,” commented Ron Shorts, Operations Manager at Libra Industries. “Also, adding this state-of-the-art Juki line to this facility will help us maintain a cost competitive advantage, which will bene t both Libra Industries and our customers.”

www.libraind.com.

Saline Lectronics Differentiates from the Rest with Seica’s Pilot 4D V8 Flying Probe Tester

Saline Lectronics, Inc., a leading electronics contract manufacturer, recently purchased and installed a Seica Pilot 4D V8 Flying Probe Tester. This new system further enhances Saline Lectronics’ testing capabilities and will allow the company to better support each of its clients’ unique testing requirements.

The Pilot 4D V8 represents the latest frontier in ying probe test technology. It is the complete solution for maximum performance, offering the highest test speed for low- to medium- volume requirements. The test coverage and exibility of the unit is ideal for prototyping situations and has an enhanced feature to help with the repairing of any type of board. Its vertical architecture is the optimum solution for probing both sides of the printed circuit board assembly (PCBA) simultaneously,

eliminating added stress or ex to the unit under test (UUT).

“This new Pilot 4D V8 tester will allow us to test boards under development and small, pilot runs in a more ef cient manner,” commented Tom Neman, Test Engineering Manager. “The xtureless testing gives us the exibility to easily tailor testing to the requirements of the assemblies undergoing any design changes.”

Lectronics’ new Seica Pilot 4D V8 has a 16 mobile resource to test PCBAs with eight electrical ying probes, two open- x mobile probes, two mobile power probes, two cameras and two thermal probes. These power probes are used to power up the UUT without requiring any additional wiring. The high-resolution cameras will make the ying probe process incredibly precise and create a smarter, intuitive tester. Also, they will scan serial barcodes automatically, keeping with Lectronics’ traceability requirements.

www.lectronics.net.

Scienscope International Establishes Scienscope GmbH

Scienscope International, a complete inspection solutions provider, is excited to announce the establishment of Scienscope GmbH, a wholly-owned subsidiary in Germany.

The new facility opened in April of 2015 to accommodate the growth of Scienscope in the European market. The of ce offers service, training and spare parts, and serves as a demonstration center.

With this announcement, Dan Kelsey, General Manager, said, “This is a signi cant milestone during the rapid growth of Scienscope. The German market is a key growth area for our company and we must have a strong presence here as we continue to develop new advanced technology.”

www.scienscope.com

Ron Shorts - Operations Manager, and Clayton Carr, Applications Engineer

Continued...

Page 56 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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Industry News

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STI Electronics Partners with Technology Transfer Services to Help Customers Apply for Grant Money

STI Electronics, Inc., a full service organization providing training resources, analytical and failure analysis, prototyping, and small-to-medium volume PCB assembly, is pleased to announce that it has partnered with Technology Transfer Services to offer assistance with applying for grant funds. STI Electronics Inc. and Technology Transfer Services have a long tradition of providing high value training with excellent customer service while seeking out opportunities for providing additional value-added services to clients and potential clients.

The manufacturing industry has become more complex, requiring staff members to be more exible and learn new skills to keep pace with the changing demands of work. Companies have invested and continue to invest in the training of their staff to remain competitive in this complex environment. The cost of training can be signi cant for organizations but is a necessary burden for continued success.

Each year the state of Florida provides grant monies for training to assist organizations in keeping their workforce current with the demands of the industry. The grant dollars are distributed through a variety of grants at both the state and the county level: CareerSource Grant Opportunities;

• Incumbent Worker Training (IWT)

• Quick Response Training (QRT)

• Employed Worker Training (EWT)

The grant dollars are awarded based on a rst come, rst serve basis as well as eligibility. In order to receive these funds, making your application early is essential. STI would like to offer you assistance in applying for these grant funds.

Patti Gander has numerous years of experience writing grant applications and receiving grant funds. She offers her services to organizations in any region of the state as a no charge service. The goal of STI Electronics Inc., Technology Transfer Services, and Patti is to make our state a manufacturing leader.

Training our workforce is one step toward achieving that vision.

www.stielectronicsinc.com

Saline Lectronics Installs the ISM2000 Intelligent Storage Solution

Storagesolutions, a division of ESSEGI SYSTEM SERVICE s.r.l., is pleased to announce that Saline Lectronics, has purchased and installed an ISM2000 Intelligent Storage Management machine, with sales and service by Juki. Saline Lectronics is a leading electronics contract manufacturer based in Saline, MI that runs ve Juki lines. The ISM2000 will support the Juki lines by ensuring that materials are in the right place at the right time.

Eric Hassen, Saline Lectronics’ General Manager, commented, “The ISM2000 provides a storage environment of less than 5 percent RH, which is ideal for the many different moisture sensitive devices that we use. Since this system’s software tracks and alarms if a component exceeds its exposure limits while outside of the unit, it has helped to simplify our component MSL management process.”

www.storagesolutions.it

Valtronic Launches New Tagline in Line with Its Development Strategy

Valtronic, manufacturer of miniaturized electronic products, announces its new tagline, “Guiding Innovation to Success,” which illustrates that the company develops partnerships built on the creation of innovative ideas, technology and positive outcomes for all. Its fully integrated team of scienti c, technical and business experts is focused on building strategic partnerships to take customers’ projects to the next level.

As evidenced by the new tagline, Valtronic’s innovative team anticipates customer needs by proactively conceptualizing them and then

using advanced engineering technologies to meet them. By using its nurtured partnerships and alliances globally, Valtronic helps customers turn their ideas into successful products.

www.valtronic.com

EMEA Electro Solutions is new Viscom sales partner in Spain and Portugal

EMEA Electro Solutions, headquartered in Barcelona, is taking over Viscom representation in Spain and Portugal. The team from EMEA is the new strong partner on the Iberian peninsula, with 15 years’ experience in SMT, THT, microelectronics, ESD products and product nishing. With his long-term experience in the industry and what by now is several years of close cooperation with Viscom, José Luis Pardo, the founder of the company, is a well-known and competent contact partner for customers and other interested persons.

The company is taking on sales of the entire Viscom product range, from SPI and AOI systems, through automatic X-ray inspection, to wire bond inspection and manual X-ray inspection. EMEA is broadly positioned and in addition to the Viscom products offers printers, board handling, pick & place systems, re ow ovens, bonders, SMT material and much more.

www.emeaelectrosolutions.com

SMTo – The Newly Appointed Strategic Channel Partner (SCP) of ViTrox Technologies in Mexico

ViTrox Technologies, a solutions provider of innovative, advanced and cost-effective automated vision inspection systems and equipment for the semiconductor and electronics packaging industries, announces the appointment of SMTo Engineering to represent ViTrox in Mexico. SMTo is authorized to represent ViTrox for its Advanced Optical Inspection (AOI) and Advanced 3D X-ray Inspection (AXI) systems in Mexico.

SMTo has been established in Mexico to offer high quality consulting and support services for the electronic manufacturing market. SMTo is led by a group of elites who have more than 15 years of strong sales and technical experiences in AOI and AXI industry. On top of the extensive coverage throughout Mexico, SMTo also provides 24/7 phone support to customers.

www.smto.mx. www.vitrox.com

Page 58 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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out & about in the industry

In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...

STI Electronics, is pleased to announce that Mark McMeen, VP of Manufacturing and Engineering Services, has celebrated his 15-year anniversary with the company.

Photo: Mark McMeen

Valtronic announces that Valerie Kalish has been promoted to Quote Coordinator, a new position created to further the company’s goal of best-in-class customer.

Photo: Valerie Kalish

Page 60 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

what’s happening in your business?

send your event pictures to red@smt today.com

Horizon Sales announces that David Smith has joined their team as Regional Sales Manager for Pittsburgh, Columbus, Dayton, Indianapolis and Southern Kentucky.

Photo: David Smith

Akrometrix LLC is pleased to announce that Mayson Brooks has joined the company as President and CEO.

Photo: Mayson Brooks

Quant 3D is pleased to announce the addition of Brent Denston to the position of Director of 3D Printing Sales – Americas.

Photo: Brent Dentson

Scienscope International announces the addition of Michael Stoll to its management and support team as Technical Support Manager for its recently established Scienscope GmbH facility near Frankfurt, Germany.

Photo: Michael Stoll

Page 62 The Choice of Publication for the Electronics Industry

| OCTOBER 2015 ISSUE

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