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P:01

The Choice of Publication for the Electronics Industry

advanced soldering

technology:

Crucial for extreme aerospace environments

a practical guide to managing material cost

pcb prototyping industry facing modernization with 3d printed electronics

red carpet

Who’s doing what, where?

meet the CEo

Jean-Marc Peallat - Vice President, Global Sales, Vi Technology

Feature Interviews

David Reyes - Sales Manager US, JBC

| APRIL 2016 ISSUE smttoday.com

P:02

Innovative Solutions for Electronic Manufacturing

User Friendly HMI based on Touch Screen 12,1” High Throughput

0,5” per Tab

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set up change in 1 minute

Fixture Less

reduced cost of ownership due to zero Jig required

Optical camera

fiducial Recognition for high accuracy cut and 2D code check for automating sorting Pass/Fail

Automatic Bit change

automatic Bit change for foolproof production

Fully modular and scalable

top or Bottom Routing head or Top / Bottom for mass production line

Configurable unloading

Wide unloading solutions: Blister, Single or Dual Tape or Jedec Tray

High reliability

linear Motor and optical encoder for intensive use 24/7

www.osai-as.com

Page2

TheChoiceofPublicationfortheElectronicsIndustry | APRIL2016ISSUE

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P:03

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chosen by leading global EMS.

SPI + AOI + CT AXI + ICT _ |N|)us1'RY

ONE STOP SOLUTION+YMS 4.0

Meet us at SMT Hybrid Packaging 2016 E! \" \"El

Exhibition Centre Nuremberg -_ -_

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P:04

welcome

to smt today

Welcome to the latest edition of SMT Today – a high quality publication created for the global electronics industry, which provides the best content and largest distribution through the latest technology channels.

Well it has been a hectic 2 months since the last issue (and my 1st issue of SMT Today) was published and a successful IPC APEX EXPO has been and gone. All our clients, contributors and readers, old and new, have made this a very busy, but very enjoyable experience, and long may it continue and grow.

The next show we will be attending is SMTHybridPackaging inNuremberg,26th–28thApril,Hall7A,Stand232. This edition of SMT Today includes an introduction to the show along with technical articles, interviews and the latest product announcements with contributions from many of the electronic industry’s leaders and technology experts. We also have a preview of NEPCON China, being held in Shanghai World Expo Exhibition & Convention Center on the same dates.

In this issue in particular, we have interviews with Mr Jean- Marc Peallat, Vi TECHNOLOGY’s Vice President, Global Sales and Mr David Reyes, JBC Tools’ newly appointed Sales Manager in the US. We also have many interesting features including an article submitted by Japan Unix on their Advanced Soldering Technology: Crucial for Extreme Aerospace Environments, A Practical Guide to Managing

Material Cost Impact by Ben Khoshnood, President of Inovaxe Material Handling Solutions and PCB Prototyping Industry Facing Modernization with 3D Printed Electronics, by Simon Fried, Chief Business O cer, Director and Co- Founder of Nano Dimension.

Continuing through 2016 SMT Today will be attending a number of trade exhibitions, and as a team will be delighted to meet up with our readers and contributors, providing an opportunity to share what additional services SMT Today can o er in the form of delivering responsive websites, successful marketing campaigns and e ective video productions.

The next issue of SMT Today will be published in June, and will focus on a full roundup on NEPCON China. If you would like to advertise with us or have any articles, news or high pro le press releases that you would like included, please don’t hesitate to contact me at wendy@smttoday. com. The deadline for both editorial and advertising for this issue is 15th May 2016.

In the meantime, we would like to extend an open invitation to exhibitors and visitors to our Booth at SMTHypbridPackaging, Hall 7A, Stand 232, and we look forward to seeing you in Nuremberg!

Wendy Tindle, Editor

Email: [email protected] Skype: wendy-smttoday Call: +44 1292 834009

Page4 TheChoiceofPublicationfortheElectronicsIndustry | APRIL2016ISSUE

P:05

magazine contacts...

Editor

Design Website

Wendy Tindle [email protected] +44(0)1292 834009 skype: wendy-smttoday

BBD Creative bbdcreative.com +44(0)1292 280022

smttoday.com

Advertising Enquiries

To enquire about available advertising opportunities, please contact:

[email protected]

NEXT EDITION

June’s edition will focus on Full RoundUp of all the news and press releases from NEPCON China.

6

SMT Hybrid Packaging 2016

12

Director Spotlight

72

Red Carpet

inside this issue...

Shows/Events

SMT Hybrid, Nuremberg

Director Spotlight

Interview with industry experts

12. Jean-Marc Peallat, Vice President, Vi TECHNOLOGY

14 Technology Today Industry experts share their knowledge

14. The Impact of Reduced Solder Alloy Power Size on Solder Paste Print Performance

20. Over 225 Years of Service Provide a Rich Past & a Bright Future for Solder Bar

22. Staying Power in the Fiercely Competitive EMS Business

26. JapanUNIXAdvancedSolderingTechnology:Crucialfor Extreme Aerospace Environments

30. FSInspection Improves Saline Lectronics’ Process with Help from the HDMag

32. “Be Ready...... Be Smart”

36. A Practical Guide to Managing Material Cost Impact

42. Manncorp Celebrates 50 Years Of Service To The Electronics Industry

44. PCB Prototyping Industry Facing Modernization with 3D Printed Electronics

46. There’s More To Pcb Manufacture Than Pick ‘N’ Place

50. ABB Introduces YuMi To The UK Market

52. Laser Processes for PCB Manufacturing High Demands on Quality and Cost-E ectiveness

58. A Massachusetts Electronics Manufacturing Company Dramatically Increases Productivity in a High-Mix Environment

60. An Interview with Mr. David Reyes, Sales Manager US, JBC Tools

68. Machines for Thermal Processes Solder voids eliminated and capacity boosted!

62 Industry News

What’s happening in the world of electronics

70 NEPCON China 72 Red Carpet

Photo gallery of industry personalities and events

74 2016 Diary Dates

6 12

62

Industry News

60

David Reyes Interview

Articles appearing in this magazine do not necessarily express the views of the Editor or the publishers. Every e ort is made to ensure the accuracy of information published. No legal responsibility will be accepted by the publishers for loss arising from articles/information contained and published. All rights reserved. No part of this publication may be reproduced or stored in a retrieval system or transmitted in any form without the written consent of the publishers.

P:06

SMT Hybrid

Packaging 2016

International Exhibition and Conference for System Integration in Micro Electronics

Nuremberg, 26 – 28 April 2016

Visitors to the SMT Hybrid Packaging trade fair, the International Exhibition and Conference for System Integration in Micro Electronics, can look forward to a diverse program and new highlights this year. They will experience the whole variety of assembly production from 26 – 28 April 2016 in Nuremberg, Germany.

Hall layout along the value chain

The new hall layout introduced last year was well-received. Due to its success, the concept will be continued on this path. Providing a supporting guideline for all attendees, the priority areas follow the value chain and are structured as follows:

• In hall 6, the topics “System Development and Production Preparation” as well as “Materials and Components” will be presented.

• In hall 7, the visitors will nd all things relating to “Processes and Manufacturing”.

• The new hall 7A showcases the topics “Reliability and Test” and “Software and Production Control”.

Experience production steps “live”

Yet another highlight at this year’s event is the production line called “Future Packaging”. It is organized by the Fraunhofer (IZM) and operating under the slogan: “Living the digital age: Work and home in a networked world”. The highlight: The expert audience can see individual production steps during the exhibition. This permits interested visitors to convince themselves of the e ciency of the machines under realistic conditions directly on-site.

New: “Optics meets Electronics” in hall 7A

For the first time the joint stand “Optics meets Electronics”, led by Fraunhofer (IZM), is offering products and solutions from the optoelectronics sector, and this year is located in hall 7A. Exhibitors present products, solutions and services in the eld of “Automotive Communications”, “Optical Sensors and Sensor Systems”, “Optical Communications”, “Optical Analysis and Detection” and “Optical Process Management”.

The ‘High Tech PCB Area’ introduced successfully last year will be brought together with the ‘EMS Intersection’ which has been established for years. Exhibitors and visitors to SMT Hybrid Packaging 2016 can look forward to great synergy from the partnership, which will be enhanced by a shared Expert Forum.

The unique concept of SMT Hybrid Packaging covers the whole process chain from initial idea to development and design as well as manufacturing of assembly production. The next few pages are a selection of companies showcasing in the exibition this year.

Page 6 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:07

Geländeübersicht

Side plan

Schwerpunkte

Main Topics

Systementwicklung und Produktionsvorbereitung

System development and Production preparation

Materialien und Bauelemente

Materials and Components

Prozesse und Fertigung

Processes and Manufacturing

Zuverlässigkeit und Test

Reliability and Test

Software und Produktionssteuerung

Shuttle-Service Route

Software and Production control

Shuttle service route

P:08

Hall 7, Booth 109

CyberOptics Corporation, a global leading developer and manufacturer of high precision sensors, announced that it will demonstrate the SE600TM and the award winning S3000TM 3DAOI.

CyberOptics recently won the 2015 Global Technology Award in the category of Inspection – AOI for its 3D SQ3000 Automated Optical Inspection (AOI) system. The system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate sensor platforms. The proprietary Multi-Re ection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms o ers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

“Customers have been rapidly adopting our 3D AOI systems. The positive feedback we have received about the superior image quality and the overall performance that the MRS technology enables, is very encouraging,”

said Dr. Subodh Kulkarni, President and CEO, CyberOptics.

www.cyberoptics.com

hall 7A at booth 505

Emil Otto GmbH will exhibit at this year’s SMT again. Besides a series of innovations, among them a product launch, the company will also be celebrating its 115th anniversary. However new developments in existing product categories will also be introduced.

Emil Otto GmbH will travel to Nuremberg with a series of new developments. The soldering ux manufacturer from the Rheingau will introduce a new product right in the area of environmentally compatible, selective soldering. ‘The product is being presented at the trade fair for the rst time. Just so much — we’re going to present a technical premier that brings many new bene ts for the customer with it right in selective soldering’, says Markus Geßner, authorized signatory at Emil Otto GmbH.

But Emil Otto will also introduce new products among the multi- ux uxes to the professional public. ‘Our customers kept asking us whether we couldn’t develop uxes for the most varied application areas’, explains Geßner. Particularly small mid-sized companies express this desire, because they want to deploy a uniform ux for as many soldering processes as possible. So Emil Otto has already introduced EO-B-001, EO-B-002, and EO-B-003 uxes from the multi- ux series to the public at productronica 2015. Additional

multi-use uxes now follow with EO-B-004, EO- B-005, EO-Y-001, and EO-Y-002.

Emil Otto is thus expanding its product range for exibly applicable uxes. ‘Our goal is to have a suitable ux in the product range for every customer group, because many of our customers have developed from small companies to mid- sized operations over the years. We’d like to grow with our customers, so it’s important for us to be able to offer broad product range’, explains Geßner.

Emil Otto isn’t just pursuing this strategy with its own uxes. In addition to these products, Emil Otto meanwhile o ers a broad range of products for packaging and connection technology. Thus cleaning media and SMD adhesives are present in the product range in addition to solders and solder pastes. With a wink Geßner leaves the extent of further collaborations with renowned manufacturers open to demand.

www.emilotto.de/

Hall 6, Stand 131

EVS International, the leader in solder recovery, will showcase the new EVS 500LF lead-free version in the Microtronic GmbH booth.

The ISO14001 compatible EVS 500LF enables the customer to reduce solder consumption by up to 50+ percent, an unheard of reduction in the electronics production industry. The EVS 500 also can help to reduce dedrossing time by 75 percent and waste dross o -site by up to 85 percent. The simple but ruggedly designed EVS 500LF meshes perfectly with environmental control systems and also helps to reduce customers’ carbon footprint by utilizing the latent heat already imputed to the dross to help the recovery process.

The EVS 500LF has been designed to be the same size as a printer and is aimed at multiple markets, such as the customer with one lead wave and one lead-free wave, the customer who uses Nitrogen, or wants to reduce their Nitrogen usage. Additionally, the system is designed for even the customer with selective solder pots who only removes small amounts of dross every hour or the customer with multiple waves where one EVS 500LF is connected to each wave to ensure that maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.

www.solderrecovery.com

Booth No. 7A-315

KIC will demonstrate how its smart oven technologies lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand. Over the last decade, re ow oven manufacturers have done a great job of making their ovens more stable, reliable and less expensive. Looking

forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies.

KIC’s smart oven technologies automatically measure the PCB pro le and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and x issues faster.

One exciting aspect of these smart technologies is that they are retro table on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies.

www.kicthermal.com

Hall 7, Booth 117

Ersa GmbH, the largest supplier of soldering equipment, is pleased to announce they will exhibit a wide range of industry leading technologies, furthermore, they will exhibit for the rst time the VERSAFLOW3/45 with VERSASCAN and VERSAEYE.

The VERSAFLOW 3/45 is the rst in-line selective soldering machine with dual track transport. Highest exibility and highest throughput can be realised with the smallest possible required space. Already an industry favorite, the 3/45 is now equipped with VERSASCAN and VERSAEYE. The VERSASCAN module recognizes multicodes on printed boards, product carrieres or printed boards that are not fully or wrong assembled. These “bad boards” will be excluded from the processing. This saves resources and cycle time and leads to a clearly increased productivity. The VERSAEYE gives information about the solder joint: good or bad. The VERSAEYE is system optimized for wave and selective solding systems, is compatible with work piece carriers, and makes modular inspection possible: bottom, top or bottom & top. VERSAEYE is also available with up to 9 cameras per module.

www.ersa.com.

Hall 7A, Booth 329

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in at the forthcoming SMT/Hybrid/Packaging.

Nordson DAGE is the market leading provider of

smthybridpackaging 26-28th april 2016

Page 8 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:09

award winning bond testing equipment and will be showcasing the second generation 4000Plus with camera assist automation which is ideally suited for applications such as pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages and the 4000 Optima which is optimized for fast, accurate and reliable bond testing in the volume manufacturing environment.

MatriX introduces its latest addition to its #-series: The X3# flexible inline system designed for sophisticated high-speed 3D inspection on solder- joint level up to component inspection. This system features 4 advanced inspection technologies all in one: transmission X-ray technology with patented Slice-Filter-TechniqueTM (SFT), o -axis technology and 3D SART. These technologies present a exible solution package for inline inspection of single and double-sided PCB assemblies with high packing density. The state of the art 3D software uses a dedicated number of angle projections for 3D reconstruction and delivers slice images needed for high quality 3D solder joint analysis. Thanks to the algebraic reconstruction method used (Simultaneous Algebraic Reconstruction Technique = SART) it is possible to generate 3D volumes for programmable slicing levels. Up to 6 slice levels can be generated automatically for high-resolution solder joint analyzing.

With its new X3# platform MatriX offers a combination of an optimized test concept with high speed transmission and selectively used 3D technique where needed.

The New FX-940 ULTRA 3D AOI from Nordson YESTECH incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips, BGA’s and other height sensitive devices. The systems’ advanced 3D sensor provides industry leading metrology capabilities and shadow-free imaging at speeds of up to 8X faster than other systems.

Nordson YESTECH’s M1m AOI o ering high-speed microelectronic device inspection with exceptional defect coverage will also be showcased. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection.

www.nordsondage.com www.nordsonmatrix.com www.nordsonyestech.com

Hall 7, Booth 109

every advanced s/w tool required for a wide variety of applications. With more tilt and a rotating work table, the X-SPECTION 6000 is the ultimate in exibility.Standard features of the X-SPECTION 6000 X-Ray Inspection System include fully integrated, 130 kV high power closed X-ray tube, 60° camera tilt for oblique angle viewing, 22′′ x 18′′ inspection stage with 350° rotation, color mapping camera with zoom window provides easy location and identi cation of faults, and Z axis movement of the x-ray tube and detector.

www.scienscope.com.

Hall 7, Booth 139

SEHO is the only manufacturer worldwide who o ers customers systems for all elds of automated soldering, integrated solutions for optical solder joint inspection, intelligent concepts for board handling and material management, as well as e cient and ergonomic work places, engineering, and informational seminars.

At this year’s SMT/Hybrid/Packaging, SEHO will

focus on processes for THT assemblies. With the aim to improve both product quality and system availability, uxing in wave soldering applications is raised to a new level: In a plasma process ux powder is selectively deposited at the solder joints. The results are convincing- remarkably reduced ux residues on the assembly, lower ux consumption, true VOC-free process, and improved solderability of overaged surfaces.

For the SMT production SEHO is introducing a new process gas cleaning system for the re ow soldering system MaxiRe ow. As an alternative to the well-established cyclone technology, the MaxiRe ow now also can be equipped with a module that thermally decomposes residues from PCB material or solder pastes.

Depending on the materials used in SMT production, customers now have the choice for the optimum process gas cleaning concept to reduce maintenance to an absolute minimum.

www.seho.de.

Hall 6, Stand 210

ULT AG will co-exhibit new and well-proven extraction and filtration systems as well as solutions for ionisation of surfaces and assemblies with the company’s long-term German distribution

partner IVH Absaugtechnik. Two di erent solutions will accentuate the topic of ionisation, i.e. removal of electrostatic charges on surfaces, assemblies and components. On the one hand, there is the mobile unit JUMBO Elephant for manual workplaces providing ionisation, compress air cleaning, extraction and ltration rolled into one. On the other hand, IVH presents the IAT1200, the worldwide first worktable with integrated ionisation and extraction, making a separate ESD grounding cable redundant. In interaction with a ULT extraction system LRA 400, the additional removal of vapours, odours and dust during part processing will be demonstrated on the table.

The LRA 160, a compact and mobile extraction and ltration unit, will be another new model. The system is suited for the safe and e cient removal of airborne pollutants that occur during soldering processes in electronics manufacturing.

O ering selective ltration and operating cost optimization, the LRA 160 is the latest device within ULT’s new generation of extraction and ltration systems.

www.ult.de

Hall 7A, Booth 317

Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to present K Series3D, its new 3D AOI, along with a complete range of inspection solutions at SMT/Hybrid/ Packaging. K Series3D is the latest evolution of the successful K Series that has been delivering the most accurate component inspection to worldwide leaders in the electronics manufacturing industry for years.

By combining its extensive 2D AOI and 3D SPI experience with new proprietary technologies, the K Series3D delivers highly accurate all-around defect coverage including lifted components, lifted leads, tombstones, etc., for components up to 25 mm in height. Coupling high quality telecentric 2D images with dual camera blue-laser-based 3D pro les guarantees superior inspection quality for both pre-re ow and post-re ow.

K Series3D is also available as a cost-e ective 3D AOI upgrade to existing 5K, 7K, and 9K systems.

Associated with 3D SPI - PI Series - and interconnected with SIGMA Link software suite, this whole 3D inspection solution is designed to satisfy the requirements of the most demanding PCB manufacturers excelling in the automotive, aerospace and defense sectors.

www.vitechnology.com.

Hall 7A, Stand 125

Viscom in Germany will be showcasing 2 revised systems alongside others, at SMT in Nuremberg this year. The MXI System X8011-II PCB and a new variant of its successful S3088 ultra 3D AOI system, the S3088 ultra gold.

Scienscope International, a complete inspection solutions provider, will exhibit the X-SPECTION 6000 Cabinet X-Ray Inspection System-the ultimate in exibility. The X-SPECTION 6000 X-Ray Inspection System is Scienscope’s most technologically advanced X-Ray inspection system. As with all X-SCOPE platforms, it includes

P:10

smthybridpackaging 26-28th april 2016

feature continued...

Firstly, the MXI system X8011 PCB, constructed by Viscom and sold worldwide for many years, has undergone a thorough revision. Viscom has reworked its successful MXI system X8011 PCB and launched this advanced development as the X8011-II PCB, which will be presented at the show. Now the customer has even more options for con guring the system. Valuable experiences from many years of practical application have been devoted to the improvement and enhancement of diverse software and hardware features.

The X8011-II PCB is recognized from the outside by its new housing, emblazoned with a large melon-yellow V. The front window is motor-driven and its new design makes loading even more convenient. Ergonomics have been signi cantly improved by the modernized design of the operating console. Within the system, a faster manipulator ensures even more precise positioning of the inspection object. Among other bene ts, this results in higher throughput. Moreover, the detector axis swivel range has been optimized to a very practical 60°.

The new variant of the successful S3088 ultra 3D AOI system, the S3088 ultra gold reaches image data rates of up to 3.6 gigapixels per second. The core of this system is the innovative high performance camera module XMplus with its outstanding, high throughput camera technology.

www.viscom.com

Hall 7, Stand 220

Yamaha Motor IM Europe will debut new surface- mount placement and inspection systems that introduce advanced features for faster and more exible assembly.

High-E ciency Modular Mounter Beefs Up for Bigger Boards

The new Z:LEX YSM20W wide-body mounter populates larger, heavier boards at speeds up to 80,000 cph, with all the exibility of the popular Z:LEX YSM20 High-E ciency Modular system. By handling boards up to 810mm long x 742mm wide and 8mm thick, with conveyable weight up to 10kg, the new machine empowers assemblers to tackle technically ambitious projects that demand capabilities beyond the ordinary. Z:LEX YSM20W is the ideal platform for taking on the most advanced challenges coming from today’s automotive, industrial, medical, power or LED- lighting sectors.

The outstanding exibility of the new mounter also extends to handling boards up to 810mm x 356mm in dual-lane con guration. Owners can thus gain a competitive edge through the ability to build larger assemblies at throughput rates usually associated with small mobile projects.

Inspection Boost for High Speed with High Con dence

The new YSi-V 12M TypeHS optical inspection system raises the performance bar, with enhanced features and the fastest 3D tact time in Yamaha’s range. Its arrival enables assemblers to maximise defect detection without trading cycle time as shrinking component sizes, increasing placement density and ne-pitch interconnects demand combined 3D, 2D and multi-angle inspection for optimum con dence. Other upgrades in the YSi-V 12M TypeHS include an improved image- processing subsystem, as well as more responsive four-direction image capturing for superior shape detection.

The arrival of the YSi-V

12M TypeHS strengthens manufacturers’ ability to implement all-item in-line inspection in high-volume production. With this new machine added to the line-up, customers can now choose from six different AOI system specifications to select the optimum feature set, inspection speed, and 12Mpixel or 5Mpixel resolution to suit a wide variety of budgets and manufacturing scenarios.

An additional bonus comes in the form of Yamaha’s new iProDB inspection history management software, which is available on request, free of charge, to all users of YSi-V AOI systems. iProDB leverages Yamaha’s position as a full-line manufacturer of surface-mount equipment to combine inspection data with status information from mounters and printers in the same line, to help with design for manufacture, process improvement, production management, and equipment maintenance.

www.yamaha-motor-im.eu

Hall 7, Stand 321

Fully automatic concentration control in PCBA cleaning

When PCBAs are cleaned a lot of factors in uence the cleaning result. There are not only the residues which have been cleaned from the PCBAs but also process-dependent in uences like evaporation or transportation of cleaner into the rinsing stage. To achieve permanent good cleaning results, continuous monitoring of the cleaning bath is recommended. For this purpose, manual and automatic methods exist. Manual methods are the measurement of conductance or pH value. However, the result of both measuring methods is in uenced by temperature or contamination

and do not provide absolute values. Furthermore, if only the above mentioned parameters are analyzed then the cleaning bath quality often cannot be evaluated e ciently when employing water based cleaning processes. On the other hand the concentration of the cleaning agent provides a very good guide to efficiency. To evaluate this parameter there are rapid manual chemical tests, based on acid-base titration, and also refractive index measurement. However both methods are only fully e ective with fresh cleaning baths, whereas a further manual concentration measurement method based on the phase separation procedure e. g. the ZESTRON® Bath Analyzer works very reliably and accurately independently of contamination.

Besides the above mentioned low priced manual bath monitoring methods there are automatic techniques available, such as the ZESTRON® EYE. Utilizing

that system, both cleaner concentration and temperature is measured permanently and

in real-time. This measurement is more precise than the

manual measurement methods and furthermore resistant

to contamination. Besides

the continuous process data documentation the data can

be saved for up to two years providing full traceability.

The ZESTRON® EYE is compatible with all common cleaning machines on the market and can communicate with their PLCs. It’s expandable by addition of an automatic dosage system (dosage of concentrate and DI water), directly controlled from the measurement data of the ZESTRON® EYE.

The additional automatic method is the ZESTRON® EYE CM (CM: ‘concentration management’), a product new to the market, a fully automatic stand alone module, performing both automatic concentration measurement and automatic dosage.

www.zestron.com.

Page 10 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:11

International Exhibition and Conference for System Integration in Micro Electronics Nuremberg, 26 – 28 April 2016

Experience the diversity of assembly production:

• System development

• Production planning

• Materials and Components • Manufacturing equipment • Reliability and Test

• Software

• Service and Consulting

Secure your free entry ticket: smthybridpackaging.com/tickets

Information:

+49 711 61946-828 [email protected] smthybridpackaging.com

P:12

Interview with Jean-Marc Peallat of Vi TECHNOLOGY

by SMT today editor

ViTECHNOLOGYisaglobaldesigner,manufactuoreryaondusurpPplireorocfeassControl wide range of innovative inspection equipment and software solutions for

PCB assembly. The company serves very demanding market segments

including telecoms, consumer, computer, automotive, infrastructure,

industrial and medical. Here we catch up with Jean-Marc Peallat, Vi TECHNOLOGY’s Vice President, Global Sales to nd out more about the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

director

spotlight

Q. Congratulations on your new product, the K Series3D. Can you please brie y describe the technology behind it and why it is unique?

A. Based on Vi TECHNOLOGY’s 20 years of experience in AOI, we developed a very pragmatic solution that solves the true problems of our customers. 3D AOI has been oversold the past two years as the ultimate solution for all types of issues. However, recently, the market discovered that e cient 3D AOI cannot exist without strong 2D. Being a pioneer in 2D AOI, Vi TECHNOLOGY has always o ered best-in-class AOI that has made the company a leader in this industry. Our 3D AOI technology is a clear complement to our existing solutions. Based on one projector with angle cameras, it provides a clear 3D de nition of the eld of view.

Q. What key bene ts does this new product provide to users?

A. Our users bene t from this new technology in many ways. First, adding 3D technology helps to simplify programming and ne-tuning of the system. With more valuable picture information (z-map), vision tools become much simpler when it comes to detect lifted leads or small components. The new 3D AOI is based on existing legendary tools such as the pro ler but it is used with 3D information. This makes the system more robust and eld-ready. The software is already running in thousands of systems.

Additionally, the market shows that not all applications require 3D AOI and users may have 2D and 3D lines coexisting in the same building. This will be the case for most CMs in the coming years. Our new 3D AOI is fully compatible with our existing 2D AOI product line. Practically, it means that programs are transferable from one machine to the other with all programs sharing the same library. If there is a production peak on a 2D line, users easily can transfer the surplus on the 3D line without having to reprogram (tests will be done in 2D only).

Next, our new 3D AOI is available for existing users through upgrade kits. Our latest equipment 5K, 7K and 9K AOI can be upgraded with the 3D head. This head makes each system fully 3D AOI capable with the same performances as our new K series3D, within a fraction of the regular 3D AOI investment. It also o ers a solution for users who do not need 3D AOI today but probably will need a quick and fast change when the time comes. Within the matter of a few hours, they will be able to run in 3D using their existing programs.

Finally, this new 3D AOI combines with our latest 3D SPI PI and our software tools Sigma Link to provide users with a completely new experience of process control. Sigma Links o ers a unique way of combining results from both inspection types within a user-friendly 3D animation that shows views of solder paste and components. On the path of Industry 4.0, it comes standard with a complete set of options to feed information forward and backward to connected equipment.

Q. What caused Vi TECHNOLOGY to develop this? What speci c customer and industry needs does it meet?

Page12 TheChoiceofPublicationfortheElectronicsIndustry

| APRIL2016ISSUE

Add a new dimension

Visit us at SMT – booth 7A-317

A. 2D solutions were developed in the 1990s

NEPCON Shanghai – booth 1F40, 1G50 & 1H45

with the popularization of mobile phones, and

have grown since thwawtw.tviimtecehn.olWogyit.chomcomponent

miniaturization, however, customers’ requirements

for leaded components have evolved, making the

need for new technology clear within the past few years. Of course, this has been driven by applications that require high process standards to guarantee the highest quality of products. The automotive and medical device industries are the most demanding. To overcome the limitation of 2D solutions in terms of lifted leads detectability or small components, the latest 3D technology was an obvious decision.

Understanding the need for a new technology to meet these challenges, Vi TECHNOLOGY quickly sized up the benefits

in terms of programming time and fine tuning time. At first look, the new technology could bring more complexity in terms of programming. In fact, 3D technology provides more information that enhances defect coverage and, in certain instances, improves fine-tuning time.

Q. Has 2016 been a good year so far for Vi TECHNOLOGY? What does the company hope to accomplish during the remaining three quarters of 2016?

A. The rst quarter has been excellent for all of our products across all of our regions. We already have exceeded our objectives for the year. The AOI product line continues to be very strong, especially in Asia, while our new SPI product line gains market share quickly.

MW/VE/34/NEPCON_2016_SMT_Today.indd 1

3/23/16 10:45 AM

Of course we are still early in the year, and the global economy could evolve quickly and impact our industry. The situation in China still shows some signs of uncertainty. Having said that, we forecast a solid year with clear growth in our SPI activities, and continuity in our AOI activities with the introduction of our new 3D AOI. Our new PI series (next SPI generation) is a serious contender of all existing solutions, and should take a large market share by end of 2016 to become the leading solution in SPI.

On the AOI side, the launch of our new 3D AOI in 2016 represents the biggest challenge. We feel very confident that our product will be largely adopted by the market through our existing 2D AOI users.

Q. Are there any new products in the pipeline that we should watch for?

A. While we cannot discuss new products as such, we can say that more and more our users are looking for global solutions that help them in their processes. In this area, Vi TECHNOLOGY aims to o er new approaches to users beyond the equipment themselves.

www.vitechnology.com

P:13

Add a new dimension to your Process Control

Visit us at SMT – booth 7A-317

NEPCON Shanghai – booth 1F40, 1G50 & 1H45

www.vitechnology.com

P:14

TECHNOLOGY TODAY FEATURE

The Impact of Reduced Solder Alloy Powder

Size on Solder Paste Print Performance

by Timothy O’Neill, AIM, Cranston, RI &

Carlos Tafoya & Gustavo Ramirez, AIM, Juarez, Mexico

Abstract

From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation, the opportunities for electronics to improve our lives are limited only by our imaginations. The capability of existing PCB assembly technology needs to advance rapidly to meet the mission pro le of these new devices. The demand common to all of these devices is increased functionality in a smaller space. For the solder paste manufacturer, this path inevitably leads to incorporating ner metal powder into solder paste to facilitate ultra- ne pitch printing. This study evaluates the bene ts and implications of ner mesh solder powder on critical aspects of solder paste performance.

in parallel and are undoubtedly shifting the existing paradigms and advancing the print process.

Experimental Method

The test vehicle (TV) selected for the solder paste print study was a Solder Paste Evaluation Board \[1\] that is commercially available from a dummy component and test kit supplier. The TV shown in Figure 3 was chosen speci cally for the range and depth of test points speci c to transfer e ciency. It is thoughtfully designed with many test-friendly characteristics:

• Print-to-Fail (PTF) patterns that combine pad sizes ranging from 3 to 15 mils with shapes including circular, square and rectangular pads, de ned with both copper and solder mask

• 0.4 and 0.5 mm BGA patterns

• Slump patterns from 10 to 4 mil (0.25 to 0.1

mm) spacing

• Markings on the PCB are etched in copper

rather than silkscreened with ink to eliminate the stand-o e ect of PCB nomenclature

The TV was modi ed for this project by removing the 3, 4 and 5 mil pads from the PTF patterns. The smallest feature size tested in this study was 6 mil. The smaller features would add cost to the TV, would not provide useful insights when printing with a 4 mil stencil foil, and would be challenging to measure accurately and reproducibly using current SPI technology. 300 panels of the modi ed design were fabricated speci cally for this test run. The data was collected using a new panel for each print. No PCBs were cleaned and reprinted.

The pad and aperture sizes, area ratios and theoretical volumes are shown in Figure 4.

The bridging/slumping test patterns are shown in Figure 5. Each pattern o ers opportunities to assess slump in horizontal, vertical or angular

Figure 3 - Solder Paste Evaluation Board \[1\]

Type 4, 5 and 6 SAC305 solder pastes were tested and their characteristics in several key areas were measured and studied. The key input variables included powder size, e ect of room temperature storage, pause time and PCB feature types. Output included print transfer e ciency, volume repeatability and performance stability over time.

The goal of the study was to measure the bene ts derived from smaller particle size and identify possiblenegativeimplications. Withthisinformation, assemblers and technical support personnel will better understand how to apply their resources to ensure the most robust process and optimized performance. The study was undertaken in two parts to measure both print characteristics and

It is important to understand that as particle size shrinks, print capability is improved, but the e ects of surface oxides on the particles begin to factor into shelf life and re ow properties. The J-STD-005 for particle size is shown in Table 1.

Figure 2 demonstrates the extraordinary di erence between the largest solder particle sphere diameters for T3 through T6 solder pastes.

There are two long held tenets of solder paste printing, the “5 Ball Rule” and 0.66 area ratios. The 5 Ball Rule indicates that the smallest aperture that can be printed by a given mesh size is 5x the largest solder sphere for that mesh size. In the case of T5 powder this would be 4.5 mil aperture, and for T6 it would be 2 mil and so on. Similarly, area ratio calculators indicate that any stencil aperture with area ratios less than 0.66 are on the edge of the T3 performance window and additional strategies or a redesign need to be incorporated to ensure consistent print performance. This study will reveal if these rules are applicable with Ultra Fine Powder (UFP) pastes and if they should be reconsidered.

Finally, it is important to consider the advancements in solder paste chemistry technology; stencil foil alloys; cutting, coating and mounting technologies; as well as printer and solder paste inspection technology. All of these advancements are occurring

reflow characteristics. reported in this paper.

Background

The print results are

The study represents a natural progression of a 2011 study in which the bene t of incorporating Type IV (T4) solder powder into solder paste versus the largely incumbent Type III (T3). Results from this study indicated that T4 powders provided a modest improvement in volume consistency versus T3. The conclusion was that other variables including paste formulation, stencil coatings and understencil wipe materials could have as signi cant an impact on transfer e ciency performance as powder mesh size. As print features continue to miniaturize, there is drive for further reduction in mesh size to accommodate ever decreasing aperture size as well as increasing aperture density. This study will help to de ne the transfer e ciency advantages of reduced mesh size of and between T4, T5 and T6 SAC305 solder powders and to identify any compromises that may arise from reducing the mesh size.

Figure 1 – Type 4 paste particles

Table 1 – JEDEC standard for solder paste particle sizes

Figure 2 – A comparison of largest sphere size in a given powder type

Figure 4 - Calculated theoretical area ratios and aperture volumes for each aperture size tested.

Page 14 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:15

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P:16

TECHNOLOGY TODAY FEATURE

feature continued...

Figure 5 – Slump test pattern

positions at line/spacing resolutions from 0.1 to 0.25 mm. The PCB contains two sets of patterns; one set per board (3 per panel) was read for each print, approximately 10-20 minutes after the print. The laboratory environment was consistently controlled at 25.4°C (77.4°F) and 59% RH. The slump patterns were photographed and the locations of any bridges were noted as part of the data collection process.

The stencils employed current state-of-the-art technology which would typically be used for ultra- ne feature applications that demand ner powder solder pastes. They were cut from ne grain stainless steel on a modern, diode laser by a high-quality, US-based stencil supplier who then applied a proprietary polymer nanocoating. Three identical stencils were produced; one was used to perform some pre-screening test runs, and two new ones were used in the actual print tests.

All apertures were sized one to one (1:1) with the test pads, with no reductions on any apertures.

The test equipment included a new printer, SPI machine and video microscope in the company Applications Laboratory. The test area is climate controlled and can be manipulated to simulate production environments around the globe. Test conditions were optimized at 25.4°C-77.4°F at 59% RH for these tests, and recorded twice daily.

The facility is sta ed with full-time SMTA Certi ed process engineers with over 50 years of combined experience in SMT assembly processes. Figure 6 shows the laboratory manager preparing the production printer and production Solder Paste Inspection machine for the test run. The print parameters were as follows:

• Squeegee speed: 40 mm/sec (~1.6 in/sec)

• Squeegee pressure: 10 kg (~1.5 lb/in on 14”

blades)

• Separation speed: 1 mm/sec (~0.040”/sec)

• Separation distance: 3 mm (~120 mils)

• Under wipe sequence: Wet-Vacuum-Dry (WVD),

using production wiper paper and production company solvent. Stencils were automatically underwiped before the rst print of each set of 5.

A at tooling support block was used to provide solid support for the PCB, and new squeegee blades were used for the tests.

Solder Paste Inspection (SPI) parameters were modi ed to improve the accuracy of the measurements. Typically,a30-40μmmeasurement threshold is used in production environments to eliminate noise from PCBs’ topographical features like silkscreen markings, mask over trace, etc. Because the design of this TV limits topographical feature noise, it enabled a 15 μm measurement

threshold, to improve measurement delity and aid in detecting subtle variations in print behavior.

The solder paste test matrix included Types 4, 5 and 6 powders in a modern, no-clean ux medium. The pastes were blended, shipped and stored under recommended refrigeration conditions. One jar of each type was removed from refrigeration and allowed to age, unopened, at room temperature for two weeks in the climate-controlled laboratory. The pastes were labeled “Fresh” for products stored under refrigeration and “Aged” for pastes that were stored at room temperature.

Prior to manufacturing the solder pastes for the tests, pre-screening print tests helped determine the ideal metal load for the T5 and T6, as shown in Table 2. Pre-screening tests were also used to optimize the nal print parameters used in the tests.

Experimental Design

Input variables in the experiment included:

• Paste Type (4, 5, 6)

• Pastecondition(Fresh,Aged)

• Pause time between print tests (0, 30, 60 and

90 minutes)

• PCB pad size (6-15 mil)

• PCB pad shape (circular, square, modi ed

square with rounded corners)

• PCB pad de nition (copper, mask) • Slump (line/space size, angle)

Output variables included:

• Deposit volume

• Deposit height

• Deposit area at measurement threshold • Transfer e ciency (% volume)

Statistics calculated from the output readings were:

The tests were executed using both fresh and aged pastes in concurrent runs by employing two stencils, two sets of squeegees and two timers. The stencils, squeegees and timers were all labeled “Fresh” or “Aged” to prevent any opportunities for cross contamination. During the run they were abbreviated “F” or “A.” A single Type of paste was tested each day for three days. Stencil under wipes were performed before each set of 5 prints, but not between prints. SPI readings were taken immediately after each print, and slump readings were taken 10-20 minutes after each print. The full runs that included 0, 30, 60 and 90 minute pauses took approximately 4 hours from start to nish. The tests were nested as follows:

Figure 7 – Test vehicle slump pattern

Time 0

Install “F” stencil and “F” squeegees

Stir “F” solder paste and apply to stencil

Print 5 boards

Start timer “F” for 30 minutes

Remove “F” stencil and squeegees, leave paste on stencil

Install “A” stencil and squeegees

Stir “A” solder paste and apply to stencil

Print 5 boards

Start timer “A” for 30 minutes

Remove “A” stencil and squeegees, leave paste on stencil

Install “F” stencil and squeegees

At 30 minute mark on timer “F” run WVD wipe

Print 5 boards

Start timer “F” for 60 minutes

Remove “F” stencil and squeegees, install “A” stencil and squeegees

At 30 minute mark on timer “A” run WVD wipe Print 5 boards

Start timer “A” for 60 minutes

Remove “A” stencil and squeegees, install “F” stencil and squeegees

At 60 minute mark on time “F” run WVD wipe

Print 5 boards

Start timer “F” for 90 minutes

Remove “F” stencil and squeegees, install “A” stencil and squeegees

At 60 minute mark on timer “A” run WVD wipe Print 5 boards

Start timer “A” for 90 minutes

Remove “A” stencil and squeegees, install “F” stencil and squeegees

Table 2 – Paste type, metal loading and lot numbers of solder pastes print tested

Figure 6 – Company Applications Laboratory

• • •

Means (or averages)

Standard deviations

Coe cients of variation (CV, or the standard deviation divided by the mean and expressed as a percentage). CV is preferred over Cpk when comparing di erent SPI datasets because it normalizes the variation with respect to the mean.

Page 16 The Choice of Publication for the Electronics Industry

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Table 3 – Data management spreadsheet

At 90 minute mark on timer “F” run WVD wipe

Print 5 boards

Start timer “F” for 120 minutes

Remove “F” stencil and squeegees, install “A” stencil and squeegees

At 90 minute mark on timer “A” run WVD wipe

Print 5 boards

Remove “A” stencil and squeegees

Clean both “F” and “A” stencil and squeegees

Slump readings were taken at approximately 12- 15X magni cation using a video microscope, as shown in Figure 7.

Visual evidence of slump was recorded and location noted in a spreadsheet that contained information on all the experimental data, including board labeling, SPI le names, start and stop times and print parameters. The number of bridges on the slump patterns

was noted and the locations were inserted as comments. All bridges in the slump patterns were photographed for future reference. An example of the data recording sheet is shown in Table 3.

Results and Discussion

One of the most challenging components facing mainstream PCB assemblers is 0.5 mm BGA devices. Figure 8 shows the measured transfer e ciency (TE), or the percentage of theoretical aperture volume that was deposited and the associated CVs. Each data point represents the average of 3780 deposit readings – 84 I/Os per device, 3 devices per board, 3 boards per panel and 5 panels per test. Figure 9 details the pad layout of the device.

Notice the TEs are all slightly higher than 100%. This is not uncommon and can be due to numerous factors relating to gasketing breaches and/ or paste pump out due to the 1:1 aperture:pad ratio and the combination of round pad with square-shaped apertures (these particular apertures are squares with rounded corners). The pads on this device are copper de ned, and, given this method of definition, shape di erences naturally lend themselves gasketing

issues, and the 1:1 aperture:pad ratio in general is highly susceptible to positional errors in the stencil or PCB, alignment error in the printer, or slightly undersized pads or oversized apertures. The CVs are all less than 10%, which is a common industry benchmark. They are actually all less than 5%, which represents very high consistency in the deposit volumes, and is attributable to both a well- printing solder paste and the polymer coating inside the stencil apertures. Note that on this TV, the 0.5mm BGAs have 11.5mil round pads, and 11.5mil square apertures (with rounded corners), with ARs of approximately 0.72. 0.72 ARs are relatively easy to print, especially with T4 and T5 solder pastes, given that the standard industry guidelines for printing with T3 pastes are ARs >0.66.

The T5 paste produced slightly higher volumes than the T4, which is expected due to the tighter

particle packing density of the smaller particle sizes and the greater propensity for pump out of smaller

particles, particularly with the geometric incongruities between apertures and pads.

The next area array pitch size to reach mainstream production is 0.4 mm. It has been in miniaturized electronics for more than 5 years as the base of POP packages, and is expected to extend to widespread use by 2018. This device has 360 I/Os with 9 per panel for a total of 16,200 measurements per data point reported. The TEs and CVs are shown in 10, and the device’s footprint is shown in Figure 11.

The TEs are again slightly over 100%, but less than the TEs of the 0.5 mm BGAs. These circular, copper de ned pads are 10mil diameter, and the apertures are 10 mil squares with rounded corners; their AR is estimated at 0.63. The CVs are also well under 10%, but slightly higher than those of the 0.5 mm BGA.

The 0.63 AR provided by this device makes for an easy comparison of aperture shape release

characteristics among aperture shapes of the same size, AR and pad de nition. The square apertures with rounded corners are also known as “squircles.” Figures 12a-12d compare the TEs and CVs of circles, squares and squircles at di erent pause times for 10 mil, copper de ned pads on the 4 mil foil.

At Time 0, little di erence is noted in the release performance of the di erent aperture shapes, although squares exhibit slightly less transfer e ciency. Squares typically show lower TE as paste particles tend to stick in tight corners, but squares also typically deposit more volume than circles of similar sizes because they have more area than their circular counterparts. In the case of Time 0, the actual volume deposits are 339, 412 and 421 mils3 for circles, squares and squircles, respectively. The TE trends are repeatable at Times 30, 60 and 90 minutes, but the CVs increase as pause time increases for both the circular and square apertures. The CVs of the squircles remain relatively stable as pause time increases.

The data for circular and square apertures used in this comparison was generated from the PTF patterns on the TV, and each point represents 480 readings (8 per pattern, 4 patterns per board, 3 boards per panel, and 5 panels per time condition).

The data from the PTF patterns was also analyzed for volume and CV.

Figures 13 and Figure 14 show the actual measured volumes for 10 mil squares and circles. These aperture sizes and shapes are typically associated with 0.5 or 0.4 mm BGAs and 0201s. Squares

Figure 10 – 0.4 mm device TE and CV by paste type over Time for copper de ned pads

Figure 12a-d – TEs and CVs various aperture and mesh types on 10 mil NSMD pads

Figure 11 – 0.4 mm BGA pad layout

Figure 8 – 0.5 mm device TE and CV by paste type over time on copper de ned (NSMD) pads

Figure 9 – 0.5 mm BGA pad layout

P:18

TECHNOLOGY TODAY FEATURE

feature continued...

Figure 13 – Actual volume measurement comparisons for 10 mil circles on both copper and mask de ned pads, and fresh and aged T4 and T5 solder pastes

Table 4 – Number of bridges found in slump patterns

Figure 14 – Actual volume measurement comparisons for 10 mil squares on both copper and mask de ned pads, and fresh and aged T4 and T5 solder pastes

Figure 15 – Actual volume measurement comparisons for 8 mil circles on both copper and mask de ned pads, and fresh and aged T4 and T5 solder pastes

Figure 16 – Actual volume measurement comparisons for 8 mil squares on both copper and mask de ned pads, and fresh and aged T4 and T5 solder pastes

always show higher volumes than circles, as previously described. Copper defined pads generally show higher volumes and CVs due to gasketing and pump out issues, also described earlier, particularly at 1:1 aperture:pad ratios. Mask de ned pads demonstrate lower volumes and less variation because the mask de nition improves gasketing. Typically BGA, LGA or BTC pads are copper de ned for improved reliability of the solder wrap around the pad edge. Discretes, however, are more easily mask de ned because they typically exhibit higher reliability with thermal cycling and drop shock than more complex component types.

Figure 15 and Figure 16 show the measured volumes for 8 mil squares and circles, which are typically associated with 01005 and emerging 0.35 mm pitch devices. Following similar trends

demonstrated by the 10 mil features, squares deposited higher volumes than circles and mask de ned pads exhibit less variation than copper de ned pads. T5 solder paste deposited higher overall volumes and comparable CVs compared to T4. The volumes of the T5 prints, however, did not explicitly duplicate the same trends as the T4, illustrating the fact that features sized this small have 0.5ARs and are more susceptible to noise in the printing process.

At time zero, no substantial di erences were noted between the fresh and aged pastes. Not reported in this paper, however was the divergence of volume variation noted at Time 60 min and Time 90 min. Aged pastes consistently produced higher CVs at the longer pause times than fresh paste, but did not demonstrate signi cantly di erent average volumes.

The increased volumetric variation can be attributed to the interaction of ux on the powders’ surface oxides which occur at room temperature storage.

Cooler temperatures retard the reaction of oxide reduction by the ux on the particle surfaces; higher temperatures accelerate it.

The data collected from the slump testing (15 patterns per paste type and condition) exhibited reduced slump on the aged samples of paste versus the fresh samples. This indicates a thickening of the paste due to increased interaction between the ux medium and alloy powder when stored at room temperature rather than refrigeration. All the bridges on the slump patterns were in the 4 mil (0.1 mm) line/space area, and were

Figure 17 - solder Bridge on 45° slump pattern

randomly distributed throughout the rotations, with no clear trends toward horizontal, vertical or angled patterns.

Further investigation will include querying the height information collected by the SPI to determine if the lower or higher viscosity pastes create more peaks or “dog ears” that can be discerned statistically.

Type 6 pastes were also tested in the matrix, but not reported for 1) the sake of brevity, 2) the lack of current market requirements, and 3) to emphasize the importance of the decision process between T4 and T5.

Conclusions

With the overwhelming amount of data collected and analyzed, several key conclusions can be drawn. These conclusions can benefit SMT process engineers confronted with ne feature assembly challenges.

1. The key to successfully printing AR <0.66 is a robust process foundation. This study was structured and performed to isolate the e ect of powder mesh with new, calibrated and maintained equipment

and highly skilled personnel. Achieving similar results in a production environment is possible but not probable. It is highly recommended to solicit on-site technical support from paste and equipment suppliers who can assist with process audits and technical guidance to ensure successful outcomes.

2. Aperture design: Square stencil apertures provide the most paste volume, but introduce the most variability. Round apertures provide less volume with equal variability. Squircles provided more volume than either circles or squares and less variability, especially after long pause times.

3. Reducing mesh size from T4 to T5 provides a modest bene t for both transfer e ciency volume and consistency on apertures with ARs <0.66. This bene t is marginal and may be negated in a production environment. Additionally, sourcing ne mesh paste may introduce burdensome cost and supply chain consequences.

4. Reducing mesh size had a modestly adverse e ect on pause-to-print TE performance over time and with extended pauses in the print process. However, minor process adjustments, such as kneading after long pauses, could alleviate these implications. While the rst prints after the long pauses were considered acceptable with respect to volume control limits, they were not optimal, which is critical to a well-controlled process.

5. NSMD pads provide more paste volume with considerable variability. Mask defined pads signi cantly reduce both paste volume and deposit variability.

6. The current requirements for Type 6 solder powder for SMT solder paste printing are still under development and production viability is being determined. However, Type 6 powders are well suited to new solder paste dispense and jetting formulas.

Future Work

The next planned phase of the test is the re ow portion, which will use the company PCB2009 TV \[2\] that includes component sizes down to 0.4 mm area array and 01005 discretes. The re ow tests will be performed in air, using Ramp-to-Spike and Ramp-Soak-Spike pro les. It will include both fresh and aged pastes in T4, T5, and T6 powder sizes. Results will be reported in a future paper.

Also planned is a repeat of the print tests on the Solder Paste Evaluation TV \[1\] using fresh T4 and T5 pastes, and uncoated stencils. Two stencil alloys will be tested in this phase, which will also be reported in a future paper.

Acknowledgements

The authors wish to thank Tech Circuits for their support in fabricating the test vehicles, Fine Line Stencil for their assistance in providing products to help execute these tests and the Parmi technical team assistance in con guring SPI equipment for the DOE. Special thanks to Shea Engineering Services for their assistance in developing and analyzing this data.

References

1. Jabil Solder Paste Evaluation Board and Kit. Can be acquired o the shelf by internet searching the phrase “Jabil Solder Paste Evaluation Board”

2. AIM PCB 2009 Solder Paste Print Test Board and Kit. Can also be acquired o the shelf by internet searching the phrase “AIM PCB 2009 Evaluation Board.”

Page 18 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:19

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TECHNOLOGY TODAY FEATURE

Over 225 Years of Service Provide a Rich Past & a Bright Future for Solder Bar

By Evan Morris, Vice President/Production, Nathan Trotter & Co.

Founded on the banks of the Delaware River in 1789, Nathan Trotter & Co. was rst known as a metal-importing company. Nathan Trotter himself provided tin to Colonial craftspeople who turned it into pewter. Today, more than 225 years later, the company has evolved into the largest manufacturer of tin and tin alloys in North America, preserving its legacy as the oldest continuously-operated metals manufacturer in the United States.

The company’s headquarters; a 45,000 sq. ft. facility in Coatesville, PA, has evolved into the largest manufacturer of tin and tin alloys in North America.

Derived from its expertise with tin, Nathan Trotter has become a leading source of solder, with a growing solder recycling program and a steadfast tradition of exceptional customer service, industry- leading metallurgical expertise, and competitive pricing. As the business and its solder products continually evolve, the company’s attention to detail, responsive service, and dependability have not waivered, earning more than two centuries of business and recognition.

Its impressive list of customers, including Fortune 500 leaders, know that the company will use its metallurgical expertise to meet increased customer demands at the highest level of quality and the lowest possible cost.

“We know solder, and have for hundreds of years,” said Ben Etherington, VP of Operations at Nathan Trotter & Co. “But providing a high-quality solder at a valued price point is what really sets us apart from the competition.”

Etherington continued to say that the company is able to leverage its large tin volume for favorable raw material pricing resulting in a more competitively priced solder bar.

Nathan Trotter & Co. operates a 45,000 sq. ft., state-of-the-art manufacturing facility in Coatesville, PA, along with a 40,000 sq ft reclaim facility nearby in West Chester, PA. From these facilities, the company provides its key services of manufacturing, solder recycling, and laboratory.

Manufacturing:

Nathan Trotter & Co. maintains unparalleled exibility and capacity to manufacture solder to exacting customer demands. Consistent purity levels and adherence to customers’ product speci cations are among the company’s top priorities. Additionally, Nathan Trotter has been ISO 9001:2000-certi ed since 1997 and internationally recognized for quality, safety, and delivery.

With both extruded and cast bar capabilities, Nathan Trotter & Co. offers a range of manufacturing options to meet customers’ speci c requirements. Etherington added, “We use con ict-free, high-quality metals for all alloys. Solder Recycling: Tin Technology and Re ning is the recycling/reclaim division of Nathan Trotter. Tin Tech works in conjunction with Nathan Trotter solder bar customers and other generators of tin-based scrap to recycle dross, drippings, residues, paste, and other solder scrap that is generated from the use of solder. Tin Tech operates as a DEP-permitted, environmentally- responsible smelter with full reduction capabilities

enabling optimal recoveries for all types of solder scrap material.

The company also o ers exible metal reclaim programs tailored to customers’ individual preferences. Customers can receive monetary payment based on the current market value and recoverability of material. As an alternative to payment, Nathan Trotter o ers a solder “swap” program to exchange scrap for new solder bar.

Laboratory: Nathan Trotter & Co.’s in-house lab is comprised of state-of-the-art XRF and Optical Emissions Spectrometry (OES) equipment, which enables precise chemistry testing of all solder alloys and ensures adherence to required specifications. A certi cate of analysis is provided with each order.

In conjunction with the use of Nathan Trotter solder bar, the company o ers a complimentary solder pot analysis program to ensure the user’s application remains at optimal chemistry. Capabilities include testing to a full chwemical analysis, speci cation, or on an elemental basis down to the single ppm. Samples typically are turned around within three business days with same-day expedited testing available.

Etherington concluded, “Nathan Trotter is proud to have a strong foundation and history, great experience from which

to draw, and longstanding industry relationships that will help us move into the future with confidence. The time- honored values, continuous pursuit of innovation, and commitment to partner with

our customers that have characterized Nathan Trotter for the last two centuries will remain a cornerstone of the business.”

www.nathantrotter.com www.tintech.com

Tin Technology and Re ning, the reclamation division of Nathan Trotter, provides maximum value for solder scrap.

Nathan Trotter & Co. has a long and rich history in solder. Its sterling reputation and dedication to quality has kept it in business for over 225 years.

Page 20 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:21

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P:22

TECHNOLOGY TODAY FEATURE

Staying Power in the Fiercely Competitive EMS Business

By Bjorn Dahle, President, KIC Thermal

With a level playing eld in terms of access to talent, technology, knowhow, infrastructure, and nancial resources, how can an

EMS company build a successful business year after year, decade after decade? There may not be a magic formula that works for everybody in this ercely competitive business. As a matter of fact, having a di erentiated strategy relative to the competitors is one opportunity for success. With the ever-growing pricing pressure

is there any alternative to penny pinching? In my opinion, not only are there successful alternatives to penny pinching, but they are necessary for long-term success.

But what if we could look at this strategy in a different light? Are there best manufacturing practices valued by a wide variety of industry segments that also reduce production costs?

Before the 2008 industry downturn, Siemens Manufacturing Co. implemented a lean manufacturing practice to run its operation more e ciently at a lower cost. This was a company- wide initiative that proved hugely bene cial over time. Let’s drill down to a speci c process and analyze how the company operates.

President John Siemens III states that because the pick-and-place machines do a great job, the company focuses more on the re ow and screen printing processes where there is room for improvement. Operational Excellence Manager Kelli Lubenkov believes that the RoHS thermal process is critical due to the narrow process window brought on by the heat tolerances of some of the components. The company has established the practice of pro ling every new, unique PCB assembly before starting production. Additionally, previously run PCB assemblies are pro led after production line changeover to verify that the oven is ready to process the assembly in spec. This is an expensive practice because it leads to additional production downtime as well as an extra labor cost associated with technicians performing such a time-consuming manual task numerous times daily. EMS companies in North America tend to produce a large variety of assemblies in a high-mix/low- to medium-volume production environment. Siemens Manufacturing Co. is no

di erent, with up to half a dozen changeovers per line per day. Client bene t is obvious in terms of better quality products that carry its name and reputation. However, such an expensive practice contradicts the trend towards lower cost.

Siemens Manufacturing Co. takes a holistic view to running their factories efficiently. Verifying that the reflow oven is ready for an in-spec reflow reduces cost associated with rework and scrap. The company recently was reminded of the cost of poor solderability when it acquired another EMS company. Before implementing the best manufacturing practices at

this facility, $7,000 worth of assemblies were scrapped due to incorrect reflow.

All this pro ling downtime is costly, and part of lean manufacturing is to seek out opportunities for improvements. The company wanted to

With the ever-growing pricing pressure is there any alternative to penny pinching? In my opinion, not only are there successful alternatives to penny pinching, but they are necessary for long-term success. The teachings of a competitive strategy led by Michael Porter states that in a commodity market there is only one long-term winner. That is the lowest cost leader because he can lower the price until everybody else leaves the business. So unless you are the Walmart or Amazon of the EMS business, you may want to consider a di erentiation strategy.

One EMS in the St. Louis area has used a number of successful strategies, some of which are counterintuitive, that have led to a successful business since 1963. There may be lessons to learn when dissecting Siemens Manufacturing Co. Inc.’s strategies. (No relation to Siemens AG, the multinational conglomerate).

The first striking revelation about Siemens Manufacturing Co. is that it does not specialize in any speci c industry segments or applications. As illustrated in Figure 1, Siemens Manufacturing Co. serves numerous industries.

According to Director of Business Development Mike Siemens, a diverse spectrum of clients provides less volatility in demand since various industry’s segments tend to be countercyclical to others. A growth in some industry sectors often compensates for downturn in other segments.

There is always a risk of being everything to everybody, which usually leads to being nothing to anybody. There is also a concern that by gearing up the factory to satisfy the most demanding customers, such as the automotive sector, expensive solutions go unappreciated by the less demanding clients.

Figure 1: Siemens Manufacturing Co. Inc.’s client industry composition

Page 22 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:23

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P:24

TECHNOLOGY TODAY FEATURE

feature continued...

Figure 2. Siemens Manufacturing Co. invested in a KIC automatic pro ling system to increase production line utilization, and to save both time and money.

signi cantly improve the time it takes to dial in an oven for a new assembly, as well as to speed up pro ling after oven changeover. The rst step was to acquire prediction software that would identify the most appropriate oven recipe for a new assembly. With literally billions of possible oven recipes, the old-fashioned, manual “trial and error” approach was wasting time. Also, the manual tweaking of the oven recipe depends on operator skill, and it tends to lead to oven recipes that are not optimized for quick oven changeover. While the new oven setup software eliminated the trial and error approach, it still relied on running manual pro les.

Siemens Manufacturing Co.’s second step was to invest in a KIC automatic pro ling system (Figure 2). Once the automatic system has been programmed, oven changeover is a simple matter of loading the product le, and the automatic system will notify the operator the instant the re ow oven is ready to run the next assembly in spec. Not a moment of unnecessary downtime is sustained. The 2-6 manual pro le runs per oven per day for existing assemblies, along with the associated production downtime, are now a thing of the past. Mike Siemens estimates that with 7 lines their factory now saves a total of 5 hours and 15 minutes downtime per day, which represents a daily saving of $1,000. The calculations are based on the following representative numbers for Siemens:

Automatic profiling is saving at least 15 minutes per changeover. $190 per hour cost of downtime ($90 labor, $100 machine time) Average 3 changeovers per day on 7 lines.

10x3x7 = 315 minutes per day 315/60*$190 = $997.50 per day savings

Another bene t is that during the production run, every PCB is pro led automatically, and adherence to the relevant process window is veri ed. John Siemens stated that there are opportunities for the oven to drift out of spec during a given production run. One example may be an upstream stoppage that leads to a temporary empty oven followed by a wave of tightly spaced PCBs. Such thermal loading may lead to changes in the PCB pro le.

Other opportunities for pro le variations during production may include facility exhaust system changes, human error and more. With KIC, the re ow quality becomes consistent and free of operator in uence.

This is an example of a win-win situation where the client is ensured a high-quality product (from the thermal process perspective) and full thermal process traceability, while

the new reflow technology reduces cost in scrap, rework, production downtime and even electricity use. (Case studies indicate a 15% electricity use reduction opportunity for each reflow oven with the use of oven setup software.)

The same investment in lean manufacturing and smart oven technology also supports Siemens Manufacturing Co.’s other core strategy characterized by an intense focus on customer support. Clients appreciate flexibility, quick response time and fast time to market. The re ow oven prediction software enables a faster NPI and the automatic system o ers process

documentation, traceability and peace of mind. Siemens Manufacturing Co. is even setting up a factory in Mexico, not motivated by reducing production cost, but by being able to better serve its many clients that now are located in Mexico.

Running a lean and flexible factory offers an opportunity to accept projects that few other contract manufacturers can handle. According to

Sales Manager Lisa Boland, the flexibility allows the company to react faster and to take on different sized projects, all the way down to small clients. As a result, Siemens Manufacturing Co. has won several contracts over the years with little

to no competition due to the difficulty in accommodating clients’ requirements while staying profitable.

The intensely competitive EMS industry makes the old adage unacceptable: “There is never enough time to do it right, but there is always enough time to do it twice.” Defects are simply too expensive and “doing it right the rst time” is the new strategy. Investing in the right technology and strategy can lead to the best of both worlds: happy customers and higher pro ts.

kicthermal.com

Figure 3. Siemens Manufacturing Co.’s smart re ow oven.

Page 24 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

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TECHNOLOGY TODAY FEATURE

Japan Unix Advanced Soldering Technology: Crucial for Extreme Aerospace Environments By Yusaku Kono, Marketing Director, Japan UNIX Co. Ltd., Tokyo, Japan

Japan Unix Advanced Soldering Technology: Crucial for Extreme Aerospace Environments

Like many industries, aerospace continues its trend toward more sophisticated electronic controls. This, in turn, drives ever-increasing solder joint density and miniaturization as more and more electronics are packed into smaller spaces. Under normal conditions, these trends present a signi cant challenge for soldering technologies. To make matters worse, the aerospace industry demands absolute reliability in extreme environments. Japan Unix o ers some of the world’s most advanced soldering technologies that help to meet these challenges.

Aerospace electronic equipment must survive the most severe environmental

conditions on earth

Environments are harsh at the edge of space. The temperature is extremely cold, reaching minus 50°C and ultra-low air pressure of 240hPa at altitudes over 10,000 meters. Strong winds rage at over 100kph, in some cases reaching 300kph in the jet stream. Aircraft must be able to safety y at speeds of 800kph in this unforgiving place.

Like military equipment, aircraft and spacecraft are precision machines built to withstand the most demanding conditions. Their designs must meet the highest engineering, quality and safety standards for components and electronic assemblies.

However, as laser technology becomes more advanced, the technology is becoming an increasingly attractive option for users seeking very high-reliability soldering.

The global aircraft and aerospace market is moving toward 100% lead-free solder. Although, lead-free solder has been successfully applied in home appliances & consumer electronics, the aviation segment has been reluctant to make this change to lead-free due to reliability concerns. However lead solder will be banned in 2018, forcing the global industry to comply.

Meanwhile, many Japanese manufacturers in electronics and automotive have promoted lead- free soldering since the inception of RoHS in 2006, and by now have almost completely transitioned to lead-free. Japan Unix has accumulated signi cant expertise in lead-free robotic soldering, working with its customers who lead their respective industry sectors. In particular, major clients in the automotive and industrial machinery sectors have products that are used in environments whose harshness is second only to aerospace or aircraft. This soldering expertise is now being applied by many aerospace and aircraft industries.

soldering iron conducts heat, but a soldering laser generates surface heat. (For more information, see our Website or “The Foundation of Soldering Technology Knowledge, Volume 2: New Evolving and Developing Solder Technologies ~ Laser ~”)

When metals such as tin, silver or copper are soldered, flux or other chemical substances promote a chemical reaction upon heating, after which they solidify. Solid metal is melted and ows into through-holes or along a surface to form a solder llet. To achieve proper and consistent soldering forms, optimal soldering designs are required. Solder joint design should consider conditions such as landing pattern, component

Highly accurate flight control is of primary importance for communication, navigation, recording and safety systems. Inside the cabin, environmental equipment such as pressurization and HVAC systems are important for passenger comfort. Entertainment systems and food service equipment also add even more electronic equipment, all of which must have high-reliability solder connections that are expected to last, in many cases, for decades.

Lead-Free solder transition raises issues for aircraft electronics

Aircraft electronics are characterized by thick substrates and large currents. Moreover, components are small and, therefore, susceptible to heat, and di culties arise when they must be densely placed at narrow pitches. Many Japan Unix customers use laser soldering systems for these reasons. To dwate, robot and laser soldering have been used primarily on mass production.

How to apply e ective laser

soldering

In order to automate the soldering process by adopting laser technology, a manufacturer should be prepared to use a combination of the following three technical capabilities:

• Distinct knowledge of lasers • Soldering expertise

• Robotic integration & control

A conventional soldering iron and a soldering laser are based on di erent concepts of heat transfer. A

geometry, material and desirable thermal capacity.

Automation of these optimally-designed soldering conditions requires translating them into robotic operating commands and programming, which takes unique expertise. Automated soldering processes include adjusting a heat source (soldering iron or laser), feeding the solder, and providing controlled heat (via an iron tip or laser irradiation). In addition to its soldering design

Page 26 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:27

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P:28

TECHNOLOGY TODAY FEATURE

feature continued...

expertise, Japan Unix owns numerous critically important technical laser soldering

patents. For example, Japan Unix owns a patent for laser irradiation position marking that is widely regarded as the rst step in the process of developing robotically soldered joints. Other related patents include solder feed and position calibration, which ensures that Japan Unix technology provides industry-leading laser soldering capabilities.

standards were transferred to IPC, and since then they have been updated and managed as IPC- J-STD. Top global organizations such as NASA, BAE Systems, Boeing, Airbus and GE together develop and adopt IPC standards.

IPC fully recognizes J-STD-001 as a globally- accepted soldering standard, and it has been adopted by worldwide electronics companies. Meanwhile, the soldering quality required by the aerospace industry, described above, has criteria that di er from the requirements of other segments. Therefore, IPC has established a J-STD-001(S) as a special standard that de nes additional aerospace-speci c requirements. Japan Unix is able to quickly obtain industrial updates and the latest requirements as the IPC’s o cial partner in Japan.

Japan Unix Soldering Lab &

Japan Unix organizes a soldering lab to scienti cally analyze soldering and operates a school to educate soldering technicians. A large number of highly-skilled soldering engineers have been internally trained to provide soldering advice for our customers. The latest assemblies are brought to the lab from all over the world to be tested and analyzed with soldering robots. These relationships help Japan Unix to accumulate a wealth of knowledge in soldering and automation.

If there is even one soldering mistake, the entire product becomes defective. It cannot serve in a safety-critical function in aerospace equipment, whose defect will directly in uence human lives. Japan Unix’s accumulated knowledge is shown in quantitative data and, thus, we can propose scienti c solutions to customers. At the same time, our experienced engineers can take an approach to solve soldering issues with both quantitative and qualitative factors.

Japan Unix has been gaining actual results and data from soldering robots and automation experience for decades. This experience applies most directly to automotive, but is adapted to other industries, such as the medical, aviation and space segments. We also have signi cant experience in the aviation and space industries where we have longstanding partnerships with ITAR-compliant distributors such as Fancort Industries in North America.

Therefore, Japan Unix has come to be seen as the only soldering robot provider for electronics made to operate under the harsh conditions where humans cannot act.

Other Examples:

1. Ultrasonic soldering may be used to solder aluminum and glass materials for aircraft instrumentation and ight equipment.

See also: “The Foundation of Soldering Technology Knowledge, Volume 3: Things that “Could Not Attach” can now “Attach:” A New Future Emerges with Ultrasonic Soldering

https://www.japanunix.com/industry/case_study. php

2. The UK National Physical Lab (NPL), the leading measurement institute, analyzed Japan Unix laser soldering samples and proved its high quality.

Visit YouTube link to view the NPL’s veri cation. https://youtu.be/aww0xXp3x1w

3. Japan Unix conducted research about how inadequate laser irradiation diameter leads to soldering defects.

Visit YouTube link to view our comparison test. https://youtu.be/JOpSwQ7-Hw0

4. Japan Unix soldering lab analyzes the growth of soldering composition.

www.japanunix.com

Optimizing laser shapes for each

component’s geometries

To support complexities in recent electronic components and assemblies, Japan Unix has uniquely developed a multi-phi laser as new laser soldering technology. In conventional laser soldering, the irradiation diameter is xed, but in the multi-phi laser, the diameter is automatically changed to match the component shapes and land patterns.

If the irradiation diameter is xed on a substrate where large and small components are placed, the diameter will be adjusted to the smallest one, but the heating capacity will then become insu cient for the largest components. As a result, the irradiation time must be longer, and that may inevitably impact production e ciency and quality. Automatically changing the diameter every instant can provide optimal soldering conditions for each component.

When contact soldering, the optimal iron tip is selected for soldering each component. Equivalent changes are accomplished by changing laser diameter or shapes. And even beyond its variable- diameter lasers, Japan Unix also can propose specially optimized variant laser shapes that include ring, square or oval.

Global standards for the aviation and aerospace industry

In 2015, Japan Unix established a partnership with IPC, and is supporting its expansion in Japan. IPC brings global manufacturers standardization for each production process. In the 1980s, the MIL

School

Page 28 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

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TECHNOLOGY TODAY FEATURE

FSInspection Improves Saline Lectronics’ Process with Help from the HDMag

by SMT Today Editor, Photos by Khalid Ibrahim

Bird’s eye view of one side of Saline Lectronic’s 110,000 sq ft plant

Saline Lectronics is an electronic contract manufacturer based in Saline, MI, specializing in manufacturing innovative electronic assemblies with lean methodology and advanced technology. Over the last 13 years, Lectronics has built a reputation for being customer-centric by establishing strong partnerships with each of their clients. Going beyond the typical contract manufacturing relationship, Lectronics provides an array of added-value services to clients including engineering support with thorough Design for Manufacturability assessments.

FSInspection will debut the all new VERSAMag® High-Magnification HD Inspection System at SMTA International in September 2015. The new VERSAMag combines the accurate measurement capabilities of a high-resolution inspection camera with a exible design to meet the industry’s diverse visual inspection needs.

VERSAMag has a multi-axis, high-resolution camera that tilts and rotates for multiple angle inspection with an adjustable Z-height arm for the versatility to inspect objects of various shapes and sizes. This lightweight and exible inspection system has magni cation up to 96x and includes real-time video inspection, exible working heights and intuitive controls.

“Due to the high caliber of technologically advanced equipment that FSInspection provides, and the fact that our manufacturing team regularly uses our current HDMag tool,

I look forward to a long- standing relationship including positive growth opportunities with FSInspection,”

commented Mario Sciberras, President/CEO of Lectronics.

With a focus on continuous improvement, Lectronics recently rolled out a new company- wide lean initiative to enhance the organization through updated lean tools and processes. Additionally, Lectronics has experienced exponential growth over the last couple of years empowering the organization to acquire the latest equipment available in the electronic manufacturing industry. Equipped with these technologically advanced machines, Lectronics delivers impeccably assembled quality products to clients on a daily basis.

One facet to which Saline Lectronics attributes their growth and success to is the partners they choose when purchasing equipment for their manufacturing process. Recently, Lectronics purchased the HDMag from FSInspection. Introduced to Lectronics via Dave Trail of Horizon Sales, the HDMag was an instant hit. “Once I tried the HDMag for myself, I immediately knew it was something we needed in our facility,” commented Jason Sciberras, Manufacturing Manager at Saline Lectronics. “We use the HDMag daily in our SMT Department to better inspect any placement concerns on a PCB Assembly, and to better ensure that all placements are within IPC quality standards.”

The HDMag® is perfectly positioned to provide greater assistance in SMT inspection, repair and rework, and in the ght of counterfeit part and component detection by improving inspection accuracy and e ciency. The ergonomic design and integrated monitor combined with the HDMag Software provides convenient collaboration among peers and supervisors, as well as real-time sharing with suppliers and/or customers. The ergonomic design also promotes good posture and reduces operator eye, neck, and back strain.

“The HDMag tool is incredibly bene cial because it allows our entire team to see the same image simultaneously, making us better equipped to troubleshoot any assembly placement concerns,” added Mr. Sciberras. “Before buying this scope we were limited to inspecting PCB placement issues separately, which made it di cult to come to a consensus about the actual root cause and move forward with a collaborative solution.”

FSInspection produces High Magni cation visual inspection systems that are advanced, accurate, and a ordable. HDMag system has been created for ease of use and has been ergonomically designed to reduce operator strain. This results in increased operator accuracy and improved productivity. These visual inspection systems are a more cost-e ective, operator supportive solution than traditional microscopes. FSInspection knows the overall quality process is constantly evolving. Their versatile Visual Inspection Systems can be used in multiple industries, including but not limited to consumer & industrial electronics, mechanical parts, automotive, forensics, medical, micro assembly, micro repair, and other quality control tasks.

“We are very pleased to know that the HDMag is not only meeting Saline Lectronics’ expectations, but also exceeding them,” commented Terry Clas,

VP of Business Development, FSInspection. “Our product line of visual inspection solutions

is expanding with the latest addition, the VERSAMag, ready to ship in October 2015.”

www.fsinspection.com www.lectronics.net

Saline Lectronics SMT Technician John Mielke using the HDMag

Page 30 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:31

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P:32

TECHNOLOGY TODAY FEATURE

“Be Ready...... Be Smart”

by Davina McDonnell, Saline Lectronics

The concept of Industry 4.0 is becoming increasingly important. Industry 4.0 is a term used to describe the concept of the “Smart Factory,” – one in which the process of manufacturing is automated and cyber-physical systems are able to communicate with one another and work together to achieve a common goal. This fourth industrial revolution is made possible via the Internet of Things – a network of physical objects embedded with electronics, software, sensors, and network connectivity that enable all of these objects to communicate with one another.

the quality of deliverables to customers.

Another example of horizontal integration would be Lectronics’ partnership with KIC in using their RPI System for oven pro le management. The RPI System provides better visibility of the PCB assembly temperatures felt during re- ow – rather than simply measuring the oven temperature. The RPI System also o ers live virtual pro les for each PCB assembly and talks directly to the aforementioned Cogiscan system for enhanced factory integration.

Additionally, Lectronics has rolled out speci c initiatives that enhance the strategic relationships between material suppliers and clients. It has long been an industry standard to be more secretive about sharing supplier relationships; however, Lectronics has found that transparency gives everyone a stake, eliminates unforeseen surprises, and has a positive impact on communication for long-term growth.

Through-engineering across the entire value chain is the third main characteristic of Industry 4.0. Through-engineering encompasses the idea that the focus in manufacturing shouldn’t just be on the production process, but also on the end product. Focusing on the entire product life cycle, as an e ortless process that happens during the production stages of new products, the development process becomes integrated with product life cycles. This creates new collaborations between product development and the corresponding production systems.

Industry 4.0 is a key concept in the world of electronics manufacturing. According to the Deloitte report “Challenges and solutions for the digital transformation and use of exponential technologies” there are four main characteristics of Industry 4.0:

1.Vertical networking of smart production systems

2.Horizontal integration via a new generation of global value chain networks

3.Through-engineering across the entire value chain

4.The impact of exponential technologies

To start, vertical networking

of smart productions systems refers to the ability of “smart factories” to be able to respond to changes in demand, supply, and faults. This allows smart factories to be needs-oriented, individualized, and customer- specific in terms of production operations. A smart factory will always know every resource and product it has, and in an ideal world, can always locate a part or material. The smart factory can better manage production, account for discrepancies or fluctuations in orders, and make necessary adjustments much faster.

Fully embracing vertical networking, within Saline Lectronics’ Surface Mount Technology (SMT), all machines are linked to one another and able to fully communicate. As an example, the Solder Paste Inspection machine (SPI) is directly linked to the Automated Optical Inspection (AOI) machine. If there is a failure found at AOI, technicians are able to automatically pull the SPI data to see what e ect, if any, the solder paste had on the failure at AOI.

Additionally, Lectronics’ Juki Surface Mount Lines communicate directly with the Juki Fortresses. These humidity-controlled Fortresses store sensitive components and other reels for high- volume production jobs. When a Juki SMT Line is running low on a speci c component, it will trigger a low-level alert directly to the Fortress to automatically dispense the required replacement reel. The replacement material is available exactly

where it should be just when it is needed. This helps to reduce line changeover time, as well as any machine idleness during a production job.

The long-term plan at Lectronics is to better connect all of the machines to one another on the production oor. These enhanced connections will require Data Analysts to fully monitor and understand the data being generated by this network of machines. With all of these new data, Data Analysts will work to make Lectronics’ manufacturing processes more intelligent and more e cient.

“Our continued investment in Smart equipment is providing us with statistical data on all aspects of the manufacturing process. We have partnered closely with both our manufacturing teams and

our technology vendors

to ensure that we have the infrastructure to support

and expand an ever-growing system of interconnected devices,” commented Tom Scales, IT Manager. “We are only just scratching the surface of what this wealth of information can enable us to achieve, and how

it will enhance the quality of products to our customers.”

The second main characteristic of Industry 4.0 is horizontal integration via a new generation of global value chain networks. These networks are optimized networks that integrate customers and business partners across countries. Process chains become increasingly transparent and exible. The process chain’s exibility is vitally important when it comes to customer-speci c adaptations. It is this same exibility that allows process chains to dynamically handle enabling factors, like quality or risk, in real-time.

Lectronics partnership with Cogiscan is a perfect example of horizontal integration. Implementing Cogiscan’s Track, Trace, and Control system throughout the production facility enabled Lectronics to provide full transparency and advanced traceability data to the reference designator. Additionally, this system provides better visibility of materials and real-time data of work-in-progress. The Cogiscan partnership has allowed Lectronics to make dramatic operational e ciency improvements, thereby greatly increasing

Page 32 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

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WWW.LECTRONICS.NET

BRINGING YOUR ELECTRONIC PRODUCT TO LIFE

Setting the Pulse for Electronic Manufacturing

P:34

TECHNOLOGY TODAY FEATURE

feature continued...

Maximizing the entire product lifecycle, Lectronics utilizes a Project Management system for each product that they manufacture. With a new product launch, the Lectronics team follows a New Product Introduction (NPI) Process, which allows Lectronics to maximize opportunities on product manufacturability enhancements while still decreasing time to market for customers. During an NPI, a Design for Manufacturability Report (DFM/DFA) can be performed for Lectronics’ clients in order to enhance the actual assembly of the product.

For products already in production, but which are being manufactured by Lectronics for the rst time, a Product Realization Process (PRP) is used as the management tool. The PRP process provides real-time information about any issues or concerns related to the manufacturing of the end product, Lectronics’ recommendations to improve those concerns, and an exact timeline for nal product delivery.

Lectronics’ Lean Initiative also contributes to through-engineering of the value chain. This initiative emphasizes synching all players required in the assembly of a nal product. Lean demands linking all of Lectronics’ internal suppliers directly with any external suppliers in order to foster open communication and collaboration. This Lean approach creates accountability for all parties involved throughout the entire product lifecycle.

The nal main characteristic of Industry 4.0 is the impact of exponential technologies as a catalyst for improvements in the manufacturing process. These exponential technologies often refer to customized solutions through Arti cial Intelligence (AI), complicated robotics, and extremely advanced sensor technologies.

Initially, these types of technologies were not entirely accessible for smaller companies, as their cost and size made them prohibitive. However, recently, these two variables have decreased while computer power has risen massively. All of these technologies allow for savings in terms of cost and time, increased manufacturing capabilities, e ciency improvement, and enhancement of the overall production process.

Lectronics is always looking forward to emerging technologies in order to stay at the forefront of what’s next within the electronic manufacturing industry. Many electronics designers, especially within the consumer and medical industries, are demanding smaller and smaller components in order to t within new, modern products. This increased need for micro-components and exible printed circuit boards has challenged both how and with what tools contract manufacturers assemble these new product types.

Lectronics has responded accordingly by investing in the appropriate technology to assemble these new types of components; for example, Lectronics’ Juki SMT Machines are equipped with nozzles that can place tiny 01005 components. Additionally, Lectronics utilizes an Apollo Seiko L-CAT-4430 EVO soldering robot for high-volume, repetitive, tight soldering needs. Overall, Lectronics’ Team Leaders from Engineering and Manufacturing regularly attend industry speci c seminars and

conferences to stay abreast of these changing requirements for micro-components and exible electronics.

“As an early adopter of the connected factory concept, we are in a unique position to remain an industry leader within Smart Manufacturing,” commented Mario Sciberras, President/CEO of Lectronics. “This added transparency and connectivity greatly enhances the electronic manufacturing experience for our customers.”

Embracing Industry 4.0 is a major cornerstone of Lectronics’ business model and vision. As this concept further evolves within manufacturing in the United States, Lectronics plans to remain at the forefront by continuously optimizing their machinery, processes, and employees to this industry of the future.

www.lectronics.net

Page 34 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:35

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TECHNOLOGY TODAY FEATURE

A Practical Guide to Managing Material

Cost Impact

By Ben Khoshnood, president, inovaxe innovative material handling solutions

When you ask the EMS management team what is the material impact on their business, they typically respond by adding up the number of people that work in the stockroom, and those involved in kitting and material stock return, plus shipping and receiving.

in bags hanging from racks, etc. There are also many methods (contraptions) that have been put together to hold the reels in a kit, so that they can be identi ed when moved to the feeder loading station, such as a peg board with long pegs, wire divider metro rack carts, manila folders and le cabinets, etc. Recently, a number of products have been introduced to help automate stocking and kitting processes. Typically, this type of equipment is large robotic systems with low reel storage counts per cubic foot, an expensive elephant in the room with a high installation cost. These robotic systems retrieve one reel at a time, taking sometimes more than 30 seconds per reel, which is much faster than a typical 4 to 10 minute retrieval time.

There is only one company from the US that has introduced a non-robotic system that can detect the presence and absence of a reel in its single package, single location storage system with the ability to light up

the location of the parts to be identified. This system is blazing fast, easy to use, mobile, and has the highest cubic foot density for the storage of reels. The InoAuto, by Inovaxe can hold over 1,100 reels in a 44”L x 15”W

x 64”H space. It lights up all the parts in your kit, making them instantly available and reducing your kitting time from hours to seconds.

The next area that has a lot of opportunity for non-value added labor reduction is the feeder setup operation. The operator typically generates a feeder setup sheet and goes through the stacks of reels the stockroom put together in order to nd the right parts in order. If you really think about

For so many years we did not pay attention to, or totally understand, the business impact of the material acquisition and handling costs. The more EMS providers get squeezed out of their pro ts from the vise grips of distributors and end customers, the more imperative it is that the industry totally focuses its attention, not only on the supply chain, but also on how material is delivered, handled, and managed in the operation. It is time to send in the armies of black belt, lean six sigma Ninjas to work, and provide the Western hemisphere EMS providers with more hope to compete globally. When bottlenecks are removed and automation is fully implemented, locally manufactured product is most cost e ective.

Background

Many years ago, I was running a high mix, low to mid volume EMS business, and like everyone else surprise shortages were driving the million dollar SMT lines to screeching halts. It was often that the sound of cha-ching would stop, and everyone, and I mean everyone, was dealing with trying to nd the part that was supposed to be in the factory, but was nowhere to be found. The program managers, material sta , purchasing, production sta , and I, would get hourly calls from the customer who wanted to know the status of their desperately needed job. We would look everywhere, and no one seemed to have the answer as to where the part was placed. My purchasing manager would raise her right hand and swear that she brought the part in. All this would take place while the SMT line was shut down waiting for us to nd the penny part. This is so common that the EMS industry added a phrase to our lexicon: “Surprise Shortages.”

In one instance when we nally found the part, it was placed on top of a shelf because the part needed to go directly to the oor when it arrived, and there was no speci c bin assigned for the part. Sound familiar?!!! Also, by the time we found the missing part, reordered it, and paid for an overnight shipment, we were now late on the demanding customer order, and overtime was in place to get the assemblies out ASAP. And then to top it o , my management team was meeting with a high-speed SMT equipment manufacture to order another line, so that we could meet customer demands! It dawned on me then, “What if we never had surprise shortages? What if we could pull the kits instantly and accurately? What if the feeder set-up crew could nd parts in seconds? What if?, What if?, What if?!”

The answer was painful and enlightening. We could have exceeded our customer demands with one less line. The existing sta could have supported the increase in volume of the business threefold without adding any more sta . My buyers would have had more time to strategize material deliveries and negotiate prices more e ectively. My

program managers were not material expediters and could have provided a lot more customer service. The overtime would have been far less, the cash ow would have improved, the material costs would have come down, my sta would have had more time to prevent the excess and obsolete inventory build-up, and our pro t would have soared.

So what is the answer? A fresh look at how we deal with material kits and inventory! When the Six Sigma revolution started to improve quality, in the 80’s, we were not setting goals to improve by 10%. Drastic change was required, not incremental improvements. Today, this means the traditional shelves and bins need to go, Metro carts and Home Depot shelving and bins are no longer the best way to store your parts. Close your eyes and envision a factory where the right amount of material arrives when you need it, and is placed in a location that, within a few seconds, can be picked up, and loaded into a feeder without human error.

Improving Material Operation

Let’s try to map out a standard material handling operation. The ow chart of a typical factory after the parts are received and moved to the stockroom looks something like this as shown in Figure 1.

This operation could take anywhere from 4-10 minutes per component in a typical stockroom with bins and shelves. There are many di erent methods that have been jerry-rigged to help with nding parts quicker or making the reordering process faster, such as Kanban, dual bin systems, weighing the parts, folder style reel holders, reels

Figure 1. Flow chart of a typical factory after the parts are received and moved to the stockroom.

Page 36 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:37

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P:38

TECHNOLOGY TODAY FEATURE

feature continued...

it, the stockroom takes a relatively organized stockroom and creates a disorganized pile of parts when they create a kit. Now the operator must locate these parts one by one and make sure they will not mistake the one Ohm resistor for a 100 Ohm resistor. The only reasons I can think of why a stockroom does this are:

1. They want to ensure the parts are there, and the stockroom parts match the system inventory. Somehow we believe that if we place the parts behind a locked door, the part counts miraculously become accurate.

2. The parts are far away from the SMT area. Companies justify this because they carry too much inventory and traditional storage shelves have too much wasted space to place the inventory next to the SMT lines.

3. The parts are expensive and need to be behind closed or locked doors. Due to the cost of components, many companies store them behind locked doors. During allocation periods, some parts do need to be protected because of their demand and or high dollar value. Regardless, in each company, there are only a handful of parts that should be totally locked up.

All of this creates extra work, which is prone to human error and mistakes that result in

a labor intensive material handling operation.

Figures 2 and 3 outline a typical process ow chart for loading feeders and reloading the feeders on the SMT machine.

The Metro racks and standard shelving cannot do too much to streamline the above process. The robotic systems and Inovaxe’s InoAuto system can eliminate the ow chart operations highlighted in yellow. The challenge with the robotic equipment is their size, which makes it impractical to place stock right next to the machines on which they are needed. The Inovaxe smart carts are ideal for point of use inventory storage because they can hold over 3300 reels in an 11’L x 1.25’W x 5.3‘H space. One of InoAuto’s clever features is that it can identify the parts you need in their feeder order. It can also identify the parts you need before a reel runs out on a feeder. The ROI on this type of automation can pay back the investment in less than six months in many cases. This product substantially improves the e ciency and throughput of loading the feeders, and running the SMT line.

The next area with signi cant opportunity for improvement is returning reels to stock after the kit is nished going through the SMT line. I call it the material “black hole”. Figure 4 shows a typical ow chart of this operation.

The return of parts back to stock can often cause the most problems. Typically the job is done, the pressure of meeting demand is reduced, and returning parts may have to wait until the material people are not very busy, so they have enough time to count parts and nding bin locations.

Figure 2. Typical process chart for loading feeders on the SMT machine.

Figure 3. Typical process chart for reloading feeders on the SMT machine.

Figure 4. Flow chart showing reels returned to stock a er a kit has passed through the SMT line.

This is a time consuming and slow process for a typical shelf and bin operation. In the case of using vertical or carousel storage systems, the problem is the bottleneck. The input and output is typically through one person and the bottleneck can back up returns. It will take anywhere between 4-10 minutes per reel to count the inventory correctly, nd the location, and place the parts in the bin. This is where the problem starts, as the parts that are not returned may be needed on another job, and, in some cases, they are all in a

pile. Finding a particular part number in the pile is like nding a needle in a haystack. This operation typically gets the least attention because everyone is working on new jobs. This is also the area in which, depending on the way WIP is accounted for, you may buy the same parts that you have in the pile, because you need it in your new job, and your MRP has lost track of it. Now, this has created more work for buyers to bring the parts in, and the program manager has to determine when you can ship the product and call the

Page 38 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:39

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king order by locating the parts one at a time, as the LED will blink one at a time, indicating one location for each one of the feeders. After the job is done, remove the reel from the feeder, scan the part number, and place it in any empty location on the cart. It is as easy as that, and as it looks in the chart above. Let those wasted dollars be invested into your growth, your customers’ and employees’ satisfaction, and your

Reduce reel storage space

shareholders’ delight.

Conclusion

Managing your cash, sorry, but your material is one of the most important parts of running a manufacturing operation. The human error mistakes, material bottlenecks, and inventory inaccuracies will have a broad e ect on the health of your business. The impact of problems in the material department can be felt in customer satisfaction, employee satisfaction, cash ow, revenue growth, and pro tability.

The traditional method of handling material, at first glance, appears adequate and low cost, but, the spaghetti chart of the material operation shows how expensive it really is. Because life goes on and in many cases painfully, more capacity for SMT lines, better software to run the ERP, more Metro

racks with typical bins and some with bar code locations continue to be the practice and unfortunately, win the budgetary decision.

Think ROI, not just the cost of smart cart vs. standard shelves and bins. Before you send out the black belt lean ninjas to ght the material challenge, make sure they are familiar with the latest material handling systems, or you may end up with more jerry-rigged contraptions.

To win the race for survival, growth and pro tability, companies must give the highest priority to the material operation and material handling tools. More SMT lines, faster machines, or new ERP software are not the only, or even the best, answers to achieve their business goals. Fortunately, there are now a number of solutions that can help electronics manufacturers to streamline and take control of the material black hole. These are robotic storage systems if you are an OEM or have limited part numbers, and money is no object, and the smart cart (InoAuto from Inovaxe) if your needs are easy to use, and a fast, exible, small foot print, with a ROI of less than one year.

www.inovaxe.com

t

orage System lights up required parts

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equipment to streamline the process.

theopointnof usedin a smsart cart line InoAuto, next to the SMT line. Upload a pick list or a BOM to the smart cart computer and it will light up the location of each part in your kit and now you can get them in seconds versus hours. You can

rec

eive th

e part

s in pic

by 60%

Figure 5. Spaghetti chart for material handling in a typical SMT operation.

Reduce material handling time by 70%

Reduce travel time by 60%

Increase inventory accuracy

Increase operator ef ciency

Store 1120 reels in .42 sq. meters

Mobile

Figure 6. Spaghetti chart for material handling in a SMT operation using InoAuto.

customer to reschedule the delivery, of course, after expediting the part. Are they a true program manager, or an expensive expediter?!

All of this also e ects the accounting process, as the operation has to buy more material, juggle the vanishing cash ow because of the increase in inventory, and process more invoices. Not to mention, the line has been sitting idle waiting for the parts to arrive.

The robotic storage system can provide a good solution for the part return process, as long as travel time and size is not important. The InoAuto smart cart is an extremely e ective tool for this process as well. Returning parts to bins takes less than three seconds and, in many cases, part counts can be adjusted automatically by

streamlining. Figure 5 is a typical presentation of the material flow through a SMT factory.

One can get dizzy looking at this chart! The irony is when you create the spaghetti chart with the e ect of the material ow throughout the other factory operations; program management, purchasing, production, test, etc. doesn’t look very messy and actually looks very streamlined. The other irony is that we are paying every day for all of that busy, ine cient work. We deal with simple “big box store” shelving and Metro carts, and will not even think to budget for complete automation of this mess and bring all of that wasted cash to the bottom line. One way to help bring those wasted

I

dollars to the bottom line is to use 21st century

n

Now let’s look at the spaghetti chart of the material process before automation and

Figure 6 is one representation of a material spaghetti chart with substantially fewer noodles. In the new process map your reels are stored at

ROI in less

than six months

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P:40

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with SMT Today

Right: AIM Solder’s Timothy O’Neill talks to SMT Today

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Left: SMT Today o cial sponsors of the 2016 IPC APEX EXPO

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Right: Checksum discusses new innovations

Below Left: Roberto Segura of KOKI Solder America

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of Saline Lectronics talks data

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P:42

TECHNOLOGY TODAY FEATURE

MANNCORP CELEBRATES 50 YEARS OF SERVICE TO THE ELECTRONICS INDUSTRY

submitted by TOM BECK, DIRECTOR OF MARKETING, MANNCORP

From advancements in technology and production methods to global shifts in markets and manufacturing economies, Manncorp Founder and CEO, Henry Mann has seen it all. The company he started from his parents’ home in suburban Philadelphia in 1966 is among a select few that not only have survived, but also continue to ourish as the electronics assembly industry has undergone the dramatic changes of the last half century.

“So many people don’t remember what the American electronics industry was like in its heyday,” says Mann. “In the late ‘60s and early ‘70s, every industrial

park in the country was full of companies building their own circuit boards. I very quickly realized there was no possible way to visit them all.”

Mann also noticed that not only were companies in dire need of equipment and supplies, but they needed them more quickly and e ciently than conventional distribution channels allowed. These observations led Mann to develop a customer- focused business model in which his printed catalogs, with published pricing for everything from hand tools to high-end capital equipment, were to become a staple of the industry. It wasn’t long before the company started designing and manufacturing its own brand of equipment, with component lead forming becoming an area of specialization.

Companies like Delco and Motorola sought Mann’s assistance in developing solutions for challenging applications like high-volume processing of

transistors, while some of the earliest equipment to form at-pack ICs for surface mounting was developed for Hughes Aircraft and TIMEX. At one point, Mann employed over 100 employees with more than half of them involved in manufacturing. Mann was also among the earliest subscribers of toll-free phone numbers where customers could call for immediate technical or sales assistance.

“Streamlined communication and instantaneous feedback between the end user and the factory

is something companies and customers still value today,” says Mann. “We’ve been doing this for decades.”

Today, Manncorp has two 18,000 square-foot facilities—its headquarters in Huntingdon Valley, PA, and its new San Diego location—as well as offices in Mexico, Brazil, and Shenzhen, China. Manncorp still employs over 30 full-time employees and its products are now produced in factories in the U.S., Europe, and Asia. Although the company has grown and evolved from its humble beginnings, one thing that has never changed is Henry Mann’s business model, even if it has been adapted for today’s equipment buyer and a global marketplace. Customers

anywhere in the world, on either their mobile device or desktop, can obtain pricing and details on Manncorp’s extensive selection of equipment for SMT and mixed technology assembly at manncorp.com. They can even monitor the company’s latest news and activity via social media. While some companies that may claim to have been around as long as Manncorp are now virtually unrecognizable due to mergers and acquisitions, Manncorp continues to retain its youthful vitality and dynamism as it looks ahead to the next 50 years.

www.manncorp.com

Page 42 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

P:43

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P:44

TECHNOLOGY TODAY FEATURE

PCB Prototyping Industry Facing Modernization with 3D Printed Electronics by Simon Fried, Chief Business Officer, Director, Co-Founder

3D PRINTED ELECTRONICS

3D PRINTED ELECTRONICS

3D printing’s next wave takes on a challenge not yet addressed in the 3D printer market: professional printed circuit board (PCB) prototyping. The resulting systems will bridge the gap between 3D printers and professional electronics to help companies accelerate their product development cycles and produce high-quality products with greater ease, speed and e ciency.

Simon Fried - Director, Co-Founder

– even for the most complex designs. This allows designers and engineers to be more responsive than those reliant on overseas manufacturers. Instead of waiting days or weeks for a PCB prototype that has to be sent o site to be made, engineers can now build, test and verify PCB designs overnight or change designs on the y with the DragonFly 2020 3D Printer. The result is greater e ciency, fewer development risks, faster time-to-market and ultimately better products.

Moreover, by using the 3D

PCB prototype printer, users will build models that would normally be very difficult or even impossible to produce, or that would be time-intensive using current standard subtractive manufacturing processes. Engineers will

soon be 3D printing complex designs that were inconceivable previously and even produce

a whole new world of electronics.

The DragonFly 2020 3D Printer is designed for extremely high resolution traces, high conductivity and production speed. Fast prototype turnaround times and more frequent iterations mean that PCB designers will have a greater degree of freedom to express what they imagine, experiment with di erent and unique geometries and designs. This ultimately means fewer errors and a better end product. In the long run, faster PCB prototyping resulting from the DragonFly 2020 system can translate to increased e ciency, shorter lead times and subsequently help companies stand out from the erce market competition.

For designers and engineers, PCB prototyping can be one of the most frustrating tasks they face. It can be time consuming, expensive, and sometimes a little conservative. Prototyping today also means sending out designs for prototyping which puts a company’s intellectual property

(IP) at risk.

These new 3D printers will address all of those issues, offering the capability for printing fully functional multilayer PCB prototypes, and even producing small-run batches, in-house. The first product in this new category will be Nano Dimension’s DragonFly 2020TM 3D Printer, an easy- to-use, enterprise solution designed to signi cantly reduce PCB development. Because of its unique capabilities, the DragonFly 2020 3D Printer will deliver a variety of business bene ts, including time savings, IP protection, cost control and improved innovation around PCB design. Nano Dimension will begin shipping this breakthrough 3D printer

later this year.

The 3D printer for PCBs addresses the pain points for designers and engineers who, at each stage of product development, must obtain actual working prototype boards in hand for testing purposes. The current standard subtractive manufacturing of PCBs is a multi-stage, labor- and material-intensive process. It is costly and time consuming, and it’s a job usually outsourced to companies in East Asia.

During the design and testing phase, companies often spend weeks simply waiting for the third- party PCB manufacturer to deliver the prototype, seriously impeding their development schedule. At the earliest prototype stages, it’s also common for the sample to reveal aws; when that happens, it’s back to the drawing board and more trips to the prototyping company before any design can go into production. The process often leads to costly delays that hinder a company’s ability to develop products quickly.

Nano Dimension has been demonstrating its DragonFly 2020 3D Printer, designed to produce professional PCB prototypes in-house. The system combines an extremely precise inkjet deposition 3D printer with advanced nano chemistry and sophisticated software to meet the rapid prototyping needs of professional electronics. This eliminates the drawbacks associated with relying on an outside manufacturing facility for prototyping needs.

Saving Time, Cutting Waste

With the DragonFly 2020 3D Printer, will bring things closer to home and reduce the time it takes for prototyping signi cantly, from weeks to hours

Page 44 The Choice of Publication for the Electronics Industry

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Another bene t for users is that by incorporating additive manufacturing into PCB fabrication, virtually no raw material goes to waste, unlike when copper is etched or holes drilled by conventional methods.

3D Printing Multilayer PCBs

The DragonFly 2020 3D Printer is essentially an inkjet printer using conductive and dielectric inks. It works with three axes: X, Y and Z, and deposits layer upon layer of nanoparticle inks, repeating the process over and over until the three-dimensional PCB is created.

Each pass of the print head precisely deposits a few microns height of material (dielectric or conductive) at the location specified by a Gerber design file. Nano Dimension’s advanced software makes it possible by effortlessly converting complex PCB Gerber design files into 3D printable layers, which the printer then lays down one at a time, building the PCB from the bottom up.

The system can be used even for creating complex PCBs, o ering the ability to add via holes in corresponding positions on di erent layers to the process. That results in the creation of electronically connected blind, open or complete vias. The printer allows for PCB through-holes by repeatedly leaving a space

at a particular XY coordinate, thereby building materials up around a void. The end result

of a print job is essentially a solid dielectric piece inlaid with silver conductive traces at the precise XYZ coordinates speci ed by the Gerber le.

Achieving the highly conductive and fine traces is possible because of Nano Dimension’s proprietary AgCiteTM silver nanoparticle inks and high- performance dielectric inks

for inkjet deposition. These two materials are critical because together they allow for the printing of complex 3D conductive structures. The inks deliver properties including conductance, controlled impedance, and other specific mechanical properties enabling multilayer boards and various electronic applications such

as RFID tags, solar cells and sensors.

The AgCite inks are created via a patented, highly e cient and environmentally responsible nanoparticle synthesis process, licensed from inks pioneer Professor Shlomo Magdassi

of the chemistry institute and the Centre for Nanotechnology at the Hebrew University of Jerusalem. The nanoparticle synthesis process begins with a silver precursor raw material and allows for ne control of the size, shape and distribution of

the silver nanoparticles in accordance with customers’ printing requirements. The company is now looking to expand the scope of 3D printing with copper-based inks as well and recently led a patent for an innovative approach to copper nanoparticle development aimed at solving the problem of copper nanoparticle oxidation.

As competition in the electronics device market grows and customers demand more for less – especially when new innovations make old versions less e ective -, the challenges facing PCB prototype designers and engineers are daunting. 3D printing of PCB prototypes can be used to streamline the most time consuming part of the process, reducing the testing and development time from a few weeks to hours. Even extremely complex designs that are not constrained to at layers on a rectangular board, do not add time or costs to the design process with 3D printed electronics.

www.nano-di.com

DragonFly 2020: The World’s First 3D Printer for Professional Multilayer PCB

P:46

TECHNOLOGY TODAY FEATURE

There’s more to PCB manufacture than pick ‘n’ place

by Philip King, Managing Director, Newbury Electronics

For many designers getting the actual design of the PCB right to deliver the complex circuits and systems required for their latest, great innovation is all that matters. The necessary components will be easily picked and placed on the board by their chosen manufacturer and then shipped back for incorporation into the next step of the process. However PCB manufacturers don’t see it quite so simply and there are a number of additional factors that the designers could and should consider.

the accuracy of the manufacturing process is severely compromised. Some companies, such as Newbury Electronics, will automatically amend the data they receive, free of charge, to include a handling frame. Boards without a frame can take up to 50 percent longer to manufacture which has a knock e ect on cost, whilst those with a frame bene t from the accuracy and speed of the fully automated manufacturing processes.

Check, check and check again is the mantra with regard to pick and place. With an estimated 5 million parts to choose from, engineers need to be sure that their BOM is accurate. Leaving of one digit from a part number may mean that your nished circuit won’t work. Missing or partial part numbers will add a further delay to production times. Whilst it may seem tedious to take the time to check your unique part reference against the industry databases from the likes of Farnell or RS, it will be a saving in the long term. Closely allied to the need for accuracy in the BOM is the absolute imperative of accurate CAD data. As the components become increasingly smaller manual selection is no longer an option and the automated machines are only as e ective as the data with which they are supplied. If it is not supplied further delays in production will be incurred whilst the necessary information is obtained.

First and foremost on the list is ‘designing for assembly’ and the view of the manufacturers is that most designers don’t! Electronic engineers should be thinking about where on the board the di erent components are placed; there needs to be an even balance of the weight of the copper, and the thermal mass of the components should be evenly distributed across the board. If done correctly this makes for a far more uniform application of re ow heat but it requires some technical insight from the designer. The art of designing an even and uniform copper density across the surfaces of the board, and side to side, also seems to have become a lost art. Good copper balance promotes even and controllable copper plating, giving a level topography to the PCB. Why is this? The clue is in the “P” of PCB. Making PCBs is a printing process, and you cannot print e ectively on rough surfaces, whether it be legends, solder resist, or solder paste, not to mention the problem of plating

resist which will not strip due to over-plating in area of isolated copper. If you remember one thing from this article, it is that to design good copper balance on your boards will forever improve the quality and manufacturability of your bare PCB and your PCB assembly.

Currently some 50 percent of prototype boards would bene t from modi cation to improve the manufacturing process. Whilst some customers appreciate feedback on changes to their initial designs others are not always as receptive. This is short sighted, and listening to the feedback from an experienced PCB manufacturer will ultimately make the nal assembly far more reliable and will help to get future designs correct.

The second plea from the manufacturers is for the inclusion of handling frames on all boards; without a handling frame and su cient ducials,

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| APRIL 2016 ISSUE

P:47

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TECHNOLOGY TODAY FEATURE

feature continued...

All white is not right

Whilst white solder is preferable for some applications, especially those that incorporate LED technology where it can actually improve the performance of the LED, some board designs are submitted with unnecessary white solder stipulated. The problem with the white is that the optical inspection equipment is optimised to operate with a green resist; a surfeit of white solder will in e ect ‘blind’ the camera, making the evaluation of the solder less e ective and for 99% of boards a green solder is by far the best option.

Similarly, just stipulating a larger board or step & repeat panel without actually thinking the process through will not always give you an automatic cost saving. Ideally a board within an A4 sized handling frame will ensure optimum e ciency through the various stages of manufacture. Anything larger may be liable to ex or will need some manual intervention to cope with a specific process. On the other side any board housed in a frame measuring less than 80mm x 80mm will be too small for the majority of standard, automated machines. The advances in technology of the last 10 years have resulted in the average part being ve times smaller than a decade earlier so smaller boards are inevitable. In addition as more and more capability is added to each board, 80 percent of those manufactured are now double sided. One bene t of the shrinking of the board size is a reduction in the use of laminate but from the manufacturer’s side the cost of investing in machines to cope with these new, smaller but more complex boards can be signi cant.

With the miniaturisation of boards, the complexity of

mixed technology and the inclusion of surface mount and leaded components, a robotic selective soldering machine is a requirement to repeatedly carry out high quality soldering. To save PCB real estate, increasing numbers of components have solder joints underneath the body of the part. This solder

can only be quality checked with high resolution X-ray verification equipment.

Building a board is now as challenging, if not more so, than designing a board. No longer are there PCB manufacturers on each town’s industrial park or independent producers working from garden sheds. PCB production in the 21st century requires highly skilled, well trained personnel working with the latest technology. So if the designers of the day can take a moment to think about the production process and the manufacturers continue to understand and learn about how the boards are going to be used, and the latest manufacturing processes, to ensure the viability of their manufacture, then the next 10 years in the electronic component market place could make it a very exciting one in which to be involved.

www.newburyelectronics.co.uk

Page 48 The Choice of Publication for the Electronics Industry

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P:50

TECHNOLOGY TODAY FEATURE

ABB Introduces YuMi To The UK Market

by Michelle Jocelyn, ABB Robotics and Rose Wilkinson, Armitage Communications Limited

Collaborative dual-arm robot will be used in small parts assembly to help increase UK productivity.

collaborative robots. With a velocity of 1500mm per second and the ability to return to the same point within 0.02mm of accuracy, YuMi makes high quality, fast production possible.

Further, YuMi’s lead through programming capabilities provide ease of use as employees can teach the robot through demonstration in a minimal amount of time. Historically ABB robots have been programmed using teach pendants or coding but this new method reduces the complexity to a level that is user-friendly. Combined with its adaptable grippers, this means that the YuMi can be programmed to perform new tasks quickly and e ciently.

“YuMi opens up great opportunities for UK businesses. Task sharing between humans and robots provides scope

for boosting UK productivity and YuMi’s Lead Through Programming capability

will enable SMEs and larger manufacturers alike to be responsive to quick changes

in consumer demand,” explains Colin Dullaghan, Product Manager for YuMi at ABB Robotics UK. “The initial market response has been very positive. ABB has begun to sell YuMi to a number of end users since the end of last year and there’s a definite growing interest in the product across industrial sectors outside of electronics as its many applications become widely recognised.”

In addition to its suitability for small parts assembly applications, YuMi has been designed for use in camera-based inspection, parts-feeding, packaging and testing.

ABB will continue to bring YuMi to the UK market providing a new era of robotic co-workers.

A strong solutions focus helps manufacturers improve productivity, product quality and worker safety. ABB has installed more than 250,000 robots worldwide.

www.abb.com/products/robotics

ABB, a leading supplier of industrial robots, modular manufacturing systems and service, has launched YuMi, a collaborative dual-arm robot, to the UK market. Aimed initially at the 3C (Computer, Communication and Consumer electronics), toys and watch-making industries, YuMi has no barriers, cages or zones. Its padded arms and motion control technology enable YuMi to work side-by-side with humans safely. The collaborative robot is able to assist in small parts assembly tasks whilst employees can either work with YuMi or apply their production skills to another part of the process.

As YuMi’s capabilities become more widely recognised, the robot will open up more opportunities in other industrial sectors. However, the robot has been primarily developed to meet the exible and agile production needs of the consumer electronics industry. With integrated hands comprised of 2-finger grippers and embedded cameras, YuMi can e ciently handle the small components typical of this environment.

The UK electronics industry is the fth largest in the world with an annual turnover of £78 billion, a total of 6,000 businesses and 800,000 employees. Benefitting from YuMi’s many features would strengthen the UK electronics industry through improved productivity, lower costs and a quicker response to the global market.

Despite rising employment gures, UK productivity has grown by just 0.6% each year between

2010 and 2015. This has made it di cult for UK companies to compete with countries of a higher output such as Germany, France and the U.S.

Germany also has a much higher level of robot automation than the UK with 20,100 units recorded in 2014 compared to the UK’s 2,094. A study conducted by the Copenhagen Business School titled “Automation, labor productivity and employment – a cross country comparison” found that if the UK were to match the most automated countries, productivity could increase by 22.3%. In the electronics industry in particular, the UK could increase productivity by 24.2% if it matched Japan, the most productive country in this industry.

YuMi is part of ABB’s strategy to provide a solution to the UK’s productivity puzzle. However, the nature of today’s electronic consumer demands means that quick changeovers of products are a necessity whilst the internet of things or ‘Industry 4.0’ means that customers expect high quality, low cost items in a short time span.

YuMi helps to overcome this. Its table mounted lightweight design means YuMi is easily moved to di erent stages of the production process whilst YuMi’s speed makes it faster than most other

PagPea5g0e 50 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE | FEBRUARY 2016 ISSUE

P:51

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TECHNOLOGY TODAY FEATURE

Laser Processes for PCB Manufacturing

High Demands on Quality and Cost-Effectiveness submitted By malte borges, marketing lpkf

Today’s smartphones have several times the computing capacity that the supercomputers of the 1980s did. The fact that this increase in performance is accompanied by a dramatic decrease in costs has to do with the continuous improvements being made in the manufac- turing processes. Laser technology can already be found at numer-ous stations on a PCB production line.

and increase the productivity of the StencilLaser.

Laser-cut solder paste stencils can currently be manufactured with an e ective size of up to 60 x 160 cm, for example, for large lighting sup-ports.

Precise PCB Cutting

with UV Lasers

For cutting of contours from full-surface base materials, the laser exhibits solid advantages. It can process complex contours without masks from process data alone without damaging the materials through mechanical loading. However, the thermal input looks somewhat di erent: depending on the laser wavelength, carbonization of the cutting edges can be quite considerable. The UV laser is still clearly superior to the more powerful CO2 lasers. Due to the wavelength, practically no cutting marks or relics are generated on organic materials. The heat-a ected zone is also limited to a few microns around the cutting contour.

These capabilities make the UV laser interesting for several stations on a PCB production line. First, the laser is recommended for prepregs and coverlays. Both are exible materials that are sensitive to mechanical factors that are present during processing. In the laser process, these foils are held in position with vacuum tables and depaneled by the laser in a distortion-free manner. In many cases, substrates already damaged in upstream processes can still be turned into good parts by the laser: thanks to a vision system, the laser system detects positional changes in the

The demands placed on PCB production are tied to the geographical loca-tion concerned. For example, for the development and small/medium- sized batch production prevailing in Europe and the US, exibility is of the utmost importance. The volumes produced per assembly here are usually not su cient to justify using special elaborate machines on a production line. On the other hand, Asian suppliers of smartphone components produce huge quantities and are mainly concerned with ensuring high throughputs, reliable processes, and simple operation of the production facilities. Despite their di erences, the above examples have two requirements in common: high process reliability and high processing quality.

These requirements can be met with advanced laser technology. As a specialist in laser micro material processing, LPKF produces machines that can be deployed at various points in the manufacturing chain.

Cutting Solder Paste Stencils

Laser fusion cutting is considered to be the standard process for making solder paste stencils. In solder paste printing, the solder paste is applied to the stencil with a doctor blade. Solder paste is forced through holes in the stencil and onto the circuit board. After the stencil has been lifted up, SMD components are positioned on the solder paste deposits and then soldered.

Stencil production takes place in advance of PCB manufacturing. Cutting of the apertures must be done with high precision in terms of position, size, shape, and orientation. Over the space of 20 years the processes have evolved to the point that even parts with side lengths of less than 1 mm or high-pin-count ICs can be contacted.

Nowadays special types of stencils are gaining popularity. Step-up stencil surfaces have local reinforcements where more solder paste is applied to the board. This is needed, for example, for components such as connectors that are subjected to high mechanical loads. The reverse is also possible: in step-down stencils, the metal foil is thinned locally so that less solder paste volume is applied to the board in these regions. This variant is suitable for compact, high-pin-count ICs.

With StencilLasers, the laser pokes a hole in the material and then guides the cutting channel around the edges of the aperture. Instead of evaporat-ing the entire material, the laser beam generates a melt, which is expelled by means of a cutting gas at the cutting joint. Today’s systems can reduce the cutting quality in favor of performance for simple passages such as mounting holes and switch between di erent cutting gases during the process. An inline check is recommended for inspection of the cutting result during the process to reduce the number of external steps required

Polyimide cuts made with a CO2 laser (left) and a UV laser (right)

A historical circuit board stackup from the ‘50s: the Cordwood circuit, in which components were mounted between two traces. Photo: Wikipedia / ArnoldReinhold

In 1992 only a few apertures with a 15- μm precision could be generated per hour. That’s not enough for today’s standards: the latest StencilLasers can cut more than 25,000 apertures per hour with a precision of +/- 2 μm (cutting sample:

LPKF reference layout B).

Step stencils locally increase or decrease the amount of solder paste applied. Welded-on bumps are shown in yellow and recesses in red on the right.

Page 52 The Choice of Publication for the Electronics Industry

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TECHNOLOGY TODAY FEATURE

feature continued...

New to the market for laser drilling of FPCs: the LPKF MicroLine 5000 with a work envelope of 533 x 610 cm.

parts by the laser: thanks to a vision system, the laser system detects positional changes in the x and y directions as well as rotations and distortions. Because no tools are necessary, the laser system can adjust the planned cutting contour so that standard parts are produced.

A special type of contour cutting is drilling – here, the laser simply makes a circular cut. A state-of- the-art laser drilling system generates holes with a minimum diameter of 20 μm in exible material with high performance and excellent cutting results. In the depaneling of assembled boards from assembled panels, the laser scores points by working from a distance without contacting the material. In this way, extremely ne cutting channels can be produced right next to components and traces. For cutting of tabs, the cutting contour can be adapted to the real coordinates determined by a vision system.

More and more applications in electronics are making use of complex layer stackups. Examples are rigid- ex PCBs in which exible and rigid components are rst connected as multilayers. In the exible regions, no lamination takes place. The laser then separates the rigid overlays to generate the nal form. Through depth-controlled

cuts, features such as pockets can be introduced into otherwise planar boards.

Additional applications for the UV laser can be found in robust ceramic substrates. UV lasers can structure metal layers applied to these sub- strates, score ceramics, cut/depanel, or drill with high precision. UV laser systems have proven their worth as standalone machines but can also be used on production lines. One example of how this is possible can be seen at SMT Hybrid & Packaging in Nuremberg, Germany. There, UV depaneling lasers have been working on the “Future Packaging” production line for years.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.

www.lpkf.de

Thanks to the UV laser depaneling system, around 1000 of these little PCBs can be placed on a panel – instead of 100 PCBs as is the case with contour milling.

Page 54 The Choice of Publication for the Electronics Industry

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TECHNOLOGY TODAY FEATURE

A Massachusetts Electronics Manufacturing Company Dramatically Increases Productivity in a High-Mix Environment

By Don Lockard with support from Vince Parente, Manufacturing Engineer and Nick Siciliano, Manufacturing Engineering Manager, Lenze Americas Corporation

In the world of volume electronics manufacturing, seconds count. Cycle time is the rate that manufacturing printed circuit board (PCB) assemblies complete the manufacturing process on an assembly line. The world’s most productive PCB assembly plants produce PCBs or panels of PCBs at cycle times of less than 20 seconds. Plants run 24/7 and there is urgency in how the factories are managed. Recognition that any time the production equipment is not producing PCBs, money is being lost. In the science of economics, this is called “opportunity cost.”

carefully. Lenze is planning to use a MES software program called iTAC to accomplish this, but the most challenging part is having the thousands of electronic components ready on new feeder carts in place. Samsung management software, TOLP (total o ine production) is perfect for planning and executing this task. The Samsung management software package allows production to be planned beforehand, not only maximizing the production e ciency of the placement machines, but also minimizing the work to changeover to each unique product. The setups are accomplished o ine to optimize productivity.

The biggest challenge in accomplishing this improvement is training the personnel that are required to carry out the job. In order to illustrate the challenge, Lenze incorporated in their training an interactive Lego game that simulates lean production, moreover a lm showing an Indianapolis 500 pit crew operating in 1952 and comparing it to one from 2013. The change is stark and so is what is required of Lenze’s manufacturing employees. Every movement in today’s pit crew is reviewed to remove seconds. The same is being employed at Lenze; everything is checked so that it is ready beforehand and when the change occurs, the team snaps into action. It will take a while to get it where it will be, but it is moving in the right direction.

The bene ts to Lenze Americas as of this writing are impressive. To start, “Production Time” (the time to complete an assembly from raw material to a nished product) has been reduced by 76 percent. Lead times on their product have been reduced by 19 days. Four SMT lines have been reduced to three. The team has con dence that the changes make Lenze a more competitive company in its marketplace. Plans to continue this e ort are already under way.

www.Lenze.com www.samsungsmt.com.

The United States produced most of the PCB assemblies in the world until the exodus of the industry o shore in the early 1990s. Now many plants in the United States, using the same equipment and more expensive labor than their overseas competitors, produce little. Equipment sits idle for most of the day, awaiting all the necessary tasks to be accomplished to make it run. When something happens that stops the line, it is accepted as part of the process, and corrected in a casual manner. It is a grand waste of capital and labor, and contributes signi cantly to our manufacturing un-competitiveness in the world.

Industry in the United States largely manufactures those PCB assemblies that are not allowed to be produced overseas, such as military electronics equipment or fast turn assemblies used in product development. Neither of these activities requires PCB producers to compete anywhere near world market pricing. The result is an industry with expectations from its capital investments that are not on the same playing eld as their overseas competitors.

Lenze Americas is a manufacturer of AC drives in the cradle of the American Industrial Revolution: Uxbridge, Massachusetts. Lenze has a high product mix of more than 400 assemblies. The Lenze manufacturing engineering department undertook an e ort to modernize their production. Their goal is to become a much more productive manufacturer. To achieve this, a throughput with cycle times as low as 20 seconds and an OEE rate (overall equipment e ectiveness) of over 80 percent are targeted. These are lofty goals in this high-mix facility.

In order to accomplish this, Lenze partnered with Samsung, a company that knows how to produce a competitive product and one of the leading producers of PCB assembly equipment in the world. Samsung won the competition for the job against other leading equipment producers because of its speed, exibility, value, and customer support. The new production line would be the rst step in a phased replacement of an existing four SMT line plant of equipment.

The placement rates of the Samsung equipment could handle the speeds necessary to make the throughput rate and cycle times of 20-60 seconds.

The challenge was to accomplish this on a line, 115 ft long (including through-hole placement and wave soldering). At any one time there can be as many as 50 boards in process, and there also can be more than one product on the line. Lot sizes can be as small as two PCB assemblies. Production must take place in what Lenze calls a “rolling changeover.”

A “rolling changeover” requires line operators to make all changes (from the stencil to the components to all the equipment programs) in such a small amount of time that it does not signi cantly interfere with the production rates. The plan is to have each piece of equipment change programs automatically. Once product “A” is produced, product “B” may be produced as a PCB passes a scanner at the entrance of the each machine. This will be accomplished from the destacker to the printer and on down the line. A requirement is that the PCBs must be identi ed with a bar code. Lenze found the most economical way to accomplish this is to have a laser marker make an unremovable mark. As each board is processed, equipment programs change automatically for SPI, three Samsung placement machines, re ow oven, AOI, and full nitrogen tunnel wave soldering.

Every change of tooling and set of components unique to each PCB must be in place as the board passes through – a tall task. In order to accomplish this, everything has to be planned

Lenze Americas’ engineering team chose to partner with Samsung because of the speed, exibility, and value of its equipment. The new production line is the rst step in a phased replacement of an existing four SMT line plant of equipment

Page 58 The Choice of Publication for the Electronics Industry

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P:60

TECHNOLOGY TODAY interview

AN Interview with Mr David Reyes, Sales Manager US, JBC Tools

by SMT today editor

Success in the emerging markets requires

adaptation to local attitudes and values

In 1999 JBC expanded its business model in the United States, the world’s largest economy. The International Monetary Fund expects the US to be the fastest growing advanced economy over the next few years, outpacing many other western countries. This represents an exceptional opportunity that JBC must not miss.

Who does JBC need to build up its market share in the country? Only someone with many years of experience under his belt. The company is committed to taking on talented and productive sta , which is why JBC hired David Reyes as Sales Manager in the US.

Q. What are your expectations for our industry?

A. Today a revolutionary development in microelectronics is taking place. The surface mount technology market is expected to grow, so I would like to be there and expand the business in the US.

“Anything that can be connected will be connected”

Q. What are the latest developments you have introduced into the country?

A. Last year we introduced our Excellence range stations with great success, with which the customers can collect data, track the performance and control and improve the soldering process by making it easier and more e cient.

This year, we have moved a step forward in the Industry 4.0 and have launched the systemB·Net, designed to remotely configure and manage JBC stations.

We are talking about the Internet of Things. The new rule for the future is going to be, “anything that can be connected will be connected.” In fact, by 2020, there will be 250,000 vehicles connected to the internet and that is what we are doing with our stations.

The B·Net system allows medium and big companies total control over the soldering process via Internet. They can con gure all their stations at the same time and apply a speci c con guration to each product line, no matter where the factory is located. For example, from the US, you can control your factories in Europe, Asia...

Having a factory connected will save money and, of course, improve the quality of products. With IoT, there are limitless opportunities for business and society.

www.jbctools.com

Q. How did you rst hear about JBC?

A. I was looking for a Spanish company to work for in the United States and heard there was a vacant post in JBC. One thing led to another.

Q. What three words would you use to describe JBC?

A. They are Innovation, Quality and Performance. Q. What do you nd the most challenging

in our company?

A. Adapting products for di erent markets around the world, which is never an easy thing. What works in one country may not work in another.

At JBC, as a global business, we have learned that success in the emerging markets requires adapting to local attitudes and values. A few years ago, we might have seen global and local as irreconcilable opposites, but today we can be both, we can be glocal.

Q. What is on your wish list for the next 10 years with our company?

A. Always improve! Work e ectively and e ciently to meet customers’ expectations and exceed standards set by competitors in the US.

Q. What advice would you give to newcomers in the company?

A. My piece of advice would be: know your product, know your competitors’ products and be constant. Then you will see the bene ts of your actions.

Q. What is your role at JBC?

A. I’m Sales Manager in the US. I’m responsible for

promoting sales, improving customer service and building up brand awareness to get new business with OEM (Original Equipment Manufacturer) and EMS (Electronics Manufacturing Services) companies.

“Constant innovation allows JBC to offer different tools that meet customers’ precise specifications”

Q. Before working at JBC, what was the most unusual or interesting job you’ve ever had?

A. I worked for a printing company in downtown Manhattan. Yes, people still print on paper!

Q. How has JBC helped you in your career development?

A. JBC has given me the chance to better understand American industry. I now have a complete knowledge of the business model in the US and its di erent singularities in this vast land.

Page 60 The Choice of Publication for the Electronics Industry

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P:62

Industry News

Keep up to date with what’s new

With each issue we’ll keep you up-to-date with the latest industry news from around the globe.

NEW APPOINTMENTS

Kurtz Ersa

Kurtz Ersa North America, a leading supplier of electronics production equipment, announces that it has hired Luis Alberto Muñoz P. As Ersa’s newest eld service engineer, Muñoz will support the company’s rapidly growing business.

Muñoz will provide technical support for Ersa equipment, perform installations and provide on-site customer training. Chad Suckow, Ersa’s North American Service Manager commented, “Luis’ process engineering and multiple language skills will be a great addition to the Ersa NA service team. We are excited to have him on board to support our growing customer base.“

JUKI Automation Systems

appoints Thomas Kempf as

Sales Manager Germany

JUKI Automation Systems, a leading supplier in SMT assembly equipment and total line solutions, is pleased to announce the appointment of Thomas Kempf as new Sales Manager Germany to support existing customers and grow the customer base across the German sales region.

Thomas Kempf and his team will spend part of their time expanding relationships across Germany to identify customer and market needs as well as growth opportunities in the market. Kempf began his career at JUKI in March 2014. In his most recent position as Sales Manager Germany West, he successfully realized revenue targets across the complete JUKI product portfolio in his sales region.

Juki Automation Systems Hires Selective Solder Applications Engineer

Juki Automation Systems (JAS), Inc., a world- leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce the appointment of Greg Brown as Selective Solder Applications Engineer. Mr. Brown will be based out of the JAS, Inc. Morrisville location.

Mr. Brown will be part of the sales team as a technical advisor and product advocate. This will include analysis of customer needs to identify the best solution, as well as providing reliable solutions for all technical issues to assure total customer satisfaction.

www.jukiamericas.com.

Joel Wolnik Returns to Libra Industries to Take on the Production Manager Position

Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that Joel Wolnik has returned to the company. Now the production manager, Mr. Wolnik previously worked for Libra Industries for more than 20 years in various roles, including IT Manager and SMT Supervisor.

Jenn Kiminas, Marketing & Communications Manager commented, “With all of Joel’s experience with the company, he is really an expert at our systems/processes. Joel will be focused on making improvements and e ciencies.”

In his new role as production manager, Wolnik will plan, direct and coordinate all activities of the production operations, and ensure the most e ective and economical production of quality goods in a timely manner. The position aligns closely with supply chain, engineering, quality, program management and nance. Additionally, Wolnik has comprehensive responsibility for Libra Industries’ contract manufacturing and assembly operation.

www.libraind.com.

Ryder Industries Announces New COO, CFO, and VP of Marketing & Sales

Ryder Industries Ltd, the Swiss-owned EMS provider with manufacturing facilities in China, today announced that after yet another year of double-digit growth, they will deploy a new

management team to help with growing needs of the company and customers.

Henry Wu has been promoted to Chief Operating O cer. His duties will now include Site Operations (Bao An campus and Xin Feng campus), the four Commercial Business Units, corporate Materials Management, Engineering & Quality, and Strategic HR.

Nelson Tse is the new Chief Financial O cer (CFO) and is responsible for Group, Site and CBU nance, Internal Audit and Compliance, IT, Liaison with Customs & Government, and Maintenance & Repair.

Lawrence Chan is now Vice President / Marketing & Sales (VP/M&S), covering New Business Development, Emerging Account Management, Integration and Strategic Resources, and Marketing Communications.

www.ryderems.com.

Scienscope Hires Eastern

Regional Sales Manager for

USA

Scienscope International, a complete inspection solutions provider, announces the addition of Mr. Don Jeka to its management team as Eastern Regional Sales Manager for North America. Scienscope is a leader in X-ray inspection technology and o ers a wide range of products for the electronics, industrial and medical industries.

Todd O’Neil, Business Development and National Sales Manager at Scienscope, commented, “Don’s professionalism and and management style will t in perfectly with the direction of our company. He has nearly 30 years’ sales experience including more than 12 years selling capital equipment, and has displayed the ability to work e ectively with manufacturers, factory representatives and customers. Scienscope sales increased by more than 150 percent in 2015 compared to 2014 and we intend on doubling that again this year. We are con dent that Don will do an outstanding job to help us achieve that goal.”

www.scienscope.com.

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Scienscope Hires Regional Manager for X-ray Sales in Mexico

Scienscope International, a complete inspection solutions provider, announces the addition of Mr. Fabian Ruvalcaba to its sales team as Regional Sales Manager for X-ray in Mexico. Mr. Ruvalcaba is based in Guadalajara.

Todd O’Neil, Business Development Manager at Scienscope, commented, “Having Fabian as part of our team will be a signi cant contribution to help expand the X-ray sales in Mexico. With his experience in customer service and relationships with the local customers, Fabian will be well received and an essential part of our team”.

Mr. Ruvalcaba has 15 years’ experience in the electronics manufacturing industry performing various roles and he understands the industry needs and customer requirements.

Scienscope is a leader in X-ray inspection technology and o ers a wide range of products for the electronics, industrial and medical industries. Scienscope launched its X-ray technology in 2000 and has installed hundreds of systems around the globe.

www.scienscope.com

Sono-Tek Corporation Announces the Appointment of a New Director for the Electronics & Advanced Energy “E&AE” Division

Sono-Tek Corporation (OTC BB: SOTK) is pleased to announce that Bennett Bruntil, Regional Sales Manager and Marketing Brand Manager for Sono-Tek since 2007, was promoted to strategic business unit director of the Electronics & Advanced Energy (E&AE) Division, e ective March 2016. In his new role, Bruntil will oversee the sales, marketing and new product development e orts worldwide in applications for the E&AE strategic business unit.

www.sono-tek.com.

Torenko & Associates Adds Salesman in Mexico

Torenko and Associates, a leading manufacturers’ representative organization specializing in the sales and marketing of premier electronic assembly equipment, production tools, test, repair, inspection and consumable products, has hired Angel Romero. A seasoned veteran, Mr. Romero joins the company’s sales team in Matamoros and Reynosa, Mexico.

Mr. Romero has more than 25 years of experience in process and sales, having worked for Siemens, Delco and Interlatin.

www.torenko.com.

Congratulations!

Kurtz Ersa

Luis Alberto Muñoz

JUKI

Thomas Kempf

JUKI

Greg Brown

Libra Industries

Joel Wolnik

Scienscope

Fabian Ruvalcaba

Scienscope

Don Jeka

Torenko & Associates

Mr. Romero

Sono-Tek

Bennett Bruntil

P:64

industry news continued

AIM Appoints Two New Manufacturer’s Representatives, ANT Sales Company and

KSM Delta

AIM is pleased to announce the addition of ANT Sales Company and KSM Delta as its representatives for AIM’s complete line of solder materials for the plumbing market. ANT Sales Company within Montana, Wyoming, Colorado, New Mexico, and El Paso, Texas, and KSM Delta within Tennesses and Georgia. Both companies will provide service and support, assisting AIM’s plumbing customers within their respective regions in nding the best solution for their soldering needs.

Based in Denver, Colorado, ANT Sales Company serves the Rocky Mountain plumbing market in a quality and timely fashion. ANT Sales Company is a young, innovative, dynamic team of pro cient individuals that provide their customers with an unmatched level of service for the industrial market that will give AIM an advantage in servicing existing and potential customers in the El Paso, Texas and Rocky Mountain regions. For more information about ANT Sales Company,

www.antsalesco.com

KSM Delta is a leading manufacturers’ representative agency in the wholesale plumbing industry. Founded in 1979, KSM Delta has made a reputable name for their service and support in the plumbing industry. The experience and skill that KSM Delta o ers will make for an excellent addition to the AIM US Plumbing Solder representative team.

www.ksmdelta.com

Count On Tools, Inc. Sees Great Interest in MYDATA Feeder Repair Kits at APEX

Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, received great customer feedback at the recent IPC APEX EXPO. The company exhibited its new refreshed look for the rst time and received many quality leads from prospective customers with special interest in the MYDATA Feeder Repair Kits. COT also used the show as a platform to launch the QWIKTRAY program to the U.S. market and celebrate the company’s 25-year anniversary.

Each MYDATA Feeder Repair Kit includes: a precision machined aluminum side cover plate with cover tape plow pre-installed, a new spring, and matching screws for re-assembly. The new MYDATA Feeder Repair Kits can be installed

by the customer, eliminating the need for worn / damaged feeders to be sent in to Count On Tools for repair.

This is the only repair option for these feeders on the market and provides signi cant cost savings in comparison to purchasing replacement feeders. With each broken feeder, customers are throwing away money. Thanks to the introduction of the new Feeder Repair Kits, customers can expect much higher durability combined with signi cant cost savings and reduced waste.

The new QWIKTRAY system has been developed to provide low-cost, custom matrix trays for many types of electronic components. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape- and-reel is not available and standard JEDEC trays do not exists. Customers no longer have to place these components by hand.

www.cotinc.com

Etek Europe Appointed Distributor of CheckSum – In- Circuit Board Systems

Etek Europe are proud to announce that they have been appointed distributor for CheckSum in the United Kingdom, Bulgaria and Romania. This new appointment will add a new Test Equipment division to Etek’s already established divisions.

This appointment reinforces the relationship between two great companies: CheckSum, a leading supplier of board test and on-board programming systems, and Etek Europe, a quality provider of production equipment, consumables and services to the aerospace, automotive, defence, medical and electronic manufacturing industries across Europe, the Middle East and Africa.

Mike Nelson, Managing Director and founder of Etek Europe, added, “With CheckSum’s robust ICT and industry-leading technology you have a one-stop, all-in-one solution for high volume small boards. We are extremely proud to announce this appointment and look forward to working with the team at CheckSum. Their products provide us with the opportunity to further extend our portfolio of equipment o erings to our customers.”

www.etek-europe.com www.etek-europe.com/checksum

Evolvi, a Quality Provider of Pre-Owned Electronic Assembly Equipment, Launch New Website

The new site can be found at the same address, www.evolvismt.com, but has been completely redesigned. The Evolvi website features a responsive, mobile-friendly framework for desktop, tablet and phone viewing. The updated asset management section includes Asset Analysis, Consignment Program, Managed Online EMS Auctions, Trade-In Options, Decommissioning and Equipment Sourcing.

Additionally, Evolvi now o er a range of nancing

options, allowing customers to free up cash ow and maximize the manufacturing returns. Whether they want to own the used equipment at the end of the deal, just lease it, or keep their options open, Evolvi have an agreement type to suit all customers.

The site also features updated and expanded equipment for sale section, which is o ered for the most recently available machines. The easy- to-use site provides a better user experience for our existing and potential customers alike.

For more information about Evolvi Pre-Own Electronic assembly Equipment or to view the new Website, visit www.evolvismt.com

Gen3 Systems Sees Fast-Growing

Customer Base for the CM Series

Gen3 Systems Limited, a specialist British manufacturer and distributor, has seen a fast- growing customer base for the CM Series in the beginning of Q1 2016. Gen3 Systems was awarded, for the second consecutive time, ‘European Product of the Year’ from Global SMT & Packaging magazine – this time for the new CM Series redesign. The redesign was developed by Mark Routley and the Gen3 team.

Since mid-Summer 2015, Gen3 has been working very closely with Robert Bosch in Germany who have been seeking to implement a “Global Process” for all of their facilities around the world. After extensive evaluations, the CM22 has been selected for that role. The research work conducted by Robert Bosch was, by far, the most thorough into this subject since the U.S. Navy research of the mid-1970s.

Gen3 also achieved full approval from the defence contractor – Thales Group – in an investigation conducted to compare all competitive systems. All of this fully validates the UNIQUE capabilities

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of the CM Series with Gauge R&R, accuracy and linearity capabilities far beyond that of the competition.

www.gen3systems.com

Microtronic GmbH Installs New Sonix ECHO at Demo Lab in Munich

Microtronic GmbH, a leading sales specialist of microelectronics, is pleased to announce that it has installed the latest version of the Sonix ECHO at its demo lab in Munich.

Ernst J. M. Eggelaar, President of Microtronic, commented, “We are thrilled to present the latest developments and features of the Sonix ECHO to our customers. The system includes many cutting-edge features.”

The Sonix ECHOTM is an industry-leading scanning acoustic microscope that provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 5 microns, the ECHO is perfect for MEMS, bonded wafers, bump detection, stacked die (3D packaging) inspection, complex ip chip inspection and more traditional plastic packages.

With 35 years’ experience, Microtronic is the microelectronics leader in Europe and offers a wide range of products and services to the microelectronics industries. The company o ers regular training courses on various topics through in-house training or can arrange for specific employee training courses on request to suit speci c needs.

www.microtronic.de

New 20K ft2 Addition Underway at Nathan Trotter & Co., Inc.’s Coatesville Plant

Nathan Trotter & Co., Inc., a leading manufacturer of tin and tin alloys, today announced the expansion of its tin and solder bar manufacturing site by an additional 20,000 ft2 attachment to its existing 30,000 ft2 nished goods plant. The addition will be out tted with a continuous-cast automated solder line, a second billet casting station to feed the two on-site extrusion presses, eight new furnaces and two new packaging stations; all resulting in approximately 100,000 lb/day of additional capacity.

“We have realized signi cant growth in the last ve to ten years in the solder bar market and other industries to which we supply tin,” said Luke Etherington, Vice President. “We felt that it was a good time to invest in additional capacity and automation to prepare for further growth.”

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P:66

industry news continued

feature continued...

Nathan Trotter’s solder reclamation division, Tin Technology and Re ning, operates in a separate 40,000 ft2 facility in nearby West Chester, PA. The businesses process more than 1,000 tons/month of tin and solder across both facilities.

Nathan Trotter & Co., Inc. Increases Capacity in Hedging Program to Help Mitigate Market Volatility

Nathan Trotter & Co., Inc., a leading manufacturer of pure tin and solder, today announced that it has expanded its metal hedging program with Wells Fargo Bank NA to allow for additional forward sales of metal and solder products to its customers. With metal prices trading at multiyear lows, there has been a growing interest to lock in these prices with blanket orders of one year or more.

Luke Etherington, VP at Nathan Trotter, commented about the hedging program: “Especially with tin being at a six-year low, we are nding that this makes good sense to many of the larger consumers of solder products. While we traditionally saw blanket order terms of up to one year, we have more customers asking for two and even three-year xed pricing. We successfully worked with Wells Fargo to increase our London Metal Exchange hedging capacity and time horizon so that we can o er these opportunities to our customers. The response has been very positive.”

www.tintech.com or www.nathantrotter.com

Ryder Industries Appointed Advanced Certi ed Enterprise (ACE) Status

Ryder Industries Ltd., the Swiss-owned EMS provider with manufacturing facilities in China, announced that it has been awarded ACE status (Advanced Certi ed Enterprise) by China Customs. Advanced Certi ed Enterprise (ACE) is the most elite status that can be awarded in China, and gives the highest level of customs clearance.

This is a great asset to all Ryder’s customers and will help Ryder Industries provide the following:

1.On-time customer shipments, on-time raw materials

2. Lower risk

www.ryderems.com

New Patents Awarded to Sono-Tek Corporation

Sono-Tek Corporation (OTC BB: SOTK) is pleased to announce that it has been awarded three new patents for its ultrasonic spray technology. The patents relate to Sono-Tek’s agship ECHO Multiband Ultrasonic Generator, a continuation in part for its unique SonicSyringe, and an ultrasonic spray process for applying coatings directly onto food products

These patents typify Sono-Tek’s continued success and long history of developing unique and valuable ultrasonic spray nozzle technology. Sono-Tek is the inventor of the ultrasonic spray nozzle, with the rst patents for its ultrasonic atomizing nozzle designs awarded to the company’s founder, Dr. Harvey Berger, and his contributors in the late 1970s.

www.sono-tek.com

Valtronic Purchases Juki Equipment during IPC APEX EXPO®

Valtronic, innovator and manufacturer of miniaturized electronic products for trusted medical device partners, attended the 2016 IPC APEX EXPO® exhibition last month at the Las Vegas Convention Center and invested in new JUKI equipment for its Solon, Ohio-based location.

In addition to learning more about industry highlights and new technologies during the IPC APEX show, Valtronic focused its strategy at the exhibition for investment opportunities in new equipment to duplicate its other JUKI SMT line. The team also considered other equipment to bene t the company in technology upgrades. The company was searching for innovative, quality machines at competitive prices to continue furthering its mission of providing advanced microelectronics to customers.

On Thursday, March 17, Valtronic purchased the TR6DNR-D Matrix Tray Changer from Juki Automation Systems, along with additional tape feeders. The company will use the tray changer

to duplicate its second JUKI SMT Line, enabling Valtronic to run various products and allowing various feeders and overall efficiency to the production line.

“Valtronic is proud to be part of this innovative network,” said Valtronic CEO Dr. Rainer Platz. “We believe the EPFL Innovation Park not only helps Switzerland affirm its position as a global leader but also helps Valtronic mark its place as an innovation leader within the medical device industry.”

The company will celebrate the grand opening with a ribbon-cutting ceremony. The invitation-only event will be held for local customers, partners, city o cials and media in Lausanne and surrounding areas. www.valtronic.com.

www.ep -innovationpark.ch.

New Viscom Building Creates Additional Capacity

Viscom AG is pleased to announce that it has moved into its new facility. The new building is one of six that makes up the expansive Viscom campus at the company’s headquarters in Hanover- Badenstedt. Now, the company has an even more spacious and modern demo center for presenting its inspection systems, a conference room for more than 300 people as well as additional training and o ce facilities.

The o cial opening of the new premises at Carl- Buderus-Straße 6 will take place during Viscom’s Technology Forum, scheduled to take place June 8-9, 2016. However, the rst system presentations are already underway at the new facilities. The new o ces have already been furnished, and Viscom’s new building is now in operation and ready for training customers and employees, hosting events and more.

www.viscom.com

Page 66 The Choice of Publication for the Electronics Industry

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P:67

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P:68

TECHNOLOGY TODAY FEATURE

Machines for Thermal Processes

Solder voids eliminated and capacity boosted! submitted By Terry Morgan, smt uk manager

The challenge for leading UK automotive manufacturer KSR was to nd a solution that satis ed stringent quality demands whilst meeting higher production volumes for their new range of MOSFET power modules.

the VAC L machine reliably removes up to 99% of voids in solder joints which greatly improves the mechanical and heat transfer qualities of the interconnect.

“We are pleased to announce our rst VAC L installation in the UK,” reports Terry Morgan, SMT UK Manager. “Since its development in 2009, we now have more than 100 vacuum soldering machines in operation around the world and that has proven to be particularly popular in automotive applications”.

www.SMT-Wertheim.de

“It is well understood that voids in the solder interface between bare die and DCB substrate drastically reduces performance and life expectancy of the power module. We currently use a number of batch vacuum soldering machines, however we were looking to improve our TAKT time for our new product range which required an in-line solution,” comments Ian Price, KSR Process Development Engineer. “Our search brought us to the SMT company based in Wertheim, Germany, where we extensively tested their innovative VAC L vacuum re ow soldering

process. The machine has been in operation at our Swansea plant for the past 6 months and we are very pleased with its performance”.

The VAC L system builds on SMT`s proven convection reflow soldering `know-how` and which also incorporates a vacuum module, the component that removes gaseous voids from the solder joint whilst still above liquid range. The process operates continuously in-line like any other re ow machine so production volumes are maintained. Independent industry test show

Page 68 The Choice of Publication for the Electronics Industry

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NEPCON CHINA

NEPCON chIna

by SMT today editor

NEPCON China is an outstanding trade platform and exhibition that features the entire electronics manufacturing industry on a large scale. The event focuses on SMT (surface mount technology) and EMA (electronics manufacturing automation). Over 22,000 electronics manufacturing industry buyers with high purchasing power and senior executives from North, East and Central China attended NEPCON China in 2015. The buyers represented the elds of EMS/ OEM/ODM, consumer electronics, computers, communications, automotive electronics and medical devices. NEPCON China is the ideal platform via which to acquire new sales leads, network with customers, showcase the new products and technologies and promote brands. To follow, are a few companies who will be exhibiting at NEPCON China this year:-

near instant oven changeover time or dramatically reduced downtime.

KIC’s smart oven technologies automatically measure the PCB pro le and its match to the relevant process window. Share this continuous and near real-time process and traceability data with all authorized personnel and MES over the factory’s LAN. True process data helps the maintenance people troubleshoot and x issues faster.

www.kicthermal.com

KYZEN

Kyzen has announced that Daniel Gao, Sales Manager – Northern China, will present during the SMTA China East Technical Conference, during NEPCON China. Gao will present the paper authored by KYZEN’s Mike Bixenman, DBA, & Jason Chan as well as STI Electronics’ Mark McMeen & Jason Tynes, entitled “Cleanliness Makes a Di erence When Miniaturization Kicks In.”

Gao will explain that the end-goal for circuit designers is to increase device functionality in smaller platforms. The stando heights within the Z-axis of miniaturized components are approaching one mil. During re ow, ux residues can become entrapped under the bottom terminations. Mobile ions within the ux residues form leakage currents, especially when the device is operating within humid environments. Flux residue can contain ionic materials which, when trapped under a part, can lead to shorts across adjacent pads or voltage/current leakage pathways.

Gao’s presentation will report ongoing research to study these multi-variant issues using a new test vehicle with sensors placed under and near bottom terminations. The test vehicles are designed to track impedance where it matters most. The goal of this research is to develop an improved method for studying multi-variables that may impact circuit reliability. Data ndings, inferences from the data ndings, and recommendations will be documented and presented.

www.kyzen.com www.kyzen.com.

Scienscope

Booth B-1E46

Scienscope International, a complete inspection solutions provider, will showcase the new AXI5100c X-ray Component Counter for the rst time in Asia along with some of its agship AXI products including: View-X 1800 (X-SCOPE 1800), X-spection 6000 and AXI-8000.

The AXI5100c is a new innovation in counting components, capable of counting the latest 03015s as well as (4) 7” or (1) 15” reels of various thicknesses.

BTU INTERNATIONAL INC

Booth 1E45

CyberOptics

Booth 1E48

CyberOptics® Corporation (NASDAQ: CYBE) announced that it will exhibit in with Kasion Automation Ltd. (KAL) at NEPCON China. CyberOptics’ will demonstrate the new SQ3000TM 3D Automated Optical Inspection (AOI) system that is increasingly being adopted by customers as a best-in-class solution.

The SQ3000TM 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary Multi-Re ection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms o ers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.

www.cyberoptics.com

KIC

Booth 1G22

KIC has announced that it will showcase its automatic smart oven technologies that eliminate manual tasks such as periodic manual pro ling and reduce the opportunities for human mistakes in setting up and running the ovens.

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will showcase its RecipePro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), as well as highlight the latest version of the Energy Pilot software and Industry 4.0 compliant solutions.

RecipePro is the only recipe generation tool in the industry to include convection rate in the recipe generator algorithm, pairing it perfectly with PYRAMAXTM’s closed-loop convection control. The integration of ECD’s recipe generator technology into BTU’s advanced re ow systems o ers manufacturers a streamlined and e ective approach to initial recipe generation for higher yield results. The pro ler will reduce non-productive time by streamlining the set-up process. RecipePro is included with new Pyramax re ow ovens that are con gured with convection control.

The Energy Pilot software saves manufacturers money whenever the oven is idle. Standby mode can save more than 25 percent. Sleep mode can be used for longer interruptions saving more than 40 percent. Long idle periods fully shut down the oven using hibernate mode. Recovery times are minimized using remote product sensors and SMEMA. Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption. The feature takes advantage of the Pyramax’s superior response time allowing the oven to return to ready very quickly, not disrupting product ow.

Energy Pilot and RecipePro are features of BTU’s proprietary Wincon operating system and are available to existing Pyramax users by upgrading Wincon to the latest version.

www.btu.com

KIC will demonstrate how its smart oven technologies lead to reduced production costs, higher quality and new capabilities that the electronic assembly market is starting to demand. One exciting aspect of these smart technologies is that they are retro table on virtually all oven models at nearly any age. Now the entire factory can use smart oven technologies.

As electronic product variety continues to grow, the result is more frequent production line changeover. Productivity is lost when a multimillion dollar production line waits 15-30+ minutes on a $50,000 oven to stabilize on the new recipe. KIC’s technology provides either

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Beyond counting reels, the AXI5100c can also count components in ESD bags, storage sticks, and trays. Even more interesting, the AXI5100c also can perform traditional X-ray inspection of electronics and counterfeit component detection, making it the obvious choice for exibility. The AXI5100c -i is a fully automated inline system that can handle loading and unloading of components using various conveyors, loaders/ unloaders and even robots.

The View-X 1800 Cabinet X-ray Inspection System is a full-featured entry level system, featuring a state-of- the-art 90 kV micro-focus X-ray tube and a standard 4′′ x 3′′ digital at panel detector with tilting capability.

The X-spection 6000 is a more advanced system, including a 130Kv micro-focus X-ray tube with optional 5” x 5” digital at panel detector or optional ultra- resolution digital at panel detector. Both have tilting capability up to 65°. The X-spection 6000 also has a rotating table that can move a total of 350° (+/- 175°).

The AXI-8000 is a fully automated inline X-ray machine that can either inspect with traditional 2D or an advanced Planar CT for reconstruction of 3D images. There is no movement of the sample once it is in place. After reconstruction, each slice can be viewed, giving greater detail of each layer in comparison to traditional 2D with overlaying images.

www.scienscope.com

SEHO

Booth 1D01

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will highlight the SelectLine-C selective soldering machine in the German Pavilion. SEHO continues to release new technologies to ensure higher productivity in electronic productions with exible and innovative machines.

The SelectLine-C machine concept is consistently modular, thus ensuring clear cost bene ts. The uxer module, various preheat modules and soldering modules may be equipped individually, and depending on the requirements, they can be con gured into a complete manufacturing line.

The soldering area of the SelectLine-C scores highly thanks to its outstanding precision and exibility. Two electro-magnetic soldering units for mini-wave or dip processes may be integrated. Especially two new and unique features that are patented by SEHO ensure a remarkable increase in productivity: The automatic ultrasonic nozzle cleaning function guarantees reliable processes and maximum machine availability, and the Synchro software feature nearly doubles production volume without major investments.

Of course, all selective soldering systems from SEHO feature a comprehensive hardware and software package to ensure 100 percent automatic process control.

www.seho.de

Techcon Systems

Booth B-1E52

Techcon Systems, a product group of OK International and a leading provider of uid dispensing systems and products, will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.

TS5624 Disposable Path Material Diaphragm Valve dispenses low to medium viscosity uids over a wide range of shot and bead sizes, down to a fraction of a micro liter. An internal spring return makes the valves fully adaptable for use with Techcon Systems controllers. A short opening stroke provides an extremely fast and positive shut-o . The seal-less valve design offers excellent moisture sensitive resistance and the incorporated diaphragm creates a barrier between the wetted parts and the air cylinder.

The TS5000DMP Series Auger Valve dispenses material with a rotary displacement action using a rotary feed screw principle. During operation, air pressure pushes the material from the syringe into the feed screw chamber. As the feed screw rotates, the material travels between the threads and out of the dispense tip. The feed screw is driven by the DC motor. The TS5000DMP Auger Valves incorporate a “Disposable Material Path” for single and plural component materials with short cure times.

The TS5540 Series Spray Valves are designed for precise spray applications of low viscosity materials. The TS5540-MS Microshot Spray Valve is designed to spray low viscosity materials through disposable dispensing tips. Spray patterns range from 0.18” to 0.60” in diameter.

Also at the show, the TSR2000 Bench Top Robot Series is ideal for a wide range of uid dispensing applications, from inline to batch. The versatile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an a ordable price. The TSR2000 Series is ideal for the following applications: dispense dots of solder paste, form-in- place gasket, lling, potting, encapsulation, bonding, coating and many more. Three models are available (TSR2201, TSR2301 and TSR2401) to accommodate a wide range of working envelopes. The TSR2201 and TSR2301 will be demonstrated at the show.

Techcon Systems also will display the 700 Series Syringe, TE, TT, M Series Needles, along with a range of cartridges and nozzles. Additionally, a wide array of uid dispensing components will be displayed, ranging from disposable accessories to complete digital controlled dispensing systems and precision valves for automation.

www. techconsystems.com

Vitrox

Booth 1H21

ViTrox’s new products – V310 3D SPI and V-One – will be highlights of the day along with the proven V810 Mini AXI system.

ViTrox’s 3D Solder Paste Inspection (SPI) is designed for paste print inspection, which is applicable to different fields such as mobile phones, tablet PCs, computers and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products and so on. SPI is one of the most decisive procedures as it a ects the nished quality of circuit board.

ViTrox’s V310 3D SPI system inspects PCB boards up to 510mm x 505mm. It can accurately detect defects in high-speed mode. In addition, it is compatible with various types of materials, including components, printed circuit boards (PCBs) and more. The Programmable Spatial Light Modulation (PSLM) of V310 3D SPI eliminates the mechanical operation and moving parts, greatly improving the ease of use and reliability, and reducing the maintenance costs compared to other solder paste inspection

technologies available in the market. The patented D-Lighting achieves full light spectrum detectability, which aims to solve the shadow e ect and reduce noise interference during 3D measurement.

The Multi-Head Technology of the V310 3D SPI inspects solder paste with three di erent color structured lighting, which acquires multiple photos from di erent angles in order to shorten the inspection process. Furthermore, it can be connected to ViTrox’s V-One Solution that allows users to access and control the machine anywhere at anytime!

Additionally, ViTrox’s V810 Mini is the smallest footprint in-line 3D advanced X-ray inspection system (AXI), certi ed by TUV SUD and TUV CE in Machine Directive, EMC and Rheinland (NRTL). V810 Mini is designed for the automotive industry, providing the fastest inspection speed and widest test coverage in the world. It supports up to 4.5kg board weight and maximum board size of 287mm x 523mm (11.3” x 20.6”)

With the introduction of Motorized X-Ray Tube, V810 Mini o ers greater top clearance up to 50mm and bottom clearance up to 80mm. High accuracy and repeatability are achieved with this motorized closed-loop design.

ViTrox’s V-One is the new software-based product launched by ViTrox that combines all of the previous and future ViTrox software into one suite of solutions to connect the inspection machines in SMT production lines in order to monitor their performance on a real- time basis. V-One allows users to manage factories smarter and optimize factory resources across geographical locations.

vitrox.com

VJ Electronix

Booth 1E48

VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, will demonstrate the improved Micra system, XQuik II with AccuCount Technology and Summit II.

The popular Micra is designed for rework of smaller, high performance components, such as Chip Scale Packages (CSP), Package on Package (PoP) and Micro Passives (01005). The enhanced Micra provides a larger 35 mm alignment eld of view, expanding its range of applications into more automotive, medical and military/aerospace products.

The revolutionary XQuik II with AccuCount Technology is helping manufacturers around the world keep accurate inventory of their component reels. The XQuik system automatically counts components as small as 01005 with better than 99 percent accuracy. The process takes only seconds, and requires no programming. The new XQuik II handles reels from 7 to 15”.

The new Summit II is the latest semi-automated rework system. Improved ergonomics combined with next-generation controls and proven heating technology provide the greatest performance and exability. Summit II features a smaller footprint, yet larger board capacity with easy to adjust board support xtures. Enhanced SierraMate software takes the popular user-friendly operation to the next level with a simple icon driven GUI and unmatched exibility through easily customized operation sequences.

www.vjelectronix.com

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red carpet

out & about in the industry

In this feature we follow our industry movers and shakers throughout the world. Time to take a bow...

SMTTODAY FITBIT WINNER

Mike Goldberg

Vice President / Robotics Division,

PROMATION, Inc

Seika Machinery Receives Top Global Distributor Award for McDry Cabinets

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce that it received the award for ‘McDry Top Distributor 2010-2015’ from ERC., Co., Ltd. Ban Saito of ERC Co., Ltd. presented the award to Michelle Ogihara during Seika’s award ceremony that took place Wednesday, March 16 at 9 a.m. in Seika Machinery’s booth on the

show oor.

www.seikausa.com

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| APRIL 2016 ISSUE

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Nihon Superior Co. Ltd. — Osaka, Japan — March 2016

Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.

www.nihonsuperior.co.jp

Microtronic GmbH Starts Its 35th Year Stronger Than Ever

Microtronic GmbH, a leading sales specialist of microelectronics, today announced that 2016 marks its 35th year in business. Microtronic was founded in 1981 and is based near Munich, Germany.

Ernst J. M. Eggelaar, President of Microtronic, commented, “With our focus on quality and test (Sonix, Akrometrix, our LBT210, our new ConTTest, etc.) as well as soldering (AIM, solderability test, squeegees, rework equipment, etc.), we have a well-rounded business setup. As a company, we are stronger than ever and we are excited to enter our 35th year in business.”

www.microtronic.de

what’s happening in your business?

send your event pictures to advertising@smt today.com

Pat Scott Celebrates 15 Years with STI Electronics

STI Electronics, Inc., a full service organization providing training resources, analytical/failure analysis, prototyping, and small-to-medium volume PCB assembly, announces Pat Scott’s 15-year anniversary. Ms Scott has held a number of positions at STI before assuming her current position as Director of Training Services. David Raby, President/CEO, presented a certi cate in appreciation of Ms. Scott’s 15 years of dedicated service.

www.stielectronicsinc.com

Horizon Sales Named Viscom Representative of the Year

Viscom today announced that it awarded Horizon Sales ‘2015 Representative of the Year’. Ed Moll, Viscom Inc.’s VP of Sales – Americas’, presented the award to Dave Trail, President of Horizon Sales, during the recent IPC APEX EXPO at the Las Vegas Convention Center. Horizon Sales was selected for the award in recognition of the company’s extraordinary work and the acquisition of several new customers in the territory of Michigan, Wisconsin, Illinois, Ohio and Western Pennsylvania.

www.viscom.com www.horizonsales.com

P:74

2016 DATES FOR YOUR DIARY

12 – 14 APRIL

Birmingham NEC

National Electronics Week will run in Hall 2 alongside MACH and Drives & Controls, contributing to the biggest UK visitor attendance of an electronics and manufacturing event. Over 30,000 visitors from the industry will descend upon the NEC to see the latest designs and innovations from all over the world. With the new Resort World opening in time for the event, it is set to be bigger and better than ever before with networking opportunities in plentiful supply.

26 – 28 APRIL

Nuremberg, Germany

SMT Hybrid Packaging is Europe´s leading event on System

Integration in Micro Electronics. Meet the industry’s leading

companies for SMT-Equipment, Components and SMT-

Services. With 33% foreign exhibitors, the event offers not

only a wide, but also an international spectrum. The perfect

THE 22ND PRESENTATION

platform to get the latest information on newest trends and developments.SOUTH CHINA 2016

26 – 28 APRIL

CHINA 2016

Shanghai World EXPO Exhibition & Convention Center

The event is one of the biggest and longest standing trading and sourcing platform in Asia, featuring all major brands

in the electronics manufacturing world. The Electronics Manufacturing Automation (EMA) Pavilion to be debuted at NEPCON China 2016 will showcase the most advanced industrial automation technologies and products in the electronics manufacturing industry. It is the only dedicated trade and purchasing platform in China to feature automation solutions for both electronics manufacturers and electronics manufacturing equipment vendors.

8 – 9 JUNE

Angers Expo Congrès - Parc des Expositions, Angers, France

ENOVA exhibitions bring together almost 10,000 visitors seeking innovative products and services. From R&D and Industry, Start-ups, industrial rms, technology providers, digital professionals, research laboratories and designers; here to explore new uses and technologies, to generate a real climate for doing business and to bring their projects to life.

THE 22ND PRESENTATION

30 AUGUST – 1 SEPTEMBER

SOUTH CHINA 2016

Schenzhen Conference & Exhibition Center

NEPCON SOUTH CHINA is one of the biggest product CHINA 2016

and technology procurement platforms for the electronics manufacturing industry in South China. Boasting the longest standing history, it gathers 33,000 high-end buyers, decision makers, engineers, and technicians from EMS/OEM/ODM, including consumer electronics, communications, and the computer, automotive and medical electronics sectors. Sideline activities such as the EMA Pavilion, CS Show, and EMS Sourcing Hub provide the most advanced industrial automation technologies and products in China, as well as the most comprehensive PCB products. The event offers

a great opportunity to showcase the best in electronics manufacturing, design, and delivery solutions.

14 – 15 SEPTEMBER

Paris Expo Pore de Versailles, Paris, France

Technical and professional experts related to the sectors of electronics and measurement will attend this event and will

get an opportunity to share their expertise with the attendees. Developmental changes which are taking place in the elds of optics and photonics will be highlighted in this event and will attract a large number of technocrats and professionals from all over the world related to these elds. Enova Paris is designed to provide useful and relevant information to the manufacturers and suppliers of measurement and control equipment and Manufacturers vision systems and Components. These manufacturers and suppliers can share their knowledge and experience with each other by attending this expo.

27 – 28 SEPTEMBER

Donald Stephens Convention Center, Rosemont, IL

This year in Rosemont, attendees and exhibitors can expect a focused event with the strongest technical conference for which SMTA International has come to be known. SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.

8 – 11 NOVEMBER

Messe Muenchen

electronica is the very rst place to see which components, systems or applications make new developments such

as smart homes and connected cars possible in the rst place. The entire industry meets here, electronica hosts a comprehensive range of exhibits on an international business platform, with an extensive supporting program. In short: the entire world of electronics.

Page 2P2age 74 The ChoiceThoef PCuhobilciceaotifoPnufbolirctahtieoEnlfeocrttrhoenEiclescItnrodnuisctsryIndustry

| APRIL 2| 0A1P6RISILS2U0E16 ISSUE

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Page 76 The Choice of Publication for the Electronics Industry

| APRIL 2016 ISSUE

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